Patents by Inventor Kwan Lee

Kwan Lee has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Apparatus for improving cooling efficiency of engine room in vehicle
    Patent number: 10024279
    Abstract: An apparatus for improving cooling performance of an engine room in a vehicle, may include an air duct connected to an air cleaner to serve as a moving guide of fresh air; a duct flap installed to open and close some section of the air duct and operated to supply all the fresh air introduced into the air duct when the air duct is in a closed state to the air cleaner and discharge some of the fresh air introduced into the air duct when the air duct is in an opened state to a space of a high temperature part of the engine room; and an actuator supplying power to the duct flap to perform an opening and closing operation of the duct flap.
    Type: Grant
    Filed: November 23, 2015
    Date of Patent: July 17, 2018
    Assignee: Hyundai Motor Company
    Inventors: Jin Kwan Lee, Dang Hee Park, Yong Beom Park, Jang Sup Na, Seong Dae Cha, Seng Joo Yang
  • USER AUTHENTICATING METHOD AND DEVICE
    Publication number: 20180189470
    Abstract: Provided is an authentication method including receiving an authentication request; obtaining authentication data for authenticating a user from at least one of a plurality of external devices as when the authentication request is received; obtaining an authentication score based on the obtained authentication data and reliability information assigned to a type of the authentication data in advance; and determining whether additional authentication is necessary based on the obtained authentication score.
    Type: Application
    Filed: June 24, 2016
    Publication date: July 5, 2018
    Applicant: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Eun-ah KIM, Hee-kwan LEE
  • Lighting apparatus
    Patent number: 10015850
    Abstract: Disclosed herein is a lighting apparatus capable of uniformly maintaining power consumed by light emitting units even in the case in which various voltages are applied, and increasing power efficiency while minimizing a heating problem by adjusting a reference voltage applied to a connection structure of the light emitting units and a distribution switch according to magnitude of the applied voltage.
    Type: Grant
    Filed: January 19, 2017
    Date of Patent: July 3, 2018
    Assignee: LUMENS CO., LTD.
    Inventors: Tai-Hyun Kim, Jong-il Kim, Hyun-Pyo Hong, Jun-Hyung Lim, Tae-Kwan Lee, Young-Jun Lee
  • METHOD FOR DETECTING DEFECTS OF GLASS SUBSTRATES
    Publication number: 20180136095
    Abstract: A method of detecting defects of a glass substrate includes cutting a glass mother substrate into a plurality of glass substrates, penetrating ions into an incision surface of the glass substrate to visualize defects of the incision surface, and photographing the defects of the incision surface to determine a bending strength of the glass substrate based on a size of the defects.
    Type: Application
    Filed: November 17, 2017
    Publication date: May 17, 2018
    Inventors: Cheol Min Park, Jeong Woo Park, Seung Kim, Seung Ho Kim, Hoi Kwan Lee, Woo Jin Cho, Hee Kyun Shin, Hyun Joon Oh
  • WINDOW SUBSTRATE AND DISPLAY DEVICE HAVING THE SAME
    Publication number: 20180132371
    Abstract: A window substrate for protecting an electronic display device includes a first glass substrate having a first thickness, a second glass substrate having a second thickness, and an interlayer disposed between the first glass substrate and the second glass substrate, the interlayer having a third thickness, wherein the sum of the first thickness, the second thickness, and the third thicknesses is equal to or less than about 190 ?m. A display device including a display panel to display an image and a window substrate also is disclosed.
    Type: Application
    Filed: November 6, 2017
    Publication date: May 10, 2018
    Inventors: Jong Hoon YEUM, Seung KIM, Hoi Kwan LEE, Seung Ho Kim
  • POWER SUPPLY APPARATUS AND A TEST SYSTEM INCLUDING THE SAME
    Publication number: 20180109184
    Abstract: A power supply apparatus includes first through M-th switching regulators, first through N-th multiplexers, and first through N-th linear regulators, where each of M and N is a natural number greater than or equal to two. The first through M-th switching regulators generate first through M-th reference power signals using an input power signal. The first through N-th multiplexers select one of the first through M-th reference power signals, in response to a power selection signal, to provide first through N-th selection power signals. The first through N-th linear regulators generate first through N-th output power signals using the first through N-th selection power signals. The first through N-th linear regulators are connected to the first through N-th multiplexers, respectively.
    Type: Application
    Filed: May 2, 2017
    Publication date: April 19, 2018
    Inventors: SEONG-KWAN LEE, SUNG-CHUL CHUN, SUNG-YEOL KIM, JAE-HONG KIM
  • METHOD OF MANUFACTURING STRENGTHENED GLASS, STRENGTHENED GLASS OBTAINED BY THE METHOD, AND ELECTRONIC DEVICE INCLUDING THE STRENGTHENED GLASS
    Publication number: 20180099904
    Abstract: A method of manufacturing strengthened glass includes: preparing glass including blocking patterns on a surface thereof, portions of the surface exposed between the blocking patterns; forming a metal particle layer on the portions of the surface of the glass exposed between the blocking patterns; removing the blocking patterns from the surface of the glass, to maintain the metal particle layer on the surface of the glass; with the metal particle layer maintained on the surface of the glass, etching the surface of the glass using the metal particle layer as an etching mask to form an etched surface of the glass, such etched surface including protruding patterns spaced apart from each other by portions of a common reference surface; and chemically strengthening the etched surface of the glass at the protruding patterns and at the reference surface.
    Type: Application
    Filed: May 11, 2017
    Publication date: April 12, 2018
    Inventors: Jeong Woo PARK, Hyun Joon OH, Woo Jin CHO, Seung Ho KIM, Hee Kyun SHIN, Jong Hoon YEUM, Hoi Kwan LEE
  • Glass composition for vitrifying low-level radioactive waste resin
    Patent number: 9941026
    Abstract: This invention relates to the vitrification of radioactive waste products. According to this invention, a glass composition, which is suitable for low-level radioactive waste resins, and a method of vitrifying the low-level radioactive waste resins using the same are provided to significantly reduce the volume of radioactive waste products and to vitrify low-level radioactive waste products using the glass composition, which is suitable for vitrifying the low-level radioactive waste resins, thereby maximally delaying or completely preventing the leakage of radioactive materials from a glass solidified body.
    Type: Grant
    Filed: December 30, 2013
    Date of Patent: April 10, 2018
    Assignee: Korea Hydro & Nuclear Power Co., Ltd.
    Inventors: Deuk Man Kim, Byung Kwan Lee, Cheon Woo Kim
  • AC-DC SINGLE-INDUCTOR MULTIPLE-OUTPUT LED DRIVERS
    Publication number: 20180092179
    Abstract: A single-stage AC-DC single-inductor multiple-output (SIMO) LED driver uses a single inductor (L) to drive multiple independent LED strings (341-34n) with Power Factor Correction (PFC). The driver uses a diode bridge (20) to achieve initial AC to DC conversion. The output of the bridge (20) is provided to a buck converter whose output is shared with multiple LED strings by a time division multiplex circuit. Feedback is used to separately control the current supplied to each LED string by using a separate reference for each string and controlling the width of the current pulse provided to a string. Current balancing in every LED string can be achieved with the same voltage reference without the need for additional circuitry.
    Type: Application
    Filed: April 23, 2015
    Publication date: March 29, 2018
    Applicant: VERSITECH LIMITED
    Inventors: Yue GUO, Ting Leung Albert LEE, Sinan LI, Siew Chong TAN, Chi Kwan LEE, Shu Yuen HUI
  • Waveband electromagnetic wave absorber and method for manufacturing same
    Patent number: 9929475
    Abstract: Provided is a wideband electromagnetic wave (EMW) absorber including a magnetic composite having a structure in which magnetic particles are dispersed in a polymer resin, and a plurality of conductive lines arranged in the magnetic composite, and a method of manufacturing the same. The wideband EMW absorber can be used for a device configured to emit EMWs and effectively absorb wideband EMWs.
    Type: Grant
    Filed: May 9, 2011
    Date of Patent: March 27, 2018
    Assignee: KOREA INSTITUTE OF MACHINERY & MATERIALS
    Inventors: Sang-Kwan Lee, Sang-Bok Lee, Ki Hyeon Kim, Yong-Ho Choa, Sung-Tag Oh
  • PACKAGE SUBSTRATE FOR SEMICONDUCTOR PACKAGE, SEMICONDUCTOR PACKAGE INCLUDING THE SAME AND METHOD OF MANUFACTURING THE SAME
    Publication number: 20180076105
    Abstract: A semiconductor package includes a package substrate including at least one through-hole in a chip mounting region, a plurality of wiring patterns at a top surface of the package substrate. The wiring patterns include respective extension portions and respective landing pads. At least some of the landing pads obliquely extend toward the through-hole. Conductive bumps are formed on corresponding landing pads to connect to a semiconductor chip mounted on the chip mounting region of the package substrate. A molding material extends between the top surface of the package substrate and the semiconductor chip and fills the through-hole.
    Type: Application
    Filed: July 4, 2017
    Publication date: March 15, 2018
    Inventors: Baek KI, Tark-Hyun KO, Kun-Dae YEOM, Yong-Kwan LEE, Keun-Ho JANG
  • SENSING CIRCUIT OF DISPLAY DEVICE
    Publication number: 20180061329
    Abstract: Disclosed is a sensing circuit of a display device for external compensation of an OLED. The sensing circuit includes a current receiving unit configured to receive a pixel current containing a leakage current, convert the pixel current at a preset current ratio, and output the converted pixel current; a current source unit; a current sinking unit; a current detection unit; and a detection signal output unit configured to sample an offset voltage corresponding to the leakage current using the detected current.
    Type: Application
    Filed: August 11, 2017
    Publication date: March 1, 2018
    Applicant: SILICON WORKS CO., LTD.
    Inventors: Jae Kwan LEE, Dong Hyun HWANG, Hyun Ho KIM
  • TOUCH SENSOR
    Publication number: 20180011582
    Abstract: Disclosed is a touch sensor, including: first sensing patterns extended in a first direction and arranged in a second direction crossing the first direction, in which each of the first sensing patterns includes: first variable resistive patterns arranged in the first direction; and first conductive patterns connecting the first variable resistive patterns, and lengths of the first variable resistive patterns in the first direction are increased in the second direction.
    Type: Application
    Filed: July 6, 2017
    Publication date: January 11, 2018
    Inventors: Jun Young KO, Tae Joon KIM, Sang Kook KIM, Eung Kwan LEE, Hyun Wook CHO, Eun Sol SEO
  • MOSFET DEVICE AND FABRICATION
    Publication number: 20170373186
    Abstract: A semiconductor device, comprising: a substrate; an active gate trench in the substrate; a source polysilicon pickup trench in the substrate; a polysilicon electrode disposed in the source polysilicon pickup trench; a gate pickup trench in the substrate; a first conductive region and a second conductive region disposed in the gate pickup trench, the first conductive region and the second conductive region being separated by oxide, wherein at least a portion of the oxide surrounding the first conductive region in the gate pickup trench is thicker than at least a portion of the oxide under the second conductive region; and a body region in the substrate.
    Type: Application
    Filed: September 8, 2017
    Publication date: December 28, 2017
    Inventors: John Chen, Il Kwan Lee, Hong Chang, Wenjun Li, Anup Bhalla, Hamza Yilmaz
  • Printed circuit board and method of manufacturing the same
    Patent number: 9839126
    Abstract: There are provided a printed circuit board including: an insulation layer in which a via hole is formed; vias formed in the via hole; first circuit patterns formed below the insulation layer and electrically connected to the vias; and second circuit patterns formed on the insulation layer to be bonded to the vias; wherein the via has a diameter smaller than that of the via hole, and a method of manufacturing a printed circuit board.
    Type: Grant
    Filed: August 12, 2015
    Date of Patent: December 5, 2017
    Assignee: Samsung Electro-Mechanics Co., Ltd.
    Inventors: Myung Sam Kang, Young Kwan Lee, Seung Eun Lee, Seung Yeop Kook
  • MOSFET device and fabrication
    Patent number: 9793393
    Abstract: A semiconductor device includes a substrate, an active gate trench in the substrate; a source polysilicon pickup trench in the substrate; a polysilicon electrode disposed in the source polysilicon pickup trench; and a body region in the substrate. The top surface of the polysilicon electrode is below the bottom of the body region.
    Type: Grant
    Filed: September 23, 2013
    Date of Patent: October 17, 2017
    Assignee: Alpha and Omega Semiconductor Incorporated
    Inventors: John Chen, Il Kwan Lee, Hong Chang, Wenjun Li, Anup Bhalla, Hamza Yilmaz
  • Circuit board and method of manufacturing the same
    Patent number: 9788409
    Abstract: A circuit board includes an insulating material; and a heat-transfer structure comprising a plurality of heat-dissipating members and inserted in the insulating material, wherein the plurality of heat-dissipating members each includes a metal wire; and an insulating part disposed on an outer circumferential surface of the metal wire excluding a top surface and a bottom surface of the metal wire.
    Type: Grant
    Filed: January 7, 2016
    Date of Patent: October 10, 2017
    Assignee: Samsung Electro-Mechanics Co., Ltd.
    Inventors: Young-Kwan Lee, Yul-Kyo Chung, Seung-Eun Lee, Ki-Jung Sung
  • ADHESIVE COMPOSITION, ADHESIVE SHEET, AND BACK GRINDING METHOD FOR SEMICONDUCTOR WAFER
    Publication number: 20170290217
    Abstract: The present invention relates to a pressure-sensitive adhesive composition including a polymer of a monomer mixture containing isobornyl (meth)acrylate, a pressure-sensitive adhesive sheet, and a semiconductor wafer backgrinding method. In the present invention, by using isobornyl (meth)acrylate which is a hard-type monomer and has a low hydrophilic property, a pressure-sensitive adhesive composition having superior releasing and re-releasing properties and wettability with respect to the wafer, and having an excellent wafer-proofing property; a pressure-sensitive adhesive sheet prepared by using the pressure-sensitive adhesive composition; and a backgrinding method using the pressure-sensitive adhesive sheet can be provided.
    Type: Application
    Filed: June 14, 2017
    Publication date: October 5, 2017
    Applicant: LG CHEM, LTD.
    Inventors: Se Ra KIM, Yoon Jeong BAEK, Jang Soon KIM, Jae Kwan LEE, Hyun Woo PARK
  • Television antenna
    Patent number: D808939
    Type: Grant
    Filed: May 2, 2017
    Date of Patent: January 30, 2018
    Assignee: VOXX International Corporation
    Inventors: Prapan Paul Tinaphong, David A. Benedetti, Chung Hua Hung, Kevin Kei Kwan Lee
  • Television antenna
    Patent number: D809491
    Type: Grant
    Filed: May 2, 2017
    Date of Patent: February 6, 2018
    Assignee: VOXX International Corporation
    Inventors: Prapan Paul Tinaphong, David A. Benedetti, Chung Hua Hung, Kevin Kei Kwan Lee