Abstract: An induction heating cooker includes at least one burner including a coil; a handling portion provided in a predetermined area separated from the burner, and including an input section for receiving a user's control and a first display for displaying information corresponding to the user's control; at least one second display provided in an area separated from the handling portion; and a controller configured to control the second display to display cooking information about the burner.

Abstract: The present disclosure relates to a cooking apparatus and a method of controlling the same, and more particularly, to a technology for reducing stress caused by a current flowing through a diode included in the cooking apparatus.

Abstract: The present invention relates to a pressure-sensitive adhesive composition including a polymer of a monomer mixture containing isobornyl (meth)acrylate, a pressure-sensitive adhesive sheet, and a semiconductor wafer backgrinding method. In the present invention, by using isobornyl (meth)acrylate which is a hard-type monomer and has a low hydrophilic property, a pressure-sensitive adhesive composition having superior releasing and re-releasing properties and wettability with respect to the wafer, and having an excellent wafer-proofing property; a pressure-sensitive adhesive sheet prepared by using the pressure-sensitive adhesive composition; and a backgrinding method using the pressure-sensitive adhesive sheet can be provided.

Abstract: A package-on-package and a package connection system including the same are provided. The package-on-package includes a first semiconductor package including a first semiconductor chip, and a second semiconductor package disposed on the first semiconductor package and including a second semiconductor chip electrically connected to the first semiconductor chip. The first semiconductor chip includes an application processor (AP) including a first image signal processor (ISP), and the second semiconductor chip includes a second image signal processor (ISP).

Abstract: A package-on-package and a package connection system including the same are provided. The package-on-package includes a first semiconductor package including a first semiconductor chip, and a second semiconductor package disposed on the first semiconductor package and including a second semiconductor chip electrically connected to the first semiconductor chip. The first semiconductor chip includes an application processor (AP) including a first image signal processor (ISP), and the second semiconductor chip includes a second image signal processor (ISP).

Abstract: The present invention relates to a pilot tone generating method and apparatus of an orthogonal frequency division multiple access system and method, and a channel estimation method and apparatus using the same. The channel estimation apparatus includes a pilot tone extracting unit for extracting a pilot tone, which is inserted within a frame with data tone, masked with an orthogonal code; a pilot tone unmasking unit for unmasking of the pilot tone extracted from the pilot tone extracting unit by using an orthogonal code information; and a channel estimation operating unit for estimating a channel by calculating an average of the pilot tones which is unmasked in the unmasking unit.

Abstract: The present invention relates to a pilot tone generating method and apparatus of an orthogonal frequency division multiple access system and method, and a channel estimation method and apparatus using the same. The channel estimation apparatus includes a pilot tone extracting unit for extracting a pilot tone, which is inserted within a frame with data tone, masked with an orthogonal code; a pilot tone unmasking unit for unmasking of the pilot tone extracted from the pilot tone extracting unit by using an orthogonal code information; and a channel estimation operating unit for estimating a channel by calculating an average of the pilot tones which is unmasked in the unmasking unit.

Abstract: The present invention relates to a pilot tone generating method and apparatus of an orthogonal frequency division multiple access system and method, and a channel estimation method and apparatus using the same. The channel estimation apparatus includes a pilot tone extracting unit for extracting a pilot tone, which is inserted within a frame with data tone, masked with an orthogonal code; a pilot tone unmasking unit for unmasking of the pilot tone extracted from the pilot tone extracting unit by using an orthogonal code information; and a channel estimation operating unit for estimating a channel by calculating an average of the pilot tones which is unmasked in the unmasking unit.

Abstract: The present invention relates to a pilot tone generating method and apparatus of an orthogonal frequency division multiple access system and method, and a channel estimation method and apparatus using the same. The channel estimation apparatus includes a pilot tone extracting unit for extracting a pilot tone, which is inserted within a frame with data tone, masked with an orthogonal code; a pilot tone unmasking unit for unmasking of the pilot tone extracted from the pilot tone extracting unit by using an orthogonal code information; and a channel estimation operating unit for estimating a channel by calculating an average of the pilot tones which is unmasked in the unmasking unit.

Abstract: A semiconductor package includes: a core structure having first and second surfaces and having first and second through-holes; a first semiconductor chip embedded in the core structure and having first and second contacts disposed on two opposing surfaces thereof, respectively; a first wiring layer on the surface of the core structure and connected to the first contact; a second wiring layer on the second surface of the core structure and connected to the second contact; a chip antenna disposed in the first through-hole; a second semiconductor chip in the second through-hole and having a connection pad; a first redistribution layer on the first surface of the core structure and connected to the connection terminal, the connection pad, and the first wiring layer; an encapsulant encapsulating the chip antenna and the second semiconductor chip; and a second redistribution layer on the encapsulant connecting to the second wiring layer.

Abstract: A method to sublimate a wide variety of coatings onto optical lens includes printing a first coating using a sublimation transfer ink onto a sublimation paper, positioning the sublimation paper onto the optical lens to align the sublimation paper to a first surface of the optical lens, placing the sublimation paper thereon, preheating a chamber of a vacuum oven to a predetermined temperature, placing the optical lens into the chamber of the vacuum oven with the first surface of the optical lens facing upward, closing the vacuum oven and setting a predetermined time for heating, heating and vacuuming the chamber of the vacuum oven during about the predetermined time such that the first coating sublimates onto the first surface of the optical lens from the sublimation paper, removing from the vacuum oven and cooling the optical lens having the first coating on its first surface.

Abstract: A power compensator for compensating voltage at a location along a power transmission line, the compensator having a controller for controlling a voltage generated across the compensator, wherein the voltage is controlled to maintain a power transmission line voltage at a value dependent on the power transmission line location.

Abstract: A package-on-package includes a first semiconductor package including a first semiconductor chip and a second semiconductor package, disposed on the first semiconductor package, including a second semiconductor chip electrically connected to the first semiconductor chip. Each of the first and second semiconductor chips includes one or more units. The number of units of the first semiconductor chip is greater than the number of units of the second semiconductor chip. The one or more units of the first semiconductor chip and the one or more units of the second semiconductor chip implement a function of an application processor chip.

Abstract: The present invention relates to a pilot tone generating method and apparatus of an orthogonal frequency division multiple access system and method, and a channel estimation method and apparatus using the same. The channel estimation apparatus includes a pilot tone extracting unit for extracting a pilot tone, which is inserted within a frame with data tone, masked with an orthogonal code; a pilot tone unmasking unit for unmasking of the pilot tone extracted from the pilot tone extracting unit by using an orthogonal code information; and a channel estimation operating unit for estimating a channel by calculating an average of the pilot tones which is unmasked in the unmasking unit.

Abstract: A semiconductor device package-on-package (PoP) includes a first package, a second package, an interposer, a first molding layer, and a second molding layer. The first package includes a first substrate and a first semiconductor chip on the first substrate. The second package is disposed on the first package and includes a second substrate and a second semiconductor chip on the second substrate. The interposer is disposed between the first package and the second package and connects the first package and the second package. A first molding layer fills a space between the first package and the interposer. A second molding layer covers an upper surface of the interposer.

Abstract: The present invention relates to a pilot tone generating method and apparatus of an orthogonal frequency division multiple access system and method, and a channel estimation method and apparatus using the same. The channel estimation apparatus includes a pilot tone extracting unit for extracting a pilot tone, which is inserted within a frame with data tone, masked with an orthogonal code; a pilot tone unmasking unit for unmasking of the pilot tone extracted from the pilot tone extracting unit by using an orthogonal code information; and a channel estimation operating unit for estimating a channel by calculating an average of the pilot tones which is unmasked in the unmasking unit.

Abstract: The present invention relates to a pilot tone generating method and apparatus of an orthogonal frequency division multiple access system and method, and a channel estimation method and apparatus using the same. The channel estimation apparatus includes a pilot tone extracting unit for extracting a pilot tone, which is inserted within a frame with data tone, masked with an orthogonal code; a pilot tone unmasking unit for unmasking of the pilot tone extracted from the pilot tone extracting unit by using an orthogonal code information; and a channel estimation operating unit for estimating a channel by calculating an average of the pilot tones which is unmasked in the unmasking unit.

Abstract: An image display method includes displaying, on a display, an item list that includes items and a cursor that indicates a location of a user input on the display, detecting movement of the user input for moving the cursor; and moving the cursor in response to the detected movement and changing properties of an item among the items according to an overlapping extent of a first virtual area that is set with respect to the cursor and a second virtual area that is set with respect to the item.

Abstract: A bridge embedded interposer and a package substrate and a semiconductor package including the same includes: a connection structure including one or more redistribution layers, a first bridge disposed on the connection structure and including one or more first circuit layers electrically connected to the one or more redistribution layers, a frame disposed around the first bridge on the connection structure and including one or more wiring layers electrically connected to the one or more redistribution layers, and an encapsulant disposed on the connection structure and covering at least a portion of each of the first bridge and the frame.