Abstract: A glass substrate chemical strengthening furnace apparatus includes a bottom portion and a side wall extending from an edge of the bottom portion, where the bottom portion and the side wall define a reaction space; and a plurality of heaters providing heat to the reaction space. The bottom portion includes an inclined portion located at a center and a collection portion disposed between the inclined portion and the side wall, the collection portion is in a groove shape in which an upper surface thereof is further recessed than the inclined portion, and the plurality of heaters includes a bottom heater disposed in the bottom portion or adjacent to the bottom portion.

Abstract: A glass article includes: a glass phase including a first structure in which a silicon atom is covalently bonded to four first oxygen atoms; and a plurality of crystals dispersed in the glass phase. The crystals include beta-quartz crystals, each of the beta-quartz crystals includes the first structure and a second structure in which aluminum is covalently bonded to four second oxygen atoms, and a crystallinity of the beta-quartz crystals is in a range of about 40% to about 50%.

Abstract: An electronic component-embedded substrate includes an electronic component module having a first surface and a second surface opposite to the first surface, and including a first support member having a first through-portion, a first electronic component disposed in the first through-portion, a first resin layer covering at least a portion of the first electronic component, a second support member disposed on one side of the first support member and having a second through-portion, a second electronic component disposed in the second through-portion and connected to the first electronic component, and a second resin layer covering at least a portion of the second electronic component, an insulating material covering at least a portion of each of a side surface of the electronic component module and the first surface, and a first wiring layer disposed on the insulating material and connected to the first electronic component.

Abstract: An apparatus for manufacturing a glass article includes a plurality of side portions spaced apart from each other; and a plurality of heat supply portions disposed on each of the side portions; where the side portions adjacent to each other are disposed to face each other, and a glass is allowed to be disposed between the adjacent side portions.

Abstract: A glass product includes: a first compressive region at a first surface; a second compressive region at a second surface; and a tensile region between the first and second compression regions. A stress profile of the first compressive region includes a first trend line between the first surface and a first transition point, a second trend line between the first transition point and a second transition point, and a third trend line between the second transition point and a point at a first compression depth from the first surface. A depth from the first surface to the first transition point is 10 ?m or less, a stress at the first transition point is 200 MPa or greater, a depth from the first surface to the second transition point is 50 ?m to 80 ?m, and a stress at the second transition point is 40 MPa to 100 MPa.

Abstract: A substrate-on-substrate structure and an electronic device including the same are provided, and the substrate-on-substrate structure includes: a first printed circuit board having a first side and a second side, opposite to the first side; a second printed circuit board disposed on the second side of the first printed circuit board, and having a first side connected to the second side of the first printed circuit board and a second side opposite to the first side connected to the second side of the first printed circuit board; a first structure disposed on the second side of the first printed circuit board, and disposed around the second printed circuit board; a second structure disposed on the second side of the second printed circuit board; and a third structure disposed on the first and second structures, and connected to each of the first and second structures.

Abstract: A substrate-on-substrate structure and an electronic device including the same are provided, and the substrate-on-substrate structure includes: a first printed circuit board having a first side and a second side, opposite to the first side; a second printed circuit board disposed on the second side of the first printed circuit board, and having a first side connected to the second side of the first printed circuit board and a second side opposite to the first side connected to the second side of the first printed circuit board; a reinforcing structure attached to the first side of the second printed circuit board, and spaced apart from the second side of the first printed circuit board; and an underfill resin disposed between the second side of the first printed circuit board and the first side of the second printed circuit board, and covering at least a portion of the reinforcing structure.

Abstract: The present invention relates to a source driver for a display apparatus, which is capable of removing delay of a DAC (Digital-Analog Converter) and in which a part of gamma lines for providing gamma voltages to the DAC is designed to have a large width and a small resistance value. Before driving a first gamma voltage to a level corresponding to display data, the DAC can select an adjacent gamma line having a small resistance value and drive a second gamma voltage, thereby removing a delay time.

Abstract: A window substrate for protecting an electronic display device includes a first glass substrate having a first thickness, a second glass substrate having a second thickness, and an interlayer disposed between the first glass substrate and the second glass substrate, the interlayer having a third thickness, wherein the sum of the first thickness, the second thickness, and the third thicknesses is equal to or less than about 190 ?m. A display device including a display panel to display an image and a window substrate also is disclosed.

Abstract: A semiconductor package includes: a core structure having first and second surfaces and having first and second through-holes; a first semiconductor chip embedded in the core structure and having first and second contacts disposed on two opposing surfaces thereof, respectively; a first wiring layer on the surface of the core structure and connected to the first contact; a second wiring layer on the second surface of the core structure and connected to the second contact; a chip antenna disposed in the first through-hole; a second semiconductor chip in the second through-hole and having a connection pad; a first redistribution layer on the first surface of the core structure and connected to the connection terminal, the connection pad, and the first wiring layer; an encapsulant encapsulating the chip antenna and the second semiconductor chip; and a second redistribution layer on the encapsulant connecting to the second wiring layer.

Abstract: An electronic component embedded substrate includes a core layer having a first cavity and a second cavity on a first surface and a second surface of the core layer, respectively, the second surface opposite to the first surface in a thickness direction of the core layer; an electronic component disposed in the first cavity; a first insulating material covering at least a portion of the electronic component; a first wiring layer disposed on the first insulating material and connected to the electronic component; a built-in block disposed in the second cavity; and a second insulating material covering at least a portion of the built-in block.

Abstract: An otoscope configured to be used together with a host device, such as a smart phone or other handheld mobile devices. The otoscope can utilize features on the hand-held mobile device, such as camera, software, and display, to allow a user view a person's ear canal and tympanic membrane or eardrum. In some embodiments, the otoscope may comprise a housing; a light source; an speculum; an optical redirection component; one or more image sensors; image-processing circuitry; and communication circuitry configured to transmit the sensed image to the host device.

Abstract: The present invention relates to a pilot tone generating method and apparatus of an orthogonal frequency division multiple access system and method, and a channel estimation method and apparatus using the same. The channel estimation apparatus includes a pilot tone extracting unit for extracting a pilot tone, which is inserted within a frame with data tone, masked with an orthogonal code; a pilot tone unmasking unit for unmasking of the pilot tone extracted from the pilot tone extracting unit by using an orthogonal code information; and a channel estimation operating unit for estimating a channel by calculating an average of the pilot tones which is unmasked in the unmasking unit.

Abstract: The present invention discloses a source driver for a display apparatus, which drives a display panel using display data and senses a pixel signal of the display panel. The source driver may include a sensor and ADC (Analog-digital Converter) which provide the pixel sensing signal obtained by comparing a reference voltage and a pixel signal of the display panel using one buffer at a sensing period, and drive the source signal to the display panel using the buffer at a driving period.

Abstract: A package-on-package includes a first semiconductor package including a first semiconductor chip and a second semiconductor package, disposed on the first semiconductor package, including a second semiconductor chip electrically connected to the first semiconductor chip. Each of the first and second semiconductor chips includes one or more units. The number of units of the first semiconductor chip is greater than the number of units of the second semiconductor chip. The one or more units of the first semiconductor chip and the one or more units of the second semiconductor chip implement a function of an application processor chip.

Abstract: The present disclosure relates to a method of preventing rheumatoid arthritis comprising administering a polynucleotide encoding Ssu72.

Abstract: Methods of calibrating a pH sensor fixed within an enclosed vessel are disclosed. The methods include introducing a buffer into the enclosed vessel, introducing a gas mixture comprising CO2 into the enclosed vessel, measuring a pH signal of the solution, measuring a CO2 concentration of a headspace gas of the solution, and calculating a pH value with a buffer calibration curve. The methods include calculating a calibration parameter with a sensor calibration curve and calibrating the pH sensor with the calibration parameter. Reactor systems are also disclosed. The systems include an enclosed reactor, a pH sensor, a CO2 sensor, a temperature control subsystem, and a controller. Methods of facilitating pH sensor calibration without sampling in a bioreactor system are also disclosed. The methods include providing a controller and providing instructions to operably connect the controller to the pH sensor and the CO2 sensor.

Abstract: Devices and systems of inductive-capacitive (LC) coil-resonators that can be embedded easily inside high-voltage insulation discs are provided. Each LC coil-resonator comprises spiral conductive tracks fabricated or printed in the form of at least two layers of planar spiral windings on electrically non-conductive materials. The planar conductive windings on at least two parallel layers may be connected to form a closed winding. The distributed inductance associated with the planar spiral windings and the distributed capacitance between the layers of the conductive tracks form an equivalent LC coil-resonator. When these LC coil-resonators are embedded in some or all of the insulation discs in a high-voltage insulation rod, they form the relay coil-resonators for wireless power transfer.

Abstract: According to an exemplary embodiment of the present disclosure, a method of manufacturing a display window includes preparing a mother substrate, performing a salt treatment on the mother substrate to form a silicon-rich layer in a surface of the mother substrate to a first depth from the surface of the mother substrate, and removing the silicon-rich layer, wherein the first depth is greater than a depth of any cracks in the surface of the mother substrate, and a ratio of silicon content in the silicon-rich layer to a silicon content in the mother substrate is 1.2 to 1.4.

Abstract: Provided is an authentication method including receiving an authentication request; obtaining authentication data for authenticating a user from at least one of a plurality of external devices as when the authentication request is received; obtaining an authentication score based on the obtained authentication data and reliability information assigned to a type of the authentication data in advance; and determining whether additional authentication is necessary based on the obtained authentication score.