Patents by Inventor Kwan Lee

Kwan Lee has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • MOSFET device and fabrication
    Patent number: 10680097
    Abstract: A semiconductor device, comprising: a substrate; an active gate trench in the substrate; a source polysilicon pickup trench in the substrate; a polysilicon electrode disposed in the source polysilicon pickup trench; a gate pickup trench in the substrate; a first conductive region and a second conductive region disposed in the gate pickup trench, the first conductive region and the second conductive region being separated by oxide, wherein at least a portion of the oxide surrounding the first conductive region in the gate pickup trench is thicker than at least a portion of the oxide under the second conductive region; and a body region in the substrate.
    Type: Grant
    Filed: September 8, 2017
    Date of Patent: June 9, 2020
    Assignee: Alpha and Omega Semiconductor Incorporated
    Inventors: John Chen, Il Kwan Lee, Hong Chang, Wenjun Li, Anup Bhalla, Hamza Yilmaz
  • INPUT SENSING UNIT AND DISPLAY DEVICE INCLUDING THE SAME
    Publication number: 20200159384
    Abstract: An input sensing unit may include the following elements: a first sensing electrode including first sensors and a first connector coupling the first sensors; a second sensing electrode including second sensors and a second connector coupling the second sensors; a first sensing line including first sensing line parts and a third connector coupling the first sensing line parts; a second sensing line; and an insulating layer including a first insulating side and a second insulating side opposite the first insulating side. The first sensing line parts may overlap the first sensors and may be disposed on the first insulating side. The second sensing line may overlap the second sensors and may be disposed on the first insulating side. The first sensors may be disposed on the second insulating side. The second sensors may be disposed on the second insulating side.
    Type: Application
    Filed: September 25, 2019
    Publication date: May 21, 2020
    Inventors: Hyun Wook CHO, Tae Joon KIM, Eun Sol SEO, Eung Kwan LEE, Jae Woo CHOI
  • Sensing circuit of display device for sensing pixel current
    Patent number: 10657902
    Abstract: Disclosed is a sensing circuit of a display device for external compensation of an OLED. The sensing circuit includes a current receiving unit configured to receive a pixel current containing a leakage current, convert the pixel current at a preset current ratio, and output the converted pixel current; a current source unit; a current sinking unit; a current detection unit; and a detection signal output unit configured to sample an offset voltage corresponding to the leakage current using the detected current.
    Type: Grant
    Filed: August 11, 2017
    Date of Patent: May 19, 2020
    Assignee: Silicon Works Co., Ltd.
    Inventors: Jae Kwan Lee, Dong Hyun Hwang, Hyun Ho Kim
  • SOURCE DRIVER
    Publication number: 20200118484
    Abstract: The present invention discloses a source driver that drives a source driver. The source driver is configured in such a manner that a source driving module for driving display data and a conversion module for converting a sensing signal of a display panel into sensing data share components thereof. Thus, the area of the source driver can be reduced.
    Type: Application
    Filed: December 11, 2019
    Publication date: April 16, 2020
    Applicant: Silicon Works Co., Ltd.
    Inventors: Jae Kwan Lee, Jong Keun Hwang
  • Package substrate for a semiconductor package having landing pads extending toward a through-hole in a chip mounting region
    Patent number: 10607905
    Abstract: A semiconductor package includes a package substrate including at least one through-hole in a chip mounting region, a plurality of wiring patterns at a top surface of the package substrate. The wiring patterns include respective extension portions and respective landing pads. At least some of the landing pads obliquely extend toward the through-hole. Conductive bumps are formed on corresponding landing pads to connect to a semiconductor chip mounted on the chip mounting region of the package substrate. A molding material extends between the top surface of the package substrate and the semiconductor chip and fills the through-hole.
    Type: Grant
    Filed: June 14, 2019
    Date of Patent: March 31, 2020
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Baek Ki, Tark-Hyun Ko, Kun-Dae Yeom, Yong-Kwan Lee, Keun-Ho Jang
  • Humidity Control in Chemical Reactors
    Publication number: 20200040298
    Abstract: Control of humidity in chemical reactors, and associated systems and methods, are generally described. In certain embodiments, the humidity within gas transport conduits and chambers can be controlled to inhibit unwanted condensation within gas transport pathways. By inhibiting condensation within gas transport pathways, clogging of such pathways can be limited (or eliminated) such that transport of gas can be more easily and controllably achieved. In addition, strategies for purging condensed liquid from chemical reactor systems are also described.
    Type: Application
    Filed: October 16, 2019
    Publication date: February 6, 2020
    Inventors: Shireen Goh, Rajeev Jagga Ram, Kevin Shao-Kwan Lee, Michelangelo Canzoneri, Horst Blum
  • SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME
    Publication number: 20200043820
    Abstract: A semiconductor package includes a package substrate, at least one semiconductor chip mounted on the package substrate, and a molding member that surrounds the at least one semiconductor chip. The molding member includes fillers. Each of the fillers includes a core and a coating layer that surrounds the core. The core includes a non-electromagnetic material and the coating layer includes an electromagnetic material. The molding member includes regions respectively have different distributions of the fillers.
    Type: Application
    Filed: March 19, 2019
    Publication date: February 6, 2020
    Applicant: Samsung Electronics Co., Ltd.
    Inventors: Jun-young OH, Hyun-ki KIM, Sang-soo KIM, Seung-hwan KIM, Yong-kwan LEE
  • SOURCE DRIVER FOR DISPLAY APPARATUS
    Publication number: 20200035143
    Abstract: The present invention relates to a source driver for a display apparatus, which is capable of removing delay of a DAC (Digital-Analog Converter) and in which a part of gamma lines for providing gamma voltages to the DAC is designed to have a large width and a small resistance value. Before driving a first gamma voltage to a level corresponding to display data, the DAC can select an adjacent gamma line having a small resistance value and drive a second gamma voltage, thereby removing a delay time.
    Type: Application
    Filed: October 3, 2019
    Publication date: January 30, 2020
    Applicant: SILICON WORKS CO., LTD.
    Inventor: Jae Kwan LEE
  • Source driver
    Patent number: 10540924
    Abstract: The present invention discloses a source driver that drives a source driver. The source driver is configured in such a manner that a source driving module for driving display data and a conversion module for converting a sensing signal of a display panel into sensing data share components thereof. Thus, the area of the source driver can be reduced.
    Type: Grant
    Filed: January 19, 2017
    Date of Patent: January 21, 2020
    Assignee: Silicon Works Co., Ltd
    Inventors: Jae Kwan Lee, Jong Keun Hwang
  • Touch sensor
    Patent number: 10534467
    Abstract: Disclosed is a touch sensor, including: first sensing patterns extended in a first direction and arranged in a second direction crossing the first direction, in which each of the first sensing patterns includes: first variable resistive patterns arranged in the first direction; and first conductive patterns connecting the first variable resistive patterns, and lengths of the first variable resistive patterns in the first direction are increased in the second direction.
    Type: Grant
    Filed: July 6, 2017
    Date of Patent: January 14, 2020
    Assignee: Samsung Display Co., Ltd.
    Inventors: Jun Young Ko, Tae Joon Kim, Sang Kook Kim, Eung Kwan Lee, Hyun Wook Cho, Eun Sol Seo
  • ELECTRONIC DEVICE DETECTING PRIVILEGE ESCALATION OF PROCESS, AND STORAGE MEDIUM
    Publication number: 20190377866
    Abstract: An electronic device is disclosed. The electronic device may include a memory, and a processor electrically connected with the memory. The processor may be configured to install an application, allocate identification information, which is included in a preset range, to the installed application, store, at a first address of the memory, the identification information for indicating access privilege to a system resource, monitor the first address during running of a first process of the application, and terminate the first process, when the identification information stored at the first address is not included in the preset range. Moreover, various embodiment found through the disclosure are possible.
    Type: Application
    Filed: December 29, 2017
    Publication date: December 12, 2019
    Inventors: Jin Mo YANG, Jung Yoon KIM, Hee Kwan LEE
  • PACKAGE-ON-PACKAGE TYPE SEMICONDUCTOR PACKAGE AND METHOD FOR MANUFACTURING THE SAME
    Publication number: 20190363073
    Abstract: A semiconductor device package-on-package (PoP) includes a first package, a second package, an interposer, a first molding layer, and a second molding layer. The first package includes a first substrate and a first semiconductor chip on the first substrate. The second package is disposed on the first package and includes a second substrate and a second semiconductor chip on the second substrate. The interposer is disposed between the first package and the second package and connects the first package and the second package. A first molding layer fills a space between the first package and the interposer. A second molding layer covers an upper surface of the interposer.
    Type: Application
    Filed: October 22, 2018
    Publication date: November 28, 2019
    Inventors: Min Gi HONG, Yong Kwan LEE
  • Method for detecting defects of glass substrates
    Patent number: 10481053
    Abstract: A method of detecting defects of a glass substrate includes cutting a glass mother substrate into a plurality of glass substrates, penetrating ions into an incision surface of the glass substrate to visualize defects of the incision surface, and photographing the defects of the incision surface to determine a bending strength of the glass substrate based on a size of the defects.
    Type: Grant
    Filed: November 17, 2017
    Date of Patent: November 19, 2019
    Assignee: Samsung Display Co., Ltd.
    Inventors: Cheol Min Park, Jeong Woo Park, Seung Kim, Seung Ho Kim, Hoi Kwan Lee, Woo Jin Cho, Hee Kyun Shin, Hyun Joon Oh
  • Humidity control in chemical reactors
    Patent number: 10472602
    Abstract: Control of humidity in chemical reactors, and associated systems and methods, are generally described. In certain embodiments, the humidity within gas transport conduits and chambers can be controlled to inhibit unwanted condensation within gas transport pathways. By inhibiting condensation within gas transport pathways, clogging of such pathways can be limited (or eliminated) such that transport of gas can be more easily and controllably achieved. In addition, strategies for purging condensed liquid from chemical reactor systems are also described.
    Type: Grant
    Filed: October 25, 2013
    Date of Patent: November 12, 2019
    Assignees: MASSACHUSETTS INSTITUTE OF TECHNOLOGY, Sanofi
    Inventors: Shireen Goh, Rajeev Jagga Ram, Kevin Shao-Kwan Lee, Michelangelo Canzoneri, Horst Blum
  • Source driver for display apparatus
    Patent number: 10467942
    Abstract: The present invention relates to a source driver for a display apparatus, which is capable of removing delay of a DAC (Digital-Analog Converter) and in which a part of gamma lines for providing gamma voltages to the DAC is designed to have a large width and a small resistance value. Before driving a first gamma voltage to a level corresponding to display data, the DAC can select an adjacent gamma line having a small resistance value and drive a second gamma voltage, thereby removing a delay time.
    Type: Grant
    Filed: January 19, 2017
    Date of Patent: November 5, 2019
    Assignee: SILICON WORKS CO., LTD.
    Inventor: Jae Kwan Lee
  • Method, apparatus and system for secure data communication
    Patent number: 10454904
    Abstract: The present disclosure relates to technologies for a sensor network, machine-to-machine (M2M) communication, machine type communication (MTC), and an Internet of Things (IoT) network. The present disclosure may be used in intelligence services based on such technologies (smart homes, smart buildings, smart cities, smart cars or connected cars, healthcare, digital education, retail business, and security and safety-related services). Provided is a method of transmitting encrypted data for preventing identification of transmitting and receiving devices, from a first device to a second device, the method including: generating an encryption key for encrypting data; generating key identification information by using the generated encryption key and encrypting the data; and transmitting a data set including the encrypted data and the key identification information to the second device.
    Type: Grant
    Filed: March 24, 2017
    Date of Patent: October 22, 2019
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Mi-suk Huh, Hee-kwan Lee, Kwang-pyo Choi, Chan-yul Kim, Seog-chung Seo
  • PACKAGE SUBSTRATE FOR SEMICONDUCTOR PACKAGE, SEMICONDUCTOR PACKAGE INCLUDING THE SAME AND METHOD OF MANUFACTURING THE SAME
    Publication number: 20190295909
    Abstract: A semiconductor package includes a package substrate including at least one through-hole in a chip mounting region, a plurality of wiring patterns at a top surface of the package substrate. The wiring patterns include respective extension portions and respective landing pads. At least some of the landing pads obliquely extend toward the through-hole. Conductive bumps are formed on corresponding landing pads to connect to a semiconductor chip mounted on the chip mounting region of the package substrate. A molding material extends between the top surface of the package substrate and the semiconductor chip and fills the through-hole.
    Type: Application
    Filed: June 14, 2019
    Publication date: September 26, 2019
    Inventors: Baek KI, Tark-Hyun KO, Kun-Dae YEOM, Yong-Kwan LEE, Keun-Ho JANG, Sang Jin HYUN
  • Key sharing method and device
    Patent number: 10419927
    Abstract: Provided is a method, performed by a first device, of sharing a key, the method including: determining a communication method for exchanging a key between the first device and a second device, based on pre-set channel ranking information; receiving a key of the second device from the second device by using the determined communication method; and authenticating the received key of the second device.
    Type: Grant
    Filed: June 17, 2015
    Date of Patent: September 17, 2019
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Mi-suk Huh, Hee-kwan Lee, Seog-chung Seo
  • Television antenna
    Patent number: D862426
    Type: Grant
    Filed: July 8, 2016
    Date of Patent: October 8, 2019
    Assignee: VOXX International Corporation
    Inventors: David Anthony Benedetti, Kevin Kei Kwan Lee
  • Kiosk
    Patent number: D883278
    Type: Grant
    Filed: October 10, 2018
    Date of Patent: May 5, 2020
    Assignee: NCR Corporation
    Inventors: Rafael Yepez, Kwan Lee