Abstract: In a method of fabricating a cover window, the method includes: forming, on a glass article having a flat upper surface, a mask layer including water glass and a recess portion having a partially recessed upper surface; and etching the mask layer and the glass article to form a cover window having a partially recessed upper surface.

Abstract: A semiconductor package includes a first substrate, a first semiconductor chip disposed on the first substrate, a second substrate disposed on the first semiconductor chip, a second semiconductor chip disposed on the second substrate, and a mold layer disposed between the first substrate and the second substrate. The second substrate includes a recess formed at an edge, the mold layer fills the recess, and the recess protrudes concavely inward from the edge of the second substrate toward a center of the second substrate.

Abstract: Disclosed is a drum printing apparatus including: a vacuum drum rotatably supported and coupled to a base and including a drum body shaped like a drum a printing head unit configured to form a set image including a text and a picture in the vacuum drum; a clamping unit configured to perform unclamping for mounting paper from a paper feeder to the drum body and clamping for holding and pressing paper to the drum body; and a cam unit coupled to the base and configured to operate being interlocked with the clamping unit, the clamping unit including a clamping knife coupled to a knife rotating-shaft and configured to be rotatable between a clamping position for pressing paper and an unclamping position for separating from paper, and a pair of clamping brackets coupled to opposite ends of the knife rotating-shaft and configured to be interlocked with the cam unit.

Abstract: Provided are a display apparatus and a display method. The display apparatus includes: a display configured to provide a plurality of item areas each of which displays at least a part of an item list including a plurality of items, wherein the display provides at least one item area, among the plurality of item areas, as a closed item area and provides at least one item area, among the plurality of item areas, as an open item area; and a controller configured to control the display to, in response to an input of a control apparatus that selects the closed item area, display at least some items of an item list corresponding to the closed item area on the open item area and to display at least some items of an item list corresponding to the open item area on the closed item area.

Abstract: An input sensing unit may include the following elements: a first sensing electrode including first sensors and a first connector coupling the first sensors; a second sensing electrode including second sensors and a second connector coupling the second sensors; a first sensing line including first sensing line parts and a third connector coupling the first sensing line parts; a second sensing line; and an insulating layer including a first insulating side and a second insulating side opposite the first insulating side. The first sensing line parts may overlap the first sensors and may be disposed on the first insulating side. The second sensing line may overlap the second sensors and may be disposed on the first insulating side. The first sensors may be disposed on the second insulating side. The second sensors may be disposed on the second insulating side.

Abstract: A semiconductor package includes a package substrate, at least one semiconductor chip mounted on the package substrate, and a molding member that surrounds the at least one semiconductor chip. The molding member includes fillers. Each of the fillers includes a core and a coating layer that surrounds the core. The core includes a non-electromagnetic material and the coating layer includes an electromagnetic material. The molding member includes regions respectively have different distributions of the fillers.

Abstract: There is provided a semiconductor package capable of preventing damage to an interposer to improve reliability. The semiconductor package includes a first substrate including a first insulating layer and first conductive patterns, an interposer disposed on a top surface of the first substrate and including a second insulating layer and second conductive patterns, first connecting members in contact with the top surface of the first substrate and a bottom surface of the interposer, and supporting members including solder parts, which are in contact with the top surface of the first substrate and the bottom surface of the interposer, and core parts, which are disposed in the solder parts and include a different material from the solder parts. The first connecting members electrically connect the first conductive patterns and the second conductive patterns, and the supporting members do not electrically connect the first conductive patterns and the second conductive patterns.

Abstract: A window drop test apparatus includes a support protruding in a first direction from the prop, and a guide portion that defines a drop space together with the support, where a drop test is performed through the drop space.

Abstract: An electronic component-embedded substrate includes an electronic component module having a first surface and a second surface opposite to the first surface, and including a first support member having a first through-portion, a first electronic component disposed in the first through-portion, a first resin layer covering at least a portion of the first electronic component, a second support member disposed on one side of the first support member and having a second through-portion, a second electronic component disposed in the second through-portion and connected to the first electronic component, and a second resin layer covering at least a portion of the second electronic component, an insulating material covering at least a portion of each of a side surface of the electronic component module and the first surface, and a first wiring layer disposed on the insulating material and connected to the first electronic component.

Abstract: A substrate-on-substrate structure and an electronic device including the same are provided. The substrate-on-substrate structure includes: a first printed circuit board having a first side and a second side; a second printed circuit board disposed on the second side of the first printed circuit board, and having a first side connected to the second side of the first printed circuit board and a second side opposite to the first side connected to the second side of the first printed circuit board; a reinforcing structure attached to the first side of the second printed circuit board, and spaced apart from the second side of the first printed circuit board; and an underfill resin disposed between the second side of the first printed circuit board and the first side of the second printed circuit board, and covering at least a portion of the reinforcing structure.

Abstract: A cooking apparatus and a control method thereof, and more particularly, technology for determining the type of vessel placed in the cooking apparatus and controlling power in response to a state change of the placed vessel or a temperature change of a coil. In accordance with one aspect, a cooking apparatus includes: a coil on which a vessel is placed, configured to form a magnetic field upon application of a current; a detection sensor configured to detect a magnitude of an input current applied differently according to a type of the vessel and a magnitude of an input voltage of the cooking apparatus; and a controller configured to determine a type of the placed vessel according to a power value calculated based on the detected input current and input voltage, and to determine a heating mode of the cooking apparatus based on the determined type of vessel.

Abstract: A display device includes a display panel including panel pads adjacent to the side surface of a display panel; connection pads disposed on the side surface of the display panel and connected to the panel pads; and a circuit board disposed on the side surface of the display panel and including lead signal lines directly bonded to the connection pads, wherein the connection pads include a first connection pad, a second connection pad disposed on the first connection pad, and a third connection pad disposed on the second connection pad, and the first connection pad is in contact with corresponding one of the panel pads, and the third connection pad is directly bonded to corresponding one of the lead signal lines.

Abstract: A substrate-on-substrate structure and an electronic device including the same are provided, and the substrate-on-substrate structure includes: a first printed circuit board having a first side and a second side, opposite to the first side; a second printed circuit board disposed on the second side of the first printed circuit board, and having a first side connected to the second side of the first printed circuit board and a second side opposite to the first side connected to the second side of the first printed circuit board; a first structure disposed on the second side of the first printed circuit board, and disposed around the second printed circuit board; a second structure disposed on the second side of the second printed circuit board; and a third structure disposed on the first and second structures, and connected to each of the first and second structures.

Abstract: An image sensing device is disclosed. The image sensing device includes a first unit pixel provided with a first photoelectric conversion element and a first floating diffusion region, a second unit pixel provided with a second photoelectric conversion element and a second floating diffusion region, a third unit pixel provided with a third photoelectric conversion region and a third floating diffusion region, and a fourth unit pixel provided with a fourth photoelectric conversion element and a fourth floating diffusion region. The first to fourth unit pixels are isolated from each other by a first device isolation structure. The first to fourth floating diffusion regions are coupled to a common floating diffusion node through conductive lines.

Abstract: Disclosed are a sensitizing composition for thermal cancer therapy using electromagnetic waves and a method of treating cancer using the composition. The sensitizing composition includes a metal ion, a metal ion-bound material, “metal ion-noncovalently bound apotransferrin” (transferrin), or a metal ion-noncovalently bound apotransferrin derivative. The sensitizing composition enables selective delivery of the metal ion to tumorous tissue when administered in vivo, and thus the generation of heat in tumorous tissue in which the metal ion accumulates is increased upon thermal cancer therapy using electromagnetic waves, thereby maximizing efficacy of thermal cancer therapy using electromagnetic waves in treating cancer.

Abstract: The present disclosure relates to a method for inhibiting a STAT3 activity, and a method for treating inflammatory bowel disease (IBD).

Abstract: A semiconductor package includes a package substrate, at least one semiconductor chip mounted on the package substrate, and a molding member that surrounds the at least one semiconductor chip. The molding member includes fillers. Each of the fillers includes a core and a coating layer that surrounds the core. The core includes a non-electromagnetic material and the coating layer includes an electromagnetic material. The molding member includes regions respectively have different distributions of the fillers.

Abstract: An input sensing unit may include the following elements: a first sensing electrode including first sensors and a first connector coupling the first sensors; a second sensing electrode including second sensors and a second connector coupling the second sensors; a first sensing line including first sensing line parts and a third connector coupling the first sensing line parts; a second sensing line; and an insulating layer including a first insulating side and a second insulating side opposite the first insulating side. The first sensing line parts may overlap the first sensors and may be disposed on the first insulating side. The second sensing line may overlap the second sensors and may be disposed on the first insulating side. The first sensors may be disposed on the second insulating side. The second sensors may be disposed on the second insulating side.

Abstract: A glass article includes a first surface, a second surface which is opposite the first surface, a first compressive region which extends to a first compression depth in a thickness direction from the first surface, a second compressive region which extends to a second compression depth from the second surface, and a tensile region which is disposed between the first compressive region and the second compressive region. A stress profile of the first compressive region includes a first point and a first inflection point, the first inflection point is located between the first point and the first surface, a depth from the first surface to the first point is 45 to 55% of the first compression depth from the first surface, stress at the first point is greater than 50% of compressive stress of the first surface, and a thickness of the glass article is 0.01 to 0.05 mm.

Abstract: A window substrate for protecting an electronic display device, the window substrate includes: a first substrate; a second substrate; and an interlayer having opposed sides disposed between the first substrate and the second substrate, with one side of the interlayer being in contact with the first substrate, and the other side of the interlayer being in contact with the second substrate, wherein the first substrate has a first thickness, the second substrate has a second thickness, and the interlayer has a third thickness, and wherein the sum of the first thickness, the second thickness, and the third thickness is about 190 ?m or less.