Abstract: A micro shutter with an iris function includes a base plate with a transparent portion formed in a circular shape corresponding to an image sensor which allows light to pass through; a plurality of rollup blades which block the light, arranged in a regular polygon at a circumference of the transparent portion on the base plate to cover the transparent portion, and each of the plurality of rollup blades to have a fixing portion fixed to the base plate and a moving portion rolled up toward the fixing portion; and a controller electrically connected with the base plate and the plurality of rollup blades which controls unrolling degrees of the plurality of rollup blades.

Abstract: A multipurpose sensing apparatus and electronic equipment are provided. The sensing apparatus includes planar type compound eyes, each planar type compound eye including ommatidium arranged in a circular arc such that each ommatidium views a contact surface; three-dimensional (3D) compound eyes, each 3D compound eye including ommatidium arranged in an array such that each ommatidium views an area in front of the contact surface; and an image signal processor that is configured to determine a touch position on the contact surface based on image signals transmitted from the planar type compound eyes, and to recognize a motion of an object existing in front of the contact surface based on image signals transmitted from the 3D compound eyes.

Abstract: An imaging device with a plurality of imaging units is provided. The imaging device includes a supporting substrate, a flexible substrate and a movable unit. The supporting substrate is formed with a hard material, and the flexible substrate includes a plurality of imaging units positioned at least in a width direction. The flexible substrate is fixed at a first edge portion with the supporting substrate, while an opposite second edge portion of the flexible substrate is connected with the movable unit. The movable unit moves the opposite second edge portion of the flexible substrate in the width direction and bends or flattens the flexible substrate. A degree of curvature at which the flexible substrate is bent may vary based on a distance by which the movable unit moves in the width direction, so that a field of view (FOV) of the plurality of imaging units may be adjusted.

Abstract: A micro shutter with an iris function includes a base plate with a transparent portion formed in a circular shape corresponding to an image sensor which allows light to pass through; a plurality of rollup blades which block the light, arranged in a regular polygon at a circumference of the transparent portion on the base plate to cover the transparent portion, and each of the plurality of rollup blades to have a fixing portion fixed to the base plate and a moving portion rolled up toward the fixing portion; and a controller electrically connected with the base plate and the plurality of rollup blades which controls unrolling degrees of the plurality of rollup blades.

Abstract: An image pickup device and a manufacturing method thereof are disclosed. The image pickup device includes a printed circuit board (PCB), an image sensor module, an optical lens module, a fluidic lens module, and a shutter module. The image sensor module is disposed over the printed circuit board and electrically connected to interconnection pads on the PCB. The optical lens module is disposed over the image sensor module and includes one or more lenses. The fluidic lens module is disposed over the optical lens module, has a variable focus and is electrically connected to interconnection pads on the PCB. The shutter module is disposed over the fluidic lens module, and is electrically connected to remaining interconnection pads on the PCB. The fluidic lens module and the shutter module may be connected to the interconnection pads through bumped plate springs.

Abstract: An image sensor module having a sensor chip closely adhered on a concave surface and a fabrication method thereof are disclosed. The image sensor module includes at least one sensor chip, at least one sensor chip-mounting structure comprising a substrate and a polymer layer formed on the substrate, the polymer layer having an concave surface formed on an upper part thereof by a polymer molding method, so that the sensor chip is bent and bonded on the concave surface, and at least one lens fixed on the at least one sensor chip-mounting structure above the sensor chip.

Abstract: Provided are a wafer-level lens module and an image pickup module including the same. The wafer lens module includes a plurality wafer-scale lenses. At least one of the plurality of wafer-scale lenses, such as a wafer-scale lens positioned toward an object side, includes a substrate and a glass lens element formed on one side of the substrate. The glass lens element may be a one-sided lens or a double-sided lens. When the glass lens is a double-sided lens, the substrate may have a through hole. The remaining wafer-scale lenses each include a substrate and polymer lens elements made of UV curable polymer and formed on both sides of the substrate. Also, spacers are interposed between the wafer-scale lenses, along the edge portions of the substrates, so as to maintain predetermined intervals between the wafer-scale lenses.

Abstract: A packaging chip formed with plural wafers. The packaging chip includes plural wafers stacked in order and plural interconnection electrodes directly connecting the plural wafers from an upper surface of an uppermost wafer of the plural wafers to the other wafers. At least one or more of the plural wafers mounts a predetermined circuit device thereon. Further, at least one or more wafers of the plural wafers have a cavity of a predetermined size. Meanwhile, the packaging chip further includes plural pads independently arranged on the upper surface of the uppermost wafer one another and electrically connected to the plural interconnection electrodes respectively. Accordingly, the present invention can enhance the performance and reliability of a packaging chip and improve fabrication yield.

Abstract: Micro lens manufacturing apparatus, a micro lens manufacturing method, a micro lens, and a camera module employing the micro lens are provided. First mold is manufactured in correspondence with a first lens profile of a lens element. Second mold is manufactured in correspondence with a second lens profile of the lens element. Second mold is aligned on a surface of a lens substrate having a hollow hole formed thereon. Material for the lens element is supplied into the hollow hole of the lens substrate. First mold is aligned on the other surface of the lens substrate having the hollow hole and compressed to form the first and second profiles of the lens element. Formed lens element hardened. First and second molds are separated from each other. Therefore, time and cost for manufacturing the micro lens are reduced, and the accurate alignment between the first and second lens profiles is achieved.

Abstract: Micro-shutter device applicable to display devices including a flexible display device and method of manufacturing same are provided. Micro-shutter device includes membrane. Frame including receiving hole in its center portion is bonded to membrane. Transparent substrate is bonded to frame to encapsulate optical fluid received in receiving hole. Actuator varies refractive power produced by change in curvature of fluid lens formed in the center portion of the receiving hole due to bending of a periphery of the fluid lens. A reflector is disposed to correspond to the fluid lens and be spaced apart from the membrane, such that light intensity transferred to a user is adjusted depending on the refractive power produced by a change in curvature of the fluid lens. Therefore, the device has improved optical efficiency compared to using liquid crystal and a polarizing film, and can have a flexible structure for application to a flexible display device.

Abstract: A fuel supply apparatus of a liquefied gas carrier includes: a compressor for compressing gas fuel into a high pressure; a compressed gas storage tank being filled with the compressed high-pressure gas fuel, for storing the gas fuel; and a decompressor for decompressing the high-pressure gas fuel drawn from the compressed gas storage tank into a pressure suitable to be used in a propulsion system, to supply fuel to the propulsion system. The gas fuel is at least one of a natural boiled-off gas which is naturally evaporated in the cargo tank, a forced boiled-off gas which is artificially evaporated, and a gas additionally supplied for the use of fuel. Further, the compressor is a multistage high-pressure compressor and the decompressor is a multistage decompressor.

Abstract: An image sensor module capable of facilitating an electrical and mechanical connection of an electric component and a fabrication thereof are disclosed.

Abstract: A method of manufacturing a micro-element package which can reduce a manufacturing cost and improve productivity by simplifying its structure and manufacturing process, and also can make contributions to miniaturization and thinness, and the micro-element package are provided. The method of the micro-element package including: providing a substrate having a micro-element on its top surface and a transparent cover having a groove on its bottom surface; attaching the transparent cover on the substrate, wherein the bottom surface of the transparent cover where the groove is formed faces the micro-element; exposing the groove by selectively eliminating the transparent cover; and dicing the substrate along the exposed groove.

Abstract: An image sensor and a method of manufacturing the image sensor, wherein the image sensor can electrically connect a light receiving portion and a printed circuit board (PCB) including circuits by forming holes and filling the holes with a conductive material, without using a wire for the electrical connection between the light receiving portion and the PCB. The light receiving portion converts lights into electrical signals and the PCB electrically processes signals. That is, since a distance for a wire between a sealing structure and because a filter is unnecessary, a thickness may be reduced. Also, since a space for wire bonding is unnecessary on the outside of an image sensor, a fill factor may increase. Also, since a process that may cause contaminates is removed, average yield may increase and production cost may decrease. The manufacturing productivity may be improved.

Abstract: An image pickup device includes a sensor substrate having image sensors arranged in its image pickup region in the form of a matrix. An interlayer insulating film layer is formed below a bottom of the sensor substrate. The interlayer insulating film layer includes wiring layers to construct an electric circuit. The wiring layer is electrically connected with the image sensors. A support substrate is attached on a bottom of the interlayer insulating film layer. The support substrate has contact electrodes formed in via holes. A lens layer is formed over the top surface of the sensor substrate to be opposite to the interlayer insulating film layer. A light-transmitting member is formed over the lens layer.

Abstract: A micro-element package which can reduce manufacturing costs and can be advantageous for mass production due to simplifying its structure and manufacturing process, and also can facilitate miniaturization and promote thinness, and a method of manufacturing the micro-element package. The micro-element package includes: a substrate having a micro-element on its top surface and a comparatively thin surrounding portion provided around the micro-element; and a circuit board that is electrically connected to the micro-element by utilizing the surrounding portion as a medium.

Abstract: An optical lens is provided. The optical lens provides miniaturization and thin size, and reduces the cost and improves productivity by simplifying the structure and manufacturing process. The optical lens includes a light-transmitting substrate with a lens chamber and a fluidic chamber that are connected with each other. The optical lens also includes a light-transmitting elastic film which seals the lens chamber, a buffer elastic film which seals the fluidic chamber, and an actuator on the buffer elastic film which corresponds to the fluidic chamber, and varies the volume of the fluidic chamber to vary a pressure acting on the light-transmitting elastic film.

Abstract: A wafer level packaging cap and method thereof for a wafer level packaging are provided. The wafer level packaging cap covering a device wafer with a device thereon, includes a cap wafer having on a bottom surface a cavity providing a space for receiving the device, and integrally combined with the device wafer, a plurality of metal lines formed on the bottom surface of the cap wafer to correspond to a plurality of device pads formed on the device wafer to be electrically connected to the device, a plurality of buffer portions connected to the plurality of metal lines and comprising a buffer wafer with a plurality of grooves and a metal filled in the plurality of grooves, a plurality of connection rods electrically connected to the plurality of buffer portions and penetrating the cap wafer from a top portion of the buffer portion, and a plurality of cap pads formed on a top surface of the cap wafer and electrically connected to a plurality of connection rods.

Abstract: An image sensor module capable of facilitating an electrical and mechanical connection of an electric component and a fabrication thereof are disclosed.

Abstract: A micro shutter with an iris function includes a base plate with a transparent portion formed in a circular shape corresponding to an image sensor which allows light to pass through; a plurality of rollup blades which block the light, arranged in a regular polygon at a circumference of the transparent portion on the base plate to cover the transparent portion, and each of the plurality of rollup blades to have a fixing portion fixed to the base plate and a moving portion rolled up toward the fixing portion; and a controller electrically connected with the base plate and the plurality of rollup blades which controls unrolling degrees of the plurality of rollup blades.