Patents by Inventor Kyu-in Han

Kyu-in Han has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240153563
    Abstract: A semiconductor memory device includes a source layer, a channel structure, gate electrodes on the source layer and spaced apart on a sidewall of the channel structure, and a common source line. The gate electrodes include a first word line group including first and second gate electrodes and a second word line group including third and fourth gate electrodes. The semiconductor memory device, in response to a voltage of the common source line reaching a target voltage, causes an inhibition voltage to be applied to the second word line group and an erase voltage to be applied to the first word line group in a first erase operation interval, and causes the inhibition voltage to be applied to the first word line group and the erase voltage to be applied to the second word line group in a second erase operation interval.
    Type: Application
    Filed: December 19, 2023
    Publication date: May 9, 2024
    Applicant: Samsung Electronics Co., Ltd.
    Inventors: Hye Ji LEE, Jin-Kyu KANG, Rae Young LEE, Se Jun PARK, Jae Duk LEE, Gu Yeon HAN
  • Publication number: 20240149819
    Abstract: The present disclosure relates to an interior material for a vehicle and a method for molding the interior material for the vehicle, and more specifically the method for molding an interior material for a vehicle according to the present disclosure includes heating a skin inserted into an upper end heater and a lower end heater spaced apart from each other; preforming the heated skin using an upper mold having a mold temperature set to have a set shape and a lower mold having a second mold temperature; and pressing the preformed skin and a core using a 1-1 mold and a 1-2 mold having set mold temperatures.
    Type: Application
    Filed: January 16, 2024
    Publication date: May 9, 2024
    Applicants: HYUNDAI MOTOR COMPANY, Kia Corporation, KBI Dongkook Ind. Co., Ltd.
    Inventors: Jae Hyun An, In Soo Han, Woo Hyun Lim, Kyu Ha Yoo, Dong II Son, Dong Hyuk Choi, Chang Woo Kang, Chang Bok Park, Wan Gyu Choi
  • Publication number: 20240142254
    Abstract: Disclosed is an image processing method. The method includes the steps of receiving an image obtained from a plurality of vehicles positioned on a road, storing the received images according to acquisition information of the received images; determining a reference image and a target image based on images having the same acquisition information among the stored images, performing an image registration using a plurality of feature points extracted from each of the determined reference image and target image, performing a transparency process for each of the reference image and the target image performed with the image registration, extracting static objects from the transparency-processed image, and comparing the extracted static objects with objects on an electronic map pre-stored to updating the electronic map data, when the objects on the electronic map data pre-stored are different from the extracted static objects.
    Type: Application
    Filed: January 10, 2024
    Publication date: May 2, 2024
    Applicant: THINKWARE CORPORATION
    Inventors: Ki Wook Lee, Hye Kyung Byun, Tae Kyu Han, Shin Hyoung Kim, Jeong Kyu Kang
  • Publication number: 20240145388
    Abstract: An integrated circuit device includes a substrate and a first electrically insulating layer on the substrate. An electrically conductive contact plug is provided, which extends at least partially through the first electrically insulating layer. The contact plug includes a protrusion having a top surface that is spaced farther from the substrate relative to a top surface of a portion of the first electrically insulating layer extending adjacent the contact plug. An electrically conductive line is provided with a terminal end, which extends on a first portion of the protrusion. A second electrically insulating layer is provided, which extends on a second portion of the protrusion and on the first electrically insulating layer. The second electrically insulating layer has a sidewall, which extends opposite a sidewall of the terminal end of the electrically conductive line.
    Type: Application
    Filed: January 10, 2024
    Publication date: May 2, 2024
    Inventors: Won Kyu HAN, Myeongsoo LEE, Rakhwan KIM, Woojin JANG
  • Patent number: 11972703
    Abstract: A foldable display device includes a display module including a first non-folding portion, a second non-folding portion, and a first folding portion between the first non-folding portion and the second non-folding portion, a first support member on a lower surface of the display module, the first support member including a first support portion supporting the first non-folding portion, a second support portion supporting the second non-folding portion, and a first opening pattern overlapping the first folding portion, and including a glass material, and a second support member under the first support member and supporting the display module.
    Type: Grant
    Filed: August 6, 2021
    Date of Patent: April 30, 2024
    Assignee: SAMSUNG DISPLAY CO., LTD.
    Inventors: Hyunjun Cho, Kyu Young Kim, Yong-Kwan Kim, Hansun Ryou, Yonghyuck Lee, Hongkwan Lee, Sohra Han
  • Publication number: 20240137024
    Abstract: A ternary logic element including a transistor and a switching element. The transistor includes a channel layer including silicon, an input electrode, an output electrode, and a control electrode. The switching element includes an emitter, a base extending from the emitter, and a collector extending from the base. When a first control voltage is applied to the control electrode, the ternary logic element outputs a first voltage, and when a second control voltage different from the first control voltage is applied to the control electrode, the ternary logic element outputs a second voltage different from the first voltage, and when a third control voltage different from the first control voltage and the second control voltage is applied to the control electrode, the ternary logic element outputs a third voltage different from the first voltage and the second voltage.
    Type: Application
    Filed: August 6, 2023
    Publication date: April 25, 2024
    Applicant: KOREA ADVANCED INSTITUTE OF SCIENCE AND TECHNOLOGY
    Inventors: Yang Kyu CHOI, Joon Kyu HAN
  • Publication number: 20240137059
    Abstract: Methods and devices for limiting the power level of low noise amplifiers (LNA) implemented in radio frequency (RF) receiver front-ends. The described methods are applicable to bypass, low and high gain modes of the LNA. According to the described methods, the decoder allows the signal to be clamped before or after being attenuated. The benefit of such methods is to improve large signal performances (e.g. IIP3, P1dB) of the RF receiver front-end, while still meeting the clamping requirements, or improve (lower) clamped output power, while still meeting large signal performances (e.g. IIP3, P1dB).
    Type: Application
    Filed: October 30, 2023
    Publication date: April 25, 2024
    Inventors: Parvez DARUWALLA, Sung Kyu HAN
  • Patent number: 11955448
    Abstract: Embodiments disclosed herein include electronic packages. In an embodiment, an electronic package comprises a package substrate and a bridge substrate embedded in the package substrate. In an embodiment, first pads are over the package substrate, where the first pads have a first pitch, and second pads are over the bridge substrate, where the second pads have a second pitch that is smaller than the first pitch. In an embodiment, a barrier layer is over individual ones of the second pads. In an embodiment, reflown solder is over individual ones of the first pads and over individual ones of the second pads. In an embodiment, a first standoff height of the reflown solder over the first pads is equal to a second standoff height of the reflown solder over the second pads.
    Type: Grant
    Filed: May 21, 2020
    Date of Patent: April 9, 2024
    Assignee: Intel Corporation
    Inventors: Jung Kyu Han, Hongxia Feng, Xiaoying Guo, Rahul N. Manepalli
  • Patent number: 11951832
    Abstract: A driver assistance system for vehicles, which is capable of preventing driver carelessness from causing a vehicle accident when a vehicle stops while traveling, includes a vehicle sensor unit configured to detect driver state data, a driver assistance unit operated to assist a driver when driver carelessness about vehicle driving is detected when a vehicle stops while traveling, and a control unit configured to identify whether the driver is careless based on the driver state data when the vehicle stops while traveling, and to operate the driver assistance unit when the driver carelessness is detected, preventing the vehicle from driving.
    Type: Grant
    Filed: October 21, 2022
    Date of Patent: April 9, 2024
    Assignees: Hyundai Motor Company, Kia Corporation
    Inventors: Dong Hyeon Woo, Kyeong Keun Kim, Min Kyu Han, Da Som Yang
  • Publication number: 20240114622
    Abstract: An electronic device includes a substrate including a core layer; a cavity formed in the core layer, wherein the cavity includes sidewalls plated with a conductive material; a prefabricated passive electronic component disposed in the cavity; and a cavity sidewall connection providing electrical continuity from the plated cavity sidewalls to a first surface of the substrate and to a second surface of the substrate.
    Type: Application
    Filed: September 29, 2022
    Publication date: April 4, 2024
    Inventors: Kristof Darmawikarta, Srinivas Venkata Ramanuja Pietambaram, Tarek A. Ibrahim, Cary Kuliasha, Siddharth K. Alur, Jung Kyu Han, Beomseok Choi, Russell K. Mortensen, Andrew Collins, Haobo Chen, Brandon C. Marin
  • Publication number: 20240105993
    Abstract: There is provided an additive for secondary battery electrolyte, containing aluminum silicate. The aluminum silicate has a particle size of 200 nm to 20 ?m. The aluminum silicate has a mass ratio of 60 to 70 wt % of oxygen (O), 0.1 to 2.0 wt % of aluminum (Al), and 25 to 35 wt % of silicon (Si). The aluminum silicate has a surface area of 50 to 1,000 m2/g. The aluminum silicate has a pore size of 0.1 to 20 nm.
    Type: Application
    Filed: February 15, 2022
    Publication date: March 28, 2024
    Applicant: GIANT CHEMICAL CO., LTD
    Inventors: Dong Min SEONG, Dong Hyun KIM, Dong Gyun KANG, Dae Uk KIM, Jin Kyu KANG, Seung Yun HAN
  • Publication number: 20240105994
    Abstract: There is provided an additive, containing magnesium silicate, for a secondary battery electrolyte and a preparation method therefor. The magnesium silicate has a mass ratio of 50 to 70 wt % of oxygen (O), 5 to 20 wt % of magnesium (Al), and 15 to 35 wt % of silicon (Si). The magnesium silicate has a surface area of 50 to 500 m2/g. The magnesium silicate has a pore size of 0.1 to 20 nm.
    Type: Application
    Filed: February 15, 2022
    Publication date: March 28, 2024
    Applicant: GIANT CHEMICAL CO., LTD
    Inventors: Dong Min SEONG, Dong Hyun KIM, Dong Gyun KANG, Dae Uk KIM, Jin Kyu KANG, Seung Yun HAN
  • Publication number: 20240097218
    Abstract: Methods and systems for executing tracking and monitoring manufacturing data of a battery are disclosed. One method includes: receiving, by a server system, sensing data of the battery from a sensing system; generating, by the server system, mapping data based on the sensing data; generating, by the server system, identification data of the battery based on the sensing data; generating, by the server system, monitoring data of the battery based on the sensing data, the identification data, and the mapping data; and generating, by the server system, display data for displaying a simulated electrode of the battery on a graphical user interface based on the monitoring data of the battery.
    Type: Application
    Filed: August 31, 2023
    Publication date: March 21, 2024
    Inventors: Min Kyu Sim, Jong Seok Park, Min Su Kim, Jae Hwan Lee, Ki Deok Han, Eun Ji Jo, Su Wan Park, Gi Yeong Jeon, June Hee Kim, Wi Dae Park, Dong Min Seo, Seol Hee Kim, Dong Yeop Lee, Jun Hyo Su, Byoung Eun Han, Seung Huh
  • Patent number: 11935857
    Abstract: Embodiments described herein include electronic packages and methods of forming such packages. An electronic package includes a package substrate, first conductive pads formed over the package substrate, where the first conductive pads have a first surface area, and second conductive pads over the package substrate, where the second conductive pads have a second surface area greater than the first surface area. The electronic package also includes a solder resist layer over the first and second conductive pads, and a plurality of solder resist openings that expose one of the first or second conductive pads. The solder resist openings of the electronic package may include conductive material that is substantially coplanar with a top surface of the solder resist layer. The electronic package further includes solder bumps over the conductive material in the solder resist openings, where the solder bumps have a low bump thickness variation (BTV).
    Type: Grant
    Filed: September 23, 2022
    Date of Patent: March 19, 2024
    Assignee: Intel Corporation
    Inventors: Kristof Darmawaikarta, Robert May, Sashi Kandanur, Sri Ranga Sai Boyapati, Srinivas Pietambaram, Steve Cho, Jung Kyu Han, Thomas Heaton, Ali Lehaf, Ravindranadh Eluri, Hiroki Tanaka, Aleksandar Aleksov, Dilan Seneviratne
  • Publication number: 20240088432
    Abstract: An embodiment sulfur dioxide-based inorganic electrolyte is provided in which the sulfur dioxide-based inorganic electrolyte is represented by a chemical formula M·(A1·Cl(4-x)Fx)z·ySO2. In this formula, M is a first element selected from the group consisting of Li, Na, K, Ca, and Mg, A1 is a second element selected from the group consisting of Al, Fe, Ga, and Cu, x satisfies a first equation 0?x?4, y satisfies a second equation 0?y?6, and z satisfies a third equation 1?z?2.
    Type: Application
    Filed: April 12, 2023
    Publication date: March 14, 2024
    Inventors: Kyu Ju Kwak, Won Keun Kim, Eun Ji Kwon, Samuel Seo, Yeon Jong Oh, Kyoung Han Ryu, Dong Hyun Lee, Han Su Kim, Ji Whan Lee, Seong Hoon Choi, Seung Do Mun
  • Publication number: 20240082240
    Abstract: A composition for preventing and/or treating cytokine release syndrome and a method of prevention and/or treatment of cytokine release syndrome are disclosed. The composition includes an aryl ethene compound, a pharmaceutically acceptable salt thereof, or a solvate thereof, as an active ingredient. The method includes administering the aryl ethene compound, an isomer, a pharmaceutically acceptable salt thereof, or a solvate thereof, in an effective amount to a subject in need thereof. The cytokine release syndrome may be caused by virulent infection. The administration of the compound reduces the pre-inflammatory cytokine levels in the subject.
    Type: Application
    Filed: October 31, 2023
    Publication date: March 14, 2024
    Applicant: NOVMETAPHARMA CO, LTD.
    Inventors: In-Kyu LEE, Jae-Han JEON, Dipanjan CHANDA, Eun Jung CHOI, Hoe Yune JUNG, Heon Jong LEE
  • Publication number: 20240088052
    Abstract: A die assembly is disclosed. The die assembly includes a die, one or more die pads on a first surface of the die and a die attach film on the die where the die attach film includes one or more openings that expose the one or more die pads and that extend to one or more edges of the die.
    Type: Application
    Filed: November 17, 2023
    Publication date: March 14, 2024
    Inventors: Bai NIE, Gang DUAN, Srinivas PIETAMBARAM, Jesse JONES, Yosuke KANAOKA, Hongxia FENG, Dingying XU, Rahul MANEPALLI, Sameer PAITAL, Kristof DARMAWIKARTA, Yonggang LI, Meizi JIAO, Chong ZHANG, Matthew TINGEY, Jung Kyu HAN, Haobo CHEN
  • Publication number: 20240081393
    Abstract: A sidestream smoke removal device and a control method thereof are provided. The sidestream smoke removal device according to some embodiments of the present disclosure may include a housing in which a smoking space is formed, an article insertion portion which is disposed at one end of the housing and forms an opening for insertion of a smoking article into the smoking space, an ignition portion which is configured to ignite the smoking article inserted into the smoking space, a sidestream smoke processing portion which is configured to process sidestream smoke generated from the smoking article inserted into the smoking space, and a heating portion disposed inside the housing to heat the smoking space. The heating portion may heat the smoking space to remove a smell generated due to by-products of smoking, and accordingly, the cleanliness of the sidestream smoke removal device can be improved.
    Type: Application
    Filed: July 11, 2022
    Publication date: March 14, 2024
    Applicant: KT&G CORPORATION
    Inventors: Seung Kyu HAN, Jin Won PARK, Jae Hyun KIM, Tae Heon KIM
  • Patent number: 11928903
    Abstract: There is provided a method for providing driver's driving information of a user terminal device, including accessing a driving information providing server storing data generated in a driving recording device for a vehicle, receiving driving record data including event record data corresponding to a driving-related event of a driver from the driving information providing server, and displaying a driving-related event occurrence location on a map using the received driving record data. The driving-related event may include at least two or more of a lane departure event, a forward collision possibility event, a rear side collision possibility event, a sudden deceleration event, a sudden acceleration event, a sudden stop event, a sudden start event, and a speeding event.
    Type: Grant
    Filed: November 12, 2020
    Date of Patent: March 12, 2024
    Assignee: THINKWARE CORPORATION
    Inventors: Min Suk Kang, Won Jun Heo, Seung Yo Jang, Youn Joo Shin, Tae Kyu Han
  • Publication number: 20240079312
    Abstract: A chip-on-film package may include a film substrate including a chip region and an edge region, a semiconductor chip provided on the chip region and mounted on a top surface of the film substrate, the semiconductor chip including a chip pad adjacent to a bottom surface thereof, an input line and an output line provided on the edge region and disposed on the top surface of the film substrate, a connection terminal interposed between the film substrate and the semiconductor chip, and a redistribution pattern disposed between the semiconductor chip and the connection terminal.
    Type: Application
    Filed: November 9, 2023
    Publication date: March 7, 2024
    Applicant: Samsung Electronics Co., Ltd.
    Inventors: KwanJai LEE, Jae-Min JUNG, Jeong-Kyu HA, Sang-Uk HAN