Abstract: Provided herein are a sidestream smoke removal device and a control method thereof. The sidestream smoke removal device according to some embodiments of the present disclosure includes a housing in which a smoking space is formed, an article insertion portion which is disposed at one end of the housing and forms an opening for insertion of a smoking article into the smoking space, an ignition portion which is configured to ignite the smoking article inserted into the smoking space, a sidestream smoke processing portion which is configured to process sidestream smoke generated from the smoking article inserted into the smoking space, and a cutting portion. The cutting portion may provide a cutting function for the smoking article inserted into the smoking space and thus ensure a convenient, safe extinguishing function.

Abstract: A driver assistance system for vehicles, which is capable of preventing driver carelessness from causing a vehicle accident when a vehicle stops while traveling, includes a vehicle sensor unit configured to detect driver state data, a driver assistance unit operated to assist a driver when driver carelessness about vehicle driving is detected when a vehicle stops while traveling, and a control unit configured to identify whether the driver is careless based on the driver state data when the vehicle stops while traveling, and to operate the driver assistance unit when the driver carelessness is detected, preventing the vehicle from driving.

Abstract: Disclosed are a thermoplastic resin composition for a high-brightness unpainted metallic material that has an excellent impact strength, chemical resistance, and heat resistance and exhibits an excellent metallic texture, and a molded article including the same. The thermoplastic resin composition suitably includes a polycarbonate resin; a first copolymer; a polyester resin; a copolymer having a core-shell structure and having, as a core, one or more rubber polymers selected from the group consisting of a diene-based rubber polymer, an acrylic rubber polymer, and a silicone-based rubber polymer; a heat resistant component including one or more selected from the group consisting of N-phenyl maleimide, a vinyl aromatic compound, and maleic anhydride; and metal particles.

Abstract: An apparatus and method are provided for receiving data by a first transceiver. The method includes receiving information for at least one transmission mode through higher layer signaling from a second transceiver; and receiving data on a first sub-frame based on a first demodulation reference signal (DMRS), if the at least one transmission mode is transmission mode 9 or transmission mode 10 and the first sub-frame is a multimedia broadcast multicast service single frequency network (MBSFN) sub-frame.

Abstract: Various embodiments disclosed relate to methods of making omni-directional semiconductor interconnect bridges. The present disclosure includes semiconductor assemblies including a mold layer having mold material, a first filler material dispersed in the mold material, and a second filler material dispersed in the mold material, wherein the second filler material is heterogeneously dispersed.

Abstract: Disclosed are a high-efficiency integrated power circuit with a reduced number of semiconductor elements and a control method thereof. A high-efficiency integrated power circuit of an integrated converter includes an input port, which is a first port, to which power for driving the integrated converter is input, a non-isolated port, which is a second port, for outputting, to outside the high-efficiency integrated power circuit, an allowable amount of power generated when power input through the input port passes through an inductor, and an isolated port, which is a third port, for conducing remaining power excepting power output through the non-isolated port and for maintaining the conducted remaining power inside the high-efficiency integrated power circuit.

Abstract: Methods and apparatus to reduce defects in interconnects between semiconductor dies and package substrates are disclosed. An apparatus includes a substrate and a semiconductor die mounted to the substrate. The apparatus further includes bumps to electrically couple the die to the substrate. Ones of the bumps have corresponding bases. The bases have a shape that is non-circular.

Abstract: Methods and apparatus to reduce defects in interconnects between semiconductor dies and package substrates are disclosed. An apparatus includes a substrate and a semiconductor die mounted to the substrate. The apparatus further includes an array of bumps to electrically couple the die to the substrate. Each of the bumps have a corresponding base. Different ones of the bases have different widths that vary spatially across the array of bumps.

Abstract: Embodiments disclosed herein include electronic packages with first level interconnects that comprise a first layer. In an embodiment, the electronic package comprises a package substrate and a pad on the package substrate. In an embodiment, the pad comprises copper. In an embodiment, a first layer is over the pad. In an embodiment, the first layer comprises iron. In an embodiment, a solder is over the first layer, and a die is coupled to the package substrate by the solder.

Abstract: Embodiments described herein may be related to apparatuses, processes, and techniques for a dam structure on a substrate that is proximate to a die coupled with the substrate, where the dam decreases the risk of die shift during encapsulation material flow over the die during the manufacturing process. The dam structure may fully encircle the die. During encapsulation material flow, the dam structure creates a cavity that moderates the different flow rates of material that otherwise would exert different pressures the sides of the die and cause to die to shift its position on the substrate. Other embodiments may be described and/or claimed.

Abstract: Embedded glass cores in package substrates and related methods are disclosed herein including an integrated circuit including a substrate having a first side and a second side opposite the first side, a plurality of vias disposed within the substrate to electrically couple corresponding contacts on the first and second sides of the substrate, a glass core surrounding a first via of the plurality of vias, and an organic core surrounding a second via of the plurality of vias, the second via different than the first via.

Abstract: Capacitor pads and methods of manufacturing the same are disclosed herein. An example apparatus disclosed herein includes a substrate to support a die, and a die-side capacitor pad on the substrate, the die-side capacitor pad including a plurality of distinct pad portions, the distinct pad portions spaced apart from one another.

Abstract: Provided is an image processing method. The image processing method includes receiving images acquired from a plurality of vehicles positioned on a road; storing the received images according to acquisition information of the received images; determining a reference image and a target image based on images having the same acquisition information among the stored images; performing an image registration using a plurality of feature points extracted from each of the determined reference image and target image; performing a transparency process for each of the reference image and the target image which are image-registered; extracting static objects from the transparency-processed image; and comparing the extracted static objects with objects on map data which is previously stored and updating the map data when the objects on the map data which is previously stored and the extracted static objects are different from each other.

Abstract: Provided herein are a sidestream smoke removal device and a control method thereof. The sidestream smoke removal device according to some embodiments of the present disclosure includes a housing in which a smoking space is formed, an article insertion portion which is disposed at one end of the housing and forms an opening for insertion of a smoking article into the smoking space, an elastic support portion which is configured to support the smoking article inserted through the article insertion portion, an ignition portion which is configured to ignite the smoking article inserted into the smoking space, and a sidestream smoke processing portion which is configured to process sidestream smoke generated from the smoking article inserted into the smoking space. By elastically supporting an upstream end of the smoking article, the elastic support portion may improve support stability and ignition stability for the smoking article.

Abstract: Embodiments described herein include electronic packages and methods of forming such packages. An electronic package includes a package substrate, first conductive pads formed over the package substrate, where the first conductive pads have a first surface area, and second conductive pads over the package substrate, where the second conductive pads have a second surface area greater than the first surface area. The electronic package also includes a solder resist layer over the first and second conductive pads, and a plurality of solder resist openings that expose one of the first or second conductive pads. The solder resist openings of the electronic package may include conductive material that is substantially coplanar with a top surface of the solder resist layer. The electronic package further includes solder bumps over the conductive material in the solder resist openings, where the solder bumps have a low bump thickness variation (BTV).

Abstract: A method and apparatus are provided for transmitting and receiving control information. A method in a base station includes transmitting, to a terminal, information associated with a resource region carrying a control channel; transmitting, to the terminal, a plurality of values associated with control channel candidates, each of the plurality of values corresponding to each of a plurality of numbers associated with CCEs constituting one control channel candidate, wherein the each of the plurality of values indicates a number of control channel candidates to be monitored by the terminal; determining a set of control channel candidates based on an ID of the terminal and at least one of the plurality of values associated with the control channel candidates; selecting at least one control channel candidate from among the set of control channel candidates; and transmitting the control information to the terminal through the at least one selected control channel candidate in the resource region.

Abstract: Provided herein are a sidestream smoke removal device and a control method thereof. The sidestream smoke removal device according to some embodiments of the present disclosure includes a housing in which a smoking space is formed, an ignition portion which is configured to ignite the smoking article inserted into the smoking space, a sidestream smoke processing portion which is configured to process sidestream smoke generated from the smoking article inserted into the smoking space, a temperature sensor which is configured to measure the temperature of the smoking article inserted into the smoking space, a display which is disposed on an outside of the housing, and a controller which is configured to monitor smoking progress with respect to the smoking article on the basis of the measured temperature and display a monitoring result through the display.

Abstract: A method and apparatus report channel state information (CSI) feedback of a user equipment (UE) in a coordinated multipoint communication system. The method includes identifying, when downlink transmissions to the UE are configured with at least two CSI subframe subsets, an interference measurement resource within one of the CSI subframe subsets belonging to a CSI reference resource. The method also includes using the identified interference measurement resource to derive an interference measurement. The apparatus includes a controller configured to, when downlink transmissions to the UE are configured with at least two CSI subframe subsets, identify an interference measurement resource within one of the CSI subframe subsets belonging to a CSI reference resource. The controller is configured to use the identified interference measurement resource to derive an interference measurement.

Abstract: Methods and devices to support multiple frequency bands in radio frequency (RF) circuits are shown. The described methods and devices are based on adjusting the effective width of a transistor in such circuits by selectively disposing matching transistors in parallel with the transistor. The presented devices and methods can be used in RF circuits including low noise amplifiers (LNAs), RF receiver front-ends or any other RF circuits where input matching to wideband inputs is required.

Abstract: Disclosed are an antimicrobial composition having excellent antimicrobial and anti-fungal properties and improved fingerprint resistance and chemical resistance, and a molded article including the same. The antimicrobial composition includes a combination of an amount of about 45 to 85 wt % of a polycarbonate resin, an amount of about 10 to 36 wt % of a polyester resin, an amount of about 3 to 12 wt % of an impact modifier, an amount of about 0.2 to 2 wt % of an inorganic antimicrobial agent, and an amount of about 1 to 6 wt % of a micro powder including a fluorine-based polymer resin, based on the total weight of the antimicrobial composition.