Abstract: An antenna apparatus includes a patch antenna pattern; a first feed via to feed power to the patch antenna pattern in a non-contact manner on a first side of the patch antenna pattern; and a plurality of feed patterns disposed on the first side of the patch antenna pattern on different levels and overlapping each other, and including at least one feed pattern that is electrically connected to the first feed via, and each having a width greater than a width of the first feed via and a cross-sectional area smaller than a cross-sectional area of the patch antenna pattern.

Abstract: An antenna apparatus includes a feed line; a ground plane surrounding a portion of the feed line; a feed via electrically connected to the feed line and extending from a first side of the feed line; a first end-fire antenna pattern disposed on a first side of at least a portion of the ground plane and spaced apart from the ground plane, and electrically connected to the feed via; a second end-fire antenna pattern disposed on a second side of the feed line opposite the first side of the feed line and spaced apart from the first end-fire antenna pattern; and a core via electrically connecting the first end-fire antenna patterns to the second end-fire antenna pattern.

Abstract: A sterilization module including a light source configured to irradiate ultraviolet light, a board on which the light source is mounted, a protective tube accommodating the board therein and configured to transmit ultraviolet light irradiated from the light source, a first base coupled to one side of the protective tube, and a second base coupled to the other side of the protective tube, in which at least one of the first base and the second base includes an insertion part to be inserted into the protective tube, the insertion part having a first diameter when viewed in a first cross-section perpendicular to a length direction of the protective tube, and a cover part integrally formed on the insertion part and having a second diameter greater than the first diameter in the first cross-section.

Abstract: A method for manufacturing a grain-oriented electrical steel sheet, according to an embodiment of the present invention includes: heating a slab, based on 100 wt % of a total composition thereof, including N at 0.0005 wt % to 0.015 wt %, Ti at 0.0001 wt % to 0.020 wt %, V at 0.0001 wt % to 0.020 wt %, Nb at 0.0001 wt % to 0.020 wt %, B at 0.0001 wt % to 0.020 wt %, and the remaining portion including Fe and other impurities, and then hot rolling it to prepare a hot-rolled steel sheet; annealing the hot-rolled steel sheet; after the hot-rolled steel sheet is annealed, cooling the hot-rolled steel sheet, and then cold rolling it to prepare a cold-rolled steel sheet; decarburization-annealing the cold-rolled steel sheet and then nitriding-annealing it, or simultaneously performing the decarburization-annealing and the nitriding-annealing; and final-annealing the decarburization-annealed and nitriding-annealed steel sheet.

Abstract: A radio frequency filter includes a first conductive pattern; a second conductive pattern connected to a first point of the first conductive pattern and extended; a third conductive pattern connected to a second point of the first conductive pattern and extended to surround a portion of the second conductive pattern; a fourth conductive pattern; a fifth conductive pattern connected to a third point of the fourth conductive pattern and extended; and a sixth conductive pattern connected to a fourth point of the fourth conductive pattern and extended to surround a portion of the fifth conductive pattern. The first conductive pattern extends toward the fourth conductive pattern and the fourth conductive pattern extends toward the first conductive pattern. A distance between the first conductive pattern and the fourth conductive pattern is greater than or equal to a distance between the third conductive pattern and the sixth conductive pattern.

Abstract: A semiconductor device includes a first interlayer dielectric film on a substrate, first and second wires respectively extending in a first direction within the first interlayer dielectric film, the first and second wires being adjacent to each other in a second direction different from the first direction, a hard mask pattern on the first interlayer dielectric film, the hard mask pattern including an opening, and an air gap within the first interlayer dielectric film, the air gap including a first portion overlapping vertically with the opening and a second portion not overlapping with the opening in the first direction.

Abstract: The present invention relates to an insect trap and, more specifically, to an insect trap which uses UV LEDs as light sources for luring insects and is capable of efficiently radiating luring light. The insect trap according to the present invention comprises a UV LED installation part having a plurality of UV LED light sources installed at intervals on the edge of the outer side surface thereof, and a trap part disposed adjacent to the UV LED installation part. The center lines of the ultraviolet light radiation areas of the UV LED light sources installed on the UV LED installation part are arranged substantially radially, extending outward from the center of the insect trap.

Abstract: A semiconductor device includes a lower wiring, an interlayer insulation film above the lower wiring and including a first portion having a first density, and a second portion on the first portion, the first portion and the second portion having a same material, and the second portion having a second density smaller than the first density, an upper wiring in the second portion of the interlayer insulating film, and a via in the first portion of the interlayer insulating film, the via connecting the upper wiring and the lower wiring.

Abstract: A chip antenna module includes: a solder layer disposed on a lower surface of the first dielectric layer; a first patch antenna pattern disposed on upper surface of the first dielectric layer and having a through-hole; a second patch antenna pattern spaced apart from an upper surface of the first patch antenna pattern and having an area less than an area of the first patch antenna pattern; a first feed via extending through the first dielectric layer and electrically connected to the first patch antenna pattern; a second feed via extending through the first dielectric layer and the through-hole, and electrically connected to the second patch antenna pattern; and shielding vias extending through the first dielectric layer, electrically connected to the first patch antenna pattern, and at least partially surrounding the second feed via.

Abstract: A method of fabricating a semiconductor device is provided. The method may include forming a first interlayer insulating film on a substrate, forming a second interlayer insulating film on the first interlayer insulating film, and forming a third interlayer insulating film on the second interlayer insulating film. Different amounts of carbon may be present in each of the first, second, and third interlayer insulating films. The third interlayer insulating film may be used as a mask pattern to form a via trench that extends at least partially into the first interlayer insulating film and the second interlayer insulating film. Supplying a carbon precursor may be interrupted between the forming of the second and third interlayer insulating films, such that the second interlayer insulating film and the third interlayer insulating film may have a discontinuous boundary therebetween.

Abstract: A method of manufacturing an integrated circuit (IC) device includes exposing a partial region of a photoresist film formed on a main surface of a substrate to generate acid, and diffusing the acid in the partial region of the photoresist film. Diffusing the acid may include applying an electric field, in a direction perpendicular to a direction in which the main surface of the substrate extends, to the photoresist film using an electrode facing the substrate through an electric-field transmission layer filling between the photoresist film and the electrode. The electric-field transmission layer may include an ion-containing layer or a conductive polymer layer.

Abstract: The present invention relates to apparatus and methods for assembling food products. More particularly, the invention relates to apparatus and methods for associating foodstuff and liquid with a base. Foodstuff may include food items such as meats, vegetables, cheeses, amongst others. Liquids include those food items that have a low viscosities (e.g. sauces, dressings, oils), high viscosities (e.g. peanut butter, frosting), and anything in between. A base can be anything on which foodstuff or liquid may be associated (e.g. bread, cake, cookies, pizza dough, a bowl in which to place foodstuff).

Abstract: The present invention relates to apparatus and methods for assembling food products. More particularly, the invention relates to apparatus and methods for associating foodstuff and liquid with a base. Foodstuff may include food items such as meats, vegetables, cheeses, amongst others. Liquids include those food items that have a low viscosities (e.g. sauces, dressings, oils), high viscosities (e.g. peanut butter, frosting), and anything in between. A base can be anything on which foodstuff or liquid may be associated (e.g. bread, cake, cookies, pizza dough, a bowl in which to place foodstuff).

Abstract: An antenna apparatus includes: a ground plane having a through-hole; a feed line disposed below the ground plane; an insulating layer disposed between the feed line and the ground plane; a feed via electrically connected to the feed line, and passing through the through-hole; and a chip patch antenna electrically connected to the feed via. The chip patch antenna includes: a patch antenna pattern electrically connected to the feed via; an upper coupling pattern disposed above the patch antenna pattern; edge coupling patterns surrounding a portion of the patch antenna pattern; upper edge coupling patterns surrounding a portion of the upper coupling pattern; and a dielectric layer disposed in a first region between the patch antenna pattern and the upper coupling pattern, and in a second region between the edge coupling patterns and the upper edge coupling patterns, and having a dielectric constant higher than that of the insulating layer.

Abstract: A semiconductor device includes a first insulating interlayer on a first region of a substrate and a second insulating interlayer on a second region of the substrate, a plurality of first wiring structures on the first insulating interlayer, the first wiring structures being spaced apart from each other, a plurality of second wiring structures filling a plurality of trenches on the second insulating interlayer, respectively, an insulation capping structure selectively on a surface of the first insulating interlayer between the first wiring structures and on a sidewall and an upper surface of each of the first wiring structures, the insulation capping structure including an insulating material, a third insulating interlayer on the first and second wiring structures, and an air gap among the first wiring structures under the third insulating interlayer.

Abstract: A radio frequency filter includes a first conductive pattern; a second conductive pattern connected to a first point of the first conductive pattern and extended; a third conductive pattern connected to a second point of the first conductive pattern and extended to surround a portion of the second conductive pattern; a fourth conductive pattern; a fifth conductive pattern connected to a third point of the fourth conductive pattern and extended; and a sixth conductive pattern connected to a fourth point of the fourth conductive pattern and extended to surround a portion of the fifth conductive pattern. The first conductive pattern extends toward the fourth conductive pattern and the fourth conductive pattern extends toward the first conductive pattern. A distance between the first conductive pattern and the fourth conductive pattern is greater than or equal to a distance between the third conductive pattern and the sixth conductive pattern.

Abstract: An oriented electrical steel sheet includes Ba at about 0.005 wt % to about 0.5 wt % inclusive, Y at about 0.005 wt % to about 0.5 wt % inclusive, or a composite of Ba and Y at about 0.005 wt % to about 0.5 wt % inclusive, the remainder including Fe and impurities, based on 100 wt % of a total composition of a base steel sheet thereof.

Abstract: An embodiment provides a lighting device comprising: a plurality of light sources which are disposed on the circumference of a concentric circle; a light guide portion which surrounds the light sources and is disposed adjacent to the light sources; and a cover member which surrounds the upper surfaces of the light sources and the upper and side surfaces of the light guide portion, wherein the light guide portion has a first surface in the light source direction and a second surface in a direction opposite to the light source which have an inclination with respect to the optical axis of the light emitted from the light sources, and wherein the cover member has a light transmitting pattern in a light diffusion region facing the upper surface of the light guide portion.

Abstract: Provided is a portable urine analysis device including: a main housing including: a tray including a tray driving unit in which a strip is loaded to introduce and withdraw the strip, wherein the strip that is completely analyzed is dropped via the tray, and a urine analysis module analyzing urine of the strip to generate urine analysis information; a sub-housing coupled under the main housing and including an accommodation box which is slidable while the accommodation box has a space that temporarily stores the dropped strip; and a support supporting the sub-housing. According to the portable urine analysis device, urine is analyzed by using the strip as a medium, portability is reinforced with a compact and slim structure, and a completely analyzed strip is disposed of hygienically.

Abstract: A chip antenna includes a first ceramic substrate, a second ceramic substrate disposed to face the first ceramic substrate, a first patch disposed on one surface of the first ceramic substrate to operate as a feeding patch, a second patch disposed on the second ceramic substrate to operate as a radiation patch, at least one feed via penetrating through the first ceramic substrate in a thickness direction to provide a feed signal to the first patch, and a bonding pad disposed on a second surface of the first ceramic substrate opposite the first surface. A thickness of the first ceramic substrate is greater than a thickness of the second ceramic substrate.