Patents by Inventor Kyu-in Han

Kyu-in Han has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20210323840
    Abstract: A fluid treatment module includes a pipe providing a flow channel in which fluid flows, the pipe having an inlet and an outlet, a light source module including a substrate and at least one light emitting diode disposed on an upper surface of the substrate and emitting light into the pipe to treat the fluid, a reflector disposed inside the pipe to reflect the light emitted from the light source module and having higher reflectivity with respect to the light than the pipe, and a heat dissipation plate contacting a rear surface of the substrate to dissipate heat from the light source module. The inlet, the outlet, or both are provided in plural to allow a flow speed and a flow direction of the fluid flowing into the pipe to be controlled, and the heat dissipation plate has higher thermal conductivity than the substrate.
    Type: Application
    Filed: April 29, 2021
    Publication date: October 21, 2021
    Applicant: SEOUL VIOSYS CO., LTD.
    Inventors: Jae Ho LEE, Jae Young CHOI, Woong Ki JUNG, Kyu Won HAN
  • Publication number: 20210325652
    Abstract: An illumination system may include an illumination source, a line-projection system to simultaneously illuminate a pupil plane with a static distribution of a plurality of one-dimensional (1D) coherent beams. Each of the 1D coherent beams of the plurality of 1D coherent beams may extend lengthwise along a coherent direction between boundaries of the pupil plane, have a width along an incoherent direction perpendicular to the coherent direction, and are distributed in a parallel distribution along the incoherent direction. Each of the 1D coherent beams of the plurality of 1D coherent beams is also spatially coherent along the coherent direction and spatially incoherent along the incoherent direction. The system may further include an objective lens to form a light sheet in an imaging plane based on an incoherent superposition of the plurality of 1D coherent beams.
    Type: Application
    Filed: April 21, 2021
    Publication date: October 21, 2021
    Inventors: Jialei Tang, Vahid Ebrahimi, Kyu Young Han
  • Publication number: 20210313694
    Abstract: A chip antenna includes: a first dielectric layer; a second dielectric layer upwardly spaced apart from the first dielectric layer; a patch antenna pattern disposed on the second dielectric layer; a feed via extending through the first dielectric layer; a feed pattern disposed between the first and second dielectric layers, electrically connected to the feed via, and spaced apart from the patch antenna pattern; and an adhesive layer adhered to the first and second dielectric layers. The adhesive layer includes a cavity surrounding the feed pattern between the first and second dielectric layers and; and a vent disposed between the cavity and an external side surface of the adhesive layer.
    Type: Application
    Filed: August 25, 2020
    Publication date: October 7, 2021
    Applicant: Samsung Electro-Mechanics Co., Ltd.
    Inventors: Dae Ki LIM, Young Sik HUR, Kyu Bum HAN, Ju Hyoung PARK, Myeong Woo HAN, Jeong Ki RYOO
  • Patent number: 11139244
    Abstract: Disclosed is a semiconductor device comprising a substrate, a first dielectric layer on the substrate, a first lower conductive line in the first dielectric layer, an etch stop layer on the first dielectric layer, a via-structure that penetrates the etch stop layer and connects to the first lower conductive line, a second dielectric layer on the etch stop layer, and an upper conductive line that penetrates the second dielectric layer and connects to the via-structure. The first dielectric layer includes a dielectric pattern at a level higher than a top surface of the first lower conductive line. The upper conductive line is in contact with a top surface of the etch stop layer. The etch stop layer has at an upper portion a rounded surface in contact with the via-structure.
    Type: Grant
    Filed: February 18, 2020
    Date of Patent: October 5, 2021
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Jangho Lee, Jongmin Baek, Wookyung You, Kyu-Hee Han, Suhyun Bark
  • Patent number: 11138970
    Abstract: The present disclosure relates to a system, method, and computer program for creating a complete transcription of an audio recording from separately transcribed redacted and unredacted words. The system receives an original audio recording and redacts a plurality of words from the original audio recording to obtain a modified audio recording. The modified audio recording is outputted to a first transcription service. Audio clips of the redacted words from the original audio recording are extracted using word-level timestamps for the redacted words. The extracted audio clips are outputted to a second transcription service. The system receives a transcription of the modified audio recording from the first transcription service and transcriptions of the extracted audio clips from the second transcription service.
    Type: Grant
    Filed: December 6, 2019
    Date of Patent: October 5, 2021
    Assignee: ASAPP, Inc.
    Inventors: Kyu Jeong Han, Madison Chandler Riley, Tao Ma
  • Patent number: 11128030
    Abstract: An antenna module includes an integrated circuit (IC) package, a first antenna package, a second antenna package, and a connection member. The IC package includes an IC and mounting electrical connection structures. The first antenna package includes a first patch antenna pattern, a first feed via connected to the first patch antenna pattern, and a first antenna dielectric layer surrounding at least a portion of the first feed via. The second antenna package includes a second patch antenna pattern, a second feed via connected to the second patch antenna pattern, and a second antenna dielectric layer surrounding at least a portion of the second feed via, and disposed to be spaced apart from the first antenna package. The connection member, connecting the IC to the first feed via and the second feed via, connects to the mounting electrical connection structures, and having a stacked structure.
    Type: Grant
    Filed: July 8, 2019
    Date of Patent: September 21, 2021
    Assignee: Samsung Electro-Mechanics Co., Ltd.
    Inventors: Hong In Kim, Hyung Ho Seo, Young Kyoon Im, Kyu Bum Han, Jeong Ki Ryoo
  • Publication number: 20210288128
    Abstract: An electronic device package includes: a substrate including a central region, and a first side region and a second side region at opposite sides of the central region; a first component in the first side region or the second side region, the first component having a first height above a surface of the substrate; a second component in the central region, the second component having a second height above the surface of the substrate that is lower than the first height; a reinforcement member in the central region and overlapping the second component, the reinforcement member having a third height above the surface of the substrate that is lower than the first height and higher than the second height; and an encapsulation member covering the first component and the second component.
    Type: Application
    Filed: March 11, 2021
    Publication date: September 16, 2021
    Inventors: Seung Hwan CHEONG, Sung Bae PARK, Myung Joon YOON, Kyu Min HAN
  • Patent number: 11121476
    Abstract: A chip antenna module includes a substrate, a plurality of chip antennas disposed on a first surface of the substrate, and an electronic element mounted on a second surface of the substrate, wherein each of the plurality of chip antennas includes a first ceramic substrate mounted on the first surface of the substrate, a second ceramic substrate opposing the first ceramic substrate, a first patch disposed on the first ceramic substrate, and a second patch disposed on the second ceramic substrate, and the first ceramic substrate and the second ceramic substrate are spaced apart from each other.
    Type: Grant
    Filed: December 23, 2019
    Date of Patent: September 14, 2021
    Assignee: Samsung Electro-Mechanics Co., Ltd.
    Inventors: Jae Yeong Kim, Sung Nam Cho, Ju Hyoung Park, Jeong Ki Ryoo, Kyu Bum Han, Sung Yong An
  • Publication number: 20210275983
    Abstract: The present invention relates to a dielectric packing material for converting carbon dioxide to a valuable material using non-thermal plasma technology, and more particularly, to a dielectric packing material for converting carbon dioxide to a valuable material using non-thermal plasma technology, wherein the dielectric packing material is packed in a non-thermal plasma reactor for conversion of carbon dioxide to a valuable material and is formed to have a hollow structure with multiple edges on the surface thereof to effectively scatter non-thermal plasma at the edges and thereby to improve CO2 conversion and energy efficiency.
    Type: Application
    Filed: March 3, 2021
    Publication date: September 9, 2021
    Inventor: Kyu Bum Han
  • Patent number: 11107705
    Abstract: A cleaning solution production system is for cleaning a semiconductor substrate. The system includes a pressure tank, a plasma reaction tank configured to form a plasma in gas bubbles suspended in a decompressed liquid obtained from the pressure tank to thereby generate radical species in the decompressed liquid, a storage tank configured to store a cleaning solution containing the radical species generated in the plasma reaction tank, and a nozzle configured to supply the cleaning solution from the storage tank to a semiconductor substrate.
    Type: Grant
    Filed: July 8, 2019
    Date of Patent: August 31, 2021
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Beom Jin Yoo, Min Hyoung Kim, Sang Ki Nam, Won Hyuk Jang, Kyu Hee Han, Young Do Kim, Jeong Min Bang
  • Publication number: 20210265087
    Abstract: Disclosed are an oriented electrical steel sheet and a manufacturing method thereof. An exemplary embodiment of the present invention provides a method of manufacturing an oriented electrical steel sheet, including: providing a slab including Si at 1.0 to 4.0 wt %, C at 0.1 to 0.4 wt %, and the remaining portion including Fe and other inevitably incorporated impurities; reheating the slab; producing a hot rolled steel sheet by hot rolling the slab; performing annealing of the hot rolled steel sheet; cold rolling the annealed hot rolled steel sheet; decarburizing and primary annealing the cold rolled steel sheet; cold rolling the decarburized and annealed steel sheet; and secondary annealing the cold rolled steel sheet.
    Type: Application
    Filed: May 12, 2021
    Publication date: August 26, 2021
    Inventors: Hyun-Seok KO, Kyu-Seok HAN, Hyung-Ki PARK, Jin-Wook SEO, Jae-Soo LIM, Hyung Don JOO
  • Patent number: 11094762
    Abstract: Disclosed is a display device. In accordance with the display device, before an organic stack of a light-emitting diode is formed, a sticker is attached to a substrate, while a camera hole-forming portion and a margin area around the same are present, to form the organic stack, and the sticker and components on top of the sticker, such as the organic stack, are removed, so that the edge of the organic stack can be aligned without any additional process using separate masks and the reliability of the display device can be improved due to the provision of the organic stack at a location spaced apart from the camera hole by the margin area.
    Type: Grant
    Filed: December 23, 2019
    Date of Patent: August 17, 2021
    Assignee: LG Display Co., Ltd.
    Inventors: Kyu-Il Han, Nam-Seok Yoo, Jin-Ho Park, Mi-Na Kim, Hyung-Won Park, Jung-Mo Cho, Yu-Ri Park, Hyoung-Min Kim, Seung-Ho Son
  • Patent number: 11072544
    Abstract: A fluid treatment device includes a pipe including an inlet, an outlet, an internal space through which a fluid moves and including a light source part disposed in the internal space and providing a light to the fluid. The light source part includes at least one light source unit having a substrate and a plurality of light sources disposed on the substrate and emitting the light. A ratio of a first distance between two light sources adjacent to each other to a second distance between each light source and an inner circumferential surface of the pipe is 1:1.25 or less when viewed in a longitudinal-section.
    Type: Grant
    Filed: February 28, 2020
    Date of Patent: July 27, 2021
    Assignee: SEOUL VIOSYS CO., LTD.
    Inventors: Jae Young Choi, Kyu Won Han, Yeo Jin Yoon, Woong Ki Jeong
  • Patent number: 11037872
    Abstract: A semiconductor device and a method of manufacturing a semiconductor device, the semiconductor device including a substrate; a first insulating interlayer on the substrate; a first wiring in the first insulating interlayer on the substrate; an insulation pattern on a portion of the first insulating interlayer adjacent to the first wiring, the insulation pattern having a vertical sidewall and including a low dielectric material; an etch stop structure on the first wiring and the insulation pattern; a second insulating interlayer on the etch stop structure; and a via extending through the second insulating interlayer and the etch stop structure to contact an upper surface of the first wiring.
    Type: Grant
    Filed: April 4, 2019
    Date of Patent: June 15, 2021
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Kyu-Hee Han, Jong-Min Baek, Hoon-Seok Seo, Sang-Hoon Ahn, Woo-Jin Lee
  • Publication number: 20210171706
    Abstract: Provided are a polyester resin having high heat resistance and degree of crystallinity, a preparation method thereof, and a resin molded article formed therefrom, the resin molded article having superior heat resistance and mechanical strength and maintaining high transparency.
    Type: Application
    Filed: December 12, 2016
    Publication date: June 10, 2021
    Inventors: Su-Min LEE, Yoo Jin LEE, Kyu-Chan HAN
  • Publication number: 20210175629
    Abstract: An antenna module includes a ground layer including a through-hole; a feed via disposed to pass through the through-hole; a patch antenna pattern spaced apart from the ground layer and electrically connected to one end of the feed via; a coupling patch pattern spaced apart from the patch antenna pattern; a first dielectric layer to accommodate the patch antenna pattern and the coupling patch pattern; a second dielectric layer to accommodate at least a portion of the feed via and the ground layer; and electrical connection structures disposed between the first dielectric layer and the second dielectric layer to separate the first dielectric layer from the second dielectric layer.
    Type: Application
    Filed: February 19, 2021
    Publication date: June 10, 2021
    Applicant: Samsung Electro-Mechanics Co., Ltd.
    Inventors: Kyung In KANG, Jeong Ki RYOO, Kyu Bum HAN
  • Patent number: 11031162
    Abstract: Disclosed are an oriented electrical steel sheet and a manufacturing method thereof. An exemplary embodiment of the present invention provides a method of manufacturing an oriented electrical steel sheet, including: providing a slab including Si at 1.0 to 4.0 wt %, C at 0.1 to 0.4 wt %, and the remaining portion including Fe and other inevitably incorporated impurities; reheating the slab; producing a hot rolled steel sheet by hot rolling the slab; performing annealing of the hot rolled steel sheet; cold rolling the annealed hot rolled steel sheet; decarburizing and annealing the cold rolled steel sheet; cold rolling the decarburized and annealed steel sheet; and final annealing the cold rolled steel sheet.
    Type: Grant
    Filed: December 8, 2014
    Date of Patent: June 8, 2021
    Assignee: POSCO
    Inventors: Hyun-Seok Ko, Kyu-Seok Han, Hyung-Ki Park, Jin-Wook Seo, Jae-Soo Lim, Hyung Don Joo
  • Publication number: 20210164102
    Abstract: A pressurization type method for manufacturing elementary metal may include a metal precursor gas pressurization dosing operation of, in a state where an outlet of a chamber having a substrate is closed, increasing a pressure in the chamber by providing a metal precursor gas consisting of metal precursors, thereby adsorbing the metal precursors onto the substrate, a main purging operation of purging a gas after the metal precursor gas pressurization dosing operation, a reaction gas dosing operation of providing a reaction gas to reduce the metal precursors adsorbed on the substrate to elementary metal, after the main purging operation, and a main purging operation of purging a gas after the reaction gas dosing operation.
    Type: Application
    Filed: January 21, 2021
    Publication date: June 3, 2021
    Applicant: IUCF-HYU (INDUSTRY-UNIVERSITY COOPERATION FOUNDATION HANYANG UNIVERSITY)
    Inventors: Myung Mo Sung, Kyu-Seok Han, Hongbum Kim
  • Publication number: 20210166974
    Abstract: A semiconductor device includes a substrate including an active pattern, a first interlayer dielectric layer on the substrate, the first interlayer dielectric layer including a recess on an upper portion thereof, and a lower connection line in the first interlayer dielectric layer, the lower connection line being electrically connected to the active pattern, and the lower connection line including a conductive pattern, the recess of the first interlayer dielectric layer selectively exposing a top surface of the conductive pattern, and a barrier pattern between the conductive pattern and the first interlayer dielectric layer, the first interlayer dielectric layer covering a top surface of the barrier pattern.
    Type: Application
    Filed: February 12, 2021
    Publication date: June 3, 2021
    Inventors: Woojin LEE, Hoon Seok SEO, Sanghoon AHN, Kyu-Hee HAN
  • Publication number: 20210163316
    Abstract: A sterilizing device includes a pipe having an inlet and an outlet and allowing fluid to move therethrough and a light source provided on one side of the pipe and providing light to the fluid. At least a portion of the pipe is provided in a spiral shape and the inlet and/or the outlet are arranged in a light emitting region.
    Type: Application
    Filed: February 8, 2021
    Publication date: June 3, 2021
    Applicant: SEOUL VIOSYS CO., LTD.
    Inventors: Jae Young CHOI, Shi Hyun AHN, Ki Yon PARK, Woong Ki JEONG, Kyu Won HAN