Abstract: Disclosed is a lamination system. A lamination system, which bonds a panel and a bonding target panel to from a panel assembly, according to one embodiment of the present invention may include a transfer which moves along a transfer shuttle and supports any one among the panel, the bonding target panel, and the panel assembly, a bonding chamber which is provided parallel to the transfer shuttle and bonds the panel and the bonding target panel, and a first robot which transfers any one among the panel, the bonding target panel, and the panel assembly between the transfer and the bonding chamber.

Abstract: A chip antenna module includes: a solder layer disposed on a lower surface of the first dielectric layer; a first patch antenna pattern disposed on upper surface of the first dielectric layer and having a through-hole; a second patch antenna pattern spaced apart from an upper surface of the first patch antenna pattern and having an area less than an area of the first patch antenna pattern; a first feed via extending through the first dielectric layer and electrically connected to the first patch antenna pattern; a second feed via extending through the first dielectric layer and the through-hole, and electrically connected to the second patch antenna pattern; and shielding vias extending through the first dielectric layer, electrically connected to the first patch antenna pattern, and at least partially surrounding the second feed via.

Abstract: A lighting device including at least one first light source emitting a visible light, at least one second light source spaced apart from the first light source and emitting a light having a wavelength for sterilization, and a housing, in which the first light source and the second light source are disposed, in which the first light source is disposed outside an area having an angle corresponding to about 50% of a maximum amount of light emitted from the second light source based on a line extending from a center of the second light source along a direction substantially perpendicular to a light emitting surface of the second light source.

Abstract: The amount of future context used in a speech processing application allows for tradeoffs between performance and the delay in providing results to users. Existing speech processing applications may be trained with a specified future context size and perform poorly when used in production with a different future context size. A speech processing application trained using a stochastic future context allows a trained neural network to be used in production with different amounts of future context. During an update step in training, a future-context size may be sampled from a probability distribution, used to mask a neural network, and compute an output of the masked neural network. The output may then be used to compute a loss value and update parameters of the neural network. The trained neural network may then be used in production with different amounts of future context to provide greater flexibility for production speech processing applications.

Abstract: Disclosed is a method of controlling an inkjet printing process. According to one embodiment of the present invention, a method of controlling an inkjet printing process by using an inkjet print system, the method including a printing operation of moving a first support chuck or a second support chuck in a second direction perpendicular to a first direction and performing the inkjet printing process of discharging an ink onto a substrate and a first suction operation of suctioning remaining ink from a nozzle formed on a first head or a second head using a first suction unit, wherein a controller controls the printing operation for a first substrate, the first suction operation for the second head or the printing operation for a second substrate, and the first suction operation for the first head to be sequentially performed.

Abstract: A connection member includes a first region, a second region, and a third region, where a number of conductive layers in the second region is greater than a number of conductive layers in the first region and is greater than a number of conductive layers in the third region, a first layer, which is an uppermost layer of the second region, extends to the third region, a second layer, which is a lowermost layer of the third region, extends to the second region, and a side portion of the second region at a boundary between the second region and the third region is covered by the first layer and the second layer.

Abstract: Disclosed is an inkjet head and a method of ejecting an ink using the same. An inkjet head according to one embodiment of the present invention may include nozzles each including a ejecting hole through which a solution including a light-emitting element is ejected and pairs of electrodes which are provided around the ejecting holes to face each other and which apply an electrode voltage to the light-emitting element.

Abstract: A semiconductor device including a first interlayer insulating film; a conductive pattern in the first interlayer insulating film; a resistance pattern on the conductive pattern; an upper etching stopper film spaced apart from the resistance pattern, extending in parallel with a top surface of the resistance pattern, and including a first metal; a lower etching stopper film on the conductive pattern, extending in parallel with a top surface of the first interlayer insulating film, and including a second metal; and a second interlayer insulating film on the upper etching stopper film and the lower etching stopper film, wherein a distance from a top surface of the second interlayer insulating film to a top surface of the upper etching stopper film is smaller than a distance from the top surface of the second interlayer insulating film to a top surface of the lower etching stopper film.

Abstract: A chip antenna module includes: a solder layer disposed on a lower surface of the first dielectric layer; a first patch antenna pattern disposed on upper surface of the first dielectric layer and having a through-hole; a second patch antenna pattern spaced apart from an upper surface of the first patch antenna pattern and having an area less than an area of the first patch antenna pattern; a first feed via extending through the first dielectric layer and electrically connected to the first patch antenna pattern; a second feed via extending through the first dielectric layer and the through-hole, and electrically connected to the second patch antenna pattern; and shielding vias extending through the first dielectric layer, electrically connected to the first patch antenna pattern, and at least partially surrounding the second feed via.

Abstract: A chip antenna module array includes a first chip antenna module including: a first solder layer disposed below a first dielectric layer; a first feed via disposed in the first dielectric layer; a first patch antenna pattern disposed above the first dielectric layer and having a first resonant frequency; and a first coupling pattern spaced apart from the first patch antenna pattern, and not vertically overlapping the first patch antenna pattern. The chip antenna module array includes a second chip antenna module including: a second solder layer disposed below a second dielectric layer; a second feed via disposed in the second dielectric layer; a second patch antenna pattern disposed above the second dielectric layer and having a second resonant frequency; and a second coupling pattern disposed above and vertically overlapping the second patch antenna pattern. The first and second chip antenna modules are disposed spaced apart on a connection member.

Abstract: A method and associated apparatus for generating instantaneous and uniform total internal reflection fluorescence (TIRF) excitation. An annular fiber bundle and is used with spatially incoherent light to provide appropriate illumination matched to parameters of the back focal plane of an oil-immersion or in-air imaging objective lens, enabling quantitative shadowless TIRF imaging.

Abstract: Disclosed is a light emitting display device which prevents pixel shrinkage and improves reliability by changing the structure of a bank and the inner structures of light emitting devices outside an active area of the light emitting display device.

Abstract: Discussed are a light-emitting device and a light-emitting display device having improved efficiency and increased lifespan. A plurality of stacks is provided between an anode and a cathode for at least a subpixel to emit a predetermined color, and emissive layers in different stacks include the same color-based materials having different luminous properties.

Abstract: A semiconductor device including a first interlayer insulating film; a conductive pattern in the first interlayer insulating film; a resistance pattern on the conductive pattern; an upper etching stopper film spaced apart from the resistance pattern, extending in parallel with a top surface of the resistance pattern, and including a first metal; a lower etching stopper film on the conductive pattern, extending in parallel with a top surface of the first interlayer insulating film, and including a second metal; and a second interlayer insulating film on the upper etching stopper film and the lower etching stopper film, wherein a distance from a top surface of the second interlayer insulating film to a top surface of the upper etching stopper film is smaller than a distance from the top surface of the second interlayer insulating film to a top surface of the lower etching stopper film.

Abstract: Optical data is collected from an optical sensor of a dual wavelength, and in order to detect the fire from the collected optical data, an average value of a first wavelength, an average value of a second wavelength, and a ratio of the average values of the two wavelengths are calculated, and an amount of change of a slope of the ratio is used to detect the fire and determine the fire occurrence time. From the determined fire occurrence time, fire features are extracted from the optical data in real time according to defined rules to configure a data set. The data set may be used for learning and inference techniques to identify a fire or non-fire, a fire source, a combustion material, and the like.

Abstract: A radio frequency filter includes a first conductive pattern; a second conductive pattern connected to a first point of the first conductive pattern and extended; a third conductive pattern connected to a second point of the first conductive pattern and extended to surround a portion of the second conductive pattern; a fourth conductive pattern; a fifth conductive pattern connected to a third point of the fourth conductive pattern and extended; and a sixth conductive pattern connected to a fourth point of the fourth conductive pattern and extended to surround a portion of the fifth conductive pattern. The first conductive pattern extends toward the fourth conductive pattern and the fourth conductive pattern extends toward the first conductive pattern. A distance between the first conductive pattern and the fourth conductive pattern is greater than or equal to a distance between the third conductive pattern and the sixth conductive pattern.

Abstract: An antenna apparatus includes: a first dipole antenna pattern; a feed line electrically connected to the first dipole antenna pattern; and a first ground plane disposed rearward of the first dipole antenna pattern and spaced apart from the first dipole antenna pattern; wherein the first ground plane forms a step-type cavity, and width of a rear portion of the step-type cavity is different from a width of a front portion of the step-type cavity.

Abstract: A chip antenna module array includes a first chip antenna module including: a first solder layer disposed below a first dielectric layer; a first feed via disposed in the first dielectric layer; a first patch antenna pattern disposed above the first dielectric layer and having a first resonant frequency; and a first coupling pattern spaced apart from the first patch antenna pattern, and not vertically overlapping the first patch antenna pattern. The chip antenna module array includes a second chip antenna module including: a second solder layer disposed below a second dielectric layer; a second feed via disposed in the second dielectric layer; a second patch antenna pattern disposed above the second dielectric layer and having a second resonant frequency; and a second coupling pattern disposed above and vertically overlapping the second patch antenna pattern. The first and second chip antenna modules are disposed spaced apart on a connection member.

Abstract: In the invention, only light reflected by a portion in which a microneedle is disposed arrives on a photodetector, and light reflected by a portion in which the microneedle is not disposed does not arrive on the photodetector. Disclosed is a skin patch for measuring blood glucose including a patch including a skin attachment surface, a reaction layer which reacts with glycation products of skin, and a plurality of microneedles disposed on the skin attachment surface to guide the glycation products of the skin to the reaction layer and an optical trap which allows light, which is reflected by only one portion among a portion in which the microneedle is disposed and a portion in which the microneedle is not disposed when the light is emitted to the reaction layer, to pass therethrough, a method of manufacturing the same, and a blood glucose measuring apparatus using the same.

Abstract: An antenna apparatus includes a feed line; a ground plane surrounding a portion of the feed line; a feed via electrically connected to the feed line and extending from a first side of the feed line; a first end-fire antenna pattern disposed on a first side of at least a portion of the ground plane and spaced apart from the ground plane, and electrically connected to the feed via; a second end-fire antenna pattern disposed on a second side of the feed line opposite the first side of the feed line and spaced apart from the first end-fire antenna pattern; and a core via electrically connecting the first end-fire antenna patterns to the second end-fire antenna pattern.