Abstract: A vehicular thermal management module includes a low-temperature-side manifold having a low-temperature refrigerant passage, a high-temperature-side manifold having a high-temperature refrigerant passage, and facing the low-temperature-side manifold, a compressor disposed between the low-temperature-side manifold and the high-temperature-side manifold, and an accumulator connected to an inlet of the compressor through a refrigerant line.

Abstract: A vehicle solar system includes a solar module mounted on an exterior surface of a vehicle, the solar module including a solar panel and a cooling channel positioned in the solar panel; a heat storage tank thermally connected to the cooling channel of the solar module; and a panel radiator thermally connected to the heat storage tank.

Abstract: Disclosed are a deep learning model optimization method and apparatus for medical image segmentation. A deep learning model optimization method for medical image segmentation includes: (a) initializing a model parameter; (b) updating the model parameter by performing model-agnostic meta learning (MAML) on a model based on sample batch and applying a gradient descent algorithm to a loss function; (c) setting an optimizer parameter as the updated model parameter, performing one-shot meta-learning on the model, and then updating the optimizer parameter by applying the gradient descent algorithm to the loss function; and (d) updating the model parameter by reflecting the updated optimizer parameter.

Abstract: A method for controlling an electric heater of a vehicular heating, ventilation, and air conditioning (HVAC) system includes turning on the electric heater; determining whether an ambient air temperature of a vehicle is higher than or equal to a threshold ambient air temperature, and a battery temperature is lower than or equal to a threshold battery temperature; determining whether battery efficiency is lower than or equal to threshold efficiency when the ambient air temperature of the vehicle is higher than or equal to the threshold ambient air temperature, and the battery temperature is lower than or equal to the threshold battery temperature; and turning off the electric heater when the battery efficiency is lower than or equal to the threshold efficiency, wherein the electric heater is configured to receive electric energy from the battery.

Abstract: A semiconductor device includes: a first resistance chain including first upper resistance segments, first resistance via plugs, and first lower resistance segments; a second resistance chain including second upper resistance segments, second resistance via plugs, and second lower resistance segments; and a third resistance chain including third upper resistance segments, third resistance via plugs, and third lower resistance segments, wherein the first upper resistance segments have a first upper effective resistance distance, and the second upper resistance segments have a second upper effective resistance distance, and the third upper resistance segments have a third upper effective resistance distance, and the first upper effective resistance distance is equal to the third upper effective resistance distance, and the second upper effective resistance distance is an integer multiple of the first upper effective resistance distance.

Abstract: An integrated circuit (IC) includes circuitry configured to, drive a flash unit comprising at least one light-emitting device, by providing a supply voltage to the flash unit based on an external input power source or a battery, the supply voltage being provided along one of a plurality of different current paths corresponding to a plurality of operation states, no voltage being received from the external input power source in a first operation state among the plurality of operation states, a first voltage level being received from the external input power source in a second operation state among the plurality of operation states, and a second voltage level being received from the external input power source in a third operation state among the plurality of operation states, and charge the battery based on an charging voltage received from the external input power source.

Abstract: A semiconductor device includes: a first resistance chain including first upper resistance segments, first resistance via plugs, and first lower resistance segments; a second resistance chain including second upper resistance segments, second resistance via plugs, and second lower resistance segments; and a third resistance chain including third upper resistance segments, third resistance via plugs, and third lower resistance segments, wherein the first upper resistance segments have a first upper effective resistance distance, and the second upper resistance segments have a second upper effective resistance distance, and the third upper resistance segments have a third upper effective resistance distance, and the first upper effective resistance distance is equal to the third upper effective resistance distance, and the second upper effective resistance distance is an integer multiple of the first upper effective resistance distance.

Abstract: The apparatus for ESD test includes a micro-controller unit client, a low voltage supply configured to output a low voltage on the basis of control by the micro-controller unit, a high voltage supply configured to output a high voltage on the basis of control by the micro-controller unit, and an ESD generator configured to generate an ESD voltage for an ESD test of a device under test (DUT) by using the low voltage and the high voltage, on the basis of control by the micro-controller unit. The ESD generator is a semiconductor integrated circuit module where a charging semiconductor switch, a discharging semiconductor switch, a switch driving block controlling a switching operation of each of the charging semiconductor switch and the discharging semiconductor switch, and a plurality of passive elements connected to the charging semiconductor switch and the discharging semiconductor switch are implemented as package, for generating the ESD voltage.

Abstract: The present invention minimizes parasitic inductance at the time of packaging a semiconductor that requires high efficiency and high-speed switching driving. In implementing a semiconductor package composed of one or more switching devices and one or more diode devices, the present invention provides a flip-stack structure in which a switching device is mounted on an insulating substrate or a metal frame, a flat metal is bonded onto the switching device, and a diode device is flipped and stacked on the flat metal, and accordingly, the flat metal with a large area is used for connection between the devices and between the devices and the insulating substrate, thereby minimizing parasitic inductance generated at a time of semiconductor packaging and automating the entire process of the semiconductor packaging.

Abstract: Provided are a semiconductor device and a method for operating the semiconductor device. A semiconductor device includes a low power condition module which determines whether a system operated by a battery satisfies enter and exit conditions of a low power mode; an address module which identifies a predetermined own address; a low power set module which sets a detailed operation mode of the low power mode in accordance with the address identified by the address module; a debounce module which executes a debounce operation before the system entering the low power mode; and a low power enter/exit module which executes entry and exit of the low power mode of the system.

Abstract: The present invention provides an electronic device, an external input device and a method for connecting the electronic device and the external input device. An electronic device according to various embodiments comprises: a camera module; a communication module, a display, a memory; and a processor electrically connected to the camera module, a communication module, a display and memory, wherein the processor displays, on the display, images comprising a left-eye image and a right-eye image, determines whether or not a connectable external input device is present if an event for the connection with the external input device occurs with respect to the images, displays, on at least one part of the display, external images, obtained by means of the camera module, if a connectable first external input device is present, and can perform connection with the first external input device. Moreover, other embodiments are possible.

Abstract: Provided is a glass product manufacturing apparatus. The glass product manufacturing apparatus includes a furnace including a gas heating zone and an electric heating zone, a first heat exchange module configured to recover heat from the furnace, and a pump configured to drive flow of a heat transfer medium fluid passing through the first heat exchange module, wherein at least a part of the first heat exchange module is thermally coupled with at least a part of an external surface of the electric heating zone. The glass product manufacturing apparatus may reduce defect rate while exhibiting high energy efficiency.

Abstract: An integrated circuit (IC) includes circuitry configured to, drive a flash unit comprising at least one light-emitting device, by providing a supply voltage to the flash unit based on an external input power source or a battery, the supply voltage being provided along one of a plurality of different current paths corresponding to a plurality of operation states, no voltage being received from the external input power source in a first operation state among the plurality of operation states, a first voltage level being received from the external input power source in a second operation state among the plurality of operation states, and a second voltage level being received from the external input power source in a third operation state among the plurality of operation states, and charge the battery based on an charging voltage received from the external input power source.

Abstract: A video encoding device includes a pixel offset pre-calculation part configured to generate a loop-filtered pixel from a coding information and at least one of a source pixel, a predicted pixel and a restructured pixel, and configured to generate an offset from the loop-filtered pixel by performing a sample adaptive offset operation. The video encoding device also includes an entropy coding part configured to generate a bit stream from the offset.

Abstract: A heat exchanger cooling system may include a frame provided in a duct housing and formed of two sections, each of the two sections being divided into two sub-sections, a single motor provided in the frame, and a drive device configured to be driven by the single motor, wherein air flaps provided in the respective sub-sections are simultaneously controlled by operation of the drive device.

Abstract: A GPU performs dynamic power level management by switching between pre-defined power levels having distinct clock and voltage levels. The dynamic power level management includes identifying a first performance metric associated with processing workloads at the for a consecutive number of measurement cycles. In some embodiments, the consecutive number of measurement cycles includes a current measurement cycle and at least one previous measurement cycle. Based on a determination that the consecutive number of measurement cycles exceeds a minimum hysteresis number, an estimated optimization is determined to be applied to the GPU for a future measurement cycle. A power level setting at the GPU for the future measurement cycle is adjusted based on the estimated optimization. By considering performance metrics including, for example, different processing workloads and hardware configurations, the GPU is able to dynamically adapt its power settings to the particular workload that it is currently processing.

Abstract: An image encoding apparatus based on a system on chip (SoC) which encodes a residual block of a current block including a first value calculator configured to calculate a first value for the residual block in a space domain, a comparator configured to decide whether to transform the residual block into a transform domain according to a size of the first value, and a transform unit configured to transform the residual block into the transform domain according to a decision on whether to transform.

Abstract: An apparatus includes a first substrate having a first land and a second substrate having a second land. A first molding compound is disposed between the first substrate and the second substrate. A first semiconductor chip is disposed on the first substrate and in contact with the first molding portion. A first connector contacts the first land and a second connector contacts the second land. The second connector is disposed on the first connector. A volume of the second connector is greater than a volume of the first connector. A surface of the first semiconductor chip is exposed. The first molding compound is in contact with the second connector, and at least a portion of the second connector is surrounded by the first molding compound.

Abstract: Provided are a semiconductor device and a method for operating the semiconductor device. A semiconductor device includes a low power condition module which determines whether a system operated by a battery satisfies enter and exit conditions of a low power mode; an address module which identifies a predetermined own address; a low power set module which sets a detailed operation mode of the low power mode in accordance with the address identified by the address module; a debounce module which executes a debounce operation before the system entering the low power mode; and a low power enter/exit module which executes entry and exit of the low power mode of the system.

Abstract: Provided is a glass product manufacturing apparatus. The glass product manufacturing apparatus includes a furnace including a gas heating zone and an electric heating zone, a first heat exchange module configured to recover heat from the furnace, and a pump configured to drive flow of a heat transfer medium fluid passing through the first heat exchange module, wherein at least a part of the first heat exchange module is thermally coupled with at least a part of an external surface of the electric heating zone. The glass product manufacturing apparatus may reduce defect rate while exhibiting high energy efficiency.