Abstract: An apparatus includes a first substrate having a first land and a second substrate having a second land. A first molding compound is disposed between the first substrate and the second substrate. A first semiconductor chip is disposed on the first substrate and in contact with the first molding portion. A first connector contacts the first land and a second connector contacts the second land. The second connector is disposed on the first connector. A volume of the second connector is greater than a volume of the first connector. A surface of the first semiconductor chip is exposed. The first molding compound is in contact with the second connector, and at least a portion of the second connector is surrounded by the first molding compound.

Abstract: The present invention provides an electronic device, an external input device and a method for connecting the electronic device and the external input device. An electronic device according to various embodiments comprises: a camera module; a communication module, a display, a memory; and a processor electrically connected to the camera module, a communication module, a display and memory, wherein the processor displays, on the display, images comprising a left-eye image and a right-eye image, determines whether or not a connectable external input device is present if an event for the connection with the external input device occurs with respect to the images, displays, on at least one part of the display, external images, obtained by means of the camera module, if a connectable first external input device is present, and can perform connection with the first external input device. Moreover, other embodiments are possible.

Abstract: IN a system on chip (SoC) for adaptively adjusting a bit rate, the SoC includes a central processing unit (CPU) configured to compare a first reference bit rate with a bit rate of a previous frame and to output a first parameter, a spatial filter configured to adjust a cutoff frequency using the first parameter, to filter high-frequency components from a current frame using an adjusted cutoff frequency and to output a filtered current frame, and a video codec configured to adjust a bit rate of a current macroblock in the filtered current frame using a second parameter generated according to a result of comparing a second reference bit rate with a bit rate of a previous macroblock in the filtered current frame.

Abstract: A method for fabricating a semiconductor package including mounting a first semiconductor chip on a first substrate, disposing a first connector on the first substrate, placing a molding control film on the first semiconductor chip to horizontally extend over the first substrate, filling a space between the molding control film and the first substrate with a molding compound such that the molding compound contacts side surfaces of the first semiconductor chip and covers the first connector and does not cover a top surface of the first semiconductor chip, detaching the molding control film, forming an opening through the molding compound to expose a portion of the first connector, disposing a second connector and a second semiconductor chip on opposite surfaces of a second substrate, respectively, and placing the second substrate on the first substrate such that the second connector contacts the first connector may be provided.

Abstract: An image processing device includes a bad pixel masking unit and a noise reduction unit. The bad pixel masking unit detects bad pixels in a plurality of blocks and masks the determined bad pixels. The noise reduction unit removes noise from the pixels in the plurality of blocks excluding the masked pixels using a pattern matching method and corrects bad pixels by obtained an average pixel value.

Abstract: An air-conditioning control method for calculating an optimum operation amount of an air-conditioning blower in an air-conditioning system of a vehicle includes: determining a heater heat quantity after an engine of the vehicle is started under a maximum heating condition of the air-conditioning system and the air-conditioning system is turned on according to current vehicle state information and air-conditioning information; determining a lost heat quantity discharged outside the vehicle during a current air-conditioning mode; determining an effective heating energy efficiency by calculating a difference between the heater heat quantity and the lost heat quantity; calculating the optimum operation amount of the air-conditioning blower where the effective heating energy is maximized; and controlling operation of the air-conditioning blower according to the determined optimum operation amount.

Abstract: A method, codec device, and system on chip (SoC) are provided for coding a region of interest (ROI) object of a frame. A current frame, which includes the ROI object is received, and a type of the current frame is determined. A complexity of the current frame is estimated. An ROI control signal is generated for controlling ROI coding of the ROI object based on the complexity.

Abstract: An application processor includes a first core configured to process a first picture including a first processing unit and a second processing unit and a second core configured to process a second picture including a third processing unit and a fourth processing unit, wherein the first core and the second core are configured to perform processing of the second processing unit and the third processing unit, respectively, in parallel.

Abstract: An apparatus includes a first substrate having a first land and a second substrate having a second land. A first molding compound is disposed between the first substrate and the second substrate. A first semiconductor chip is disposed on the first substrate and in contact with the first molding portion. A first connector contacts the first land and a second connector contacts the second land. The second connector is disposed on the first connector. A volume of the second connector is greater than a volume of the first connector. A surface of the first semiconductor chip is exposed. The first molding compound is in contact with the second connector, and at least a portion of the second connector is surrounded by the first molding compound.

Abstract: Disclosed herein is a vacuum cleaner including a first cleaning module to perform a cleaning of a floor and a second cleaning module detachably coupled to the first cleaning module and configured to perform a cleaning in a handheld manner while detached from the first cleaning module, wherein the second cleaning module includes a connecting pipe to deliver inlet force to an inlet of the first cleaning module while connected to the first cleaning module, a handle connected to one side of the connecting pipe, having an inside space, and provided in a shape in which a rear surface thereof is open, a connecting hose connecting the connecting pipe to a dust collector, and a connector having a hose support provided to support the connecting hose, and to connect the connecting pipe to the connecting hose, and the hose support is disposed to support the connecting hose rounded along an inner side of the handle in a state that the connector is coupled to an inside space of the handle.

Abstract: A semiconductor package having improved performance and reliability and a method of fabricating the same are provided. The semiconductor package includes a processing chip including a first pin at a first side to output a first signal, and a second pin at a second side to output a second signal different from the first signal, and a substrate having the processing chip thereon, the substrate including a first bump ball electrically connected to the first pin and a second bump ball electrically connected to the second pin, wherein the first bump ball and the second bump ball are adjacent at one of the first and second sides of the substrate.

Abstract: A GPU performs dynamic power level management by switching between pre-defined power levels having distinct clock and voltage levels. The dynamic power level management includes identifying a first performance metric associated with processing workloads at the for a consecutive number of measurement cycles. In some embodiments, the consecutive number of measurement cycles includes a current measurement cycle and at least one previous measurement cycle. Based on a determination that the consecutive number of measurement cycles exceeds a minimum hysteresis number, an estimated optimization is determined to be applied to the GPU for a future measurement cycle. A power level setting at the GPU for the future measurement cycle is adjusted based on the estimated optimization. By considering performance metrics including, for example, different processing workloads and hardware configurations, the GPU is able to dynamically adapt its power settings to the particular workload that it is currently processing.

Abstract: A system module includes a printed circuit board (PCB), a first semiconductor chip embedded in the PCB, a semiconductor package connected to the PCB through a plurality of stack balls, and a second semiconductor chip disposed on a surface of the PCB in a space between the PCB and the semiconductor package.

Abstract: An image frame motion estimation device and image frame motion estimation method using the same include performing first sampling for generating a first sample source block by performing first-type sampling on pixels of a source block; performing second sampling for generating a first sample reference block by performing first-type sampling on pixels of a reference block; determining a first matching region by comparing pixel values of the first sample source block and the first sample reference block; and determining a second matching region corresponding to the source block by comparing pixel values of a plurality of regions adjacent to the first matching region and the source block.

Abstract: A heat exchanger cooling system may include a frame provided in a duct housing and formed of two sections, each of the two sections being divided into two sub-sections, a single motor provided in the frame, and a drive device configured to be driven by the single motor, wherein air flaps provided in the respective sub-sections are simultaneously controlled by operation of the drive device.

Abstract: A system on package includes a first package and a second package stacked on the first package and electrically connected to one another through metal contacts. The first package includes a first printed circuit board (PCB), a system on chip which is connected to the first PCB through bumps, and a first memory device which is connected to the system on chip through micro bumps connected to vias in the system on chip. The second package includes a second PCB, a second memory device connected to the second PCB, a third memory device connected to the second PCB, and a memory controller which is connected to the second PCB and controls the third memory device.

Abstract: An apparatus includes a first substrate having a first land and a second substrate having a second land. A first molding compound is disposed between the first substrate and the second substrate. A first semiconductor chip is disposed on the first substrate and in contact with the first molding portion. A first connector contacts the first land and a second connector contacts the second land. The second connector is disposed on the first connector. A volume of the second connector is greater than a volume of the first connector. A surface of the first semiconductor chip is exposed. The first molding compound is in contact with the second connector, and at least a portion of the second connector is surrounded by the first molding compound.

Abstract: A method of individually setting the quantization parameter for each coding unit of a frame in high efficiency video coding (HEVC) is disclosed. The method for setting a quantization parameter for each coding unit in a frame for HEVC encoding includes receiving at least one of partition size information of the coding unit and prediction mode information of the coding unit, performing an adaptive bit allocation operation per each coding unit based on at least one of the unit partition size information of the coding unit and the prediction mode information of the coding unit, and setting a quantization parameter per each coding unit according to the performed adaptive bit allocation operation.

Abstract: A coolant circulation system for turbochargers is provided. The coolant circulation system includes a turbocharger provided with a coolant outlet line and a coolant inlet line. The coolant is discharged from the turbocharger through the coolant outlet line. The coolant outlet line is connected to a first flow path connecting an inlet port of a radiator to an outlet port of a heater core. The coolant is supplied into the turbocharger through the coolant inlet line. The coolant inlet line is connected to a second flow path connecting a first end of a water pump to an inlet port of the heater core.

Abstract: An image encoding apparatus based on a system on chip (SoC) which encodes a residual block of a current block including a first value calculator configured to calculate a first value for the residual block in a space domain, a comparator configured to decide whether to transform the residual block into a transform domain according to a size of the first value, and a transform unit configured to transform the residual block into the transform domain according to a decision on whether to transform.