Abstract: A system on package SoP module includes a printed circuit board (PCB) having a first side and an opposing second side, a first IC attached to the first side, a second IC attached to the second side. The PCB also provides electrical paths for connecting the first IC and the second IC. Conductors by which the second IC is attached to the PCB also allow for electrical testing of the first IC when the SoP is in a system level state.

Abstract: A method of encoding data includes selecting a line to define an adjustment target coefficient group in each of a plurality of coefficient groups included in a transform unit that has been transformed and quantized. Each of the coefficient groups comprises a plurality of coefficients. For each of the coefficient groups, a sum of the coefficients for the respective coefficient group is calculated. For each of the coefficient groups, a value of one adjustment target coefficient included in the adjustment target coefficient group is adjusted according to a result of the calculation of the sum of the coefficients for the respective coefficient group.

Abstract: A package on package may include: a first printed circuit board (PCB); a bottom package which includes a first chip die and a second chip die attached to the first PCB; a top package which includes a second PCB and a third chip die attached to the second PCB, and is overlaid over the bottom package; and/or first stack connection solder balls and second stack connection solder balls which are electrically connected between the first PCB and the second PCB, and are formed only around two sides facing each other among sides of the bottom package.

Abstract: A transform processor may process original data that includes video information by using at least one of first and second processing methods, and generates at least one of first and second transformed data. Index determination logic may determine an index satisfying a determination condition based on at least one of the first and second transformed data. Energy compaction determination logic may determine energy compaction of at least one of the first and second transformed data based on the determined index. Output selection logic may selectively output one of the first and second transformed data based on the determined energy compaction. An entropy encoder may encode data output from the output selection logic.

Abstract: An image encoding apparatus based on a system on chip (SoC) which encodes a residual block of a current block including a first value calculator configured to calculate a first value for the residual block in a space domain, a comparator configured to decide whether to transform the residual block into a transform domain according to a size of the first value, and a transform unit configured to transform the residual block into the transform domain according to a decision on whether to transform.

Abstract: An intra refresh method is provided. The intra refresh method includes dividing a first frame into regions, counting a number of intra macroblocks included in each of the regions, calculating weight values of the regions, configuring a macroblock included in a second region of a second frame as an intra macroblock, based on the number of the first region. The second region corresponds to the first region.

Abstract: An image processing apparatus includes a region determiner configured to receive image data and perform a region determination by determining whether each of a plurality of sub-pixels included in the image data is included in an in-focusing region that is focused or an out-focusing region that is not focused; and an interpolator configured to perform demosaicing with respect to a sub-pixel included in the in-focusing region by using a first algorithm and perform the demosaicing with respect to a sub-pixel included in the out-focusing region by using a second algorithm, according to a result of the region determination, wherein, when the demosaicing with respect to the sub-pixel included in the in-focusing region is performed, one or more peripheral sub-pixels having phases that are different from a phase of the sub-pixel, on which the demosaicing is performed, are used.

Abstract: A system module includes a printed circuit board (PCB), a first semiconductor chip embedded in the PCB, a semiconductor package connected to the PCB through a plurality of stack balls, and a second semiconductor chip disposed on a surface of the PCB in a space between the PCB and the semiconductor package.

Abstract: A multi core graphic processing device includes a first graphic core that processes a first segment of a graphic frame divided into a plurality of segments and generates a first local decision that defines a scene property of the first segment, a second graphic core that processes a second segment of the graphic frame different from the first segment and generates a second local decision that defines a scene property of the second segment, and a global decision unit that receives the first local decision and the second local decision from the first graphic core and the second graphic core, and selects one of the received first local decision and second local decision as a global decision.

Abstract: A video/image compression method based on an region of interest (ROI) can be performed in a variable block video encoder such as a HEVC. A ROI coding method using variable block size coding information partitions a maximum coding unit (LCU) block obtained from an image into coding unit (CU) blocks. To obtain a quantization parameter of each coding unit (CU) block, the value of its quantization parameter is assigned based on its first hierarchical depth information and its second hierarchical depth information by using the first hierarchical depth information related to the size of the coding unit (CU) block and using the second hierarchical depth information related to the size of a prediction unit (PU) block correspondingly represented in consequence of the partition of the coding unit (CU) block. The resulting values of a quantization parameter assigned to different coding unit (CU) blocks may be different.

Abstract: To stabilize video (an image sequence), reconstructed block data and decoding information of a video frame are received by unit of macroblock from a decoding circuit. Global affine parameters are determined and provided based on the reconstructed block data and the decoding information, and the global affine parameters represent an affine transform of a frame. Stabilized block data are provided based on the global affine parameters by compensating the reconstructed block data for an affine motion corresponding to the affine transform.

Abstract: A semiconductor package includes a printed circuit board (PCB), a chip bonded to the PCB, a mold protecting the chip and exposing a backside surface of the chip, via openings extending in the mold to expose first contacts bonded to the PCB, and at least one first marking inscribed in a marking region of the mold between the backside surface of the chip and the vias. The mold has an exposed molded underfill (eMUF) structure covering the sides of the chip while exposing the backside surface of the chip. A PoP package includes a top package stacked on and electrically connected to the semiconductor package.

Abstract: An air-conditioning control method for calculating an optimum operation amount of an air-conditioning blower in an air-conditioning system of a vehicle includes: determining a heater heat quantity after an engine of the vehicle is started under a maximum heating condition of the air-conditioning system and the air-conditioning system is turned on according to current vehicle state information and air-conditioning information; determining a lost heat quantity discharged outside the vehicle during a current air-conditioning mode; determining an effective heating energy efficiency by calculating a difference between the heater heat quantity and the lost heat quantity; calculating the optimum operation amount of the air-conditioning blower where the effective heating energy is maximized; and controlling operation of the air-conditioning blower according to the determined optimum operation amount.

Abstract: A semiconductor chip may include a semiconductor substrate, a first central pad, a second central pad, a first peripheral pad, a second peripheral pad, a first pad line and a second pad line. The semiconductor substrate may have an active face. The first central pad and the second central pad may be arranged on a central region of the active face. The first peripheral pad and the second peripheral pad may be arranged on an edge region of the active face. The first pad line may be connected between the first central pad and the first peripheral pad. The second pad line may be connected between the second central pad and the second peripheral pad.

Abstract: A stacked semiconductor package has a first semiconductor package including a first package substrate and a first semiconductor chip mounted on the first package substrate, a second semiconductor package including a second package substrate and a second semiconductor chip mounted on the second package substrate, and a plurality of connections electrically connecting the first and second semiconductor packages. The connections are disposed on an outer region of the first package substrate outside the first semiconductor chip. The connections are disposed along opposite first longer sides and opposite shorter second sides of the first package substrate. The heights of those connections disposed along each longer first side gradually vary from a central to an outer region (i.e., the ends) of the longer first side.

Abstract: A system on package includes a first package and a second package stacked on the first package and electrically connected to one another through metal contacts. The first package includes a first printed circuit board (PCB), a system on chip which is connected to the first PCB through bumps, and a first memory device which is connected to the system on chip through micro bumps connected to vias in the system on chip. The second package includes a second PCB, a second memory device connected to the second PCB, a third memory device connected to the second PCB, and a memory controller which is connected to the second PCB and controls the third memory device.

Abstract: A coolant circulation system for turbochargers is provided. The coolant circulation system includes a turbocharger provided with a coolant outlet line and a coolant inlet line. The coolant is discharged from the turbocharger through the coolant outlet line. The coolant outlet line is connected to a first flow path connecting an inlet port of a radiator to an outlet port of a heater core. The coolant is supplied into the turbocharger through the coolant inlet line. The coolant inlet line is connected to a second flow path connecting a first end of a water pump to an inlet port of the heater core.

Abstract: A semiconductor package including a mounting substrate, a first semiconductor chip mounted on an upper surface of the mounting substrate, a unit package stacked on the first semiconductor chip may be provided. The unit package includes a package substrate and a second semiconductor chip mounted on the package substrate. A plurality of bonding wires connects bonding pads of the mounting substrate and connection pads of the unit package, thereby electrically connecting the first and second semiconductor chips to each other. A molding member is provided on the mounting substrate to cover the first semiconductor chip and the unit package.

Abstract: An apparatus and a method for payment using short range communication are disclosed. The apparatus includes an electronic device having a communication module configured to wirelessly transmit at least one piece card information to an external device, a sensor configured to sense an orientation of the electronic device so as to generate a first signal, a processor configured to be electrically connected the wireless communication module and the sensor, and a memory configured to be electrically connected to the processor and at least temporarily store first card information and second card information, wherein the memory, at the time of execution, includes instructions which instruct the processor to receive the first signal, select one of the first card information and the second card information, at least partially on the basis of the first signal, and wirelessly transmit the selected card information to the external device.

Abstract: An apparatus includes a first substrate having a first land and a second substrate having a second land. A first molding compound is disposed between the first substrate and the second substrate. A first semiconductor chip is disposed on the first substrate and in contact with the first molding portion. A first connector contacts the first land and a second connector contacts the second land. The second connector is disposed on the first connector. A volume of the second connector is greater than a volume of the first connector. A surface of the first semiconductor chip is exposed. The first molding compound is in contact with the second connector, and at least a portion of the second connector is surrounded by the first molding compound.