Abstract: A semiconductor package can include a substrate body having a first surface and a second surface. A semiconductor chip can be mounted on the first surface and a plurality of electrode pads can be on the second surface and selectively formed to have progressively smaller or larger sizes extending from a central region of the substrate body toward an outer edge of the substrate body based on a reflow soldering process warpage profile for the semiconductor package.

Abstract: An apparatus includes a first substrate having a first land and a second substrate having a second land. A first molding compound is disposed between the first substrate and the second substrate. A first semiconductor chip is disposed on the first substrate and in contact with the first molding portion. A first connector contacts the first land and a second connector contacts the second land. The second connector is disposed on the first connector. A volume of the second connector is greater than a volume of the first connector. A surface of the first semiconductor chip is exposed. The first molding compound is in contact with the second connector, and at least a portion of the second connector is surrounded by the first molding compound.

Abstract: A stack package includes a lower package including a lower package substrate and a lower semiconductor chip disposed on the lower package substrate, an upper package including an upper package substrate and an upper semiconductor chip disposed on the upper package substrate, a fastening element formed between a top surface of the lower semiconductor chip and a bottom surface of the upper package substrate, and a halogen-free inter-package connector connecting the lower package substrate to the upper package substrate.

Abstract: A method for parallel processing of a video frame in accordance with principles of inventive concepts may include dividing the video frame into N tiles in a direction perpendicular to a raster scan direction; and sequentially encoding or decoding coding tree blocks included in each of the N tiles from a first row to an mth row according to the raster scan direction, wherein encoding or decoding of an Kth tile (K being a natural number more than 2 and less than N) starts at a point of time when encoding or decoding of coding tree blocks included in a first row of a (K?1)th tile is completed.

Abstract: A method of encoding data includes selecting a line to define an adjustment target coefficient group in each of a plurality of coefficient groups included in a transform unit that has been transformed and quantized. Each of the coefficient groups comprises a plurality of coefficients. For each of the coefficient groups, a sum of the coefficients for the respective coefficient group is calculated. For each of the coefficient groups, a value of one adjustment target coefficient included in the adjustment target coefficient group is adjusted according to a result of the calculation of the sum of the coefficients for the respective coefficient group.

Abstract: A video encoding device includes a pixel offset pre-calculation part configured to generate a loop-filtered pixel from a coding information and at least one of a source pixel, a predicted pixel and a restructured pixel, and configured to generate an offset from the loop-filtered pixel by performing a sample adaptive offset operation. The video encoding device also includes an entropy coding part configured to generate a bit stream from the offset.

Abstract: A video encoding method includes detecting properties of pixels included in a prediction block, dividing the prediction block into at least two regions according to a result of detecting the properties of the pixels, calculating offset values respectively for the at least two regions, according to a result of dividing the prediction block, and generating an offset prediction block by applying the offset values calculated respectively for the at least two regions to pixel values of the pixels in the prediction block.

Abstract: Provided are a depth information based optical distortion correction (ODC) circuit and method. The ODC circuit includes a depth acquisition unit acquiring a depth of an image, a grid generation unit dynamically generating a correction grid corresponding to the depth of the image using depth information of the image and a projection matrix, and a distortion correction unit correcting optical distortion in the image using the correction grid. The corrected image can then be stored, transmitted, or otherwise output. The image can be a single static image or photograph or a frame in a video recording.

Abstract: A package stack structure may an upper package include an upper package substrate having a first edge and a second edge opposite to the first edge. The upper package substrate has a first region arranged near the first edge and a second region arranged near the second edge. A first upper semiconductor device is mounted on the upper package substrate. The package stack structure may also include a lower package having a lower package substrate and a lower semiconductor device. The lower package is connected to the upper package through a plurality of inter-package connectors. The plurality of the inter-package connectors may include first inter-package connectors configured to transmit data signals; second inter-package connectors configured to transmit address/control signals; third inter-package connectors configured to provide a supply voltage for an address/control circuit; and fourth inter-package connectors configured to provide a supply voltage for a data circuit.

Abstract: A vacuum cleaner that includes an upright main body, an upright fan motor generating a suction force, and a wheel assembly that is mounted on the upright main body and guides movement and rotation of the upright main body. The upright main body includes a first housing that is installed on the wheel assembly so as to be rotatable in a leftward/rightward direction, and a second housing that is installed in the first housing so as to be rotatable in a forward/backward direction. The vacuum cleaner can be moved and rotated by freely moving an extension frame extending upward from the second housing in forward, backward, leftward, and rightward directions.

Abstract: An image frame motion estimation device and image frame motion estimation method using the same include performing first sampling for generating a first sample source block by performing first-type sampling on pixels of a source block; performing second sampling for generating a first sample reference block by performing first-type sampling on pixels of a reference block; determining a first matching region by comparing pixel values of the first sample source block and the first sample reference block; and determining a second matching region corresponding to the source block by comparing pixel values of a plurality of regions adjacent to the first matching region and the source block.

Abstract: Semiconductor packages are provided. The semiconductor packages may include an upper package including a plurality of upper semiconductor devices connected to an upper package substrate. The semiconductor packages may also include a lower package including a lower semiconductor device connected to a lower package substrate. The upper and lower packages may be connected to each other.

Abstract: An intra refresh method is provided. The intra refresh method includes dividing a first frame into regions, counting a number of intra macroblocks included in each of the regions, calculating weight values of the regions, configuring a macroblock included in a second region of a second frame as an intra macroblock, based on the number of the first region. The second region corresponds to the first region.

Abstract: A system for detecting and diagnosing a faultive state of an airplane engine, including: at least one vibration sensor attached to an airplane; a reference model database construction unit; and a fault detection and diagnosis unit which estimates a parameter of a model, obtains a test variable and a numerator coefficient value difference of a transfer function between the models, and the covariance of parameter estimation error, and diagnoses the faultive state and the faultive cause of the airplane engine. Accordingly, the present invention can determine the faultive state and the detective cause of the airplane engine using the vibration data of the airplane engine.

Abstract: A multi core graphic processing device includes a first graphic core that processes a first segment of a graphic frame divided into a plurality of segments and generates a first local decision that defines a scene property of the first segment, a second graphic core that processes a second segment of the graphic frame different from the first segment and generates a second local decision that defines a scene property of the second segment, and a global decision unit that receives the first local decision and the second local decision from the first graphic core and the second graphic core, and selects one of the received first local decision and second local decision as a global decision.

Abstract: There is provided a probe card comprising a plurality of probe tips, each being ball-shaped or pillar-shaped and having a top end in contact with each of target chip pads to be tested; a first space converting unit; a second space converting unit; a frame configured to support the second space converting unit; an interposer unit; and a circuit board.

Abstract: The inventive concept relates to an encoding method of encoding image data of a frame including a plurality of image blocks. The encoding method includes selecting a first image block as the main image block of a first window, selecting a first window having to perform a plurality of loop filtering schemes on image data of the selected window. The loop filtering schemes includes a deblocking filtering, a sample adaptive offset filtering, and an adaptive loop filtering. The perimeter of the selected first window does not coincide with the perimeter of the first image block.

Abstract: A stack package includes a lower package including a lower package substrate and a lower semiconductor chip disposed on the lower package substrate, an upper package including an upper package substrate and an upper semiconductor chip disposed on the upper package substrate, a fastening element formed between a top surface of the lower semiconductor chip and a bottom surface of the upper package substrate, and a halogen-free inter-package connector connecting the lower package substrate to the upper package substrate.

Abstract: A method of individually setting the quantization parameter for each coding unit of a frame in high efficiency video coding (HEVC) is disclosed. The method for setting a quantization parameter for each coding unit in a frame for HEVC encoding includes receiving at least one of partition size information of the coding unit and prediction mode information of the coding unit, performing an adaptive bit allocation operation per each coding unit based on at least one of the unit partition size information of the coding unit and the prediction mode information of the coding unit, and setting a quantization parameter per each coding unit according to the performed adaptive bit allocation operation.

Abstract: Provided is a dynamic thermal management method performed by an application processor which stores a first dynamic voltage and frequency scaling (DVFS) table and a second DVFS table, the method including comparing a surface temperature of a mobile apparatus with a critical surface temperature, controlling performance of the application processor according to the first DVFS table when the surface temperature is less than the critical surface temperature, and controlling performance of the application processor according to the second DVFS table when the surface temperature is not less than the critical surface temperature.