Abstract: Disclosed herein is a stacked memory device including a base die and a plurality of core dies stacked using a plurality of through-chip electrodes. Each of the core dies may include a plurality of input pads capable of receiving addresses externally in a wafer-level test mode; a control signal generation unit capable of decoding the addresses received through the input pads to generate a first control signal; an address generation unit capable of generating a first address based on the addresses received through the input pads; and a signal selection unit capable of selecting one of the first control signal and a second control signal received from the base die through a corresponding through-chip electrode to output a global control signal, and selecting one of the first address and a second address received from the base die through a corresponding through-chip electrode to output a global address.

Abstract: A memory device includes: a plurality of bank groups each comprising one or more banks; a first bus coupled to the plurality of bank groups; a second bus coupled to the plurality of bank groups; a toggle signal generation unit suitable for generating a first signal which toggles in response to a column command signal and a second signal having the opposite logic value of the first signal; a column command transmission unit suitable for transmitting a read command signal or write command signal to the first bus when the first signal is activated, and transmitting the read command signal or write command signal to the second bus when the second signal is activated; and a column address transmission unit suitable for transmitting one or more column address signals corresponding to the read command signal or write command signal to a bus to which the read command signal or write command signal is transmitted, between the first and second buses.

Abstract: A memory device includes: a plurality of first lines; a plurality of second lines; a plurality of bank groups each including a predetermined number of banks; and a column signal transmission unit suitable for transmitting one or more column command signals and one or more column address signals to the bank groups through the first lines based on an odd-numbered column command, and transmitting the column command signals and the column address signals to the bank groups through the second lines based on an even-numbered column command.

Abstract: A stack package may include a first chip, a second chip, a through silicon via (TSV) and an interface circuit unit. The first chip may include a first internal circuit unit driven by an internal voltage. The second chip may be stacked over the first chip. The second chip may include a second internal circuit unit driven by the internal voltage. The TSV may be electrically coupled between the first chip and the second chip. The interface circuit unit may be arranged in the first chip and the second chip. The interface circuit unit may be coupled to the TSV. A portion of the interface circuit unit may be received a variable voltage different from the internal voltage as a driving voltage.

Abstract: A memory device includes: a plurality of first lines; a plurality of second lines; a plurality of bank groups each including a predetermined number of banks; and a column signal transmission unit suitable for transmitting one or more column command signals and one or more column address signals to the bank groups through the first lines based on an odd-numbered column command, and transmitting the column command signals and the column address signals to the bank groups through the second lines based on an even-numbered column command.

Abstract: A memory chip may include a plurality of channels including a plurality of memory banks and having a separate input/output interface, and each of the plurality of channels may be configured to simultaneously latch compression data groups obtained by compressing respective unit data groups outputted from the plurality of memory banks, sequentially output latched data as test read data according to a read start signal or a read end signal, and generate the read end signal which defines that final data output has ended.

Abstract: A semiconductor memory device may include: a plurality of banks suitable for performing an all bank refresh operation or single bank refresh operation; an address output control unit suitable for generating a plurality of output control signals in response to a single bank refresh pulse signal; an address latch unit suitable for outputting a target row address of a bank corresponding to an activated output control signal; and an address output unit suitable for outputting a row address adjacent to the target row address to a selected bank.

Abstract: A semiconductor memory device may include: a plurality of banks suitable for performing an all bank refresh operation or single bank refresh operation; an address output control unit suitable for generating a plurality of output control signals in response to a single bank refresh pulse signal; an address latch unit suitable for outputting a target row address of a bank corresponding to an activated output control signal; and an address output unit suitable for outputting a row address adjacent to the target row address to a selected bank.

Abstract: A stack package may include a first chip, a second chip, a through silicon via (TSV) and an interface circuit unit. The first chip may include a first internal circuit unit driven by an internal voltage. The second chip may be stacked over the first chip. The second chip may include a second internal circuit unit driven by the internal voltage. The TSV may be electrically coupled between the first chip and the second chip. The interface circuit unit may be arranged in the first chip and the second chip. The interface circuit unit may be coupled to the TSV. A portion of the interface circuit unit may be received a variable voltage different from the internal voltage as a driving voltage.

Abstract: An input/output strobe pulse control circuit includes a control signal generator suitable for generating first to third control signals in response to a column selection enable signal and a first input/output strobe pulse signal, a first latch suitable for generating a second input/output strobe pulse signal in response to the first and second control signals, wherein the second input/output strobe pulse signal is enabled at a failing edge of the column selection enable signal and disabled at a falling edge of the first input/output strobe pulse signal, and a second latch suitable for generating a selection control signal for selectively outputting the first input/output strobe pulse signal or the second input/output strobe pulse signal based on whether the first input/output strobe pulse signal is enabled within an enabling section of the column selection enable signal, in response to the second and third control signals.

Abstract: An input/output strobe pulse control circuit includes a control signal generator suitable for generating first to third control signals in response to a column selection enable signal and a first input/output strobe pulse signal, a first latch suitable for generating a second input/output strobe pulse signal in response to the first and second control signals, wherein the second input/output strobe pulse signal is enabled at a failing edge of the column selection enable signal and disabled at a falling edge of the first input/output strobe pulse signal, and a second latch suitable for generating a selection control signal for selectively outputting the first input/output strobe pulse signal or the second input/output strobe pulse signal based on whether the first input/output strobe pulse signal is enabled within an enabling section of the column selection enable signal, in response to the second and third control signals.

Abstract: A plurality of memory blocks; and a control block configured to independently operate a part of the plurality of memory banks as a first sub-channel and a remainder of the plurality of memory banks as a second sub-channel according to whether a sub-channel is set.

Abstract: A plurality of memory blocks; and a control block configured to independently operate a part of the plurality of memory banks as a first sub-channel and a remainder of the plurality of memory banks as a second sub-channel according to whether a sub-channel is set.

Abstract: A semiconductor device is capable of generating an internal voltage having a voltage level that is dependent on an external power supply voltage. The semiconductor device includes an internal voltage generation unit configured to generate a plurality of internal voltages having different voltage levels by using an external power supply voltage, a voltage level detection unit configured to detect a voltage level of the external power supply voltage, and a selection unit configured to selectively output one of the internal voltages in response to a detection result of the voltage level detection unit.

Abstract: A semiconductor device is capable of generating an internal voltage having a voltage level that is dependent on an external power supply voltage. The semiconductor device includes an internal voltage generation unit configured to generate a plurality of internal voltages having different voltage levels by using an external power supply voltage, a voltage level detection unit configured to detect a voltage level of the external power supply voltage, and a selection unit configured to selectively output one of the internal voltages in response to a detection result of the voltage level detection unit.

Abstract: An internal voltage generating circuit of a semiconductor memory apparatus includes a first voltage generating unit to output a first output voltage to a common node, the first output voltage is generated in response to a first reference voltage, and a second voltage generating unit to output a second output voltage to the common node, the second output voltage is generated in response to a second reference voltage.

Abstract: A delay control circuit includes a delay locked loop configured to delay an external clock by a first delay amount and generate an internal clock, a first delay unit configured to delay an input signal by a first delay amount, a first replica delay unit having a replica delay amount corresponding to a modeled delay amount of a system, a delay control unit configured to control the replica delay amount in response to a latency of an input signal, a measurement unit configured to measure the first delay amount and the controlled replica delay amount and generate path information, an operation unit configured to generate delay information in response to the latency of the input signal and the path information, and a latency delay unit configured to delay the delayed input signal of the first delay unit by the delay information and generate a latency signal.

Abstract: A latency control circuit includes a delay unit configured to delay an input signal for a delay corresponding to a phase difference between an external clock and an internal clock and generate a delayed input signal, a delay information generation unit configured to generate a delay information based on a latency information and a delay amount of the input signal caused by a chip including the latency control circuit, a shift unit configured to shift the delayed input signal for a time period corresponding to the delay information in synchronism with the internal clock and an asynchronous control unit configured to selectively control the shift unit to output the delayed input signal without performing a shift operation.

Abstract: A signal delay circuit including a clock transfer control circuit configured to transmit or block a clock signal, and a pulse signal generation circuit configured to delay a first pulse signal in response to the transmitted clock signal to generate a second pulse signal which has a longer active period than the first pulse signal.

Abstract: A semiconductor memory device having read and write operations includes a discrimination signal generating unit for generating a discrimination signal during the write operation and a selective delay unit for receiving and selectively delaying a command-group signal in response to the discrimination signal.