Patents by Inventor Lakshminarayana Pappu

Lakshminarayana Pappu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11686767
    Abstract: In one embodiment, an apparatus includes at least one fabric to interface with a plurality of intellectual property (IP) blocks of the apparatus, the at least one fabric including at least one status storage, and a fabric bridge controller coupled to the at least one fabric. The fabric bridge controller may be configured to initiate a functional safety test of the at least one fabric in response to a fabric test signal received during functional operation of the apparatus, receive a result of the functional safety test via the at least one status storage, and send to a destination location a test report based on the result. Other embodiments are described and claimed.
    Type: Grant
    Filed: November 2, 2017
    Date of Patent: June 27, 2023
    Assignee: Intel Corporation
    Inventors: Lakshminarayana Pappu, Robert P. Adler, R. Selvakumar Raja Gopal
  • Publication number: 20230115292
    Abstract: An infrastructure for a platform immersive experience is described. An example of an apparatus includes a microcontroller to receive control parameters for platform lighting options for a computing system and information regarding current system conditions for the computing system, and generate control instructions for a lighting pattern for a set of lights based at least in part on the control parameters and the information regarding current system conditions; and host control circuitry to receive the control instructions for the lighting pattern from the microcontroller, and provide control signals to control the set of lights.
    Type: Application
    Filed: October 7, 2021
    Publication date: April 13, 2023
    Applicant: Intel Corporation
    Inventors: Lakshminarayana Pappu, Ankur N. Shah, Murali Ramadoss
  • Publication number: 20230114271
    Abstract: An apparatus to facilitate a system-on-a-chip (SoC) architecture for low power state communication is disclosed. The apparatus includes a low power state fabric to provide a low power state path that avoids compute processing resources of the apparatus, and a low power state agent circuitry communicably coupled to the low power state fabric to update, in response to initiation of a low power state in the apparatus, a configuration of routers of the low power state fabric to utilize the low power state path provided by the low power state fabric, and to route memory transactions to the low power state path while the apparatus is in the low power state.
    Type: Application
    Filed: October 7, 2021
    Publication date: April 13, 2023
    Applicant: Intel Corporation
    Inventors: Lakshminarayana Pappu, Altug Koker, Naveen Kanumuri
  • Publication number: 20230109990
    Abstract: One embodiment provides a graphics processor including an active base die including a fabric interconnect and a chiplet including a switched fabric, wherein the chiplet couples with the active base die via an array of interconnect structures, the array of interconnect structures couple the fabric interconnect with the switched fabric, and the chiplet includes a first modular interconnect configured to couple a block of graphics processing resources to the switched fabric and a second modular interconnect configured to couple a memory subsystem with the switched fabric and the block of graphics processing resources, the memory interconnect including a set of memory controllers and a set of physical interfaces.
    Type: Application
    Filed: October 7, 2021
    Publication date: April 13, 2023
    Applicant: Intel Corporation
    Inventors: Lakshminarayana Pappu, Altug Koker, Aditya Navale, Prasoonkumar Surti, Ankur Shah, Joydeep Ray, Naveen Matam
  • Publication number: 20230114164
    Abstract: In a further embodiment, a system on a chip integrated circuit (SoC) is provided that includes an active base die including a first cache memory, a first die mounted on and coupled with the active base die, and a second die mounted on the active base die and coupled with the active base die and the first die. The first die includes an interconnect fabric, an input/output interface, and an atomic operation handler. The second die includes an array of graphics processing elements and an interface to the first cache memory of the active base die. At least one of the graphics processing elements are configured to perform, via the atomic operation handler, an atomic operation to a memory device.
    Type: Application
    Filed: December 15, 2021
    Publication date: April 13, 2023
    Applicant: Intel Corporation
    Inventors: Rahul Pal, Aravindh Anantaraman, Lakshminarayana Pappu, Dongsheng Bi, Guadalupe J. Garcia, Altug Koker, Joydeep Ray, Rahul Joshi, Shrikul Atulkumar Joshi, Mahak Gupta
  • Publication number: 20230113953
    Abstract: In one embodiment, a system on a chip integrated circuit (SoC) is provided that includes graphics processing resources including one or more graphics processing cores a memory subsystem including a memory controller, a physical interface, and a memory device and circuitry to dynamically adjust a voltage and frequency of the memory subsystem based on a workload executed by the graphics processing resources.
    Type: Application
    Filed: October 6, 2022
    Publication date: April 13, 2023
    Applicant: Intel Corporation
    Inventors: Lakshminarayana Pappu, Phani Kumar Kandula, Ali Ibrahim, Murali Ramadoss, Ankur Shah
  • Publication number: 20220291733
    Abstract: Methods, apparatus, systems, and articles of manufacture are disclosed to reduce display connection latency. An example apparatus includes interface circuitry to: detect when a display is plugged into a port; and notify processor circuitry of the detection. In response to the notification, the processor circuitry of the example apparatus moves discrete circuitry into a high power state. The example apparatus also includes discrete circuitry to, while in the high power state, identify the display.
    Type: Application
    Filed: June 2, 2022
    Publication date: September 15, 2022
    Inventors: Lakshminarayana Pappu, Nausheen Ansari, Todd Witter
  • Publication number: 20220138101
    Abstract: Methods and apparatus relating to memory controller techniques. In an example, an apparatus comprises a cache memory, a high-bandwidth memory, and a processor communicatively coupled to the cache memory and the high-bandwidth memory, the processor to manage data transfer between the cache memory and the high-bandwidth memory for memory access operations directed to the high-bandwidth memory. Other embodiments are also disclosed and claimed.
    Type: Application
    Filed: March 14, 2020
    Publication date: May 5, 2022
    Applicant: Intel Corporation
    Inventors: Abhishek R. Appu, Aravindh Anantaraman, Elmoustapha Ould-Ahmed-Vall, Valentin Andrei, Nicolas Galoppo Von Borries, Varghese George, Altug Koker, Mike Macpherson, Subramaniam Maiyuran, Joydeep Ray, Lakshminarayana Pappu, Guadalupe Garcia
  • Publication number: 20220121594
    Abstract: A system comprising a discrete graphics system-on-chip (SoC) to couple to a host processor unit, the SoC comprising a memory bridge comprising a first port to receive requests sent by a compute engine through a first path to the memory; and a second port to receive requests sent by a plurality of agents of the SoC through a second path to the memory.
    Type: Application
    Filed: December 23, 2021
    Publication date: April 21, 2022
    Applicant: Intel Corporation
    Inventors: Lakshminarayana Pappu, Ashwin A. Mendon, Nausheen Ansari, Howard L. Heck, David J. Harriman
  • Publication number: 20220116322
    Abstract: An apparatus comprises a first tile comprising a first instance of a plurality of global endpoints and a first instance of a plurality of local networks comprising a plurality of local endpoints; and an interconnect network of the first tile to couple to an interconnect network of a second tile, the second tile comprising a second instance of the plurality of global endpoints and a second instance of the plurality of local networks comprising the plurality of local endpoints; wherein the interconnect network utilizes an address space comprising unique identifiers for the plurality of global endpoints of the first and second tiles; and non-unique identifiers for the plurality of local endpoints of the first and second tiles, wherein non-unique identifiers are reused in multiple local networks of the plurality of local networks of the first and second tiles.
    Type: Application
    Filed: December 23, 2021
    Publication date: April 14, 2022
    Applicant: Intel Corporation
    Inventors: Abhishek Reddy Pamu, Lakshminarayana Pappu, David J. Harriman, Ramadass Nagarajan
  • Publication number: 20220114131
    Abstract: In one embodiment, a device includes: an interface circuit to couple the device to a host via a link, where in a first mode the interface circuit is to be configured as an integrated switch controller and in a second mode the interface circuit is to be configured as a link controller; and a fabric coupled to the interface circuit, the fabric to couple to a plurality of hardware circuits, where the fabric is to be dynamically configured for one of the first mode or the second mode based on link training of the link. Other embodiments are described and claimed.
    Type: Application
    Filed: December 22, 2021
    Publication date: April 14, 2022
    Inventors: Lakshminarayana Pappu, David J. Harriman, Ramadass Nagarajan, Mahesh S. Natu
  • Publication number: 20220113967
    Abstract: A system comprising a discrete graphics system-on-chip (SoC) to couple to a host processor unit, the SoC comprising a fabric comprising a handler circuitry to decode a request from a compute engine, the handler circuitry to route the request based on an opcode included in the request, the handler configured to decode the opcode from a set of opcodes for use in requests by the compute engine, wherein the set of opcodes include opcodes corresponding to a first write request type and a first read request type, wherein requests of the first write request type and the first read request type are routed to either the host memory or the graphics memory; and a second write request type and a second read request type, wherein requests of the second write request type and the second request type are to be routed to the sideband network.
    Type: Application
    Filed: December 23, 2021
    Publication date: April 14, 2022
    Applicant: Intel Corporation
    Inventors: Abhishek Reddy Pamu, Lakshminarayana Pappu, David J. Harriman, Debra Bernstein, Ramadass Nagarajan
  • Publication number: 20220070522
    Abstract: Embodiments relate to a controller subsystem that includes a virtual reality (VR) subsystem to: identify data received from a peripheral device as related to an audio/visual (A/V) function of the peripheral device; direct, based on the identification that the data is related to the A/V function of the peripheral device, the data to be stored in a memory subsystem of the controller subsystem; and facilitate transmission of an indication of a storage location of the data in the memory subsystem to a host system that is communicatively coupled with the controller subsystem. The controller subsystem further includes a graphics engine to: identify, in a message received from the host system based on the transmission of the indication of the storage location of the data, instructions related to rendering the data; and generate, based on the data received from the peripheral device, rendered data. Other embodiments may be described and claimed.
    Type: Application
    Filed: November 10, 2021
    Publication date: March 3, 2022
    Inventors: Lakshminarayana Pappu, Nausheen Ansari, Howard Heck, Amit Kumar Srivastava
  • Patent number: 11231927
    Abstract: In one embodiment, an apparatus includes: an accelerator to execute instructions; an accelerator request decoder coupled to the accelerator to perform a first level decode of requests from the accelerator and direct the requests based on the first level decode, the accelerator request decoder including a memory map to identify a first address range associated with a local memory and a second address range associated with a system memory; and a non-coherent request router coupled to the accelerator request decoder to receive non-coherent requests from the accelerator request decoder and perform a second level decode of the non-coherent requests, the non-coherent request router to route first non-coherent requests to a sideband router of the first die and to direct second non-coherent requests to a computing die. Other embodiments are described and claimed.
    Type: Grant
    Filed: March 8, 2018
    Date of Patent: January 25, 2022
    Assignee: Intel Corporation
    Inventors: Lakshminarayana Pappu, Robert D. Adler, Amit Kumar Srivastava, Aravindh Anantaraman
  • Patent number: 11105854
    Abstract: In one embodiment, an apparatus includes multiple die and at least one interconnect to couple the die. A first die includes one or more cores, a first fabric and a first fabric transactor coupled to the first fabric, the first fabric transactor to initiate a functional test of the apparatus in response to a test signal, cause at least one first test transaction to be sent to a second die, receive a first response to the at least one first test transaction from the second die, and identify, based at least in part on the first response to the at least one test transaction, a location of a failure and report the location of the failure to a destination. Other embodiments are described and claimed.
    Type: Grant
    Filed: November 2, 2017
    Date of Patent: August 31, 2021
    Assignee: Intel Corporation
    Inventors: Lakshminarayana Pappu, Robert P. Adler, Ki Yoon
  • Patent number: 11042315
    Abstract: In a computer system, a multilevel memory includes a near memory device and a far memory device, which are byte addressable. The multilevel memory includes a controller that receives a data request including original tag information. The controller includes routing hardware to selectively provide alternate tag information for the data request to cause a cache hit or a cache miss to selectively direct the request to the near memory device or to the far memory device, respectively. The controller can include selection circuitry to select between the original tag information and the alternate tag information to control where the data request is sent.
    Type: Grant
    Filed: March 29, 2018
    Date of Patent: June 22, 2021
    Assignee: Intel Corporation
    Inventors: Lakshminarayana Pappu, Christopher E. Cox, Navneet Dour, Asaf Rubinstein, Israel Diamand
  • Patent number: 10901035
    Abstract: Embodiments of the present disclosure describe methods, apparatuses, storage media, and systems for in-field safety tests on system-level and circuit-level, providing real-time and on-chip tests with respect to, including but not limited to, circuit reliability, power consumption, and system safety. The in-field safety tests may include implementing voltage droop monitors (VDMs) and signature collectors with authentication-enabled launching. Other embodiments may be described and claimed.
    Type: Grant
    Filed: February 1, 2019
    Date of Patent: January 26, 2021
    Assignee: Intel Corporation
    Inventors: Lakshminarayana Pappu, Amit Kumar Srivastava, Robert Milstrey
  • Patent number: 10739836
    Abstract: In one embodiment, an apparatus includes: at least one processing circuit; at least one array associated with the at least one processing circuit; a power controller to manage power consumption of the apparatus; and a fabric bridge coupled to the power controller. The fabric bridge and power controller may be configured to implement a handshaking protocol to enable the fabric bridge to receive data from the at least one array via a sideband communication path and send the data to a system memory coupled to the apparatus via a primary communication path, prior to entry of the apparatus into a first low power state. Other embodiments are described and claimed.
    Type: Grant
    Filed: March 27, 2018
    Date of Patent: August 11, 2020
    Assignee: Intel Corporation
    Inventors: Lakshminarayana Pappu, Robert Milstrey, Amit Kumar Srivastava
  • Publication number: 20200249276
    Abstract: Embodiments of the present disclosure describe methods, apparatuses, storage media, and systems for in-field safety tests on system-level and circuit-level, providing real-time and on-chip tests with respect to, including but not limited to, circuit reliability, power consumption, and system safety. The in-field safety tests may include implementing voltage droop monitors (VDMs) and signature collectors with authentication-enabled launching. Other embodiments may be described and claimed.
    Type: Application
    Filed: February 1, 2019
    Publication date: August 6, 2020
    Inventors: Lakshminarayana Pappu, Amit Kumar Srivastava, Robert Milstrey
  • Patent number: 10732699
    Abstract: An apparatus is provided which comprises: a power management circuitry; and a processing circuitry comprising a processing core, wherein the power management circuitry is to: compute first voltage and frequency parameters, and transmit the first voltage and frequency parameters to the processing circuitry for operation of the processing core, and wherein in response to a detection of a fault, the power management circuitry is to: access second voltage and frequency parameters from a memory, and transmit the accessed second voltage and frequency parameters to the processing circuitry for operation of the processing core.
    Type: Grant
    Filed: February 23, 2018
    Date of Patent: August 4, 2020
    Assignee: Intel Corporation
    Inventors: Lakshminarayana Pappu, Robert Milstrey, Amit K. Srivastava