Abstract: In one embodiment, an apparatus includes: at least one processing circuit; at least one array associated with the at least one processing circuit; a power controller to manage power consumption of the apparatus; and a fabric bridge coupled to the power controller. The fabric bridge and power controller may be configured to implement a handshaking protocol to enable the fabric bridge to receive data from the at least one array via a sideband communication path and send the data to a system memory coupled to the apparatus via a primary communication path, prior to entry of the apparatus into a first low power state. Other embodiments are described and claimed.

Abstract: A system includes test control circuitry in parallel with power control circuitry. The power control circuitry enables a core processor and memory interface drivers responsive to a reset. The test control circuitry can enable the memory interface drivers separately from the core processor to enable testing of the connections to the memory devices. The test control circuitry is triggered separately from the other power control circuitry, and can be protected to allow only secured access for testing.

Abstract: In a computer system, a multilevel memory includes a near memory device and a far memory device, which are byte addressable. The multilevel memory includes a controller that receives a data request including original tag information. The controller includes routing hardware to selectively provide alternate tag information for the data request to cause a cache hit or a cache miss to selectively direct the request to the near memory device or to the far memory device, respectively. The controller can include selection circuitry to select between the original tag information and the alternate tag information to control where the data request is sent.

Abstract: Techniques are provided for low-latency, high bandwidth graphics accelerator die and memory system. In an example, a graphics accelerator die can include a plurality of memory blocks for storing graphic information, a display engine configured to request and receive the graphic information from the plurality of memory blocks for transfer to a display, a graphics engine configured to generate and transfer the graphic information to the plurality of memory blocks, and a high-bandwidth, low-latency isochronous fabric configured to arbitrate the transfer and reception of the graphic information.

Abstract: In one embodiment, an apparatus includes at least one fabric to interface with a plurality of intellectual property (IP) blocks of the apparatus, the at least one fabric including at least one status storage, and a fabric bridge controller coupled to the at least one fabric. The fabric bridge controller may be configured to initiate a functional safety test of the at least one fabric in response to a fabric test signal received during functional operation of the apparatus, receive a result of the functional safety test via the at least one status storage, and send to a destination location a test report based on the result. Other embodiments are described and claimed.

Abstract: In one embodiment, an apparatus includes multiple die and at least one interconnect to couple the die. A first die includes one or more cores, a first fabric and a first fabric transactor coupled to the first fabric, the first fabric transactor to initiate a functional test of the apparatus in response to a test signal, cause at least one first test transaction to be sent to a second die, receive a first response to the at least one first test transaction from the second die, and identify, based at least in part on the first response to the at least one test transaction, a location of a failure and report the location of the failure to a destination. Other embodiments are described and claimed.

Abstract: A method and system for high speed on chip testing for quality assurance. A multi-core system on a chip has a plurality of processing cores. The cores act as transaction agents with an auto-response unit fabricated on the chip at a chip boundary, the auto-response unit to provide a deterministic return value based on a logical address of a received read request.

Abstract: Techniques and mechanisms for providing test functionality at an integrated circuit (IC) chip. In an embodiment, the IC chip includes protocol stacks variously coupled each between a switch fabric and other switch circuitry which is configurable to selectively implement, at least in part, either of an operational mode and a test mode. The operational mode facilitates communication, via the switch circuitry, between a first protocol stack and physical layer circuitry. The test mode instead enables communication, between the first protocol stack and a second protocol stack, of test packet information which is based on a test packet received from the switch fabric. In another embodiment, the protocol stacks support communication according to a Thunderbolt™ protocol.

Abstract: Described is a host interface, a device interface, a downstream translation circuitry, an upstream translation circuitry, and a host line-state state machine. The host interface may comprise a host line-state output. The device interface may comprise a device line-state output. The downstream translation circuitry may be operable to process a transaction received on the host interface and to generate a transaction for the device interface. The upstream translation circuitry may be operable to process a transaction received on the device interface and to generate a transaction for the host interface. The host line-state state machine may be operable to set the host line-state output to a value that is one of: an SE0-state value, a J-state value, or a K-state value.

Abstract: Techniques and mechanisms to modify packet information in support of on-chip test functionality. In an embodiment, an integrated circuit (IC) chip includes a protocol stack to receive and process packetized information—e.g., where the processing of at least one isochronous timestamp packet (ITP) includes circuitry of the protocol stack replacing non-deterministic data of the ITP with substitute information. A deterministic nature of the substitute information enables the subsequent generation of corresponding signature information which can be used in an evaluation of circuit performance. In another embodiment, the ITP packet is modified at a transaction layer of the protocol stack, and the signature information is determined with an accumulator circuit which is part of another layer of the protocol stack.

Abstract: Techniques and mechanisms for providing test functionality at an integrated circuit (IC) chip. In an embodiment, the IC chip includes protocol stacks variously coupled each between a switch fabric and other switch circuitry which is configurable to selectively implement, at least in part, either of an operational mode and a test mode. The operational mode facilitates communication, via the switch circuitry, between a first protocol stack and physical layer circuitry. The test mode instead enables communication, between the first protocol stack and a second protocol stack, of test packet information which is based on a test packet received from the switch fabric. In another embodiment, the protocol stacks support communication according to a Thunderbolt™ protocol.

Abstract: Embodiments are generally directed to maintaining IO block operation in electronic systems for board testing. An embodiment of a system includes a processor; a power management block for the system; a plurality of IO (input/output) blocks; a read only memory for storage of firmware for the processor. The system is to provide support for a board-level test of the system including testing of one or more IO blocks of the plurality of IO blocks; and the firmware includes elements to stall a reset sequence of the system including the system branching to a mode that maintains power to the one or more IO blocks.

Abstract: Embodiments are generally directed to phase lock loop bypass for board level testing of systems. An embodiment of system includes a power management block for the system; multiple IO (input/output) blocks; a phase lock loop (PLL) block for each of the IO blocks, each of the phase lock loop blocks being switchable between providing an output of a PLL clock signal or providing a replacement clock signal as clocking for the respective IO block; and a read only memory for storage of firmware. In some embodiments, the firmware includes elements to enable operation of the plurality of IO blocks utilizing replacement clocking.

Abstract: Embodiments are generally directed to board level leakage testing for a memory interface. An embodiment of an apparatus includes multiple logic cells for testing of a memory interface, each logic cell being connected to an interconnect for a respective memory element. Each logic cell includes a driver to drive a signal onto the interconnect with the respective memory element, an element to generate a value for the logic cell by comparing a signal with a reference voltage, a flip-flop to capture a cell value for the logic cell, and a drive control element to control the value driven on the interconnect by the driver. The apparatus further includes a processor to identify failure conditions based at least in part on testing using the logic cells.

Abstract: Embodiments are generally directed to display controller testing through a high speed communications switch. An embodiment of an apparatus includes a display controller including a first test machine; a high speed switch coupled with the display controller; and one or more physical layer (PHY) logic elements including a first PHY with a second test machine, the first test machine and second test machine being replicas of each other at least in part. The first test machine and the second test machine are operable to synchronously lock with each other, the first test machine to generate a data sequence and transmit the data sequence to the second test machine, the second test machine to generate an expected data sequence and compare the expected data sequence to a received data sequence from the first test machine.

Abstract: Embodiments are generally directed to a mechanism to provide back-to-back testing of memory controller operation. An embodiment of an apparatus includes a test controller including a specialized self-testing mechanism for memory control testing, the memory control testing including testing with back-to-back transactions; and a memory controller, the memory controller including one or more transaction arbiters, one or more arbiter queues for memory transactions, an auto response mechanism to provide a response to a read transaction, and a switching mechanism to switch the memory control between a functional mode and an auto response mode. The test controller is to generate test transactions and transfer the test transactions to the memory controller. The memory controller is to block the one or more transaction arbiters, place the plurality of test transactions in the one or more arbiter queues, and to unblock the transaction arbiters upon an event.

Abstract: A stacked semiconductor package includes a functional silicon die, and a test controller having signature accumulation logic embedded therein. A fabric to route transactions is between the test controller and a far memory controller of the functional silicon die. The far memory controller includes a physical memory interface having no physical memory attached. A Two Level Memory (2LM) controller is included having logic to modify received transactions to indicate a cache miss forcing all received transactions to be routed to the far memory controller via the fabric. An auto response mechanism is included to observe the transactions on the fabric and route responses and completions issued in reply to the transactions back to an agent having initiated the transactions.

Abstract: An apparatus and method are described for a scalable testing agent. For example, one embodiment of a scalable test engine comprises: an input interface to receive commands and/or data from a processor core or an external test system, the commands and/or data to specify one or more test operations to be performed on one or more intellectual property (IP) blocks of a chip; a first circuit to establish communication with an IP block over an interconnect fabric, the first circuit to transmit the one or more test operations to the IP block responsive to the received commands and/or data, the IP block to process the test operations and generate results; and a second circuit to receive the results from the IP block over the interconnect fabric, the results to be provided from the second circuit to the processor core and/or the external test system for analysis.

Abstract: Techniques and mechanisms for providing on-chip link control functionality to facilitate emulation of a communication. In an embodiment, an integrated circuit (IC) chip includes a physical layer (PHY) which supports communication compatible with a high-speed serial interface standard. A link controller of the IC chip is coupled between the PHY and an interconnect architecture which variously couples a host and other resources of the IC chip to each other. A test controller of the IC chip signals a test mode to implement a loopback path of the link controller in lieu of one or more functional paths for communication with the PHY. In another embodiment, signal output by the loopback path emulate a communication from a resource other than the test controller.

Abstract: In one embodiment, a request may be received to load firmware on a microcontroller of a device. A firmware transfer may be initiated to load the firmware on the microcontroller. Data traffic may be monitored at one or more locations on a communication path associated with the firmware transfer. It may be determined whether the data traffic matches a digital fingerprint associated with the firmware.