Abstract: One embodiment provides a method of testing humidity, comprising: i) determining a property of a device which encloses a plurality of interferometric modulators and ii) determining a relative humidity value or a degree of the relative humidity inside the device based at least in part upon the determined property, wherein the determined property comprises at least one of i) the thickness and width of a seal of the device and ii) adhesive permeability of a component of the device. In one embodiment, the determined property further comprises at least one of the following: i) temperature-humidity combination inside the device, ii) a desiccant capacity inside the device and iii) a device size.

Abstract: A first electrode and a sacrificial layer are sequentially formed on a substrate, and then first openings for forming supports inside are formed in the first electrode and the sacrificial layer. The supports are formed in the first openings, and then a second electrode is formed on the sacrificial layer and the supports, thus forming a micro electro mechanical system structure. Afterward, an adhesive is used to adhere and fix a protection structure to the substrate for forming a chamber to enclose the micro electro mechanical system structure, and at least one second opening is preserved on sidewalls of the chamber. A release etch process is subsequently employed to remove the sacrificial layer through the second opening in order to form cavities in an optical interference reflection structure. Finally, the second opening is closed to seal the optical interference reflection structure between the substrate and the protection structure.

Abstract: Physical forces sufficient to deform an electronic device and/or packaging for the electronic device can damage the device. Some mechanical components in a device, for example, in a microelectromechanical device and/or in an interferometric modulator are particularly susceptible to damage. Accordingly, provided herein is a packaging system and packaged electronic device that resists physical damage, a method for manufacturing the same, and a method for protecting an electronic device from physical damage. The packaging system for the electronic device includes one or more spacers that prevent or reduce damage to the electronic device arising from contact with the packaging. In some embodiments, the packaged electronic device comprising spacers is thinner than a comparable device manufactured without spacers.

Abstract: One embodiment provides a method of testing humidity. The method includes measuring i) a first weight of a first device which encloses a plurality of interferometric modulators and ii) a second weight of a second device which encloses a plurality of interferometric modulators, wherein the first and second devices contain a different amount of water vapor. The method further includes comparing the weights of the first and second devices and determining a relative humidity value or a degree of the relative humidity inside one of the two devices based at least in part upon the weight comparison. In one embodiment, the relative humidity value or degree is determined considering at least one of the following parameters: i) temperature-humidity combination inside at least one of the devices, ii) the thickness and width of a seal of the at least one device, iii) adhesive permeability of a component of the at least one device, iv) a desiccant capacity inside the at least one device and v) a device size.

Abstract: Methods and systems for packaging MEMS devices such as interferometric modulator arrays are disclosed. One embodiment of a MEMS device package structure includes a seal with a chemically reactant getter. Another embodiment of a MEMS device package comprises a primary seal with a getter, and a secondary seal proximate an outer periphery of the primary seal. Yet another embodiment of a MEMS device package comprises a getter positioned inside the MEMS device package and proximate an inner periphery of the package seal.

Abstract: A package structure and method of packaging an interferometric modulator with an integrated desiccant. An interferometric modulator is formed on a transparent substrate. A backplane is joined to the transparent substrate to form a package structure and to encapsulate the interferometric modulator. A desiccant integrated into the backplane or the transparent substrate is provided to absorb moisture within the package.

Abstract: A first electrode and a sacrificial layer are sequentially formed on a substrate, and then first openings for forming supports inside are formed in the first electrode and the sacrificial layer. The supports are formed in the first openings, and then a second electrode is formed on the sacrificial layer and the supports, thus forming a micro electro mechanical system structure. Afterward, an adhesive is used to adhere and fix a protection structure to the substrate for forming a chamber to enclose the micro electro mechanical system structure, and at least one second opening is preserved on sidewalls of the chamber. A release etch process is subsequently employed to remove the sacrificial layer through the second opening in order to form cavities in an optical interference reflection structure. Finally, the second opening is closed to seal the optical interference reflection structure between the substrate and the protection structure.

Abstract: A package structure and method of packaging for an interferometric modulator. A thin film material is deposited over an interferometric modulator and transparent substrate to encapsulate the interferometric modulator. A gap or cavity between the interferometric modulator and the thin film provides a space in which mechanical parts of the interferometric modulator may move. The gap is created by removal of a sacrificial layer that is deposited over the interferometric modulator.

Abstract: A package is made of a transparent substrate having an interferometric modulator and a back plate. A non-hermetic seal joins the back plate to the substrate to form a package, and a desiccant resides inside the package. A method of packaging an interferometric modulator includes providing a transparent substrate and manufacturing an interferometric modulator array on a backside of the substrate. A back plate is provided and a desiccant is applied to the back plate. The back plate is sealed to the backside of the substrate with a back seal in ambient conditions, thereby forming a package.

Abstract: A package structure and method of packaging for an interferometric modulator. A thin film material is deposited over an interferometric modulator and transparent substrate to encapsulate the interferometric modulator. A gap or cavity between the interferometric modulator and the thin film provides a space in which mechanical parts of the interferometric modulator may move. The gap is created by removal of a sacrificial layer that is deposited over the interferometric modulator.

Abstract: Disclosed is an electronic device utilizing interferometric modulation and a package of the device. The packaged device includes a substrate, an interferometric modulation display array formed on the substrate, and a back-plate. The back-plate is placed over the display array with a gap between the back-plate and the display array. The device further includes reinforcing structures which are integrated with the back-plate. The reinforcing structures add stiffness to the back-plate. The back-plate may have a thickness varying along an edge thereof.

Abstract: A package is made of a transparent substrate having an interferometric modulator and a back plate. A non-hermetic seal joins the back plate to the substrate to form a package, and a desiccant resides inside the package. A method of packaging an interferometric modulator includes providing a transparent substrate and manufacturing an interferometric modulator array on a backside of the substrate. A back plate includes a curved portion relative to the substrate. The curved portion is substantially throughout the back plate. The back plate is sealed to the backside of the substrate with a back seal in ambient conditions, thereby forming a package.

Abstract: One embodiment provides a method of testing humidity. The method includes measuring i) a first weight of a first device which encloses a plurality of interferometric modulators and ii) a second weight of a second device which encloses a plurality of interferometric modulators, wherein the first and second devices contain a different amount of water vapor. The method further includes comparing the weights of the first and second devices and determining a relative humidity value or a degree of the relative humidity inside one of the two devices based at least in part upon the weight comparison. In one embodiment, the relative humidity value or degree is determined considering at least one of the following parameters: i) temperature-humidity combination inside at least one of the devices, ii) the thickness and width of a seal of the at least one device, iii) adhesive permeability of a component of the at least one device, iv) a desiccant capacity inside the at least one device and v) a device size.

Abstract: One embodiment provides a method of testing humidity, comprising: i) determining a property of a device which encloses a plurality of interferometric modulators and ii) determining a relative humidity value or a degree of the relative humidity inside the device based at least in part upon the determined property, wherein the determined property comprises at least one of i) the thickness and width of a seal of the device and ii) adhesive permeability of a component of the device. In one embodiment, the determined property further comprises at least one of the following: i) temperature-humidity combination inside the device, ii) a desiccant capacity inside the device and iii) a device size.

Abstract: Disclosed is an electronic device utilizing interferometric modulation and a package of the device. The packaged device includes a substrate, an interferometric modulation display array formed on the substrate, and a back-plate. The back-plate is placed over the display array with a gap between the back-plate and the display array. The depth of the gap may vary across the back-plate. The back-plate can be curved or have a recess on its interior surface facing the display array. Thickness of the back-plate may vary. The device may include reinforcing structures which are integrated with the back-plate.

Abstract: One embodiment provides a method of testing humidity, comprising: determining a property of a device which encloses a plurality of interferometric modulators; and determining a relative humidity value or a degree of the relative humidity inside the device based at least in part upon the determined property. In one embodiment, the property of the device includes one of the following: i) a weight of the device, ii) a color change of a desiccant enclosed in the device, iii) a resistance inside the device, iv) whether frost formed in an inside area of the device which is contacted by a cold finger device, v) whether a desiccant enclosed in the device, when water vapor is provided into the device, is working properly, and vi) combination of at lest two of i)-v).

Abstract: A package structure and method for packaging a MEMS device is described. In one embodiment, the MEMS base device can include a substrate having a MEMS device formed thereon, a backplate, an exposed or activated desiccant disposed between the backplate and the transparent substrate, and a cover at least partially encapsulating said desiccant. In another embodiment, a MEMS display device can be manufactured by contacting the substrate and/or backplate with a cover which at least partially encapsulates a desiccant, joining the backplate and the substrate to form a package, and exposing or activating the desiccant.

Abstract: A package structure and method of packaging for a MEMS device is described. A transparent substrate having an interferometric modulator array formed thereon is shown. A single or dual-layered backplate is joined to a frame that circumscribes the modulator array. The frame is bonded to the transparent substrate and to the backplate to provide a hermetic package.

Abstract: A package is made of a transparent substrate having an interferometric modulator and a back plate. A non-hermetic seal joins the back plate to the substrate to form a package, and a desiccant resides inside the package. A method of packaging an interferometric modulator includes providing a transparent substrate and manufacturing an interferometric modulator array on a backside of the substrate. A back plate is provided and a desiccant is applied to the back plate. The back plate is sealed to the backside of the substrate with a back seal in ambient conditions, thereby forming a package.

Abstract: A MEMS-based display device is described, wherein an array of interferometric modulators are configured to reflect light through a transparent substrate. The transparent substrate is sealed to a backplate and the backplate can contain electronic circuitry for controlling the array of interferometric modulators. The backplate can provide physical support for device components, such as electronic components which can be used to control the state of the display. The backplate can also be utilized as a primary structural support for the device.