Abstract: An integrated circuit includes a first-voltage power rail and a second-voltage power rail in a first connection layer, and includes a first-voltage underlayer power rail and a second-voltage underlayer power rail below the first connection layer. Each of the first-voltage and second-voltage power rails extends in a second direction that is perpendicular to a first direction. Each of the first-voltage and second-voltage underlayer power rails extends in the first direction. The integrated circuit includes a first via-connector connecting the first-voltage power rail with the first-voltage underlayer power rail, and a second via-connector connecting the second-voltage power rail with the second-voltage underlayer power rail.

Abstract: A method includes depositing a first passivation layer over a conductive feature, wherein the first passivation layer has a first dielectric constant, forming a capacitor over the first passivation layer, and depositing a second passivation layer over the capacitor, wherein the second passivation layer has a second dielectric constant greater than the first dielectric constant. The method further includes forming a redistribution line over and electrically connecting to the capacitor, depositing a third passivation layer over the redistribution line, and forming an Under-Bump-Metallurgy (UBM) penetrating through the third passivation layer to electrically connect to the redistribution line.

Abstract: A package structure and a manufacturing method for the same are provided. The package structure includes a circuit, a mold sealing layer, a conductive metal board, and a conductive layer. The circuit board includes a substrate and a first electronic element disposed on the substrate. The mold sealing layer is disposed on the substrate and covers the first electronic element. The mold sealing layer has a top surface, a bottom surface corresponding to the top surface, and a side surface connected between the top surface and the bottom surface. The conductive metal board is disposed on the top surface and adjacent to the first electronic element. The conductive layer is disposed on the side surface and electrically connected to the conductive metal board. The conductive metal board and the conductive layer are each an independent component.

Abstract: Features related to systems and methods for automated generation of a machine learning model based in part on a pretrained model are described. The pretrained model is used as a starting point to augment and retrain according to client specifications. The identification of an appropriate pretrained model is based on the client specifications such as model inputs, model outputs, and similarities between the data used to train the models.

Abstract: A package structure and a manufacturing method for the same are provided. The package structure includes a circuit, a mold sealing layer, a conductive metal board, and a conductive layer. The circuit board includes a substrate and a first electronic element disposed on the substrate. The mold sealing layer is disposed on the substrate and covers the first electronic element. The mold sealing layer has a top surface, a bottom surface corresponding to the top surface, and a side surface connected between the top surface and the bottom surface. The conductive metal board is disposed on the top surface and adjacent to the first electronic element. The conductive layer is disposed on the side surface and electrically connected to the conductive metal board. The conductive metal board and the conductive layer are each an independent component.

Abstract: The present invention relates to a method for producing CRM197 recombinant protein in cells. The method comprises culturing a cell comprising an expression plasmid with a polynucleotide and inducing expression of the CRM197 protein.

Abstract: A package structure and a manufacturing method thereof are provided. The package structure includes a circuit board, a barrier structure and a molding layer. The circuit board includes a substrate and a component disposed on the substrate. The substrate includes a molding area and a non-molding area, and the component is disposed on the molding area. The barrier structure is disposed on the substrate and located between the molding area and the non-molding area. The barrier structure has a first predetermined height. The molding layer is disposed on the molding area and covers the component. The molding layer has a second predetermined height. The first predetermined height of the barrier structure is less than or equal to the second predetermined height of the molding layer.

Abstract: A package structure and a manufacturing method for the same are provided. The package structure includes a circuit, a mold sealing layer, a conductive metal board, and a conductive layer. The circuit board includes a substrate and a first electronic element disposed on the substrate. The mold sealing layer is disposed on the substrate and covers the first electronic element. The mold sealing layer has a top surface, a bottom surface corresponding to the top surface, and a side surface connected between the top surface and the bottom surface. The conductive metal board is disposed on the top surface and adjacent to the first electronic element. The conductive layer is disposed on the side surface and electrically connected to the conductive metal board. The conductive metal board and the conductive layer are each an independent component.

Abstract: A package structure and a manufacturing method thereof are provided. The package structure includes a circuit board, a barrier structure and a molding layer. The circuit board includes a substrate and a component disposed on the substrate. The substrate includes a molding area and a non-molding area, and the component is disposed on the molding area. The barrier structure is disposed on the substrate and located between the molding area and the non-molding area. The barrier structure has a first predetermined height. The molding layer is disposed on the molding area and covers the component. The molding layer has a second predetermined height. The first predetermined height of the barrier structure is less than or equal to the second predetermined height of the molding layer.

Abstract: One or more heat pipes are utilized along with a substrate in order to provide heat dissipation through the substrate for heat that can build up at an interface between the substrate and one or more semiconductor chips in a package. In an embodiment the heat pipe may be positioned on a side of the substrate opposite the semiconductor chip and through-substrate vias may be utilized to dissipate heat through the substrate. In an alternative embodiment, the heat pipe may be positioned on a same side of the substrate as the semiconductor chip and may be thermally connected to the one or more semiconductor chips.

Abstract: An exemplary embodiment of the present disclosure illustrates a gesture sensing module disposed on a substrate. The gesture sensing module includes at least one light emitting unit, at least one light sensor, and a control circuit. The light emitting unit provides a light to illuminate a sensing area, wherein a central optical axis of the light forms an angle with a normal vector of the substrate, and the angle is not equal to 0. The light sensor senses a reflection light which a target in the sensing area reflects the light, and generate a sensing signal according to the reflection light. The control circuit coupled to the light sensor and the light emitting unit determines a traveling direction of the target according to the sensing signal.

Abstract: One or more heat pipes are utilized along with a substrate in order to provide heat dissipation through the substrate for heat that can build up at an interface between the substrate and one or more semiconductor chips in a package. In an embodiment the heat pipe may be positioned on a side of the substrate opposite the semiconductor chip and through-substrate vias may be utilized to dissipate heat through the substrate. In an alternative embodiment, the heat pipe may be positioned on a same side of the substrate as the semiconductor chip and may be thermally connected to the one or more semiconductor chips.

Abstract: An exemplary embodiment of the present disclosure illustrates a gesture sensing module disposed on a substrate. The gesture sensing module includes at least one light emitting unit, at least one light sensor, and a control circuit. The light emitting unit provides a light to illuminate a sensing area, wherein a central optical axis of the light forms an angle with a normal vector of the substrate, and the angle is not equal to 0. The light sensor senses a reflection light which a target in the sensing area reflects the light, and generate a sensing signal according to the reflection light. The control circuit coupled to the light sensor and the light emitting unit determines a traveling direction of the target according to the sensing signal.

Abstract: One or more heat pipes are utilized along with a substrate in order to provide heat dissipation through the substrate for heat that can build up at an interface between the substrate and one or more semiconductor chips in a package. In an embodiment the heat pipe may be positioned on a side of the substrate opposite the semiconductor chip and through-substrate vias may be utilized to dissipate heat through the substrate. In an alternative embodiment, the heat pipe may be positioned on a same side of the substrate as the semiconductor chip and may be thermally connected to the one or more semiconductor chips.

Abstract: A dust collector for collecting sawdust and wood chips is disclosed. The sawdust and wood chips may be extracted from the conduit and the seat to the upper cylinder and the lower cylinder by the exhaust fan motor. The dust collector may collect the sawdust and wood chips adjacent to the ceiling or higher locations while the seat is at the second mode. And the dust collector may also collect the sawdust and wood chips adjacent to the floor or lower locations while the seat is at the first mode. It is easy to operate to turn around the seat to change to the first mode or the second.

Abstract: A drill press with pivot table(s) includes a support column and a collar disposed on an outer periphery of the support column. The outer periphery of the support column and the collar delimit a first groove therebetween. A base connects to the support column. The outer periphery of the support column and the base delimit a second groove therebetween. A pivotal device is movable relative to the support column. The pivotal device has various fixed pivoting and sliding positions relative to the support column. A first work platform connects to the pivotal device. The first work platform is movable relative to the pivotal device. A second work platform connects to the pivotal device. The second work platform is movable relative to the pivotal device.

Abstract: An energy-saving and safer drill press includes a drill head having an original position and being operably moved from the original position in the process of a workpiece. A control selectively engages with the drill head. The drill press has a turned on and turn off modes. The drill press in the turned on mode thereof and the drill head in a position disengaging from the control include the drill head in a spinning motion and spins a bit when the bit is installed to the drill head. The drill press in the turned on mode thereof and the drill head in a position engaging with the control include the drill head in a stop and non-spin motion.

Abstract: An exemplary embodiment of the present disclosure illustrates a proximity sensing method used in a controller of a proximity sensing device. Firstly, a cross talk value is initialized. After the cross talk value is initialized, whether the cross talk value should be updated is judged at least according to a first sensing value currently received from a sensing unit of the proximity sensing device. When the cross talk value is judged to be updated, the cross talk value is updated at least according to a first sensing value. Then, a compensated sensing value is obtained by subtracting the cross talk value from the first sensing value.

Abstract: A planer head is provided with a cylindrical body; an axis formed through the body; a knife carrier assembly formed with the cylindrical body and including a first knife carrier and second knife carriers circumferentially equally spaced apart, each of the first and second knife carriers including a flat front surface, a flat rear surface, and a curved, intermediate surface; and threaded holes formed on the front surface of each of the first and second knife carries; an elongated first knife including first through holes; second knives each including second through holes; first fasteners driven through the first through holes into the threaded holes to secure the first knife to the front surface of the first knife carrier; and second fasteners driven through the second through holes into the threaded holes to secure the second knives to the front surface of each second knife carrier.

Abstract: An exemplary embodiment of the present disclosure illustrates a proximity sensing method used in a controller of a proximity sensing device. Firstly, a cross talk value is initialized. After the cross talk value is initialized, whether the cross talk value should be updated is judged at least according to a first sensing value currently received from a sensing unit of the proximity sensing device. When the cross talk value is judged to be updated, the cross talk value is updated at least according to a first sensing value. Then, a compensated sensing value is obtained by subtracting the cross talk value from the first sensing value.