Abstract: A cutting apparatus includes a body defining a wall having a groove in which mounted the driving mechanism, which is provided for driving a cutter and includes a fixture mounted thereon for connecting a safeguard and a position adjusting mechanism connected thereto for operably adjusting positions of the driving mechanism in the groove. An adjustable retaining member which selectively moves on the fixture in a first position for retaining the safeguard in the space and a second position for allowing removal of the safeguard.

Abstract: A fence assembly for a cutting machine includes a body which is adapted to guide a workpiece on a worktable during cutting process. A coupling mechanism includes a sliding bracket slidably mounted to a rail and connected to the body such that movement of the bracket along the rail causes movement of the body relative to the worktable. The sliding bracket is adapted for providing stable sliding movement with respect to the rail and engaging with at least three sides of the rail. A locking mechanism is utilized for selectively locking and unlocking the sliding bracket on the rail.

Abstract: The method for copying data from a tape onto a storage medium comprises the steps of scanning the tape in a fast winding operation, counting control pulses present on the tape during the fast winding operation in a counter, defining a compression rate in dependency of the number of control pulses and the capacity of the optical medium, reading the data from the tape and writing the data onto the storage medium by using said compression rate. The appliance comprises a media recorder, a tape recorder and a micro-controller for performing the method. The appliance allows in particular, copying in an automated procedure all information being recorded on the tape onto the storage medium via a one touch copy operation, by making optimum use of the capacity of the storage medium.

Abstract: A saw machine includes a housing, with the housing including a support collar disposed on the top edge thereof and two fixed portions respectively disposed in the interior thereof below the support collar, at least one of attached portions defined between the support collar and the fixed portions. Two locking devices are respectively set in the attached portions and fixed to an associated fixed portions, with each locking device disposed below and not exposed from the support collar. A saw means is provided in the housing and installed to the locking devices. A granite working plate is installed onto the top of the support collar and spaced from each locking device.

Abstract: A hand jointer includes a fence assembly, a jointer base assembly and a jointer table assembly. The fence assembly includes a fence member made of granite and the fence member defines a fence surface for supporting a wood workpiece. A fence adjusting means is mounted to a side of the jointer table assembly and connects to the fence member. The fence adjusting means allows the fence member to tilt to adjust the angle between the fence member and the jointer table assembly.

Abstract: The invention refers to a method for updating of content information related to an audio/visual storage medium wherein content information is being stored on the storage medium after generating the content information. The updated content information is stored in a user data area of the data stream stored on the storage medium.

Abstract: The combination of a generator with an air compressor includes an engine having; a generator, a clutch device, an air compressor and a speed accelerating/decelerating mechanism. The engine includes a throttle disposed at a side thereof. The generator includes a power-generating module, an output unit and a shell. The clutch device is comprised of a solenoid valve. The air compressor includes an air-compressing module connected to the clutch device, a plurality of air reservoirs connected to the air-compressing module, and a pressure sensor installed between the air reservoirs and the solenoid valve of the clutch device. The speed accelerating/decelerating mechanism is connected to the throttle of the engine. The speed accelerating/decelerating mechanism includes a motor electrically connected to the output unit, wherein the motor is adapted for moving the throttle to control the speed of the engine.

Abstract: A woodworking bench includes a table made of granite and mounted on a base of a woodworking machine. A table extension is mounted to a side of the table and made of granite. The side of the table includes two first tracks mounted therein. The table extension includes a side having two second tracks mounted therein and respectively aligned with the first tracks of the table. Two supporting rods are provided and each have a first end slidably received in one of the first tracks and a second end slidably received in one of the second tracks. At least one adjusting member is mounted to the second end of each supporting rod for adjusting coplanarity of a top face of the table and a top face of the table extension.

Abstract: A semiconductor device includes a first sense amplifier coupled to an input for generating a first output; a second sense amplifier couple to the input for generating a second output; and a third sense amplifier coupled to the input for generating a third output, wherein a fourth output amplifying the input is generated based on combinations of logic states of the first, second and third outputs.

Abstract: A wafer level packaging structure with inductors and manufacture method thereof. The method comprises providing a substrate, having several inductors, forming conductive lines and holes to connect the inductors and the wafer, and bonding the substrate and the wafer via bonding pads. Therefore, there are air gaps between the inductors and the wafer, thereby reducing the inductor's dispassion loss and increasing the inductor's quality factor. In addition, the inductors having a high quality factor can be integrated in the wafer containing active/passive components.

Abstract: A packaging structure with protective layers and a packaging method thereof are provided. A protective layer is formed on the surface and the pre-dicing line of the wafer to protect the chip and the die during the wafer grinding process, so as to prevent the wafer from being damaged due to the collision during the transportation process, and thereby reinforcing the mechanical strength of the wafer and the chip, which is useful for the subsequent packaging process.

Abstract: A wafer level chip scale packaging structure and the method of fabricating the same are disclosed to form a sacrificial layer below the bump using a normal semiconductor process. The bump is used to connect the signals between the Si wafer and the PCB. The interface between the sacrificial layer and the PCB is the weakest part in the whole structure. When the stress applied to the bump is overloaded, the interface between the sacrificial layer and the adjacent layers will peel or the sacrificial layer material will crash to remove the stress generated by different thermal expansion coefficients of the Si wafer and the PCB. The sacrificial layer would help avoid the crash occurring to the bump to protect the electrical conduction between the Si wafer and the PCB.

Abstract: A latch type sense amplifier includes a latch unit, an amplifying unit and a circuit module for charging or discharging the latch unit. The latch unit is configured by two sets of serially coupled PMOS and NMOS transistors, whose gates and drains are cross-coupled. The amplifying unit is coupled between the latch unit and a complementary power supply for controlling the latch unit in response to a bit line signal and a complementary bit line signal. The circuit module is designed to charge or discharge the data storage node and the complementary data storage node of the latch unit in response to the bit line signal and the complementary bit line signal, without using a current path across the NMOS transistors therein, such that the data storage node and the complementary data storage node are charged or discharged in a manner insensitive to a mismatch between the two NMOS transistors.

Abstract: A wafer level packaging structure with inductors and manufacture method thereof. The method comprises providing a substrate, having several inductors, forming conductive lines and holes to connect the inductors and the wafer, and bonding the substrate and the wafer via bonding pads. Therefore, there are air gaps between the inductors and the wafer, thereby reducing the inductor's dispassion loss and increasing the inductor's quality factor. In addition, the inductors having a high quality factor can be integrated in the wafer containing active/passive components.

Abstract: A wafer level chip scale packaging structure and the method of fabricating the same are provided to form a sacrificial layer below the bump using a normal semiconductor process. The bump is used to connect the signals between the Si wafer and the PCB. The interface between the sacrificial layer and the adjacent layers is the weakest part in the whole structure. When the stress applied to the bump is overloaded, the interface between the sacrificial layer and the adjacent layers will crash to remove the stress generated by different thermal expansion coefficients of the Si wafer and the PCB. The sacrificial layer would help avoid the crash occurring to the bump to protect the electrical conduction between the Si wafer and the PCB.

Abstract: A method for generating a list of desired elements of a first software code, the first code having a predefined command structure; extracting the desired elements from the first code; and performing an operation on the extracted elements. A system includes a first engine which receives a list of desired elements of a first software code, the first code having a predefined command structure; a second engine which extracts the desired elements from the first code; and a third engine which performs an operation on the extracted elements.

Abstract: A wafer level chip scale packaging structure and the method of fabricating the same are disclosed to form a sacrificial layer below the bump using a normal semiconductor process. The bump is used to connect the signals between the Si wafer and the PCB. The interface between the sacrificial layer and the PCB is the weakest part in the whole structure. When the stress applied to the bump is overloaded, the interface between the sacrificial layer and the PCB will crash to remove the stress generated by different thermal expansion coefficients of the Si wafer and the PCB. The sacrificial layer would help avoid the crash occurring to the bump to protect the electrical conduction between the Si wafer and the PCB.

Abstract: A Wiegand Converter for generating a bi-directional data includes a Terminal Data Separator, a Switch Controller, a Bi-directional Switch to control the Input or Output Wiegand Data send through a Bi-directional Wiegand Data Line. The Received Data sent to Converter and Transmitted Data received From Converter are in recognized computer form such as ASCII. The unsecured Wiegand protocols can then be manipulated by a terminal or transmitted it via a secured form or different data communication protocols and reversed it back to an acceptable Wiegand form for controlling the devices to be located at remote sites or in separate compartments.

Abstract: A wafer level chip scale packaging structure and the method of fabricating the same are disclosed to form a sacrificial layer below the bump using a normal semiconductor process. The bump is used to connect the signals between the Si wafer and the PCB. The interface between the sacrificial layer and the PCB is the weakest part in the whole structure. When the stress applied to the bump is overloaded, the interface between the sacrificial layer and the PCB will crash to remove the stress generated by different thermal expansion coefficients of the Si wafer and the PCB. The sacrificial layer would help avoid the crash occurring to the bump to protect the electrical conduction between the Si wafer and the PCB.

Abstract: An embossing tool for embossing a sheet of material has a body formed with a fissure for receiving the sheet of material, a lever pivotably mounted about a pivot point on the body and a block positionable between the lever and the body. The block has an embossing face moveable along a first axis, and further has a center riser configured to receive the lever. At least one resilient member is provided, adjacent to the embossing face along a second axis, spaced apart from the first axis, and disposed between the block and the body. When the block is positioned between the lever and the body and when the lever is pivoted about the pivot point between a first position and a second position, the lever engages the block having the axially moveable embossing face to emboss the sheet of material.