Abstract: Disclosed is a filtering device. The device includes a main body part and a filter element assembly, where the main body part has a mounting cavity for accommodating the filter element assembly, further includes a base and a screen cover arranged as a cover of the base, and at least one rack for fixing the filter element assembly is disposed on an inner wall of the screen cover and/or the base; and the filter element assembly includes a folded filter element arranged in a folded shape, and a rubber strip arranged on the folded filter element for maintaining the shape of the folded filter element to facilitate quick assembly and disassembly of the folded filter element. Further, the screen cover and the base are connected through various snap-fit assemblies, without requiring additional connecting members for fixing them, which is convenient for disassembly and assembly, and has a simple structure.

Abstract: Methods and systems are provided for improving user authentication and access control by a network file system service in a multi-tenant public cloud environment by receiving a request for a connection to a file system from a file system client (client), sending an identification request for identification authentication of the client to a control system, receiving a response from the control system, establishing the connection to the file system upon determining that the connection to the file system is allowed based on cloud tenant information associated with the client, receiving an attempt to access the file system from the client by a sub-user, authenticating the sub-user based on the cloud tenant information, issuing a security token including a globally unique sub-user identifier of the sub-user, and using the security token to determine access rights of the sub-user to the file system for a subsequent request.

Abstract: Various embodiments of a flexible circuit package with a high-modulus molding compound layer are disclosed. A flexible circuit package includes a substrate with first and second regions. The first region is configured to bend. The flexible circuit package further includes a conductive line disposed on the second region, an electronic component disposed on the conductive line, and a molding compound layer disposed on the second region and surrounding the electronic component. A modulus of the molding compound layer is greater than a modulus of the substrate and the molding compound layer is configured to prevent the second region from bending.

Abstract: The present invention is generally directed to nanoparticle stabilized firefighting foam concentrates, firefighting foam solutions, and firefighting foams prepared from a concentrate or solution of the present invention containing one or more silica nanoparticles (e.g., surface modified silica nanoparticles) and any or all of one or more components selected from one or more organic solvents, one or more surfactants, one or more biopolymers, and one or more alcohols. The present invention is also directed to methods for increasing the resistance of a firefighting foam to a polar solvent. The present invention is further directed to methods for preparing firefighting foam concentrates including silica nanoparticles (e.g., surface modified silica nanoparticles).

Abstract: The present invention is directed to fluorine-free firefighting foam concentrates containing one or more solvents, one or more surfactants, one or more alcohols, and one or more biopolymers. The present invention is also directed to firefighting foam solutions and firefighting foams prepared from such concentrates and methods for their use. The present invention is also directed to methods for controlling the viscosity of firefighting foam concentrates, including lowering of the concentrate viscosity as temperature decreases.

Abstract: The present invention is generally directed to fluorine-free firefighting foam concentrates containing a surfactant component comprising one or more surfactants, optionally one or more solvents, optionally one or more inorganic salts, and optionally one or more organic salts. The present invention is also directed to firefighting foam solutions and firefighting foams prepared from such concentrates and methods for their use. The fluorine-free firefighting foam concentrates exhibit Newtonian behavior. The fluorine-free firefighting foam solution exhibits dilution thickening properties.

Abstract: Robust estimation of temperatures inside and outside a device can be achieved using one or more absolute temperature sensors optionally in conjunction with thermopile heat flux sensors. Thermopile temperature sensing systems can measure a temperature gradient across two locations within the device, to estimate absolute temperature at locations that are impractical to measure using absolute temperature sensors. Using heat flux models associated with the device, the thermopile temperature sensing system can be used to estimate temperature associated with objects that contact an outer surface of the device, such as a user's skin temperature. Additionally, the thermopile temperature sensing system can be used to estimate ambient air temperature. Within a device, temperature measurements from the thermopile temperature sensors can be used to compensate sensor measurements, such as when the accuracy or reliability of a sensor varies with temperature.

Abstract: Flexible modules and methods of manufacture are described. In an embodiment, a flexible module includes a flex board formed in which a passivation layer is applied in liquid form in a panel level process, followed by exposure and development. An electronic component is then mounted onto the flex board and encapsulated in a molding compound that is directly on a top surface of the passivation layer.

Abstract: Methods and systems are provided for characterizing interfacial tension (IFT) of reservoir fluids, which involves obtaining fluid property data that represents fluid properties of a reservoir fluid sample measured downhole at reservoir conditions, and inputting the fluid property data to a computational model that determines a value of oil-water IFT of the reservoir fluid sample based on the fluid property data. In embodiments, the fluid property data represents single-phase fluid properties of the reservoir fluid sample, such as fluid density and viscosity of an oil phase of the reservoir fluid sample and fluid density of a water phase of the reservoir fluid sample. In embodiments, the computation model can be based on machine learning or analytics combined with a thermodynamics-based physics model.

Abstract: Electronic package structures and assembly methods are described. In an embodiment, an electronic package includes a die mounted face up on a bottom side of a package substrate, and a plurality of components on a top side of the package substrate. The plurality of components may be unmolded, and available for rework. Additional structures are included within the package substrate to provide mechanical rigidity and robustness to the package for warpage control.

Abstract: Methods and systems are provided for characterizing interfacial tension (IFT) of reservoir fluids, which involves obtaining fluid property data that represents fluid properties of a reservoir fluid sample measured downhole at reservoir conditions, and inputting the fluid property data to a computational model that determines a value of oil-water IFT of the reservoir fluid sample based on the fluid property data. In embodiments, the fluid property data represents single-phase fluid properties of the reservoir fluid sample, such as fluid density and viscosity of an oil phase of the reservoir fluid sample and fluid density of a water phase of the reservoir fluid sample. In embodiments, the computation model can be based on machine learning or analytics combined with a thermodynamics-based physics model.

Abstract: Electronic package structures and assembly methods are described. In an embodiment, an electronic package includes a die mounted face up on a bottom side of a package substrate, and a plurality of components on a top side of the package substrate. The plurality of components may be unmolded, and available for rework. Additional structures are included within the package substrate to provide mechanical rigidity and robustness to the package for warpage control.

Abstract: Electronic assembly methods and structures are described. In an embodiment, an electronic assembly method includes bringing together an electronic component and a routing substrate, and directing a large area photonic soldering light pulse toward the electronic component to bond the electronic component to the routing substrate.

Abstract: An electrode unit for measuring physiological electrical activity in a subject is provided. The electrode unit comprises a base material, an electrode, a connector, a conductive ribbon, a space limiting module, and a film. The base material includes a first base material layer and a second base material layer. The electrode is inserted in an opening of the first base material layer. The conductive ribbon is placed on the first base material layer. The conductive ribbon connects the electrode and the connector. The connector is placed inside the space limiting module. The space limiting module is placed inside an opening of the film. The second base material layer is placed on top of the conductive ribbon. The film is placed over the first base material layer and the second base material layer.

Abstract: Electronic assembly methods and structures are described. In an embodiment, an electronic assembly method includes bringing together an electronic component and a routing substrate, and directing a large area photonic soldering light pulse toward the electronic component to bond the electronic component to the routing substrate.

Abstract: Stacked circuit board structures are described. In an embodiment, a plurality of vertical devices serves as electrical interconnections between the first circuit board and the second circuit board. In an embodiment, a plurality of vertical interconnects or pins serve as electrical interconnections between the first circuit board and the second circuit board. The vertical interconnects or pins may be arranged side-by-side with a plurality of vertical or horizontal devices.

Abstract: A drawer-type microwave oven (200), and a door opening and closing control method for the drawer-type microwave oven (200). The drawer-type microwave oven (200) comprises: a cavity assembly; a drawer assembly, provided in the cavity assembly and used for containing food to be processed; a push rod assembly (2062), provided at the bottom of the cavity assembly and capable of pushing the drawer assembly out of or into the cavity assembly; a control panel (220), disposed on the cavity assembly, and provided with an “on/off” button for controlling the drawer assembly to be opened or closed; and a microprocessor (202), connected to the push rod assembly (2062) and/or the control panel (220) and used for controlling the operating state of the push rod assembly (2062) according to an instruction of the control panel (220). Automatic door opening and closing of the drawer-type microwave oven (200) can be controlled with one button.

Abstract: A process for manufacturing a printed circuit board having high-density microvias formed in a thick substrate is disclosed. The method includes the steps of forming one or more holes in a thick substrate using a laser drilling technique, electroplating the one or more holes with a conductive material, wherein the conductive material does not completely fill the one or more holes, and filling the one or more plated holes with a non-conductive material.

Abstract: An integrated circuit package includes a packaging substrate, which has an electrically conductive grid formed on a dielectric layer, and an integrated circuit die electrically coupled to the electrically conductive grid at one or more locations. In this embodiment, the electrically conductive grid includes a plurality of electrically conductive portions, wherein each portion is electrically coupled to at least one other portion, and a plurality of void regions that are electrically non-contiguous and substantially free of electrically conductive material. One advantage of the integrated circuit package is that a packaging substrate that is reduced in thickness, and therefore rigidity, can still maintain planarity during operation.

Abstract: Stiffening is provided for an electronic package assembly having a substrate. A first electronic package, having a first function, is electromechanically fastened to a first surface of the substrate with a first array of electrically conductive interconnects, which is disposed over a central area of the substrate first surface. A second electronic package, having a second function, is fastened to the first substrate surface with a second conductive interconnect array. At least a pair of the first array conductors is electrically coupled to at least a pair of the second array conductors for data/signal exchange and at least a component of the first electronic package interacts with at least a component of the second package. A metallic stiffener ring is disposed about an outer periphery of at least the central area of the substrate.