Abstract: A control method includes: in case that a first operation is received, determining an operation object and an operation type of the first operation, a first window information of a first window currently displayed on a display interface and a current display mode of an electronic apparatus; in case that the current display mode is a first mode, determining a second window to be displayed on the display interface after the first operation and a second window information based on at least one of the first window information, the operation object and the operation type; and displaying the second window based on the second window information.

Abstract: A touch substrate and a display device are disclosed. The touch substrate has a folding line, the touch substrate including a touch region and a non-touch region. The non-touch region includes a first non-touch region, a second non-touch region, and a third non-touch region between the first non-touch region and the second non-touch region. The touch substrate includes: multiple first electrode groups; multiple second electrode groups; a touch integrated circuit in the third non-touch region; multiple first sub-electrode group connecting lines in the first non-touch region; and a shielded line.

Abstract: Electronic assembly methods and structures are described. In an embodiment, an electronic assembly method includes bringing together an electronic component and a routing substrate, and directing a large area photonic soldering light pulse toward the electronic component to bond the electronic component to the routing substrate.

Abstract: Flexible modules and methods of manufacture are described. In an embodiment, a flexible module includes a flex board formed in which a passivation layer is applied in liquid form in a panel level process, followed by exposure and development. An electronic component is then mounted onto the flex board and encapsulated in a molding compound that is directly on a top surface of the passivation layer.

Abstract: The present invention is generally directed to nanoparticle stabilized firefighting foam concentrates, firefighting foam solutions, and firefighting foams prepared from a concentrate or solution of the present invention containing one or more silica nanoparticles (e.g., surface modified silica nanoparticles) and any or all of one or more components selected from one or more organic solvents, one or more surfactants, one or more biopolymers, and one or more alcohols. The present invention is also directed to methods for increasing the resistance of a firefighting foam to a polar solvent. The present invention is further directed to methods for preparing firefighting foam concentrates including silica nanoparticles (e.g., surface modified silica nanoparticles).

Abstract: Various embodiments of a flexible circuit package with a high-modulus molding compound layer are disclosed. A flexible circuit package includes a substrate with first and second regions. The first region is configured to bend. The flexible circuit package further includes a conductive line disposed on the second region, an electronic component disposed on the conductive line, and a molding compound layer disposed on the second region and surrounding the electronic component. A modulus of the molding compound layer is greater than a modulus of the substrate and the molding compound layer is configured to prevent the second region from bending.

Abstract: The present invention is directed to fluorine-free firefighting foam concentrates containing one or more solvents, one or more surfactants, one or more alcohols, and one or more biopolymers. The present invention is also directed to firefighting foam solutions and firefighting foams prepared from such concentrates and methods for their use. The present invention is also directed to methods for controlling the viscosity of firefighting foam concentrates, including lowering of the concentrate viscosity as temperature decreases.

Abstract: The present invention is generally directed to fluorine-free firefighting foam concentrates containing a surfactant component comprising one or more surfactants, optionally one or more solvents, optionally one or more inorganic salts, and optionally one or more organic salts. The present invention is also directed to firefighting foam solutions and firefighting foams prepared from such concentrates and methods for their use. The fluorine-free firefighting foam concentrates exhibit Newtonian behavior. The fluorine-free firefighting foam solution exhibits dilution thickening properties.

Abstract: Robust estimation of temperatures inside and outside a device can be achieved using one or more absolute temperature sensors optionally in conjunction with thermopile heat flux sensors. Thermopile temperature sensing systems can measure a temperature gradient across two locations within the device, to estimate absolute temperature at locations that are impractical to measure using absolute temperature sensors. Using heat flux models associated with the device, the thermopile temperature sensing system can be used to estimate temperature associated with objects that contact an outer surface of the device, such as a user's skin temperature. Additionally, the thermopile temperature sensing system can be used to estimate ambient air temperature. Within a device, temperature measurements from the thermopile temperature sensors can be used to compensate sensor measurements, such as when the accuracy or reliability of a sensor varies with temperature.

Abstract: Flexible modules and methods of manufacture are described. In an embodiment, a flexible module includes a flex board formed in which a passivation layer is applied in liquid form in a panel level process, followed by exposure and development. An electronic component is then mounted onto the flex board and encapsulated in a molding compound that is directly on a top surface of the passivation layer.

Abstract: Methods and systems are provided for characterizing interfacial tension (IFT) of reservoir fluids, which involves obtaining fluid property data that represents fluid properties of a reservoir fluid sample measured downhole at reservoir conditions, and inputting the fluid property data to a computational model that determines a value of oil-water IFT of the reservoir fluid sample based on the fluid property data. In embodiments, the fluid property data represents single-phase fluid properties of the reservoir fluid sample, such as fluid density and viscosity of an oil phase of the reservoir fluid sample and fluid density of a water phase of the reservoir fluid sample. In embodiments, the computation model can be based on machine learning or analytics combined with a thermodynamics-based physics model.

Abstract: Electronic package structures and assembly methods are described. In an embodiment, an electronic package includes a die mounted face up on a bottom side of a package substrate, and a plurality of components on a top side of the package substrate. The plurality of components may be unmolded, and available for rework. Additional structures are included within the package substrate to provide mechanical rigidity and robustness to the package for warpage control.

Abstract: Methods and systems are provided for characterizing interfacial tension (IFT) of reservoir fluids, which involves obtaining fluid property data that represents fluid properties of a reservoir fluid sample measured downhole at reservoir conditions, and inputting the fluid property data to a computational model that determines a value of oil-water IFT of the reservoir fluid sample based on the fluid property data. In embodiments, the fluid property data represents single-phase fluid properties of the reservoir fluid sample, such as fluid density and viscosity of an oil phase of the reservoir fluid sample and fluid density of a water phase of the reservoir fluid sample. In embodiments, the computation model can be based on machine learning or analytics combined with a thermodynamics-based physics model.

Abstract: Electronic package structures and assembly methods are described. In an embodiment, an electronic package includes a die mounted face up on a bottom side of a package substrate, and a plurality of components on a top side of the package substrate. The plurality of components may be unmolded, and available for rework. Additional structures are included within the package substrate to provide mechanical rigidity and robustness to the package for warpage control.

Abstract: Electronic assembly methods and structures are described. In an embodiment, an electronic assembly method includes bringing together an electronic component and a routing substrate, and directing a large area photonic soldering light pulse toward the electronic component to bond the electronic component to the routing substrate.

Abstract: An electrode unit for measuring physiological electrical activity in a subject is provided. The electrode unit comprises a base material, an electrode, a connector, a conductive ribbon, a space limiting module, and a film. The base material includes a first base material layer and a second base material layer. The electrode is inserted in an opening of the first base material layer. The conductive ribbon is placed on the first base material layer. The conductive ribbon connects the electrode and the connector. The connector is placed inside the space limiting module. The space limiting module is placed inside an opening of the film. The second base material layer is placed on top of the conductive ribbon. The film is placed over the first base material layer and the second base material layer.

Abstract: Electronic assembly methods and structures are described. In an embodiment, an electronic assembly method includes bringing together an electronic component and a routing substrate, and directing a large area photonic soldering light pulse toward the electronic component to bond the electronic component to the routing substrate.

Abstract: Stacked circuit board structures are described. In an embodiment, a plurality of vertical devices serves as electrical interconnections between the first circuit board and the second circuit board. In an embodiment, a plurality of vertical interconnects or pins serve as electrical interconnections between the first circuit board and the second circuit board. The vertical interconnects or pins may be arranged side-by-side with a plurality of vertical or horizontal devices.

Abstract: A drawer-type microwave oven (200), and a door opening and closing control method for the drawer-type microwave oven (200). The drawer-type microwave oven (200) comprises: a cavity assembly; a drawer assembly, provided in the cavity assembly and used for containing food to be processed; a push rod assembly (2062), provided at the bottom of the cavity assembly and capable of pushing the drawer assembly out of or into the cavity assembly; a control panel (220), disposed on the cavity assembly, and provided with an “on/off” button for controlling the drawer assembly to be opened or closed; and a microprocessor (202), connected to the push rod assembly (2062) and/or the control panel (220) and used for controlling the operating state of the push rod assembly (2062) according to an instruction of the control panel (220). Automatic door opening and closing of the drawer-type microwave oven (200) can be controlled with one button.

Abstract: A process for manufacturing a printed circuit board having high-density microvias formed in a thick substrate is disclosed. The method includes the steps of forming one or more holes in a thick substrate using a laser drilling technique, electroplating the one or more holes with a conductive material, wherein the conductive material does not completely fill the one or more holes, and filling the one or more plated holes with a non-conductive material.