Abstract: The hinge mechanism includes a base and a main hinge module. The base includes a support surface for supporting a flexible display. The main hinge module includes a first rotating component and a second rotating component disposed on two opposite sides of the base. The first rotating component includes a first support plate, and the first support plate includes a first plate surface for supporting the flexible display. The second rotating component includes a second support plate, and the second support plate includes a second plate surface for supporting the flexible display. When the hinge mechanism is in a folded state, an included angle between the first plate surface and a bearing surface is less than an included angle between the second plate surface and the bearing surface, to form display accommodating space between the first plate surface, the second plate surface, and the bearing surface.

Abstract: The disclosure relates to the technical field of display, in particular to a displaying substrate, a manufacturing method thereof and a display panel. The displaying substrate comprises a passivation layer (28) and a flat layer (29) covering the passivation layer (28), wherein the flat layer (29) comprises a first flat via hole and a plurality of second flat via holes, the passivation layer (28) comprises a first passivation via hole, and the first flat via hole and the first passivation via hole form a first sleeve hole (31); and the hole depth of the first flat via hole is smaller than that of each second flat via hole, and the hole depth of the first passivation via hole is greater than or equal to the difference between the maximum hole depth of all the second flat via holes and the hole depth of the first flat via hole.

Abstract: A method and a device for performing synchronization detection on wireless earphones, wireless earphones and a computer readable storage medium are provided. In the method, a synchronization state between a left earphone and a right earphone of the wireless earphones is acquired when the wireless earphones trigger a target action, where the target action includes any one of: entering a box, leaving a box, entering an ear, leaving an ear and connecting to a terminal; a countdown with a predetermined time duration is started in a case that the synchronization state is a non-synchronous state; and the synchronization state between the left earphone and the right earphone of the wireless earphones is acquired when the countdown ends.

Abstract: A rotating shaft mechanism includes a body, a first door plate, a second door plate, an intermediate door plate, a first connecting rod assembly, and a second connecting rod assembly. The first connecting rod assembly includes a first housing connecting rod, a first gear connecting rod, and a first secondary connecting rod. The rotating shaft mechanism further includes a first meshing transmission structure. The first housing connecting rod, the first gear connecting rod, the first secondary connecting rod, the first door plate, and the body form a crank-slider structure to drive the first door plate to rotate relative to the body. The first gear connecting rod drives the intermediate door plate to move relative to the body using the first meshing transmission structure.

Abstract: Flexible modules and methods of manufacture are described. In an embodiment, a flexible module includes a flex board formed in which a passivation layer is applied in liquid form in a panel level process, followed by exposure and development. An electronic component is then mounted onto the flex board and encapsulated in a molding compound that is directly on a top surface of the passivation layer.

Abstract: Electronic assembly methods and structures are described. In an embodiment, an electronic assembly method includes bringing together an electronic component and a routing substrate, and directing a large area photonic soldering light pulse toward the electronic component to bond the electronic component to the routing substrate.

Abstract: Various embodiments of a flexible circuit package with a high-modulus molding compound layer are disclosed. A flexible circuit package includes a substrate with first and second regions. The first region is configured to bend. The flexible circuit package further includes a conductive line disposed on the second region, an electronic component disposed on the conductive line, and a molding compound layer disposed on the second region and surrounding the electronic component. A modulus of the molding compound layer is greater than a modulus of the substrate and the molding compound layer is configured to prevent the second region from bending.

Abstract: The present invention is generally directed to nanoparticle stabilized firefighting foam concentrates, firefighting foam solutions, and firefighting foams prepared from a concentrate or solution of the present invention containing one or more silica nanoparticles (e.g., surface modified silica nanoparticles) and any or all of one or more components selected from one or more organic solvents, one or more surfactants, one or more biopolymers, and one or more alcohols. The present invention is also directed to methods for increasing the resistance of a firefighting foam to a polar solvent. The present invention is further directed to methods for preparing firefighting foam concentrates including silica nanoparticles (e.g., surface modified silica nanoparticles).

Abstract: The present invention is directed to fluorine-free firefighting foam concentrates containing one or more solvents, one or more surfactants, one or more alcohols, and one or more biopolymers. The present invention is also directed to firefighting foam solutions and firefighting foams prepared from such concentrates and methods for their use. The present invention is also directed to methods for controlling the viscosity of firefighting foam concentrates, including lowering of the concentrate viscosity as temperature decreases.

Abstract: The present invention is generally directed to fluorine-free firefighting foam concentrates containing a surfactant component comprising one or more surfactants, optionally one or more solvents, optionally one or more inorganic salts, and optionally one or more organic salts. The present invention is also directed to firefighting foam solutions and firefighting foams prepared from such concentrates and methods for their use. The fluorine-free firefighting foam concentrates exhibit Newtonian behavior. The fluorine-free firefighting foam solution exhibits dilution thickening properties.

Abstract: Robust estimation of temperatures inside and outside a device can be achieved using one or more absolute temperature sensors optionally in conjunction with thermopile heat flux sensors. Thermopile temperature sensing systems can measure a temperature gradient across two locations within the device, to estimate absolute temperature at locations that are impractical to measure using absolute temperature sensors. Using heat flux models associated with the device, the thermopile temperature sensing system can be used to estimate temperature associated with objects that contact an outer surface of the device, such as a user's skin temperature. Additionally, the thermopile temperature sensing system can be used to estimate ambient air temperature. Within a device, temperature measurements from the thermopile temperature sensors can be used to compensate sensor measurements, such as when the accuracy or reliability of a sensor varies with temperature.

Abstract: Flexible modules and methods of manufacture are described. In an embodiment, a flexible module includes a flex board formed in which a passivation layer is applied in liquid form in a panel level process, followed by exposure and development. An electronic component is then mounted onto the flex board and encapsulated in a molding compound that is directly on a top surface of the passivation layer.

Abstract: Methods and systems are provided for characterizing interfacial tension (IFT) of reservoir fluids, which involves obtaining fluid property data that represents fluid properties of a reservoir fluid sample measured downhole at reservoir conditions, and inputting the fluid property data to a computational model that determines a value of oil-water IFT of the reservoir fluid sample based on the fluid property data. In embodiments, the fluid property data represents single-phase fluid properties of the reservoir fluid sample, such as fluid density and viscosity of an oil phase of the reservoir fluid sample and fluid density of a water phase of the reservoir fluid sample. In embodiments, the computation model can be based on machine learning or analytics combined with a thermodynamics-based physics model.

Abstract: Electronic package structures and assembly methods are described. In an embodiment, an electronic package includes a die mounted face up on a bottom side of a package substrate, and a plurality of components on a top side of the package substrate. The plurality of components may be unmolded, and available for rework. Additional structures are included within the package substrate to provide mechanical rigidity and robustness to the package for warpage control.

Abstract: Methods and systems are provided for characterizing interfacial tension (IFT) of reservoir fluids, which involves obtaining fluid property data that represents fluid properties of a reservoir fluid sample measured downhole at reservoir conditions, and inputting the fluid property data to a computational model that determines a value of oil-water IFT of the reservoir fluid sample based on the fluid property data. In embodiments, the fluid property data represents single-phase fluid properties of the reservoir fluid sample, such as fluid density and viscosity of an oil phase of the reservoir fluid sample and fluid density of a water phase of the reservoir fluid sample. In embodiments, the computation model can be based on machine learning or analytics combined with a thermodynamics-based physics model.

Abstract: Electronic package structures and assembly methods are described. In an embodiment, an electronic package includes a die mounted face up on a bottom side of a package substrate, and a plurality of components on a top side of the package substrate. The plurality of components may be unmolded, and available for rework. Additional structures are included within the package substrate to provide mechanical rigidity and robustness to the package for warpage control.

Abstract: Electronic assembly methods and structures are described. In an embodiment, an electronic assembly method includes bringing together an electronic component and a routing substrate, and directing a large area photonic soldering light pulse toward the electronic component to bond the electronic component to the routing substrate.

Abstract: An electrode unit for measuring physiological electrical activity in a subject is provided. The electrode unit comprises a base material, an electrode, a connector, a conductive ribbon, a space limiting module, and a film. The base material includes a first base material layer and a second base material layer. The electrode is inserted in an opening of the first base material layer. The conductive ribbon is placed on the first base material layer. The conductive ribbon connects the electrode and the connector. The connector is placed inside the space limiting module. The space limiting module is placed inside an opening of the film. The second base material layer is placed on top of the conductive ribbon. The film is placed over the first base material layer and the second base material layer.

Abstract: Electronic assembly methods and structures are described. In an embodiment, an electronic assembly method includes bringing together an electronic component and a routing substrate, and directing a large area photonic soldering light pulse toward the electronic component to bond the electronic component to the routing substrate.

Abstract: Stacked circuit board structures are described. In an embodiment, a plurality of vertical devices serves as electrical interconnections between the first circuit board and the second circuit board. In an embodiment, a plurality of vertical interconnects or pins serve as electrical interconnections between the first circuit board and the second circuit board. The vertical interconnects or pins may be arranged side-by-side with a plurality of vertical or horizontal devices.