Patents by Inventor Leilei Zhang

Leilei Zhang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20250101868
    Abstract: Disclosed are a visualization grouting device for coal and rock fissures and a test method, a test device including a visualization fissure grouting box body, a box body bracket, a grouting device and a monitoring device. A bottom plate is divided into four identical areas, rubber cushion blocks with different specifications are arranged to simulate different fissure widths and tortuosity, artificial protolith thin film is pasted inside, and a grouting hole and a plurality of pressure measuring holes are arranged in the center of the upper top plate. In the present disclosure, the grouting process of fissures under different grouting conditions, such as different fissure widths, roughness, grouting resistance and tortuosity of pore channels can be simulated, the grouting under different fissure conditions can be simultaneously simulated, and the differences of different grouting diffusion forms can be clearly and intuitively analyzed and compared through the visualization box body.
    Type: Application
    Filed: October 24, 2024
    Publication date: March 27, 2025
    Inventors: Dengke Wang, Haohang Feng, Jianping Wei, Lei Wang, Hongtu Zhang, Chuanqi Zhu, Le Wei, Banghua Yao, Bo Li, Leilei Si, Zhihui Wen, Xiangyu Xu, Yong Liu, Jian Zhang, Baobao Chen, Shaobo Li, Hewu Liu, Shuaibing Song, Hao Fan, Kun Zhang
  • Patent number: 12248651
    Abstract: A touch substrate and a display device are disclosed. The touch substrate has a folding line, the touch substrate including a touch region and a non-touch region. The non-touch region includes a first non-touch region, a second non-touch region, and a third non-touch region between the first non-touch region and the second non-touch region. The touch substrate includes: multiple first electrode groups; multiple second electrode groups; a touch integrated circuit in the third non-touch region; multiple first sub-electrode group connecting lines in the first non-touch region; and a shielded line.
    Type: Grant
    Filed: November 8, 2023
    Date of Patent: March 11, 2025
    Assignee: Wuhan China Star Optoelectronics Semiconductor Display Technology Co., Ltd.
    Inventors: Chenghao Zhang, Leilei Luo
  • Publication number: 20250053281
    Abstract: A control method includes: in case that a first operation is received, determining an operation object and an operation type of the first operation, a first window information of a first window currently displayed on a display interface and a current display mode of an electronic apparatus; in case that the current display mode is a first mode, determining a second window to be displayed on the display interface after the first operation and a second window information based on at least one of the first window information, the operation object and the operation type; and displaying the second window based on the second window information.
    Type: Application
    Filed: January 19, 2024
    Publication date: February 13, 2025
    Inventors: Huiying YANG, Jiayan LI, Siqi LI, Leilei ZHANG
  • Publication number: 20250036243
    Abstract: A touch substrate and a display device are disclosed. The touch substrate has a folding line, the touch substrate including a touch region and a non-touch region. The non-touch region includes a first non-touch region, a second non-touch region, and a third non-touch region between the first non-touch region and the second non-touch region. The touch substrate includes: multiple first electrode groups; multiple second electrode groups; a touch integrated circuit in the third non-touch region; multiple first sub-electrode group connecting lines in the first non-touch region; and a shielded line.
    Type: Application
    Filed: November 8, 2023
    Publication date: January 30, 2025
    Inventors: Chenghao ZHANG, Leilei LUO
  • Patent number: 12041728
    Abstract: Electronic assembly methods and structures are described. In an embodiment, an electronic assembly method includes bringing together an electronic component and a routing substrate, and directing a large area photonic soldering light pulse toward the electronic component to bond the electronic component to the routing substrate.
    Type: Grant
    Filed: January 28, 2021
    Date of Patent: July 16, 2024
    Assignee: Apple Inc.
    Inventors: Maryam Rahimi, Meng Chi Lee, Wyeman Chen, Leilei Zhang, Jason P. Marsh, Lan Hoang, Yashar Abdollahian
  • Patent number: 12040262
    Abstract: Flexible modules and methods of manufacture are described. In an embodiment, a flexible module includes a flex board formed in which a passivation layer is applied in liquid form in a panel level process, followed by exposure and development. An electronic component is then mounted onto the flex board and encapsulated in a molding compound that is directly on a top surface of the passivation layer.
    Type: Grant
    Filed: July 21, 2021
    Date of Patent: July 16, 2024
    Assignee: Apple Inc.
    Inventors: Dennis R. Pyper, Leilei Zhang, Lan H. Hoang
  • Publication number: 20240075331
    Abstract: The present invention is generally directed to nanoparticle stabilized firefighting foam concentrates, firefighting foam solutions, and firefighting foams prepared from a concentrate or solution of the present invention containing one or more silica nanoparticles (e.g., surface modified silica nanoparticles) and any or all of one or more components selected from one or more organic solvents, one or more surfactants, one or more biopolymers, and one or more alcohols. The present invention is also directed to methods for increasing the resistance of a firefighting foam to a polar solvent. The present invention is further directed to methods for preparing firefighting foam concentrates including silica nanoparticles (e.g., surface modified silica nanoparticles).
    Type: Application
    Filed: September 1, 2023
    Publication date: March 7, 2024
    Inventors: Leilei ZHANG, Pamela HAVELKA-RIVARD, Monica AMANDI, Covadonga PEREZ, Melissa KIM
  • Publication number: 20240080970
    Abstract: Various embodiments of a flexible circuit package with a high-modulus molding compound layer are disclosed. A flexible circuit package includes a substrate with first and second regions. The first region is configured to bend. The flexible circuit package further includes a conductive line disposed on the second region, an electronic component disposed on the conductive line, and a molding compound layer disposed on the second region and surrounding the electronic component. A modulus of the molding compound layer is greater than a modulus of the substrate and the molding compound layer is configured to prevent the second region from bending.
    Type: Application
    Filed: March 16, 2023
    Publication date: March 7, 2024
    Applicant: Apple Inc.
    Inventors: Leilei ZHANG, Abhay Maheshwari, Ali N. Ergun, Arun Chawan
  • Publication number: 20230310918
    Abstract: The present invention is directed to fluorine-free firefighting foam concentrates containing one or more solvents, one or more surfactants, one or more alcohols, and one or more biopolymers. The present invention is also directed to firefighting foam solutions and firefighting foams prepared from such concentrates and methods for their use. The present invention is also directed to methods for controlling the viscosity of firefighting foam concentrates, including lowering of the concentrate viscosity as temperature decreases.
    Type: Application
    Filed: April 4, 2023
    Publication date: October 5, 2023
    Inventors: LeiLei Zhang, Pamela Havelka-Rivard, Aaron Donovan, Covadonga Perez
  • Publication number: 20230271046
    Abstract: The present invention is generally directed to fluorine-free firefighting foam concentrates containing a surfactant component comprising one or more surfactants, optionally one or more solvents, optionally one or more inorganic salts, and optionally one or more organic salts. The present invention is also directed to firefighting foam solutions and firefighting foams prepared from such concentrates and methods for their use. The fluorine-free firefighting foam concentrates exhibit Newtonian behavior. The fluorine-free firefighting foam solution exhibits dilution thickening properties.
    Type: Application
    Filed: February 24, 2023
    Publication date: August 31, 2023
    Inventors: Mark Siem, Pamela Havelka-Rivard, LeiLei Zhang, Robert Paulick, Monica Fernandez, Covadonga Perez
  • Publication number: 20230099638
    Abstract: Robust estimation of temperatures inside and outside a device can be achieved using one or more absolute temperature sensors optionally in conjunction with thermopile heat flux sensors. Thermopile temperature sensing systems can measure a temperature gradient across two locations within the device, to estimate absolute temperature at locations that are impractical to measure using absolute temperature sensors. Using heat flux models associated with the device, the thermopile temperature sensing system can be used to estimate temperature associated with objects that contact an outer surface of the device, such as a user's skin temperature. Additionally, the thermopile temperature sensing system can be used to estimate ambient air temperature. Within a device, temperature measurements from the thermopile temperature sensors can be used to compensate sensor measurements, such as when the accuracy or reliability of a sensor varies with temperature.
    Type: Application
    Filed: September 6, 2022
    Publication date: March 30, 2023
    Inventors: James C. CLEMENTS, Lan Hoang HOANG, Leilei ZHANG, Jacky G. KO, Jafir A. HAIDRI, Xinsheng CHU, Saahil MEHRA
  • Publication number: 20230026254
    Abstract: Flexible modules and methods of manufacture are described. In an embodiment, a flexible module includes a flex board formed in which a passivation layer is applied in liquid form in a panel level process, followed by exposure and development. An electronic component is then mounted onto the flex board and encapsulated in a molding compound that is directly on a top surface of the passivation layer.
    Type: Application
    Filed: July 21, 2021
    Publication date: January 26, 2023
    Inventors: Dennis R. Pyper, Leilei Zhang, Lan H. Hoang
  • Patent number: 11550975
    Abstract: Methods and systems are provided for characterizing interfacial tension (IFT) of reservoir fluids, which involves obtaining fluid property data that represents fluid properties of a reservoir fluid sample measured downhole at reservoir conditions, and inputting the fluid property data to a computational model that determines a value of oil-water IFT of the reservoir fluid sample based on the fluid property data. In embodiments, the fluid property data represents single-phase fluid properties of the reservoir fluid sample, such as fluid density and viscosity of an oil phase of the reservoir fluid sample and fluid density of a water phase of the reservoir fluid sample. In embodiments, the computation model can be based on machine learning or analytics combined with a thermodynamics-based physics model.
    Type: Grant
    Filed: July 28, 2020
    Date of Patent: January 10, 2023
    Assignees: SCHLUMBERGER TECHNOLOGY CORPORATION, SAUDI ARABIAN OIL COMPANY
    Inventors: Sharath Chandra Mahavadi, Robin Singh, Wael Abdallah, Mohammed Al-Hamad, Bastian Sauerer, Shouxiang Ma, Leilei Zhang
  • Patent number: 11462461
    Abstract: Electronic package structures and assembly methods are described. In an embodiment, an electronic package includes a die mounted face up on a bottom side of a package substrate, and a plurality of components on a top side of the package substrate. The plurality of components may be unmolded, and available for rework. Additional structures are included within the package substrate to provide mechanical rigidity and robustness to the package for warpage control.
    Type: Grant
    Filed: June 3, 2020
    Date of Patent: October 4, 2022
    Assignee: Apple Inc.
    Inventors: Leilei Zhang, Lan H. Hoang
  • Publication number: 20220035971
    Abstract: Methods and systems are provided for characterizing interfacial tension (IFT) of reservoir fluids, which involves obtaining fluid property data that represents fluid properties of a reservoir fluid sample measured downhole at reservoir conditions, and inputting the fluid property data to a computational model that determines a value of oil-water IFT of the reservoir fluid sample based on the fluid property data. In embodiments, the fluid property data represents single-phase fluid properties of the reservoir fluid sample, such as fluid density and viscosity of an oil phase of the reservoir fluid sample and fluid density of a water phase of the reservoir fluid sample. In embodiments, the computation model can be based on machine learning or analytics combined with a thermodynamics-based physics model.
    Type: Application
    Filed: July 28, 2020
    Publication date: February 3, 2022
    Inventors: Sharath Chandra Mahavadi, Robin Singh, Wael Abdallah, Mohammed Al-Hamad, Bastian Sauerer, Shouxiang Ma, Leilei Zhang
  • Publication number: 20210384113
    Abstract: Electronic package structures and assembly methods are described. In an embodiment, an electronic package includes a die mounted face up on a bottom side of a package substrate, and a plurality of components on a top side of the package substrate. The plurality of components may be unmolded, and available for rework. Additional structures are included within the package substrate to provide mechanical rigidity and robustness to the package for warpage control.
    Type: Application
    Filed: June 3, 2020
    Publication date: December 9, 2021
    Inventors: Leilei Zhang, Lan H. Hoang
  • Publication number: 20210185831
    Abstract: Electronic assembly methods and structures are described. In an embodiment, an electronic assembly method includes bringing together an electronic component and a routing substrate, and directing a large area photonic soldering light pulse toward the electronic component to bond the electronic component to the routing substrate.
    Type: Application
    Filed: January 28, 2021
    Publication date: June 17, 2021
    Inventors: Maryam Rahimi, Meng Chi Lee, Wyeman Chen, Leilei Zhang, Jason P. Marsh, Lan Hoang, Yashar Abdollahian
  • Publication number: 20210137381
    Abstract: An electrode unit for measuring physiological electrical activity in a subject is provided. The electrode unit comprises a base material, an electrode, a connector, a conductive ribbon, a space limiting module, and a film. The base material includes a first base material layer and a second base material layer. The electrode is inserted in an opening of the first base material layer. The conductive ribbon is placed on the first base material layer. The conductive ribbon connects the electrode and the connector. The connector is placed inside the space limiting module. The space limiting module is placed inside an opening of the film. The second base material layer is placed on top of the conductive ribbon. The film is placed over the first base material layer and the second base material layer.
    Type: Application
    Filed: December 11, 2019
    Publication date: May 13, 2021
    Inventors: Wenzan ZHANG, Xun JIN, Leilei ZHANG
  • Publication number: 20210043597
    Abstract: Electronic assembly methods and structures are described. In an embodiment, an electronic assembly method includes bringing together an electronic component and a routing substrate, and directing a large area photonic soldering light pulse toward the electronic component to bond the electronic component to the routing substrate.
    Type: Application
    Filed: March 30, 2020
    Publication date: February 11, 2021
    Inventors: Leilei Zhang, Jason P. Marsh, Lan Hoang, Yashar Abdollahian
  • Patent number: 10602612
    Abstract: Stacked circuit board structures are described. In an embodiment, a plurality of vertical devices serves as electrical interconnections between the first circuit board and the second circuit board. In an embodiment, a plurality of vertical interconnects or pins serve as electrical interconnections between the first circuit board and the second circuit board. The vertical interconnects or pins may be arranged side-by-side with a plurality of vertical or horizontal devices.
    Type: Grant
    Filed: July 15, 2019
    Date of Patent: March 24, 2020
    Assignee: Apple Inc.
    Inventors: Lan H. Hoang, Takayoshi Katahira, Leilei Zhang, Raghunandan R. Chaware