Abstract: An electronic device can include a semiconductor fin with a first gate electrode adjacent to a first wall, and a second gate electrode adjacent to a second wall. In one embodiment, a conductive member can be formed overlying the semiconductor fin, and a portion of the conductive member can be reacted to form the first and second gate electrodes. In another embodiment, a patterned masking layer can be formed including a masking member over a gate electrode layer, and portion of the masking member overlying the semiconductor fin can be removed. In still another embodiment, a first fin-type transistor structure can include the semiconductor fin, the first and second gate electrodes, and a first insulating cap. The electronic device can also include a second fin-type transistor structure having a second insulating cap thicker than the first insulating cap.

Abstract: A process of forming an electronic device can include forming a gate electrode layer and forming a patterned masking layer. In a first aspect, a process operation is performed before removing substantially all of a lower portion of the gate electrode layer. In a second aspect, a gate dielectric layer is formed prior to forming the gate electrode layer, and a portion of the gate dielectric layer is exposed after removing the patterned masking layer and prior to forming another masking layer. A portion of the gate electrode layer remains covered during a process where some or all of the portion would be otherwise removed or consumed. By forming the electronic device using such a process, damage to the gate electrode structure while performing subsequent processing can be significantly reduced.

Abstract: A multi-bit split-gate memory device is formed over a substrate. A storage layer is formed over the substrate. A first conductive layer is formed over the storage layer. A thickness of a portion of the conductive layer is removed to leave a pillar of the conductive layer and an area of reduced thickness of the conductive layer. A first sidewall spacer is formed adjacent to the pillar to cover a first portion and a second portion of the area of reduced thickness of the conductive layer. The pillar is replaced with a select gate. The area of reduced thickness is selectively removed to leave the first and second portions as control gates.

Abstract: A method for forming a semiconductor device including forming a semiconductor substrate; forming a gate electrode over the semiconductor substrate having a first side and a second side, and forming a gate dielectric under the gate electrode. The gate dielectric has a first area under the gate electrode and adjacent the first side of the gate electrode, a second area under the gate electrode and adjacent the second side of the gate electrode, and a third area under the gate electrode that is between the first area and the second area, wherein the first area is thinner than the second area, and the third area is thinner than the first area and is thinner than the second area.

Abstract: A semiconductor device has a semiconductor substrate that in turn has a top semiconductor layer portion and a major supporting portion under the top semiconductor layer portion. An interconnect layer is over the semiconductor layer. A memory array is in a portion of the top semiconductor layer portion and a portion of the interconnect layer. The memory is erased by removing at least a portion of the major supporting portion and, after the step of removing, applying light to the memory array from a side opposite the interconnect layer. The result is that the memory array receives light from the backside and is erased.

Abstract: A semiconductor device is formed by patterning a semiconductor layer to create a vertical active region and a horizontal active region, wherein the horizontal active region is adjacent the vertical active region. The semiconductor layer overlies an insulating layer. A spacer is formed adjacent the vertical active region and over a portion of the horizontal active region. At least a portion of the horizontal active region is oxidized to form an isolation region. The spacer is removed. A gate dielectric is formed over the vertical active region after removing the spacer. A gate electrode is formed over the gate dielectric. However, forming the spacer is optional.

Abstract: A semiconductor process and apparatus provide a dual or hybrid substrate by forming a second semiconductor layer (214) that is isolated from, and crystallographically rotated with respect to, an underlying first semiconductor layer (212) by a buried insulator layer (213); forming an STI region (218) in the second semiconductor layer (214) and buried insulator layer (213); exposing the first semiconductor layer (212) in a first area (219) of a STI region (218); epitaxially growing a first epitaxial semiconductor layer (220) from the exposed first semiconductor layer (212); and selectively etching the first epitaxial semiconductor layer (220) and the second semiconductor layer (214) to form CMOS FinFET channel regions (e.g, 223) and planar channel regions (e.g., 224) from the first epitaxial semiconductor layer (220) and the second semiconductor layer (214).

Abstract: A rail clamp circuit (100) includes first and second power supply voltage rails, a multiple independent gate field effect transistor (MIGFET) (128), and an ESD event detector circuit (138). The MIGFET (128) has a source/drain path coupled between the first (112) and second (114) power supply voltage rails, and first and second gates. The ESD event detector circuit (138) is coupled between the first (112) and second (114) power supply voltage rails, and has first and second output terminals respectively coupled to the first and second gates of the MIGFET. In response to an electrostatic discharge (ESD) event between the first (112) and second (114) power supply voltage rails, the ESD event detector circuit (138) provides a voltage to the second gate to lower an absolute threshold voltage of the MIGFET (128) while providing a voltage to the first gate above the absolute threshold voltage so lowered, thereby making the MIGFET (128) conductive with relatively high conductivity.

Abstract: Forming structures such as fins in a semiconductor layer according to a pattern formed by oxidizing a sidewall of a layer of oxidizable material. In one embodiment, source/drain pattern structures and a fin pattern structures are patterned in the oxidizable layer. The fin pattern structure is then masked from an oxidation process that grows oxide on the sidewalls of the channel pattern structure and the top surface of the source/drain pattern structures. The remaining oxidizable material of the channel pattern structure is subsequently removed leaving a hole between two portions of the oxide layer. These two portions are used in one embodiment as a mask for patterning the semiconductor layer to form two fins. This patterning also leaves the source/drain structures connected to the fins.

Abstract: A method for forming a semiconductor device including forming a semiconductor substrate; forming a gate electrode over the semiconductor substrate having a first side and a second side, and forming a gate dielectric under the gate electrode. The gate dielectric has a first area under the gate electrode and adjacent the first side of the gate electrode, a second area under the gate electrode and adjacent the second side of the gate electrode, and a third area under the gate electrode that is between the first area and the second area, wherein the first area is thinner than the second area, and the third area is thinner than the first area and is thinner than the second area.

Abstract: Removing a portion of a structure in a semiconductor device to separate the structure. The structure has two portions of different heights. In one example, the structure is removed by forming a spacer over the lower portion adjacent to the sidewall of the higher portion. A second material is then formed on the structure outside of the spacer. The spacer is removed and the portion under the spacer is then removed to separate the structure at that location. In one embodiment, separate channel regions are implemented in the separated structures. In other embodiments, separate gate structures are implemented in the separated structures.

Abstract: A voltage controlled oscillator (VCO) has a plurality of series-connected inverters. Within each inverter a first transistor has a first current electrode coupled to a first power supply voltage terminal, a second current electrode, a first control electrode coupled to an output terminal of another inverter of the plurality of series-connected inverters, and a second control electrode for receiving a first bias signal. A second transistor has a first current electrode coupled to the second current electrode of the first transistor, a second current electrode coupled to a second power supply voltage terminal, and a first control electrode coupled to the first control electrode of the first transistor. The second control electrode of the first transistor of each inverter receives a same or separate analog control signal to adjust the threshold voltage of the first transistors thereof to affect frequency and phase of the VCO's signal.

Abstract: A device and method for phase detection are disclosed. The device includes a phase differential module that provides a phase difference signal based on the phase difference between a data signal and a reference signal. The phase difference signal is provided to a first gate of a multi-gate fin-type field effect transistor (multi-gate FinFET) of the device. A second gate of the multi-gate FinFET transistor receives a bias signal that provides a phase detection threshold. A phase adjustment signal is provided at one or both of the FinFET current electrodes based on the phase difference signal and the bias signal.

Abstract: A semiconductor optical device includes an insulating layer, a photoelectric region formed on the insulating layer, a first electrode having a first conductivity type formed on the insulating layer and contacting a first side of the photoelectric region, and a second electrode having a second conductivity type formed on the insulating layer and contacting a second side of the photoelectric region. The photoelectric region may include nanoclusters or porous silicon such that the device operates as a light emitting device. Alternatively, the photoelectric region may include an intrinsic semiconductor material such that the device operates as a light sensing device. The semiconductor optical device may be further characterized as a vertical optical device. In one embodiment, different types of optical devices, including light emitting and light sensing devices, may be integrated together.

Abstract: A FinFET includes a plurality of semiconductor fins. Over a semiconductor layer, patterned features (e.g. of minimum photolithographic size and spacing) are formed. In one example of fin formation, a first set of sidewall spacers are formed adjacent to the sides of these patterned features. A second set of sidewall spacers of a different material are formed adjacent to the sides of the first set of sidewall spacers. The first set of sidewall spacers are removed leaving the second set of sidewall spacers spaced from the patterned features. Both the second set of sidewall spacers and the patterned features are used as a mask to an etch that leaves semiconductor fins patterned as per the second set of sidewall spacers and the patterned features. These resulting semiconductor fins, which have sub-lithographic spacings, are then used for channels of a FinFET transistor.

Abstract: A method for making a semiconductor device includes patterning a semiconductor layer, overlying an insulator layer, to create a first active region and a second active region, wherein the first active region is of a different height from the second active region, and wherein at least a portion of the first active region has a first conductivity type and at least a portion of the second active region has a second conductivity type different from the first conductivity type in at least a channel region of the semiconductor device. The method further includes forming a gate structure over at least a portion of the first active region and the second active region. The method further includes removing a portion of the second active region on one side of the semiconductor device.

Abstract: A device and method for temperature compensation of an electronic device are disclosed. The device includes a temperature bias controller with a temperature sensor. A bias signal based upon a signal from the temperature sensor is provided to a first gate of a multiple fin gate field effect transistor (multigate FinFET) transistor of a functional block. A second gate of the multigate FinFET transistor receives a control signal to control its operation within the functional block. In this configuration the first gate of the multigate FinFET transistor can be used for temperature compensation while the second gate is used for functional operation of the transistor. Specific embodiments of the present disclosure will be better understood with respect to the figures.

Abstract: A semiconductor device is formed by patterning a semiconductor layer to create a vertical active region and a horizontal active region, wherein the horizontal active region is adjacent the vertical active region. The semiconductor layer overlies an insulating layer. A spacer is formed adjacent the vertical active region and over a portion of the horizontal active region. At least a portion of the horizontal active region is oxidized to form an isolation region. The spacer is removed. A gate dielectric is formed over the vertical active region after removing the spacer. A gate electrode is formed over the gate dielectric. However, forming the spacer is optional.

Abstract: An integrated circuit includes a logic circuit and a memory cell. The logic circuit includes a P-channel transistor, and the memory cell includes a P-channel transistor. The P-channel transistor of the logic circuit includes a channel region. The channel region has a portion located along a sidewall of a semiconductor structure having a surface orientation of (110). The portion of the channel region located along the sidewall has a first vertical dimension that is greater than a vertical dimension of any portion of the channel region of the P-channel transistor of the memory cell located along a sidewall of a semiconductor structure having a surface orientation of (110).

Abstract: A process for forming an electronic device can include forming a semiconductor fin of a first height for a fin-type structure and removing a portion of the semiconductor fin such that the semiconductor fin is shortened to a second height. In accordance with specific embodiment a second semiconductor fin can be formed, each of the first and the second semiconductor fins having a different height representing a channel width. In accordance with another specific embodiment a second and a third semiconductor fin can be formed, each of the first, the second and the third semiconductor fins having a different height representing a channel width.