Patents by Inventor Leping Li

Leping Li has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 6741913
    Abstract: A method is described for noise reduction in a CMP endpoint detection system employing torque measurement. The torque signals are acquired using an adjustable sampling rate and sample size, and averaged using a moving array of adjustable size. By introducing these three adjustable quantities in the torque-based endpoint control algorithm and properly setting their values in the endpoint detection recipe, periodic noise associated with carrier rotation and carrier oscillation can be effectively removed. This in turn permits reliable, closed-loop control of the CMP process.
    Type: Grant
    Filed: December 11, 2001
    Date of Patent: May 25, 2004
    Assignee: International Business Machines Corporation
    Inventors: Xinhui Wang, Yingru Gu, Leping Li
  • Patent number: 6673923
    Abstract: The present invention provides pyrazole and pyrazolone derivatives. Preferred compounds of the invention are useful as RNA polymerase inhibitors. Further preferred compounds of the invention are useful as antimicrobial agents.
    Type: Grant
    Filed: May 2, 2001
    Date of Patent: January 6, 2004
    Assignee: Tularik Inc.
    Inventors: Leping Li, Xiaoqi Chen, Serena T. Cutler
  • Publication number: 20030217990
    Abstract: Improved endpoint detection is obtained for wet etch and/or other chemical processes involving in situ measurement of bath impedance. The endpoint detection uses a measurement apparatus having a measurement circuit with a capacitor designed to alter the phase angle of the circuit. The capacitor is preferably a variable capacitor which is used to set the initial phase angle of the measurement circuit to about zero. The methods using the improved detection enable etch to be more precisely controlled even under conditions where noise would otherwise adversely impact determination of the endpoint.
    Type: Application
    Filed: May 24, 2002
    Publication date: November 27, 2003
    Applicant: International Business Machines Corporation
    Inventors: Leping Li, Steven G. Barbee
  • Patent number: 6649593
    Abstract: Compounds, compositions and methods are provided for the inhibition of S1 protease and for the modulation of cholesterol homeostasis in a cell.
    Type: Grant
    Filed: October 6, 2000
    Date of Patent: November 18, 2003
    Assignees: Tularik Inc., Board of Regents, University of Texas Systems
    Inventors: Juan C. Jaen, Leping Li, Michael S. Brown, Joseph L. Goldstein, Dong Cheng
  • Publication number: 20030206114
    Abstract: An instrumentation device for controlling one or more instruments, wherein the instrumentation device having an interface which accepts at least three sets of inputs and transmits at least three sets of outputs, the interface capable of transmitting signals of different voltage between the individual inputs and individual outputs of the interface and wherein the interface is capable of accepting, translating and transmitting as one of the at least three sets of outputs, input from more than one set of the at least sets of three inputs.
    Type: Application
    Filed: August 30, 2001
    Publication date: November 6, 2003
    Inventors: Leping Li, James A. Gilhooly, Clifford O. Morgan, Cong Wei, Werner Moser, Matthias Kutter, Joseph Knee, Walter Imfeld, Bruno Greuter, Heinz Stuenzi
  • Publication number: 20030176694
    Abstract: Compounds, compositions and methods are provided that are useful in the treatment and/or prevention of a condition or disorder mediated by a G-protein coupled receptor. In particular, the compounds of the invention are useful in the treatment and/or prevention of eating disorders, obesity, anxiety disorders and mood disorders.
    Type: Application
    Filed: November 6, 2002
    Publication date: September 18, 2003
    Inventors: Xiaoqi Chen, Pingchen Fan, Juan Jaen, Leping Li, Mike Lizarzaburu, Jeffrey Thomas Mihalic, Stephen Joseph Shuttleworth
  • Publication number: 20030109194
    Abstract: A method is described for noise reduction in a CMP endpoint detection system employing torque measurement. The torque signals are acquired using an adjustable sampling rate and sample size, and averaged using a moving array of adjustable size. By introducing these three adjustable quantities in the torque-based endpoint control algorithm and properly setting their values in the endpoint detection recipe, periodic noise associated with carrier rotation and carrier oscillation can be effectively removed. This in turn permits reliable, closed-loop control of the CMP process.
    Type: Application
    Filed: December 11, 2001
    Publication date: June 12, 2003
    Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION
    Inventors: Xinhui Wang, Yingru Gu, Leping Li
  • Publication number: 20030023085
    Abstract: Compounds, compositions and methods are provided that are useful in the treatment and/or prevention of a condition or disorder mediated by a G-protein coupled receptor. In particular, the compounds of the invention are useful in the treatment and/or prevention of eating disorders, obesity, anxiety disorders and mood disorders.
    Type: Application
    Filed: May 3, 2002
    Publication date: January 30, 2003
    Applicant: Tularik Inc.
    Inventors: Xiaoqi Chen, Kang Dai, Pingchen Fan, Shugui Huang, Leping Li, Jeffrey Thomas Mihalic
  • Patent number: 6506341
    Abstract: An apparatus is described for detecting the presence of a gaseous chemical produced during a chemical-mechanical polishing operation. The apparatus includes a catalytic converter, a reaction chamber and a light sensor. The catalytic converter, heated to about 800° C. converts the chemical to a different chemical product. The reaction chamber produces an excited species; the pressure in the reaction chamber is maintained sufficiently low to substantially avoid collisional deactivation of the excited species, so as to permit real-time detection of the chemical. A light signal from the excited species is input to the light sensor. An output from the light sensor corresponds to the real-time detection of the chemical, thereby permitting real-time control of the chemical-mechanical polishing operation.
    Type: Grant
    Filed: August 4, 1998
    Date of Patent: January 14, 2003
    Assignees: International Business Machines Corporation, ECO Physics AG
    Inventors: Leping Li, James A. Gilhooly, Clifford O. Morgan, III, Cong Wei, Werner Moser, Matthias Kutter, Joseph Knee, Walter Imfeld, Bruno Greuter, Heinz Stuenzi
  • Patent number: 6440263
    Abstract: Detection of the endpoint for removal of a target film overlying a stopping film by removing the target film with a process that selectively generates a chemical reaction product (for example ammonia when polishing a wafer with a nitride film in a slurry containing KOH) with one of the stopping film and the target film, converting the chemical reaction product to a separate product, producing excited molecules from the separate product, and monitoring the level of light emitted from the excited molecules as the target film is removed.
    Type: Grant
    Filed: August 17, 2000
    Date of Patent: August 27, 2002
    Assignee: International Business Machines Corporation
    Inventors: Leping Li, James Albert Gilhooly, Clifford Owen Morgan, III, William Joseph Surovic, Cong Wei
  • Patent number: 6419785
    Abstract: Detection of the endpoint for removal of a target film overlying a stopping film by removing the target film with a process that selectively generates a chemical reaction product (for example, ammonia when polishing a wafer with a nitride film in a slurry containing KOH) with either the target or stopping film, and monitoring the level of chemical reaction product as the target film is removed. The reaction product is extracted as a gas from the slurry and monitored using a threshold photoionization mass spectrometer.
    Type: Grant
    Filed: October 3, 2000
    Date of Patent: July 16, 2002
    Assignee: International Business Machines Corporation
    Inventors: Leping Li, James Albert Gilhooly, Clifford Owen Morgan, III, Cong Wei, Chienfan Yu
  • Publication number: 20020049205
    Abstract: The present invention provides pyrazole and pyrazolone derivatives. Preferred compounds of the invention are useful as RNA polymerase inhibitors. Further preferred compounds of the invention are useful as antimicrobial agents.
    Type: Application
    Filed: May 2, 2001
    Publication date: April 25, 2002
    Inventors: Leping Li, Xiaoqi Chen, Serena T. Cutler
  • Publication number: 20020045749
    Abstract: Hydroxyamidines and related compounds are provided which are suitable as antibacterial agents.
    Type: Application
    Filed: January 12, 2001
    Publication date: April 18, 2002
    Inventors: Leping Li, Xiaoqi Chen, Pingchen Fan, Jeffrey Thomas Mihalic, Serena Cutler
  • Patent number: 6316503
    Abstract: The invention provides compounds, compositions and methods for modulating the effects of LXR in a cell. The compounds and compositions are useful both as diagnostic indicators of LXR function and as pharmacologically active agents. The compounds and compositions find particular use in the treatment of disease states associated with cholesterol metabolism, particularly atherosclerosis and hypercholesterolemia.
    Type: Grant
    Filed: March 14, 2000
    Date of Patent: November 13, 2001
    Assignee: Tularik Inc.
    Inventors: Leping Li, Julio C. Medina, Kevin Lustig, Bei Shan, Hirohiko Hasegawa, Serena T. Cutler, Jiwen Liu, Liusheng Zhu
  • Patent number: 6291351
    Abstract: A method is described for fabricating a cloisonné structure, in which a top surface of a metal oxide layer is made coplanar with a top surface of a metallic structure formed on a substrate. A nitride layer is deposited on at least the top surface of the metallic structure, and the metal oxide layer is deposited over the metallic structure and the nitride layer. The metal oxide layer is then polished by a chemical-mechanical polishing (CMP) process using a slurry, to expose the nitride layer on the top surface of the metallic structure. Polishing of the nitride layer causes ammonia to be generated in the slurry. The ammonia is extracted as a gas from the slurry, and a signal is generated in accordance with the ammonia concentration. The CMP process is terminated in accordance with a change in the signal. In a preferred embodiment, the metal oxide is aluminum oxide, the nitride is aluminum nitride, and the nitride layer is deposited as a conformal layer on the substrate and the metallic structure.
    Type: Grant
    Filed: June 28, 2000
    Date of Patent: September 18, 2001
    Assignee: International Business Machines Corporation
    Inventors: Leping Li, Steven George Barbee, Eric James Lee, Francisco A. Martin, Cong Wei
  • Patent number: 6276987
    Abstract: Determination of an endpoint for removing a film from a wafer, by determining a first reference point removal time indicating when a breakthrough of the film has occurred, determining a second reference point removal time indicating when the film has been polished almost to completion, determining an additional removal time indicating an overpolishing interval, and adding the second reference point removal time with the additional removal time to get a total removal time to the endpoint.
    Type: Grant
    Filed: August 4, 1998
    Date of Patent: August 21, 2001
    Assignee: International Business Machines Corporation
    Inventors: Leping Li, James A. Gilhooly, Clifford O. Morgan, III, Cong Wei
  • Patent number: 6261851
    Abstract: In a chemical mechanical planarization assembly directed for the removal of oxide layers, which stop on films containing silicon nitride, a conventional polishing table is provided with a gas extraction unit which transmits a gas sample to an infrared spectrometer. The presence of ammonia in the slurry, which is generated when a stop layer containing silicon nitride is abraded under high pH conditions, can be detected using infrared spectroscopy and accordingly provides for an in situ endpoint detection method.
    Type: Grant
    Filed: September 30, 1999
    Date of Patent: July 17, 2001
    Assignee: International Business Machines Corporation
    Inventors: Leping Li, James A. Gilhooly, Clifford O. Morgan, III, Cong Wei
  • Publication number: 20010007772
    Abstract: The invention discloses an apparatus for detecting the presence of a chemical in a gaseous state, having:
    Type: Application
    Filed: August 4, 1998
    Publication date: July 12, 2001
    Inventors: LEPING LI, JAMES A. GILHOOLY, CLIFFORD O. MORGAN, CONG WEI, WERNER MOSER, MATTHIAS KUTTER, JOSEPH KNEE, WALTER IMFELD, BRUNO GREUTER, HEINZ STUNZI
  • Patent number: 6254453
    Abstract: A method is provided to optimize the chemical mechanical planarization process of wafers having a target removal layer and a stop layer. A slurry is added to a polishing table which includes a polishing pad and a platen adapted for rotation; a portion of the slurry is allowed to engage an interface between the polishing pad and the wafer. A gaseous sample is continuously extracted from the slurry; the gaseous sample includes a reactant product created when the polishing pad engages the stop layer. The gaseous sample is introduced into a reactant product detector. A first time is determined, corresponding to an initial detection of the reactant product in the slurry, thereby creating a first reference point. A second time is determined, corresponding to the detection of a maximum volume of the reactant in said slurry, thereby creating a second reference point.
    Type: Grant
    Filed: September 30, 1999
    Date of Patent: July 3, 2001
    Assignee: International Business Machines Corporation
    Inventors: Leping Li, James A. Gilhooly, Clifford O. Morgan, III, Cong Wei
  • Patent number: 6251784
    Abstract: A method and apparatus are described for detecting an endpoint of a film removal process in which a target film overlying a stopping film is removed. A chemical reaction product is generated from at least one of the target film and the stopping film; this chemical reaction product is converted to a separate product. The separate product is exposed to ionizing radiation. The ionization current generated by the radiation is monitored as the target film is removed. A change in the ionization current corresponds to a change in concentration of the separate product, thereby indicating the endpoint of the film removal process. In the particular case of removal of a silicon dioxide film overlying a silicon nitride film by chemical-mechanical polishing, the reaction product is ammonia extracted from the polishing slurry. The ammonia is converted to ammonium chloride by a reaction with hydrogen chloride vapor.
    Type: Grant
    Filed: December 8, 1998
    Date of Patent: June 26, 2001
    Assignee: International Business Machines Corporation
    Inventors: Leping Li, James Albert Gilhooly, Clifford Owen Morgan, Cong Wei