Patents by Inventor Leping Li

Leping Li has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 6254453
    Abstract: A method is provided to optimize the chemical mechanical planarization process of wafers having a target removal layer and a stop layer. A slurry is added to a polishing table which includes a polishing pad and a platen adapted for rotation; a portion of the slurry is allowed to engage an interface between the polishing pad and the wafer. A gaseous sample is continuously extracted from the slurry; the gaseous sample includes a reactant product created when the polishing pad engages the stop layer. The gaseous sample is introduced into a reactant product detector. A first time is determined, corresponding to an initial detection of the reactant product in the slurry, thereby creating a first reference point. A second time is determined, corresponding to the detection of a maximum volume of the reactant in said slurry, thereby creating a second reference point.
    Type: Grant
    Filed: September 30, 1999
    Date of Patent: July 3, 2001
    Assignee: International Business Machines Corporation
    Inventors: Leping Li, James A. Gilhooly, Clifford O. Morgan, III, Cong Wei
  • Patent number: 6251784
    Abstract: A method and apparatus are described for detecting an endpoint of a film removal process in which a target film overlying a stopping film is removed. A chemical reaction product is generated from at least one of the target film and the stopping film; this chemical reaction product is converted to a separate product. The separate product is exposed to ionizing radiation. The ionization current generated by the radiation is monitored as the target film is removed. A change in the ionization current corresponds to a change in concentration of the separate product, thereby indicating the endpoint of the film removal process. In the particular case of removal of a silicon dioxide film overlying a silicon nitride film by chemical-mechanical polishing, the reaction product is ammonia extracted from the polishing slurry. The ammonia is converted to ammonium chloride by a reaction with hydrogen chloride vapor.
    Type: Grant
    Filed: December 8, 1998
    Date of Patent: June 26, 2001
    Assignee: International Business Machines Corporation
    Inventors: Leping Li, James Albert Gilhooly, Clifford Owen Morgan, Cong Wei
  • Patent number: 6228280
    Abstract: A method for detecting the endpoint for removal of a target film overlying a stopping film by chemical-mechanical polishing using a slurry, by removing the target film with a polishing process that generates a chemical reaction product (for example ammonia when polishing a wafer with a nitride film in a slurry containing KOH) in the slurry, adding to the slurry a reagent which produces a characteristic result upon reacting with the chemical reaction product, and monitoring the slurry for the characteristic result as the target film is removed.
    Type: Grant
    Filed: May 6, 1998
    Date of Patent: May 8, 2001
    Assignee: International Business Machines Corporation
    Inventors: Leping Li, James Albert Gilhooly, Clifford Owen Morgan, III, Cong Wei
  • Patent number: 6228769
    Abstract: Detection of the endpoint for removal of a target film overlying a stopping film by removing the target film with a process that selectively generates a chemical reaction product (for example ammonia when polishing a wafer with a nitride film in a slurry containing KOH) with either the target or stopping film, and monitoring the level of chemical reaction product by threshold photoionization mass spectroscopy as the target film is removed.
    Type: Grant
    Filed: May 6, 1998
    Date of Patent: May 8, 2001
    Assignee: International Business Machines Corporation
    Inventors: Leping Li, James Albert Gilhooly, Clifford Owen Morgan, III, Cong Wei, Chienfan Yu
  • Patent number: 6213846
    Abstract: A method is provided for detecting the endpoint of a film removal process such as chemical-mechanical polishing (CMP). The process uses a device having a shaft, and friction in the film removal causes torque on the shaft. Two axially displaced reflecting portions are provided on the shaft. Light reflected from these portions generates first and second reflected signals, respectively. A phase difference between the reflected signals is detected, and an output signal is generated in accordance therewith. A change in the output signal indicates a change in deformation of the shaft resulting from change in the torque, thereby indicating the endpoint of the film removal process.
    Type: Grant
    Filed: July 12, 1999
    Date of Patent: April 10, 2001
    Assignee: International Business Machines Corporation
    Inventors: Leping Li, Xinhui Wang
  • Patent number: 6194230
    Abstract: Detection of the endpoint for removal of a target film overlying a stopping film by removing the target film with a process that selectively produces a gaseous chemical reaction product (for example ammonia when polishing a wafer with a nitride film in a slurry containing KOH) with one of the stopping film and the target film, mixing the gaseous chemical reaction product present with a separate gas to form solid particles, and monitoring the amount of the solid particles as the target film is removed. Also, detection of a substance at very low concentrations in a liquid, by extracting the substance present as a gas from the liquid, mixing the gas with another substance to form solid particles, and monitoring the amount of the solid particles to detect the substance.
    Type: Grant
    Filed: May 6, 1998
    Date of Patent: February 27, 2001
    Assignee: International Business Machines Corporation
    Inventors: Leping Li, James Albert Gilhooly, Clifford Owen Morgan, III, Cong Wei
  • Patent number: 6180422
    Abstract: Detection of the endpoint for removal of a target film overlying a stopping film by removing the target film with a process that selectively generates a chemical reaction product (for example ammonia when polishing a wafer with a nitride film in a slurry containing KOH) with either the target or stopping film, and monitoring the level of chemical reaction product as the target film is removed. Also, detection of a substance at very low concentrations in a liquid, by extracting the substance present as a gas from the liquid and monitoring the gas to detect the substance.
    Type: Grant
    Filed: May 6, 1998
    Date of Patent: January 30, 2001
    Assignee: International Business Machines Corporation
    Inventors: Leping Li, James Albert Gilhooly, Clifford Owen Morgan, III, Cong Wei, Chienfan Yu
  • Patent number: 6176765
    Abstract: A fluid collection apparatus having an accumulator for contacting a polishing surface of a polishing pad and collecting fluid from the polishing pad, a reservoir for receiving fluid from the accumulator, and a volume maintainer for maintaining a set volume of fluid in the reservoir.
    Type: Grant
    Filed: February 16, 1999
    Date of Patent: January 23, 2001
    Assignee: International Business Machines Corporation
    Inventors: Leping Li, James A. Gilhooly, Robert B. Lipori, Clifford O. Morgan, III, William J. Surovic, Cong Wei
  • Patent number: 6126848
    Abstract: Detection of the endpoint for removal of a target film overlying a stopping film by removing the target film with a process that selectively generates a chemical reaction product (for example ammonia when polishing a wafer with a nitride film in a slurry containing KOH) with one of the stopping film and the target film, converting the chemical reaction product to a separate product, producing excited molecules from the separate product, and monitoring the level of light emitted from the excited molecules as the target film is removed.
    Type: Grant
    Filed: May 6, 1998
    Date of Patent: October 3, 2000
    Assignee: International Business Machines Corporation
    Inventors: Leping Li, James Albert Gilhooly, Clifford Owen Morgan, III, William Joseph Surovic, Cong Wei
  • Patent number: 6075011
    Abstract: Antimicrobial compounds having the formula ##STR1## as well as the pharmaceutically acceptable salts, esters and prodrugs thereof; pharmaceutical compositions comprising such compounds; methods of treating bacterial infections by the administration of such compounds; and processes for the preparation of the compounds.
    Type: Grant
    Filed: April 29, 1997
    Date of Patent: June 13, 2000
    Assignee: Abbott Laboratories
    Inventors: Yat Sun Or, Richard F. Clark, Zhenkun Ma, George Griesgraber, Leping Li, Daniel T. Chu
  • Patent number: 6072313
    Abstract: The change in thickness of a film on an underlying body such as a semiconductor substrate is monitored in situ by inducing a current in the film, and as the thickness of the film changes (either increase or decrease), the changes in the current are detected. With a conductive film, eddy currents are induced in the film by a generating an alternating electromagnetic field with a sensor which includes a capacitor and an inductor.
    Type: Grant
    Filed: June 17, 1997
    Date of Patent: June 6, 2000
    Assignee: International Business Machines Corporation
    Inventors: Leping Li, Steven George Barbee, Arnold Halperin, Tony Frederick Heinz
  • Patent number: 6066564
    Abstract: Detection of the endpoint for removal of a target film overlying a stopping film by removing the target film with a process that selectively generates a chemical reaction product (for example ammonia when polishing a wafer with a nitride film in a slurry containing KOH) with one of the stopping film and the target film, converting the chemical reaction product to a separate product, and monitoring the level of the separate product as the target film is removed.
    Type: Grant
    Filed: May 6, 1998
    Date of Patent: May 23, 2000
    Assignee: International Business Machines Corporation
    Inventors: Leping Li, James Albert Gilhooly, Clifford Owen Morgan, III, Cong Wei, Chienfan Yu
  • Patent number: 6046171
    Abstract: Novel 6,11-bridged erythromycin compounds and pharmaceutically acceptable salts and esters thereof having antibacterial activity having a formula ##STR1## compositions comprising a therapeutically effective amount of a compound of the invention in combination with a pharmaceutically acceptable carrier, a method for treating bacterial infections by administering to a mammal a pharmaceutical composition containing a therapeutically-effective amount of a compound of the invention, and processes for their preparation.
    Type: Grant
    Filed: September 22, 1998
    Date of Patent: April 4, 2000
    Assignee: Abbott Laboratories
    Inventors: Yat Sun Or, George Griesgraber, Leping Li, Daniel T. Chu
  • Patent number: 6021679
    Abstract: Device for in-situ collection of a gaseous reaction product from a polishing slurry as a workpiece, such as a semiconductor wafer, is being polished with the slurry, including a probe capable of being placed in contact with the slurry, the probe having a channel for transmitting the gaseous reaction product to an analyzer, a first hydrophobic membrane for allowing passage of the gaseous reaction product from the slurry to the channel, and means for directing a carrier gas through the channel.
    Type: Grant
    Filed: August 4, 1998
    Date of Patent: February 8, 2000
    Assignee: International Business Machines Corporation
    Inventors: Leping Li, James A. Gilhooly, Clifford O. Morgan, III, Cong Wei, Werner Moser, Matthias Kutter, Joseph Knee, Walter Imfeld, Bruno Greuter, Heinz Stuenzi
  • Patent number: 5788801
    Abstract: A contactless method and apparatus for real-time in-situ monitoring of a chemical etching process during etching of at least one wafer in a wet chemical etchant bath are disclosed. The method comprises the steps of providing two conductive electrodes in the wet chemical bath, wherein the two electrodes are proximate to but not in contact with a wafer; monitoring an electrical characteristic between the two electrodes as a function of time in the etchant bath of the at least one wafer, wherein a prescribed change in the electrical characteristic is indicative of a prescribed condition of the etching process; and recording a plurality of values of the electrical characteristic as a function of time during etching. From the plurality of recorded values and corresponding times, instantaneous etch rates, average etch rates, and etching end points may be determined. Such a method and the apparatus therefor are particularly useful in a wet chemical etch station.
    Type: Grant
    Filed: March 27, 1997
    Date of Patent: August 4, 1998
    Assignee: International Business Machines Corporation
    Inventors: Steven George Barbee, Tony Frederick Heinz, Yiping Hsiao, Leping Li, Eugene Henry Ratzlaff, Justin Wai-chow Wong
  • Patent number: 5770948
    Abstract: An apparatus for rotary signal coupling in in-situ monitoring of a chemical-mechanical polishing process by a polisher is provided with a sensor fixed to a rotatable wafer carrier for creating a signal responsive to the chemical mechanical polishing process, a conductor coupled to the sensor for receiving the signal, the conductor fixed to the rotatable wafer carrier, a contact coupled to the conductor, the contact fixed to a stationary drive arm, and signal transfer means coupled to the contact for transferring the signal to a monitoring means.
    Type: Grant
    Filed: March 19, 1996
    Date of Patent: June 23, 1998
    Assignee: International Business Machines Corporation
    Inventors: Leping Li, Steven George Barbee, Arnold Halperin, Richard Mars Ruggiero, William Joseph Surovie
  • Patent number: 5731697
    Abstract: The change in thickness of a film on an underlying body such as a semiconductor substrate is monitored in situ by inducing a current in the film, and as the thickness of the film changes (either increase or decrease), the changes in the current are detected. With a conductive film, eddy currents are induced in the film by a generating an alternating electromagnetic field with a sensor which includes a capacitor and an inductor.
    Type: Grant
    Filed: May 1, 1996
    Date of Patent: March 24, 1998
    Assignee: International Business Machines Corporation
    Inventors: Leping Li, Steven George Barbee, Arnold Halperin, Tony Frederick Heinz
  • Patent number: 5696084
    Abstract: Disclosed are novel antifungal agents having the formula: ##STR1## or a pharmaceutically acceptable acid, ester or prodrug thereof, wherein preferred compounds include those compounds wherein R.sub.1 is selected from the group consisting of --NH.sub.2 ; R.sub.2 is selected from the group consisting of hydrogen, fluoro, and hydroxyl; R.sub.3 is selected from the group consisting of --CH.sub.2 (p-C.sub.6 H.sub.4).sub.3 O(CH.sub.2).sub.3 CH.sub.3, --CH.sub.2 (p-C.sub.6 H.sub.4)O(CH.sub.2).sub.6 CH.sub.3, --COO(p-C.sub.6 H.sub.4)O(CH.sub.2).sub.6 CH.sub.3, --CO(Piperazinyl)(p-C.sub.6 H.sub.4).sub.2 OCH.sub.3, --CO(p-C.sub.6 H.sub.4)O(CH.sub.2).sub.6 CH.sub.3, --CO(p-C.sub.6 H.sub.4)(Piperazinyl)(p-C.sub.6 H.sub.4)O(CH.sub.2).sub.4 CH.sub.3, --CO(p-C.sub.6 H.sub.4)(Piperazinyl)(p-C.sub.6 H.sub.4)O(CH.sub.2).sub.6 CH.sub.3, --CO(p-C.sub.6 H.sub.4)(Piperazinyl)(p-C.sub.6 H.sub.4)OCH.sub.3, and --CO(p-C.sub.6 H.sub.4)(Piperazinyl)O(CH.sub.2).sub.6 CH.sub.3 ; and R.sub.
    Type: Grant
    Filed: August 16, 1996
    Date of Patent: December 9, 1997
    Assignee: Abbott Laboratories
    Inventors: Paul A. Lartey, Leping Li, Larry Lewis Klein, Christina Louise Leone, Sheela Albert Thomas, Ming Clinton Yeung, David Allen Degoey, David J. Grampovnik
  • Patent number: 5663637
    Abstract: Rotary signal coupling in in-situ monitoring of a chemical-mechanical polishing process. A sensor fixed to a rotatable wafer carrier for creating a signal responsive to the chemical mechanical polishing process is coupled to a bottom half of a rotary transformer fixed to a rotating portion of the polisher. A top half of the rotary transformer, coupled to the bottom half of the rotary transformer, is fixed to a stationary portion of the polisher. The signal from the sensor is thus coupled through the rotary transformer to a process monitor.
    Type: Grant
    Filed: March 19, 1996
    Date of Patent: September 2, 1997
    Assignee: International Business Machines Corporation
    Inventors: Leping Li, Steven George Barbee, Gary Richard Doyle, Arnold Halperin, Kevin L. Holland, Francis Walter Kazak, Robert B. Lipori, Anne Elizabeth McGuire, Rock Nadeau, William Joseph Surovic
  • Patent number: 5660672
    Abstract: The change in thickness of a film on an underlying body such as a semiconductor substrate is monitored in situ by inducing a current in the film, and as the thickness of the film changes (either increase or decrease), the changes in the current are detected. With a conductive film, eddy currents are induced in the film by a generating an alternating electromagnetic field with a sensor which includes a capacitor and an inductor.
    Type: Grant
    Filed: April 10, 1995
    Date of Patent: August 26, 1997
    Assignee: International Business Machines Corporation
    Inventors: Leping Li, Steven George Barbee, Arnold Halperin, Tony Frederick Heinz