Abstract: The present invention presents an electronic device. The electronic device includes a socket and a supplementary antenna. The socket is disposed on the electronic device, wherein the socket includes an accommodating portion for accommodating an external wireless communication module inserted from the outside. The supplementary antenna is disposed in the electronic device, wherein when the wireless communication module is completely inserted into the accommodating portion, the main antenna of the wireless communication module and the supplementary antenna become electromagnetically coupled; and wherein when the wireless communication module is completely inserted into the accommodating portion, the electronic device transmits/receives wireless signals using the main antenna and the supplementary antenna together.

Abstract: The present disclosure relates to a semiconductor device and method of manufacturing the same. The method of manufacturing the semiconductor device includes: providing a substrate, forming a patterned semiconductor layer on the substrate, forming a filter layer to cover the patterned semiconductor layer and forming a low concentration dopant buried layer within the semiconductor substrate, wherein one to forty percent of dopant are filtered out by the filter layer in the formation of the low concentration dopant buried layer.

Abstract: The present disclosure provides a light emitting structure including a blue light source, a first fluorescent material layer and a second fluorescent material layer. The blue light source has a light emitting surface. The first fluorescent material layer covers the light emitting surface of the blue light source. The first fluorescent material layer consists of a first fluorescent material. An excitation band of the first fluorescent material is in a blue wave band, and an emission band of the first fluorescent material is in a green wave band. The second fluorescent material layer covers the first fluorescent material layer. The second fluorescent material layer consists of a second fluorescent material. An excitation band of the second fluorescent material is in a green wave band, and an emission band of the second fluorescent material is in a red wave band. A light device and a backlight module are also provided herein.

Abstract: Apparatuses, methods, and non-transitory tangible computer readable media thereof for creating a 3D scene are provided. The apparatus generates a height map according to a plurality of depth data of an image. The apparatus finds a first region of the height map, wherein the depth data within the first region change more greatly than the depth data outside the first region. The apparatus creates a plurality of grids on a plane according to the first region and generate a 3D mesh by morphing the height map with the grids of the plane. The plane and the height map are of the same size, a second region within the plane corresponds to the first region of the height map, and the grids inside the second region has a finer resolution than the grids outside the second region. The apparatus generates the 3D scene by mapping the image onto the 3D mesh.

Abstract: The present disclosure provides various embodiments of a via structure and method of manufacturing same. In an example, a via structure includes a via having via sidewall surfaces defined by a semiconductor substrate. The via sidewall surfaces have a first portion and a second portion. A conductive layer is disposed in the via on the first portion of the via sidewall surfaces, and a dielectric layer is disposed on the second portion of the via sidewall surfaces. The dielectric layer is disposed between the second portion of the via sidewall surfaces and the conductive layer. In an example, the dielectric layer is an oxide layer.

Abstract: A biological sensing structure includes a mesa integrally connected a portion of a substrate, wherein the mesa has a top surface and a sidewall surface adjacent to the top surface. The biological sensing structure includes a first light reflecting layer over the top surface and the sidewall surface of the mesa. The biological sensing structure includes a filling material surrounding the mesa, wherein the mesa protrudes from the filling material. The biological sensing structure includes a stop layer over the filling material and a portion of the first light reflecting layer. The biological sensing structure includes a second light reflecting layer over a portion of the stop layer and a portion of the top surface of the mesa. The biological sensing structure includes an opening in the second light reflecting layer to partially expose the top surface of the mesa.

Abstract: The disclosure provides a heat sink for electrical elements and a light-emitting device containing thereof. The heat sink includes a radiating substrate and at least one hollow radiating channel. In which, the hollow radiating channel is horizontally embedded in the radiating substrate, and has two openings disposed on the same site or the opposite sites of the radiating substrate, so that gas may flow in the hollow radiating channel and remove heat of the radiating substrate. And a light-emitting device containing the heat sink is also provided.

Abstract: A screw tap with replaceable tool bit has a holding body, a detachable blade, and a fixing element. The holding body has a receiving area and a first engaging portion. The detachable blade is mounted in the receiving area of the holding body and has a second engaging portion, and the second sharp part of the second engaging portion engages with the first sharp part of the first engaging portion. The fixing element is securely mounted through the holding body and the detachable blade. The detachable blade can disassemble from the holding body, and thus one holding body could be installed with detachable blades of various dimensions. As the detachable blade is damaged, the damaged detachable blade is replaced with a new detachable blade to keep processing.

Abstract: Disclosed herein is a framework for generating and providing self-distinguishable identifiers as to users. In accordance with one aspect, an entry is retrieved from an object, wherein the entry includes one or more fields. The one or more fields may be concatenated to create a concatenated string. The framework may then determine if the concatenated string is unique from other concatenated strings in a listing of the object. If the concatenated string is determined to be not unique, a unique sequence identifier may be added to the concatenated string.

Abstract: The invention discloses an image cropping manipulation method for use in a portable electronic device. The portable electronic device comprises a touch screen and an image processing unit. The method comprises: displaying a sub-image on the touch screen, the sub-image is cropped from a digital image; receiving a user input from the touch screen; in response to the user input, map the user input to an operation on the digital image; and performing the operation to update the sub-image.

Abstract: A bond free of an anti-stiction layer and bonding method is disclosed. An exemplary method includes forming a first bonding layer; forming an interlayer over the first bonding layer; forming an anti-stiction layer over the interlayer; and forming a liquid from the first bonding layer and interlayer, such that the anti-stiction layer floats over the first bonding layer. A second bonding layer can be bonded to the first bonding layer while the anti-stiction layer floats over the first bonding layer, such that a bond between the first and second bonding layers is free of the anti-stiction layer.

Abstract: A method of determining whether a layout is colorable includes assigning nodes to polygon features of the layout. The method includes designating nodes as being adjacent nodes for nodes separated by less than a minimum pitch. The method includes iteratively removing nodes having less than three adjacent nodes from consideration to identify a node arrangement, wherein all nodes in the node arrangement have at least three adjacent nodes. The method includes determining whether the layout is colorable based on the node arrangement. Determining whether the layout is colorable includes independently assessing each internal node of node arrangement to determine whether each internal node of the node arrangement is colorable. The method includes generating a colored layout design for fabrication of the semiconductor device if each internal node of the node arrangement is colorable; and modifying the layout if at least one internal node of the node arrangement is not colorable.

Abstract: The present disclosure provides anti-CD73 binding molecules, e.g., antibodies and antigen binding fragments thereof. Also provided are pharmaceutical formulations comprising the disclosed compositions, and methods for the diagnosis and treatment of diseases associated with CD73-expression, e.g., cancer. Such diseases can be treated, e.g., by direct therapy with the anti-CD73 binding molecules disclosed herein (e.g., naked antibodies or antibody-drug conjugates that bind CD73), by adjuvant therapy with other antigen-binding anticancer agents such as immune checkpoint inhibitors (e.g., anti-CTLA-4 and anti-PD-1 monoclonal antibodies), and/or by combination therapies where the anti-CD73 molecules are administered before, after, or concurrently with chemotherapy.

Abstract: A method is provided to fabricate an electrolyte membrane. The membrane has an asymmetric structure and is a polybenzimidazole membrane doped with phosphoric acid. The asymmetric structure comprises a dense layer and a porous layer. The content of phosphoric acid introduced into the polybenzimidazole membrane reaches 20 phosphoric acid molecules per polymer repeating unit. The proton conductivity of the polybenzimidazole membrane reaches 5×10?2 siemens per centimeter (S/cm). An electrode made with the polybenzimidazole membrane can be smoothly operated in a proton exchange membrane fuel cell.

Abstract: A method for a mobile node dynamically obtaining a location identifier, and a locator/ID separation protocol (LISP) network are provided. The method is applied in the LISP network, including: when a mobile node moves to a new location, sending an address information allocation request including a first option to an address information allocation device, wherein, the first option includes attribute information of which a value represents globally routable; after receiving the address information allocation request, the address information allocation device preferentially selecting globally routable address information in locally available address information resources, and then replying with an address information allocation response carrying the selected address information to the mobile node, wherein the address information includes an address or a routing prefix.

Abstract: A device for controlling the amount of energy stored in a storage device comprises a control unit that is adapted to adjust the power received via an input of the device, based on the amount of energy currently stored in the storage device, and that is further adapted to output the adjusted power via an output of the device to the storage device.

Abstract: A biological sensing structure includes a mesa integrally connected a portion of a substrate, wherein the mesa has a top surface and a sidewall surface adjacent to the top surface. The biological sensing structure includes a first light reflecting layer over the top surface and the sidewall surface of the mesa. The biological sensing structure includes a filling material surrounding the mesa, wherein the mesa protrudes from the filling material. The biological sensing structure includes a stop layer over the filling material and a portion of the first light reflecting layer. The biological sensing structure includes a second light reflecting layer over a portion of the stop layer and a portion of the top surface of the mesa. The biological sensing structure includes an opening in the second light reflecting layer to partially expose the top surface of the mesa.

Abstract: A semiconductor structure and a method for fabricating the same are provided. The semiconductor structure includes a wafer substrate having a top surface and a bottom surface, and a conductive pillar in the wafer substrate defined by a deep trench insulator through the top surface and the bottom surface of the wafer substrate. The method for fabricating the semiconductor structure includes following steps. A deep trench is formed from a top surface of a wafer substrate to define a conductive region in the wafer substrate. The conductive region is doped with a dopant. The deep trench is filled with an insulation material to form a deep trench insulator. And the wafer substrate is thinned from a bottom surface of the wafer substrate to expose the deep trench insulator and isolate the conductive region to form a conductive pillar.

Abstract: In some embodiments, the present disclosure relates to a MEMs (micro-electromechanical system) package device having a getter layer. The MEMs package includes a first substrate having a cavity located within an upper surface of the first substrate. The cavity has roughened interior surfaces. A getter layer is arranged onto the roughened interior surfaces of the cavity. A bonding layer is arranged on the upper surface of the first substrate on opposing sides of the cavity, and a second substrate bonded to the first substrate by the bonding layer. The second substrate is arranged over the cavity. The roughened interior surfaces of the cavity enables more effective absorption of residual gases, thereby increasing the efficiency of a gettering process.

Abstract: A semiconductor structure and a method for forming the same are provided. The semiconductor structure includes a metal gate structure having curved sidewalls formed over a substrate. The semiconductor structure further includes spacers formed on the curved sidewalls of the metal gate structure. In addition, each curved sidewall of the metal gate structure has a top portion, a middle portion, and a bottom portion, and an angle between the middle portion and the bottom portion of the curved sidewall of the metal gate structure is smaller than 180° C.