Patents by Inventor Li Wei

Li Wei has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11951286
    Abstract: An automatic injection device for fluid has a sleeve, an actuating unit, a barrel with a piercing needle and a high-pressure air source. The high-pressure air source is mounted slidably in the barrel. The actuating unit is mounted in the sleeve and barrel and selectively blocks the high-pressure air source. When the user needs to release the high-pressure air in the high-pressure air source, the user press the actuating unit to allow the high-pressure air source to slide until the high-pressure air source hits the piercing needle. Therefore, the high-pressure air in the high-pressure air source is easily released by actuate the actuating unit without additional hand tools.
    Type: Grant
    Filed: December 25, 2020
    Date of Patent: April 9, 2024
    Assignee: BANZA STAMPING INDUSTRY CORP.
    Inventors: Li-Wei Chen, Cole Krebs
  • Patent number: 11957018
    Abstract: A display device includes: a substrate having display and non-display areas; a first conductive layer including first and second sub-conductive lines; a second conductive layer including third and fourth sub-conductive lines, wherein, in the display area, the first sub-conductive line and the third sub-conductive lines cross from a top view; and a third conductive layer including third conductive lines and corresponding to the non-display area; wherein, corresponding to the non-display area, a portion of a projection of the one of the third conductive lines is overlapped with a portion of a projection of the second sub-conductive line on the substrate, and another portion of the projection of the one of the third conductive lines is overlapped with a portion of a projection of the fourth sub-conductive line on the substrate.
    Type: Grant
    Filed: May 9, 2023
    Date of Patent: April 9, 2024
    Assignee: INNOLUX CORPORATION
    Inventors: Hui-Min Huang, Li-Wei Sung, Cheng-Tso Chen, Chia-Min Yeh
  • Publication number: 20240109955
    Abstract: Disclosed are antigen binding polypeptides and antigen binding polypeptide complexes (e.g., antibodies and antigen binding fragments thereof) having certain structural and/or functional features. Also disclosed are polynucleotides and vectors encoding such polypeptides and polypeptide complexes; host cells, pharmaceutical compositions and kits containing such polypeptides and polypeptide complexes; and methods of using such polypeptides and polypeptide complexes.
    Type: Application
    Filed: June 30, 2023
    Publication date: April 4, 2024
    Inventors: Juan LI, Chi-Jen WEI, Ronnie R. WEI, Zhi-Yong YANG, John R. MASCOLA, Gary J. NABEL, John MISASI, Amarendra PEGU, Lingshu WANG, Tongqing ZHOU, Misook CHOE, Olamide K. OLONINIYI, Bingchun ZHAO, Yi ZHANG, Eun Sung YANG, Man CHEN, Kwanyee LEUNG, Wei SHI, Nancy J. SULLIVAN, Peter D. KWONG, Richard A. KOUP, Barney S. GRAHAM, Peng HE
  • Publication number: 20240113112
    Abstract: Methods of cutting gate structures and fins, and structures formed thereby, are described. In an embodiment, a substrate includes first and second fins and an isolation region. The first and second fins extend longitudinally parallel, with the isolation region disposed therebetween. A gate structure includes a conformal gate dielectric over the first fin and a gate electrode over the conformal gate dielectric. A first insulating fill structure abuts the gate structure and extends vertically from a level of an upper surface of the gate structure to at least a surface of the isolation region. No portion of the conformal gate dielectric extends vertically between the first insulating fill structure and the gate electrode. A second insulating fill structure abuts the first insulating fill structure and an end sidewall of the second fin. The first insulating fill structure is disposed laterally between the gate structure and the second insulating fill structure.
    Type: Application
    Filed: December 1, 2023
    Publication date: April 4, 2024
    Inventors: Ryan Chia-Jen Chen, Cheng-Chung Chang, Shao-Hua Hsu, Yu-Hsien Lin, Ming-Ching Chang, Li-Wei Yin, Tzu-Wen Pan, Yi-Chun Chen
  • Patent number: 11948971
    Abstract: A method includes forming isolations extending into a semiconductor substrate, recessing the isolation regions, wherein a semiconductor region between the isolation regions forms a semiconductor fin, forming a first dielectric layer on the isolation regions and the semiconductor fin, forming a second dielectric layer over the first dielectric layer, planarizing the second dielectric layer and the first dielectric layer, and recessing the first dielectric layer. A portion of the second dielectric layer protrudes higher than remaining portions of the first dielectric layer to form a protruding dielectric fin. A portion of the semiconductor fin protrudes higher than the remaining portions of the first dielectric layer to form a protruding semiconductor fin. A portion of the protruding semiconductor fin is recessed to form a recess, from which an epitaxy semiconductor region is grown. The epitaxy semiconductor region expands laterally to contact a sidewall of the protruding dielectric fin.
    Type: Grant
    Filed: August 10, 2021
    Date of Patent: April 2, 2024
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Jeng-Wei Yu, Tsz-Mei Kwok, Tsung-Hsi Yang, Li-Wei Chou, Ming-Hua Yu
  • Publication number: 20240103097
    Abstract: The present disclosure provides a direct current (DC) transformer error detection apparatus for a pulsating harmonic signal, including a DC and pulsating harmonic current output module and an external detected input module, where the DC and pulsating harmonic current output module outputs a DC and a DC superimposed pulsating harmonic current to an internal sampling circuit and a self-calibrated standard resistor array; and the internal sampling circuit converts the input DC and the input DC superimposed pulsating harmonic current into a voltage signal, and sends the voltage signal to an analog-to-digital (AD) sampling and measurement component through a front-end conditioning circuit and a detected input channel. The DC transformer error detection apparatus can complete self-calibration for measurement of the DC and the pulsating harmonic signal on a test site.
    Type: Application
    Filed: August 17, 2022
    Publication date: March 28, 2024
    Inventors: Xin Zheng, Wenjing Yu, Tao Peng, Yi Fang, Ming Lei, Hong Shi, Ben Ma, Li Ding, Wei Wei, Linghua Li, He Yu, Tian Xia, Yingchun Wang, Sike Wang, Dongri Xie, Xin Wang, Bo Pang, Xianjin Rong
  • Patent number: 11942403
    Abstract: In an embodiment, a package includes: an interposer having a first side; a first integrated circuit device attached to the first side of the interposer; a second integrated circuit device attached to the first side of the interposer; an underfill disposed beneath the first integrated circuit device and the second integrated circuit device; and an encapsulant disposed around the first integrated circuit device and the second integrated circuit device, a first portion of the encapsulant extending through the underfill, the first portion of the encapsulant physically disposed between the first integrated circuit device and the second integrated circuit device, the first portion of the encapsulant being planar with edges of the underfill and edges of the first and second integrated circuit devices.
    Type: Grant
    Filed: November 4, 2022
    Date of Patent: March 26, 2024
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Chih-Chien Pan, Li-Hui Cheng, Chin-Fu Kao, Szu-Wei Lu
  • Publication number: 20240097011
    Abstract: A method includes forming a fin structure over a substrate, wherein the fin structure comprises first semiconductor layers and second semiconductor layers alternately stacked over a substrate; forming a dummy gate structure over the fin structure; removing a portion of the fin structure uncovered by the dummy gate structure; performing a selective etching process to laterally recess the first semiconductor layers, including injecting a hydrogen-containing gas from a first gas source of a processing tool to the first semiconductor layers and the second semiconductor layers; and injecting an F2 gas from a second gas source of the processing tool to the first semiconductor layers and the second semiconductor layers; forming inner spacers on opposite end surfaces of the laterally recessed first semiconductor layers of the fin structure; and replacing the dummy gate structure and the first semiconductor layers with a metal gate structure.
    Type: Application
    Filed: December 1, 2023
    Publication date: March 21, 2024
    Applicants: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD., TSMC NANJING COMPANY LIMITED
    Inventors: Han-Yu LIN, Fang-Wei LEE, Kai-Tak LAM, Raghunath PUTIKAM, Tzer-Min SHEN, Li-Te LIN, Pinyen LIN, Cheng-Tzu YANG, Tzu-Li LEE, Tze-Chung LIN
  • Publication number: 20240098330
    Abstract: A display device and a signal source switching method therefore are provided. The display device is connected with a first signal source device and a second signal source device and includes a switching circuit, a receiver circuit and a control circuit. The switching circuit includes a first connection port and a second connection port, which are respectively connected to the first signal source device and the second signal source device. When the control circuit receives a signal source switching command, the control circuit records a current operating state of each of the first signal source device and the second signal source device. When the control circuit receives an active source command from the first signal source device, the control circuit refers to the current operating state to control the switching circuit to switch the image signal source to the first signal source device or the second signal source device.
    Type: Application
    Filed: June 16, 2023
    Publication date: March 21, 2024
    Applicant: Qisda Corporation
    Inventors: Bo-Wei Shih, Li-Chun Chen, I-Hsuan Lai
  • Publication number: 20240092746
    Abstract: Provided herein are opioid receptor modulators and pharmaceutical compositions comprising said compounds.
    Type: Application
    Filed: February 13, 2023
    Publication date: March 21, 2024
    Inventors: Julio Cesar MEDINA, Alok NERURKAR, Corinne SADLOWSKI, Frederick SEIDL, Heng CHENG, Jason DUQUETTE, John LEE, Martin HOLAN, Pingyu DING, Xiaodong WANG, Tien WIDJAJA, Thomas NGUYEN, Ulhas BHATT, Yihong LI, Zhi-liang WEI
  • Publication number: 20240095434
    Abstract: A method performed by at least one processor includes the following steps: generating a layout of an integrated circuit (IC), the layout comprising a cell and a layout context in a vicinity of the cell; receiving from a library a set of context groups and a set of timing tables, wherein each of the context groups is associated with one of the set of timing tables; determining a representative context group for the cell through comparing the layout context of the cell with the set of context groups; and performing a timing analysis on the layout according to a representative timing table associated with the representative context group for the cell.
    Type: Application
    Filed: November 23, 2023
    Publication date: March 21, 2024
    Inventors: ZHE-WEI JIANG, JERRY CHANG JUI KAO, SUNG-YEN YEH, LI CHUNG HSU
  • Publication number: 20240096630
    Abstract: Disclosed is a semiconductor fabrication method. The method includes forming a gate stack in an area previously occupied by a dummy gate structure; forming a first metal cap layer over the gate stack; forming a first dielectric cap layer over the first metal cap layer; selectively removing a portion of the gate stack and the first metal cap layer while leaving a sidewall portion of the first metal cap layer that extends along a sidewall of the first dielectric cap layer; forming a second metal cap layer over the gate stack and the first metal cap layer wherein a sidewall portion of the second metal cap layer extends further along a sidewall of the first dielectric cap layer; forming a second dielectric cap layer over the second metal cap layer; and flattening a top layer of the first dielectric cap layer and the second dielectric cap layer using planarization operations.
    Type: Application
    Filed: January 12, 2023
    Publication date: March 21, 2024
    Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Li-Wei Yin, Tzu-Wen Pan, Yu-Hsien Lin, Yu-Shih Wang, Jih-Sheng Yang, Shih-Chieh Chao, Yih-Ann Lin, Ryan Chia-Jen Chen
  • Patent number: 11935581
    Abstract: A circuit module with reliable margin configuration, may include a main circuit, a first auxiliary circuit and a second auxiliary circuit. When the first auxiliary circuit is on, the second auxiliary circuit may be on or off according to whether a control signal is of a first level or a second level. When the first auxiliary circuit and the second auxiliary circuit are both on, the first auxiliary circuit and the second auxiliary circuit may jointly cause an operation parameter of the main circuit to be a first value. When the first auxiliary circuit is on and the second auxiliary circuit is off, the first auxiliary circuit may cause the operation parameter to be a second value. An operation margin of the main circuit may cover a range between the first value and the second value.
    Type: Grant
    Filed: May 31, 2022
    Date of Patent: March 19, 2024
    Assignee: M31 TECHNOLOGY CORPORATION
    Inventors: Li-Wei Chu, Nan-Chun Lien
  • Patent number: 11937334
    Abstract: Methods, systems, and apparatuses for Sidelink Discontinuous Reception (SL DRX) in a wireless communication system to avoid ambiguity on slot offset calculations on SL DRX. A method for a UE comprises performing a SL communication associated with a destination Identity (ID), having a SL DRX configuration associated with the SL communication, wherein the SL DRX configuration comprises at least an on-duration timer and a DRX cycle, deriving a first offset associated with the SL communication based on the destination ID and the DRX cycle, deriving a second offset associated with the SL communication based on the destination ID and a number of slots per subframe, starting the on-duration timer after a time period determined based on the second offset from the beginning of a subframe, wherein the subframe is determined based on at least the first offset, and monitoring Sidelink Control Information (SCI) when the on-duration timer is running.
    Type: Grant
    Filed: March 8, 2023
    Date of Patent: March 19, 2024
    Assignee: ASUSTek Computer Inc.
    Inventors: Yi-Hsuan Kung, Li-Chih Tseng, Chun-Wei Huang, Ming-Che Li
  • Patent number: 11934060
    Abstract: Provided is an array substrate. The array substrate includes: a base substrate, and a plurality of gate lines, a plurality of data lines, a plurality of sub-pixels and a plurality of touch signal lines disposed on the base substrate. The data lines have a plurality of first extending parts and a plurality of second extending parts which are in an alternating arrangement. When the array substrate is used to prepare a liquid crystal display panel and the liquid crystal display panel is displaying, in each column of the sub-pixels, the voltage polarities of the two adjacent sub-pixels which respectively belong to two adjacent first pixel regions are opposite.
    Type: Grant
    Filed: February 2, 2021
    Date of Patent: March 19, 2024
    Assignees: BEIJING BOE DISPLAY TECHNOLOGY CO., LTD., BOE TECHNOLOGY GROUP CO., LTD.
    Inventors: Bo Feng, Shijun Wang, Yang Wang, Zhan Wei, Wenkai Mu, Yi Liu, Li Tian
  • Publication number: 20240088030
    Abstract: Provided are semiconductor devices that include a first gate structure having a first end cap portion, a second gate structure having a second end cap portion coaxial with the first gate structure, a first dielectric region separating the first end cap portion and the second end cap portion, a first conductive element extending over the first gate structure, a second conductive element extending over the second gate structure, and a gate via electrically connecting the second gate structure and the second conductive element, with the first dielectric region having a first width and being positioned at least partially under the first conductive element and defines a spacing between the gate via and an end of the second end cap portion that exceeds a predetermined distance.
    Type: Application
    Filed: January 23, 2023
    Publication date: March 14, 2024
    Inventors: Chin-Liang CHEN, Chi-Yu LU, Ching-Wei TSAI, Chun-Yuan CHEN, Li-Chun TIEN
  • Publication number: 20240088650
    Abstract: In some aspects of the present disclosure, an electrostatic discharge (ESD) protection circuit is disclosed. In some aspects, the ESD protection circuit includes a first transistor coupled to a pad, a second transistor coupled between the first transistor and ground, a stack of transistors coupled to the first transistor, and an ESD clamp coupled between the stack of transistors and the ground.
    Type: Application
    Filed: November 20, 2023
    Publication date: March 14, 2024
    Applicant: Taiwan Semiconductor Manufacturing Company Ltd.
    Inventors: Li-Wei Chu, Tao Yi Hung, Chia-Hui Chen, Wun-Jie Lin, Jam-Wem Lee
  • Publication number: 20240084369
    Abstract: A digital microfluidic apparatus and a driving method therefor. The digital microfluidic apparatus comprises a digital microfluidic chip (10), a thermal control apparatus (20), and an elastic support apparatus (30). The digital microfluidic chip (10) is provided with a droplet channel (91), and the droplet channel (91) is configured to allow droplets (90) to move therein; the thermal control apparatus (20) is disposed on one side of the digital microfluidic chip (10), and is configured to generate at least two independent and non-interference hot zones in the droplet channel (91), and control the temperature of each hot zone; and the elastic support apparatus (30) is disposed on the side of the thermal control apparatus (20) away from the digital microfluidic chip (10), and is configured to drive the thermal control apparatus (20) to be pasted on the surface of the digital microfluidic chip (10).
    Type: Application
    Filed: July 21, 2022
    Publication date: March 14, 2024
    Inventors: Qiuxu WEI, Wenliang YAO, Yongjia GAO, Bolin FAN, Yingying ZHAO, Le GU, Li YANG
  • Publication number: 20240088171
    Abstract: An array substrate and display device are provided. The array substrate includes a base substrate, and gate lines, data lines, compensation blocks and sub-pixels located on the base substrate. Two gate lines are arranged between two adjacent rows of sub-pixels. The data lines are provided with multiple first extensions and second extensions arranged alternately. The extending direction of the first extensions intersects with the extending direction of the second extensions.
    Type: Application
    Filed: November 27, 2023
    Publication date: March 14, 2024
    Inventors: Wenkai MU, Shijun WANG, Yi LIU, Bo FENG, Yang WANG, Zhan WEI, Li TIAN
  • Patent number: D1019739
    Type: Grant
    Filed: May 8, 2020
    Date of Patent: March 26, 2024
    Assignee: COMPAL ELECTRONICS, INC.
    Inventors: Chen-Hsien Cheng, Li-Fang Chen, Ruei-Hong Hong, Ting-Wei Wu