Patents by Inventor Li Wen

Li Wen has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10833048
    Abstract: A technique relates to a semiconductor device. First nanowires are formed on a first substrate, the first nanowires being electrically coupled to one or more first electrical sites on the first substrate. Second nanowires are formed on a second substrate, the second nanowires being electrically coupled to one or more second electrical sites on the second substrate. The first nanowires and the second nanowires are electrically coupled such that the one or more first electrical sites are electrically coupled to the one or more second electrical sites.
    Type: Grant
    Filed: April 11, 2018
    Date of Patent: November 10, 2020
    Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATION
    Inventors: Li-Wen Hung, Reinaldo Vega, Hari Mallela
  • Patent number: 10811305
    Abstract: A multi-layer wafer and method of manufacturing such wafer are provided. The method comprises applying a stress compensating oxide layer to each of two heterogeneous wafers, applying at least one bonding oxide layer to at least one of the two heterogeneous wafers, chemical-mechanical polishing the at least one bonding oxide layer, and low temperature bonding the two heterogeneous wafers to form a multi-layer wafer pair. The multi-layer wafer comprises two heterogeneous wafers, each of the heterogeneous wafers having a stress compensating oxide layer and at least one bonding oxide layer applied to at least one of the two heterogeneous wafers. The two heterogeneous wafers are low temperature bonded together to form the multi-layer wafer.
    Type: Grant
    Filed: September 22, 2016
    Date of Patent: October 20, 2020
    Assignee: International Business Machines Corporation
    Inventors: Li-Wen Hung, John U. Knickerbocker, Leathen Shi, Cornelia Tsang Yang, Bucknell C. Webb
  • Patent number: 10811413
    Abstract: Multi-voltage threshold vertical transport transistors and methods of fabrication generally include forming the transistors with vertically oriented silicon fin channels for both the n-type doped field effect transistors (nFET) and the p-type doped field effect transistors (pFET). A silicon oxynitride interfacial layer is provided on sidewalls of the fins in the nFET and a silicon dioxide interfacial with aluminum is provided on sidewalls of the fins in the pFET to provide an aluminum induced dipole. A high k dielectric overlays the interfacial layers and a common work function metal overlays the high k dielectric layer to define a gate structure.
    Type: Grant
    Filed: August 13, 2018
    Date of Patent: October 20, 2020
    Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATION
    Inventors: Takashi Ando, Reinaldo Vega, Choonghyun Lee, Hari Mallela, Li-Wen Hung
  • Publication number: 20200312912
    Abstract: A stacked resistive random access memory (ReRAM) structure is provided. The stacked ReRAM structure includes a channel, a ReRAM cell sub-structure and a contact via sub-structure. The ReRAM cell structure includes ReRAM cell, drain, gate and source layers, which are insulated from one another and respectively disposed in operative contact with the channel. The contact via sub-structures includes first, second, third and fourth contact vias, which are separate from one another. The first contact via is disposed in exclusive operative contact with the ReRAM cell layer. The second contact via is disposed in exclusive operative contact with the drain layer. The third contact via is disposed in exclusive operative contact with the gate layer. The fourth contact via is disposed in exclusive operative contact with the source layer.
    Type: Application
    Filed: March 28, 2019
    Publication date: October 1, 2020
    Inventors: REINALDO VEGA, TAKASHI ANDO, HARI MALLELA, Li-Wen Hung
  • Patent number: 10783955
    Abstract: A circuit includes a column of memory cells, a first read data line coupled exclusively with a first subset of memory cells of the column of memory cells, a second read data line coupled exclusively with a second subset of memory cells of the column of memory cells, and a plurality of read word lines. Each read word line of the plurality of read word lines is coupled with a memory cell of the first subset of memory cells and with a memory cell of the second subset of memory cells.
    Type: Grant
    Filed: November 30, 2018
    Date of Patent: September 22, 2020
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
    Inventors: Hidehiro Fujiwara, Li-Wen Wang, Yen-Huei Chen, Hung-Jen Liao
  • Patent number: 10775858
    Abstract: A liquid immersion cooling tank includes a reservoir and a liquid flow tube. The reservoir contains an insulating coolant to immerse an electronic device. The liquid flow tube includes an adjusting member. The reservoir includes an inlet and an outlet. The inlet and the outlet are respectively arranged at opposite ends of the electronic device. The liquid flow tube is located inside the reservoir. The liquid flow tube is coupled to at least one of the inlet and the outlet. The adjusting member faces the electronic device to control an amount of inflow or outflow of the insulating coolant. When the electronic device is immersed in the reservoir for cooling, the insulating coolant flows through the electronic device. The liquid flow tube coupled to the inlet or the outlet of the reservoir uses the adjusting member to control the amount of inflow or outflow of the insulating coolant.
    Type: Grant
    Filed: March 8, 2019
    Date of Patent: September 15, 2020
    Assignee: HONGFUJIN PRECISION ELECTRONICS (TIANJIN) CO., LTD.
    Inventors: Tze-Chern Mao, Yen-Chun Fu, Chih-Hung Chang, Yao-Ting Chang, Li-Wen Chang, Chao-Ke Wei
  • Patent number: 10770512
    Abstract: A stacked resistive random access memory (ReRAM) structure is provided. The stacked ReRAM structure includes a channel, a ReRAM cell sub-structure and a contact via sub-structure. The ReRAM cell structure includes ReRAM cell, drain, gate and source layers, which are insulated from one another and respectively disposed in operative contact with the channel. The contact via sub-structures includes first, second, third and fourth contact vias, which are separate from one another. The first contact via is disposed in exclusive operative contact with the ReRAM cell layer. The second contact via is disposed in exclusive operative contact with the drain layer. The third contact via is disposed in exclusive operative contact with the gate layer. The fourth contact via is disposed in exclusive operative contact with the source layer.
    Type: Grant
    Filed: March 28, 2019
    Date of Patent: September 8, 2020
    Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATION
    Inventors: Reinaldo Vega, Takashi Ando, Hari Mallela, Li-Wen Hung
  • Patent number: 10755768
    Abstract: A semiconductor memory device includes: a local write bit (LWB) line; a local write bit_bar (LWB_bar) line; a global write bit (GWB) line; a global write bit_bar (GWBL_bar) line; a column of segments, each segment including bit cells; each of the bit cells including a latch circuit and first and second pass gates connecting the corresponding LWB and LWB_bar lines to the latch circuit; and a distributed write driving arrangement. The distributed write driving arrangement includes: a global write driver including a first inverter connected between the GWB line and the LWB line, and a second inverter connected between the GWB_bar line and the LWB_bar line; and a local write driver included at an interior of each segment, each local write driver including a third inverter connected between the GWB line and the LWB line; and a fourth inverter connected between the GWB_bar line and the LWB_bar line.
    Type: Grant
    Filed: July 3, 2019
    Date of Patent: August 25, 2020
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
    Inventors: Hidehiro Fujiwara, Hung-Jen Liao, Li-Wen Wang, Jonathan Tsung-Yung Chang, Yen-Huei Chen
  • Publication number: 20200257342
    Abstract: A liquid immersion cooling tank includes a reservoir and a liquid flow tube. The reservoir contains an insulating coolant to immerse an electronic device. The liquid flow tube includes an adjusting member. The reservoir includes an inlet and an outlet. The inlet and the outlet are respectively arranged at opposite ends of the electronic device. The liquid flow tube is located inside the reservoir. The liquid flow tube is coupled to at least one of the inlet and the outlet. The adjusting member faces the electronic device to control an amount of inflow or outflow of the insulating coolant. When the electronic device is immersed in the reservoir for cooling, the insulating coolant flows through the electronic device. The liquid flow tube coupled to the inlet or the outlet of the reservoir uses the adjusting member to control the amount of inflow or outflow of the insulating coolant.
    Type: Application
    Filed: March 8, 2019
    Publication date: August 13, 2020
    Inventors: TZE-CHERN MAO, YEN-CHUN FU, CHIH-HUNG CHANG, YAO-TING CHANG, LI-WEN CHANG, CHAO-KE WEI
  • Patent number: 10740667
    Abstract: Apparatus, systems, and methods for determining a temperature excursion are provided. In one example, a system can comprise a temperature switch component that experiences a temperature excursion associated with a metal alloy of the temperature switch component and one or more electrodes, wherein the temperature excursion is based on a temperature of the metal alloy exceeding a defined threshold value. Additionally, the system can comprise a radio frequency identification tag component that receives a signal, from an external reader device, utilized to determine that the temperature excursion has occurred based on a parameter change, associated with the temperature excursion, from a first parameter to a second parameter different than the first parameter.
    Type: Grant
    Filed: March 6, 2018
    Date of Patent: August 11, 2020
    Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATION
    Inventors: Li-Wen Hung, Jae-Woong Nah
  • Publication number: 20200238734
    Abstract: The present subject matter describes determination of amount of print media present in an input tray of a printing system. In an example implementation of the present subject matter, a current operating torque of a motor that moves a pick arm for drawing print media from the input tray is monitored. The current operating torque is monitored while the pick arm is moved between a rest position and a pick-ready position. Based on the monitored operating torque, it is determined whether amount of print media present in the input tray is one of below and above a predefined amount of print media.
    Type: Application
    Filed: July 31, 2017
    Publication date: July 30, 2020
    Inventors: Wei Lit Teoh, Li-Wen Benedict TAN, Eugene Goh, Angel Astorgano-Ballesteros, Ken Ko
  • Publication number: 20200238735
    Abstract: A printing apparatus determines a change in torque of a motor that moves a pick arm for translating print media, determines based on the change in torque whether a media in present adjacent to the pick arm.
    Type: Application
    Filed: July 31, 2017
    Publication date: July 30, 2020
    Inventors: Wei Lit Teoh, Felicia Rezamda, Eugene Goh, Li-Wen Benedict Tan
  • Publication number: 20200196489
    Abstract: A heat dissipation apparatus for a plurality of heat-generating electrical devices in a server dissipates heat of the heat-generating electrical devices by using heat-absorbing liquid. The apparatus includes a container, an inlet pipe, and an outlet pipe. The container contains a non-conductive coolant liquid and the plurality of heat-generating electrical devices are entirely submerged in the coolant liquid.
    Type: Application
    Filed: December 27, 2018
    Publication date: June 18, 2020
    Inventors: CHIH-HUNG CHANG, CHAO-KE WEI, TZE-CHERN MAO, YEN-CHUN FU, YAO-TING CHANG, LI-WEN CHANG
  • Patent number: 10679887
    Abstract: Various embodiments process semiconductor devices. In one embodiment, a release layer is applied to a handler. The release layer comprises at least one additive that adjusts a frequency of electro-magnetic radiation absorption property of the release layer. The additive comprises, for example, a 355 nm chemical absorber and/or chemical absorber for one of more wavelengths in a range comprising 600 nm to 740 nm. The at least one singulated semiconductor device is bonded to the handler. The at least one singulated semiconductor device is packaged while it is bonded to the handler. The release layer is ablated by irradiating the release layer through the handler with a laser. The at least one singulated semiconductor device is removed from the transparent handler after the release layer has been ablated.
    Type: Grant
    Filed: March 26, 2018
    Date of Patent: June 9, 2020
    Assignee: International Business Machines Corporation
    Inventors: Paul S. Andry, Bing Dang, Jeffrey Donald Gelorme, Li-Wen Hung, John U. Knickerbocker, Cornelia Tsang Yang
  • Publication number: 20200171593
    Abstract: Methods of fabricating a probe are described. In an example, a structure may be formed on a surface of a substrate. The structure may include the probe, a hinge, and an anchor arranged linearly, where an angle is formed between the probe and the hinge. The hinge may be positioned between the probe and the anchor, and the structure may be parallel to the substrate. An amount of solder may be deposited on an area of the structure that spans from a portion of the probe to a portion of the anchor, and across the hinge. The deposited solder may be reshaped by an execution of a solder reflow process. The reshape of the deposited solder may cause the probe to rotate about the hinge in order to reduce the angle between the probe and the hinge.
    Type: Application
    Filed: November 30, 2018
    Publication date: June 4, 2020
    Inventors: Li-Wen Hung, Jui-Hsin Lai, Chia-Yu Chen, Ko-Tao Lee
  • Publication number: 20200176297
    Abstract: Various embodiments process semiconductor devices. In one embodiment, a release layer is applied to a handler. The release layer comprises at least one additive that adjusts a frequency of electro-magnetic radiation absorption property of the release layer. The additive comprises, for example, a 355 nm chemical absorber and/or chemical absorber for one of more wavelengths in a range comprising 600 nm to 740 nm. The at least one singulated semiconductor device is bonded to the handler. The at least one singulated semiconductor device is packaged while it is bonded to the handler. The release layer is ablated by irradiating the release layer through the handler with a laser. The at least one singulated semiconductor device is removed from the transparent handler after the release layer has been ablated.
    Type: Application
    Filed: February 3, 2020
    Publication date: June 4, 2020
    Applicant: International Business Machines Corporation
    Inventors: Paul S. ANDRY, Bing DANG, Jeffrey Donald GELORME, Li-Wen HUNG, John U. KNICKERBOCKER, Cornelia Tsang YANG
  • Publication number: 20200168475
    Abstract: Various embodiments process semiconductor devices. In one embodiment, a release layer is applied to a handler. The at least one singulated semiconductor device is bonded to the handler. The at least one singulated semiconductor device is packaged while it is bonded to the handler. The release layer is ablated by irradiating the release layer through the handler with a laser. The the at least one singulated semiconductor device is removed from the transparent handler after the release layer has been ablated.
    Type: Application
    Filed: January 31, 2020
    Publication date: May 28, 2020
    Inventors: Paul S. ANDRY, Bing DANG, Jeffrey Donald GELORME, Li-Wen HUNG, John U. KNICKERBOCKER, Cornelia Tsang YANG
  • Patent number: 10667434
    Abstract: A liquid immersion cooling device includes a mounting frame, a liquid reservoir mounted to the mounting frame, and a cold source distributor mounted on an outer side of the mounting frame. The liquid reservoir is configured to immerse a server in an insulating coolant. The liquid reservoir is movably mounted to the mounting frame. The cold source distributor comprises a telescopic cold source tube and a telescopic heat return tube. An output end of the cold source tube and an output end of the heat return tube are coupled to the liquid reservoir. When the liquid reservoir is pulled out of the mounting frame, the cold source tube and the heat return tube are extended by the liquid reservoir to a predetermined length. When the liquid reservoir is pushed into the mounting frame, the cold source tube and the heat return tube are retracted.
    Type: Grant
    Filed: April 9, 2019
    Date of Patent: May 26, 2020
    Assignee: HONGFUJIN PRECISION ELECTRONICS (TIANJIN) CO., LTD.
    Inventors: Tze-Chern Mao, Li-Wen Chang, Chao-Ke Wei, Yao-Ting Chang, Chih-Hung Chang, Yen-Chun Fu, Ching-Tang Liu
  • Publication number: 20200155138
    Abstract: A fibrocartilage suturing device is provided to solve the problem where the conventional procedure of the surgery is inconvenient. The fibrocartilage suturing device includes a tube assembly, a tubular member, and an anchor. The tube assembly extends through the tube assembly and includes an insertion section. The movement member is coupled with the tube assembly and includes a thrust rod extending through the tubular member. The anchor is located at one end of the thrust rod and includes a body and at least two wings connected to the body is able to be folded and unfolded relative to the body. The body of the anchor is connected to an end of a thread. Another end of the thread is connected to the tubular member.
    Type: Application
    Filed: September 12, 2019
    Publication date: May 21, 2020
    Inventors: Chen-Chie WANG, Po-Chih Chow, Yue-Jun Wang, Shih-Hua Huang, Chih-Lung Lin, Tung-Lin Tsai, Chun-Chieh Tseng, Li-Wen Weng
  • Patent number: 10658182
    Abstract: Small size chip handling and electronic component integration are accomplished using handle fixturing to transfer die or other electronic components from a full area array to a targeted array. Area array dicing of a thinned device wafer on a handle wafer/panel may be followed by selective or non-selective de-bonding of targeted die or electronic components from the handle wafer and optional attachment to a carrier such as a transfer head or tape. Alignment fiducials may facilitate precision alignment of the transfer head or tape to the device wafer and subsequently to the targeted array. Alternatively, the dies or other electronic elements are transferred selectively from either a carrier or the device wafer to the targeted array.
    Type: Grant
    Filed: August 26, 2019
    Date of Patent: May 19, 2020
    Assignee: International Business Machines Corporation
    Inventors: Russell A. Budd, Qianwen Chen, Bing Dang, Jeffrey D. Gelorme, Li-wen Hung, John U. Knickerbocker