Patents by Inventor Li Wen

Li Wen has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20210329817
    Abstract: A heat exchange system includes a heat-absorbing substance such as Liquid Natural Gas (LNG), a heat dissipation apparatus, a water storage tank, a heat exchanger, and a heat exchanger. The heat exchanger is coupled between the LNG and the water storage tank. The heat exchanger is coupled between the heat dissipation apparatus and the water storage tank.
    Type: Application
    Filed: June 29, 2021
    Publication date: October 21, 2021
    Inventors: TZE-CHERN MAO, YEN-CHUN FU, CHIH-HUNG CHANG, CHAO-KE WEI, LI-WEN CHANG, CHING-TANG LIU, HUNG-CHOU CHAN
  • Patent number: 11152301
    Abstract: A method of designing a memory circuit is provided that includes generating a layout of a first memory cell using an integrated circuit design system. The layout of the first memory cell is generated by routing a first word line in a first layer on a first level, and routing a second word line in the first layer. Also, the method includes generating a layout of a second memory cell using the integrated circuit design system. The layout of the second memory cell is generated by routing a third word line in the first layer, the second word line being between the first word line and the third word line, and routing a fourth word line in the first layer, the third word line being between the second word line and the fourth word line. Moreover, the method includes assigning a first color scheme to the first word line and to the third word line, and assigning a second color scheme to the second word line and to the fourth word line.
    Type: Grant
    Filed: July 15, 2019
    Date of Patent: October 19, 2021
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
    Inventors: Hidehiro Fujiwara, Li-Wen Wang, Yen-Huei Chen, Hung-Jen Liao
  • Publication number: 20210303085
    Abstract: A mouse includes a main body, a supporting component, a stopping structure and an elastic component. The main body has a receiving chamber penetrating through one end of the main body. An upper portion of the main body is equipped with a magnetic attraction component located to a top of the receiving chamber. The supporting component is slidably arranged in the receiving chamber to be retracted into or be pulled out from the receiving chamber. A top of the supporting component is equipped with a magnetic attraction element. The stopping structure is arranged between the main body and the supporting component for limiting the supporting component from being retracted into the main body. One end of the elastic component is connected to the main body, and the other end of the elastic component is connected to the supporting component.
    Type: Application
    Filed: March 19, 2021
    Publication date: September 30, 2021
    Inventor: Li Wen Lin
  • Publication number: 20210284846
    Abstract: A pigment composite particle is provided, which includes an organic pigment core, a polyelectrolyte shell wrapped around the organic pigment core, and an oxide shell wrapped around the polyelectrolyte shell. The organic pigment core is water-insoluble. The organic pigment core and the polyelectrolyte shell have a weight ratio of 1:0.25 to 1:1. The oxide shell is formed from tetraalkyl orthosilicate, tetraalkyl orthotitanate, or a combination thereof, and the organic pigment core and the tetraalkyl orthosilicate, tetraalkyl orthotitanate, or the combination thereof have a weight ratio of 1:0.7 to 1:3.
    Type: Application
    Filed: March 16, 2020
    Publication date: September 16, 2021
    Applicant: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE
    Inventors: Cheng En WU, Li Wen CHEN, Chih Lung CHIU, Pang-Hung LIU
  • Patent number: 11120868
    Abstract: A semiconductor memory device comprising a plurality of memory cells configured to store digital data and an input multiplexer configured to enable the selection of a particular memory cell from the plurality of memory cells. The semiconductor memory device further comprises a read/write driver circuit configured to read data from the selected memory cell and write data to the selected memory cell, and a write logic block configured to provide logical control to the read/write driver circuit for writing data to the selected of memory cell. The read/write driver circuit may be coupled to the read/write input multiplexer by a data line and an inverted data line and the read and the write operations to the selected memory cell occur over the same data line and inverted data line.
    Type: Grant
    Filed: December 5, 2019
    Date of Patent: September 14, 2021
    Assignee: Taiwan Semiconductor Manufacturing Company Limited
    Inventors: Chien-Yuan Chen, Che-Ju Yeh, Hau-Tai Shieh, Cheng Hung Lee, Hung-Jen Liao, Sahil Preet Singh, Manish Arora, Hemant Patel, Li-Wen Wang
  • Patent number: 11121005
    Abstract: Various embodiments process semiconductor devices. In one embodiment, a release layer is applied to a handler. The at least one singulated semiconductor device is bonded to the handler. The at least one singulated semiconductor device is packaged while it is bonded to the handler. The release layer is ablated by irradiating the release layer through the handler with a laser. The at least one singulated semiconductor device is removed from the transparent handler after the release layer has been ablated.
    Type: Grant
    Filed: January 31, 2020
    Date of Patent: September 14, 2021
    Assignee: International Business Machines Corporation
    Inventors: Paul S. Andry, Bing Dang, Jeffrey Donald Gelorme, Li-Wen Hung, John U. Knickerbocker, Cornelia Tsang Yang
  • Publication number: 20210280437
    Abstract: A method of fabricating (a distributed write driving arrangement for a semiconductor memory device) includes: forming bit cells and a local write driver in a first device layer; forming a local write bit (LWB) line and a local write bit_bar (LWB_bar) line in a first metallization layer; connecting each of the bit cells correspondingly between the LWB and LWB_bar lines; connecting the local write driver to the LWB line and the LWB_bar line; forming a global write bit (GWB) line and a global write bit_bar (GWBL_bar) line in a second metallization layer; connecting the GWB line to the LWB line; connecting the GWB line and the GWBL_bar line to the corresponding LWB line and LWB_bar line; forming a global write driver in a second device layer; and connecting the global write driver to the GWB line and the GWBL_bar line.
    Type: Application
    Filed: April 27, 2021
    Publication date: September 9, 2021
    Inventors: Hidehiro FUJIWARA, Hung-Jen LIAO, Li-Wen WANG, Jonathan Tsung-Yung CHANG, Yen-Huei CHEN
  • Patent number: 11107696
    Abstract: Examples described herein provide for methods for semiconductor processing for forming source/drain regions of transistors. An example is a method for semiconductor processing. An etch stop liner is formed in a semiconductor substrate. Forming the etch stop liner includes implanting etch selectivity dopants into the semiconductor substrate. The etch selectivity dopants form at least part of the etch stop liner. A source/drain cavity is formed in the semiconductor substrate. Forming the source/drain cavity includes etching the etch stop liner. Etching the etch stop liner selectively etches the etch stop liner relative to a material of the semiconductor substrate. A source/drain region is epitaxially grown in the source/drain cavity.
    Type: Grant
    Filed: October 29, 2019
    Date of Patent: August 31, 2021
    Assignee: XILINX, INC.
    Inventors: Li-Wen Chang, Ping-Chin Yeh
  • Patent number: 11094407
    Abstract: A drug delivery form includes a drug and electronics. The electronics includes memory(ies) having drug delivery form information, including information about the drug and about at least part of a supply chain from manufacture of the drug delivery form to a current location in the supply chain. The electronics includes communication circuitry configured to read data from and write data to the drug delivery form information. An apparatus includes memory(ies) having computer readable code, and processor(s). The processor(s) cause the apparatus to perform operations including communicating with a drug delivery form including a drug and drug delivery form information, including information about the drug and about at least part of a supply chain from manufacture of the drug delivery form to a current location in the supply chain. The processor(s) cause the apparatus to perform reading data from or writing data into the drug and drug delivery form information.
    Type: Grant
    Filed: June 13, 2019
    Date of Patent: August 17, 2021
    Assignee: International Business Machines Corporation
    Inventors: John Knickerbocker, Li-Wen Hung, Bing Dang, Katsuyuki Sakuma, Jeffrey Donald Gelorme, Rajeev Narayanan, Qianwen Chen
  • Patent number: 11083109
    Abstract: A heat exchange system includes a heat-absorbing substance such as Liquid Natural Gas (LNG), a heat dissipation apparatus, a water storage tank, a heating portion, and a cooling portion. The heating portion is coupled between the LNG and the water storage tank. The cooling portion is coupled between the heat dissipation apparatus and the water storage tank. The cooling portion transfers heat of the heat dissipation apparatus to water of the water storage tank to heat the heating portion, and the heating portion transfers heat of the water of the water storage tank to the LNG.
    Type: Grant
    Filed: August 15, 2017
    Date of Patent: August 3, 2021
    Assignee: HONGFUJIN PRECISION ELECTRONICS (TIANJIN) CO., LTD.
    Inventors: Tze-Chern Mao, Yen-Chun Fu, Chih-Hung Chang, Chao-Ke Wei, Li-Wen Chang, Ching-Tang Liu, Hung-Chou Chan
  • Publication number: 20210225770
    Abstract: A semiconductor structure and a method for manufacturing the same are provided. The semiconductor structure includes a substrate and a seed layer on the substrate. The substrate includes a base and a composite layer encapsulating the base. The semiconductor structure also includes an epitaxial layer on the seed layer. The semiconductor structure also includes a semiconductor device on the epitaxial layer, and an interlayer dielectric layer on the epitaxial layer. The interlayer dielectric layer covers the semiconductor device. The semiconductor structure further includes a via structure that penetrates at least the composite layer of the substrate and is in contact with the base.
    Type: Application
    Filed: January 22, 2020
    Publication date: July 22, 2021
    Applicant: Vanguard International Semiconductor Corporation
    Inventors: Yung-Fong LIN, Li-Wen CHUANG, Jui-Hung YU, Cheng-Tao CHOU, Chun-Hsu CHEN, Yu-Chieh CHOU
  • Patent number: 11059230
    Abstract: A biomaterial printing apparatus includes a support base, a movement device, a printing device, a first optical-detection device, and a second optical-detection device. The carrier is configured for a culture container to be put thereon. The movement device is connected to the support base. The printing device is connected to the movement device. The first optical-detection device is configured to detect the position of the injection needle of the printing device. The second optical-detection device is configured to detect the position of the culture container. According to the detection of the first optical-detection device and the second optical-detection device, the biological material printing device can accurately move the injection needle to the injection position relative to the culture container, thereby improving the accuracy of printing the biological material.
    Type: Grant
    Filed: January 30, 2019
    Date of Patent: July 13, 2021
    Assignee: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE
    Inventors: Chang-Chou Li, Li-Wen Lai, Yang-Cheng Lin
  • Publication number: 20210209578
    Abstract: The present disclosure relates to an electronic device, a method, and a computer-readable recording medium for electronic transactions. The electronic device displays a first graphical user interface (GUI) on a touch screen, the first GUI including a currency amount, displays a second GUI corresponding to transmission of the currency amount according to a currency transmission signal input to the touch screen, determines an amount of an electronic transaction according to the currency transmission signal, and transmits a generated signal containing information on the amount of the electronic transaction to an information processing system.
    Type: Application
    Filed: January 4, 2021
    Publication date: July 8, 2021
    Applicant: LINE Corporation
    Inventors: Yun-Ru SUN, Chien-Wei HU, Yu-Chuan WEI, Li-Wen LIAO
  • Publication number: 20210206064
    Abstract: A three-dimensional printing apparatus having electrostatic auxiliary, including a printing platform, a feeding device, a nozzle, and a high voltage power supply, is provided. The feeding device and the nozzle are disposed above the printing platform. The nozzle is connected to the feeding device and is located between the feeding device and the printing platform. A distance between the nozzle and the printing platform is less than or equal to 1 cm. The high voltage power supply has an output end electrically connected to the nozzle and a ground end electrically connected to the printing platform.
    Type: Application
    Filed: December 22, 2020
    Publication date: July 8, 2021
    Applicant: Industrial Technology Research Institute
    Inventors: Hsin-Hsin Shen, Chang-Chou Li, Li-Wen Lai, Yu-Bing Liou, Ying-Wen Shen
  • Patent number: 11055459
    Abstract: A method of forming an electrical device is provided that includes forming microprocessor devices on a microprocessor die; forming memory devices on an memory device die; forming component devices on a component die; and forming a plurality of packing devices on a packaging die. Transferring a plurality of each of said microprocessor devices, memory devices, component devices and packaging components to a supporting substrate, wherein the packaging components electrically interconnect the memory devices, component devices and microprocessor devices in individualized groups. Sectioning the supporting substrate to provide said individualized groups of memory devices, component devices and microprocessor devices that are interconnected by a packaging component.
    Type: Grant
    Filed: June 6, 2019
    Date of Patent: July 6, 2021
    Assignee: International Business Machines Corporation
    Inventors: Qianwen Chen, Li-Wen Hung, Wanki Kim, John U. Knickerbocker, Kenneth P. Rodbell, Robert L. Wisnieff
  • Patent number: 11057784
    Abstract: A data communication system able to provide a speedy response to a user equipment transmitting data includes a base station and a data center. The base station is disposed adjacent to the data center, the base station is coupled between the data center and the user equipment, and the base station transmits data provided by the user equipment to the data center. The data center processes first data from the user equipment, and transmits a second data to the user equipment through the base station. Therefore, the data transmission time between the data center and the user equipment is shortened, and the data can be quickly fed back to the user equipment.
    Type: Grant
    Filed: July 11, 2019
    Date of Patent: July 6, 2021
    Assignee: HONGFUJIN PRECISION ELECTRONICS(TIANJIN)CO., LTD.
    Inventors: Yao-Ting Chang, Chao-Ke Wei, Tze-Chern Mao, Li-Wen Chang, Hui-Hsuan Wang
  • Patent number: 11043301
    Abstract: Methods and systems for activity monitoring include capturing an infrared image of an environment that comprises at least one patient being monitored and at least one infrared-emitting tag. A relationship between the patient being monitored and the at least one infrared-emitting tag is determined. An activity conducted by the patient being monitored is determined based on the relationship between the patient being monitored and the at least one infrared-emitting tag. A course of treatment for the patient being monitored is adjusted based on the determined activity.
    Type: Grant
    Filed: October 23, 2019
    Date of Patent: June 22, 2021
    Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATION
    Inventors: Li-Wen Hung, Jui-Hsin Lai
  • Publication number: 20210165234
    Abstract: An optical assembly includes a beam path, passing, in succession, through multiple microlens arrays and a Fourier lens assembly. The microlens arrays have a uniform aperture of their microlenses, and the entirety of the microlens arrays has an effective focal length. The optical assembly further includes an adjustment mechanism, configured to adjust a mutual optical distance of at least some of the microlens arrays in the beam path, thereby setting the effective focal length of the entirety of the microlens arrays. The adjustment mechanism has multiple adjustment positions i=1, . . . , M wherein M is a natural number ?2, i is an adjustment position index, at which the term a 2 ? ยท f ML , i in each case essentially smoothly results in a natural number Ni. ? is a center wavelength, fML,i is an effective focal length fML of the entirety of the microlens arrays set by the adjustment position i.
    Type: Application
    Filed: January 15, 2021
    Publication date: June 3, 2021
    Inventors: Christoph Tillkorn, Daniel Flamm, Julian Hellstern, Andreas Heimes, Li-Wen Chang, Maike Prossotowicz
  • Publication number: 20210159382
    Abstract: A quantum device includes a qubit chip having a plurality of qubits and an interposer attached to and electrically connected to the qubit chip. The device also includes a substrate handler attached to one side of the qubit chip or to one side of the interposer, or both so as to be thermally in contact with the qubit chip or the interposer, or both. The substrate handler includes a plurality of vias, at least a portion of plurality of vias being filled with a non-superconducting material, the non-superconducting material being selected to dissipate heat generated in the qubit chip, the interposer or both.
    Type: Application
    Filed: November 27, 2019
    Publication date: May 27, 2021
    Inventors: Jae-Woong Nah, Li-Wen Hung, Eric P. Lewandowski, Adinath S. Narasgond
  • Patent number: D929381
    Type: Grant
    Filed: July 3, 2017
    Date of Patent: August 31, 2021
    Assignee: HON HAI PRECISION INDUSTRY CO., LTD.
    Inventor: Li-Wen Tien