Abstract: A Static Random Access Memory (SRAM) device in a binary neural network is provided. The SRAM device includes an SRAM inference engine having an SRAM computation architecture with a forward path that include multiple SRAM cells. The multiple SRAM cells are configured to form a chain of SRAM cells such that an output of a given one of the multiple SRAM cells is an input to a following one of the multiple SRAM cells. The SRAM computation architecture is configured to compute a prediction from an input.

Abstract: Small size chip handling and electronic component integration are accomplished using handle fixturing to transfer die or other electronic components from a full area array to a targeted array. Area array dicing of a thinned device wafer on a handle wafer/panel may be followed by selective or non-selective de-bonding of targeted die or electronic components from the handle wafer and optional attachment to a carrier such as a transfer head or tape. Alignment fiducials may facilitate precision alignment of the transfer head or tape to the device wafer and subsequently to the targeted array. Alternatively, the dies or other electronic elements are transferred selectively from either a carrier or the device wafer to the targeted array.

Abstract: A method of manufacturing a multi-layer wafer is provided. At least one stress compensating polymer layer is applied to at least one of two heterogeneous wafers. The stress compensating polymer layer is low temperature bonded to the other of the two heterogeneous wafers to form a multi-layer wafer pair. Channels are created between die on at least one of the two heterogeneous wafers. The channels are back filled with one of oxide or polymer to create a channel oxide deposition.

Abstract: An apparatus and method of three dimensional conductive lines comprising a first memory column segment in a first tier, a second memory column segment in a second tier, and conductive lines connecting the first memory column segment to the second memory column segment. In some embodiments a conductive line is disposed in the first tier on a first side of the memory column and in the second tier on a second side of the memory column.

Abstract: A cooling device includes a cooling tank, a support frame, and a rotary shaft. The cooling tank accommodates coolant and an electronic device. The electronic device is immersed in the coolant. The support frame defines an opening in a first side plate and a receiving space communicating with the opening. The cooling tank is received in the receiving space. The cooling tank includes a base plate and a sidewall. The rotary shaft is rotationally mounted to a bottom corner of the cooling tank formed by the base plate and the sidewall. The rotary shaft serves as a rotating axis of the cooling tank to rotate the cooling tank out of the opening.

Abstract: A screwless mounting assembly mounts an expansion card in a server. The screwless mounting assembly includes a tray, a flexible bracket, and a mounting member. The tray defines a positioning hole. The bracket includes a number of pegs for mounting the expansion card to the bracket. The mounting member includes a spring pin for mounting the bracket to the tray. When the bracket mounts the expansion card, the bracket is placed on a predetermined location on the tray, and the mounting member is slid along a first direction until the spring pin is aligned with the positioning hole and is received within the positioning hole to mount the bracket to the tray. The spring pin is pulled out of the positioning hole, and the mounting member is slid along a second direction to remove the bracket from the tray.

Abstract: A method of manufacturing a multi-layer wafer is provided. The method comprises creating under bump metallization (UMB) pads on each of the two heterogeneous wafers; applying a conductive means above the UMB pads on at least one of the two heterogeneous wafers; and low temperature bonding the two heterogeneous wafers to adhere the UMB pads together via the conductive means. At least one stress compensating polymer layer may be applied to at least one of two heterogeneous wafers. The multi-layer wafer comprises two heterogeneous wafers, each of the heterogeneous wafer having UMB pads and at least one of the heterogeneous wafers having a stress compensating polymer layer and a conductive means applied above the UMB pads on at least one of the two heterogeneous wafers. The two heterogeneous wafers low temperature bonded together to adhere the UMB pads together via the conductive means.

Abstract: A semiconductor memory device comprising a plurality of memory cells configured to store digital data and an input multiplexer configured to enable the selection of a particular memory cell from the plurality of memory cells. The semiconductor memory device further comprises a read/write driver circuit configured to read data from the selected memory cell and write data to the selected memory cell, and a write logic block configured to provide logical control to the read/write driver circuit for writing data to the selected of memory cell. The read/write driver circuit may be coupled to the read/write input multiplexer by a data line and an inverted data line and the read and the write operations to the selected memory cell occur over the same data line and inverted data line.

Abstract: A method for using an intercom to implement an intelligent calling process, an intelligent calling apparatus and a system is presented. The method is adapted to a site that adopts intercoms to perform a calling process. The system utilizes a server for receiving a calling signal generated by an intelligent calling apparatus. The calling signal records ID information used to represent a calling location. The server obtains the calling location by querying a database. The software process running in the server combines voice signals according to the calling location. A calling voice is generated and sent to the intercoms carried by the personnel member. When any personnel members receive the calling voice by the intercom, this calling process can be completed as the personnel member arrives at the calling location.

Abstract: Data analytics is performed on a distributed document storage database by receiving a request for initiating a data analytics job; collecting statistics from the database in response to the request; using the statistics to estimate a first cost for merging an incremental data update for the job into a first resilient distributed dataset; using the statistics to estimate a second cost for newly creating a second resilient distributed dataset for the job; when the first cost is less than the second cost, reading data updates from the database and merging the data updates into the first resilient distributed dataset; and when the first cost is not less than the second cost, newly creating the second resilient distributed dataset by reading all documents from the database.

Abstract: A biomaterial printing apparatus includes a support base, a movement device, a printing device, a first optical-detection device, and a second optical-detection device. The carrier is configured for a culture container to be put thereon. The movement device is connected to the support base. The printing device is connected to the movement device. The first optical-detection device is configured to detect the position of the injection needle of the printing device. The second optical-detection device is configured to detect the position of the culture container. According to the detection of the first optical-detection device and the second optical-detection device, the biological material printing device can accurately move the injection needle to the injection position relative to the culture container, thereby improving the accuracy of printing the biological material.

Abstract: Various embodiments process semiconductor devices. In one embodiment, a release layer is applied to a handler. The release layer comprises at least one additive that adjusts a frequency of electro-magnetic radiation absorption property of the release layer. The additive comprises, for example, a 355 nm chemical absorber and/or chemical absorber for one of more wavelengths in a range comprising 600 nm to 740 nm. The at least one singulated semiconductor device is bonded to the handler. The at least one singulated semiconductor device is packaged while it is bonded to the handler. The release layer is ablated by irradiating the release layer through the handler with a laser. The the at least one singulated semiconductor device is removed from the transparent handler after the release layer has been ablated.

Abstract: A random number signal generator used for performing dropout or weight initialization for a node in a neural network. The random number signal generator includes a transistor which generates a random noise signal. The transistor includes a substrate, source and drain regions formed in the substrate, a first insulating layer formed over a channel of the transistor, a first trapping layer formed over the first insulating layer, a second insulating layer formed over the first trapping layer, and a second trapping layer formed over the second insulating layer. One or more traps in the first and second trapping layers are configured to capture or release one or more carriers flowing through the channel region. The random noise signal is generated as a function of one or more carrier being captured or released by the one or more traps.

Abstract: The disclosure is related to a method for intelligent calling service, an apparatus and a system thereof. The method is performed in a server. When the server receives a service request signal recording a device ID generated by an apparatus for intelligent calling service, call information of service personnel can be obtained based on a service location corresponding to the device ID by querying a database of the server. After that, the server issues a service call signal to service communication devices carried by the service personnel. When a distance between the service communication device and the apparatus for intelligent calling service reaches a threshold, it shows that one of the service personnel is in service. This calling service procedure is done when the server receives a dismissing signal generated by the apparatus or the service communication device near the apparatus.

Abstract: The disclosure is related to an IoT service system with a Bluetooth Low Energy mesh network, and a communication method thereof. The IoT service system includes multiple intelligent service calling devices, multiple service communication devices and an agent node forming a BLE mesh network. One service calling device generates a service request signal that is broadcasted over a BLE mesh network. When a server receives the service request signal through the agent node, a service personnel and his portable service communication device are obtained by querying a database according to identification information relating to the service calling device that generates the service request signal. A service calling signal is therefore formed and broadcasted over the BLE mesh network. If a distance between the service communication device and the service calling device reaches a threshold while the service personnel is in service, a service dismissing signal is generated.

Abstract: Various embodiments process semiconductor devices. In one embodiment, a release layer is applied to a handler. The at least one singulated semiconductor device is bonded to the handler. The at least one singulated semiconductor device is packaged while it is bonded to the handler. The release layer is ablated by irradiating the release layer through the handler with a laser. The the at least one singulated semiconductor device is removed from the transparent handler after the release layer has been ablated.

Abstract: Methods and systems for activity monitoring include capturing an infrared image of an environment that comprises at least one patient being monitored and at least one infrared-emitting tag. A relationship between the patient being monitored and the at least one infrared-emitting tag is determined. An activity conducted by the patient being monitored is determined based on the relationship between the patient being monitored and the at least one infrared-emitting tag. A course of treatment for the patient being monitored is adjusted based on the determined activity.

Abstract: A liquid-immersion cooling device includes a reservoir, a partition board, and a heat exchanger. The reservoir contains coolant to immerse the electronic device. The partition board and the heat exchanger are mounted within the reservoir. The partition board is arranged parallel to the electronic device. The heat exchanger and the electronic device are respectively arranged on opposite sides of the partition board within the reservoir. The partition board is configured to guide a flow of the coolant within the reservoir. When the coolant flows through the electronic device and carries away heat generated by the electronic device, the coolant carrying the heat is guided by the partition board to flow through the heat exchanger. After exchanging heat with the heat exchanger, the coolant is guided by the partition board to flow through the electronic device.

Abstract: A low-temperature co-fired microwave dielectric ceramic material includes: (a) 85 wt % to 99 wt % ceramic material comprising Mg2SiO4, Ca2SiO4, CaTiO3, and CaZrO3, wherein a weight ratio of Mg2SiO4 relative to Ca2SiO4 is of (1?x):x, a weight ratio of CaTiO3 relative to CaZrO3 is of y:z, and a weight ratio of entities of Mg2SiO4 and Ca2SiO4 relative to CaTiO3 is of (1?y?z):y, 0.2?x?0.7, 0.05?y?0.2, 0.05?z?0.4; and (b) 1 wt % to 15 wt % glass material composed of Li2O, BaO, SrO, CaO, B2O3, and SiO2.