Abstract: A method of transferring micro devices includes: aligning a detachable transfer plate by an alignment assistive mechanism; picking up the micro devices and detaching the detachable transfer plate from the alignment assistive mechanism; placing the detachable transfer plate with the micro devices thereon into a transfer head stocker capable of storing multiple detachable transfer plates; moving the transfer head stocker to a place near an another alignment assistive mechanism; disassembling the detachable transfer plate with the micro devices thereon from the transfer head stocker; moving the detachable transfer plate with the micro devices thereon to be assembled to another alignment assistive mechanism above a receiving substrate to form a device transfer assembly; aligning the micro devices on the detachable transfer plate with the receiving substrate; and transferring the micro devices to the receiving substrate by the another alignment assistive mechanism through the detachable transfer plate.

Abstract: A method of transferring a micro device is provided. The method includes: aligning a transfer plate with the micro device thereon with a receiving substrate having a contact pad thereon such that the micro device is above or in contact with the contact pad; moving a combination of the transfer plate with the micro device thereon and the receiving substrate into a confined space with a relative humidity greater than or equal to about 85% so as to condense some water between the micro device and the contact pad; and attaching the micro device to the contact pad.

Abstract: A method of liquid assisted bonding includes: forming a structure with a liquid layer between an electrode of a device and a contact pad of a substrate, and two opposite surfaces of the liquid layer being respectively in contact with the electrode and the contact pad in which hydrogen bonds are formed between the liquid layer and at least one of the electrode and the contact pad; and evaporating the liquid layer to break said hydrogen bonds such that at least one of a surface of the electrode facing the contact pad and a surface of the contact pad facing the electrode is activated so as to assist a formation of a diffusion bonding between the electrode of the device and the contact pad in which a contact area between the electrode and the contact pad is smaller than or equal to about 1 square millimeter.

Abstract: A method of transferring micro devices includes: aligning a detachable transfer plate by an alignment assistive mechanism; picking up the micro devices and detaching the detachable transfer plate from the alignment assistive mechanism; placing the detachable transfer plate with the micro devices thereon into a transfer head stocker capable of storing multiple detachable transfer plates; moving the transfer head stocker to a place near an another alignment assistive mechanism; disassembling the detachable transfer plate with the micro devices thereon from the transfer head stocker; moving the detachable transfer plate with the micro devices thereon to be assembled to another alignment assistive mechanism above a receiving substrate to form a device transfer assembly; aligning the micro devices on the detachable transfer plate with the receiving substrate; and transferring the micro devices to the receiving substrate by the another alignment assistive mechanism through the detachable transfer plate.

Abstract: A method for replacing an element of a display device includes: forming a structure with a first liquid layer between a first micro device and a conductive pad of a substrate in which the first micro device is gripped by a capillary force produced by the first liquid layer; evaporating the first liquid layer such that the first micro device is bound to the substrate; determining if the first micro device is malfunctioned or misplaced; removing the first micro device when the first micro device is malfunctioned or misplaced; forming an another structure with a second liquid layer between a second micro device and the conductive pad of the substrate in which the second micro device is gripped by a capillary force produced by the second liquid layer; and evaporating the second liquid layer such that the second micro device is bound to the substrate.

Abstract: A direct coupling fiber-device structure including an optical fiber and a micro device is provided. The optical fiber has a first end, a second end opposite to the first end, and an inner cavity recessed from the first end. The micro device is in the inner cavity. The micro device has a first surface and a second surface. The first surface is substantially facing away from the first end. The second surface is opposite to the first surface and facing toward the first end.

Abstract: An optical measurement system is provided. The optical measurement system includes an optical fiber and a photo detecting component. The optical fiber has a first end, a second end opposite to the first end, and an inner cavity recessed from the first end and is configured to accommodate a micro device. The photo detecting component is connected to the second end of the optical fiber and is configured to receive light propagating from the first end of the optical fiber.

Abstract: An electrical contact structure including a substrate, first/second conductive pads, a light-emitting diode, a cured positive photoresist layer, and a top electrode is provided. A thickness of a second type semiconductor layer of the light-emitting diode is greater than a thickness of a first type semiconductor layer of the light-emitting diode. The cured positive photoresist layer is in contact with the light-emitting diode, which exposes a top surface of the second conductive pad through a via hole therein, and exposes a top surface of the light-emitting diode. A height of the top surface of the light-emitting diode relative to the top surface of the substrate is greater than a height of a top surface of the cured positive photoresist layer relative to the top surface of the substrate. The top electrode covers the top surface of the light-emitting diode and the second conductive pad.

Abstract: A micro light-emitting diode display including a column of first/second micro light-emitting diodes and a first/second/third/fourth type column data line is provided. The first type column data line is configured to provide first data voltages to some of the first micro light-emitting diodes. The second type column data line is configured to provide second data voltages to a remaining of the first micro light-emitting diodes. The second type column data line is not crossed over by other data lines. The third type column data line is configured to provide third data voltages to some of the second micro light-emitting diodes. The third type column data line is not crossed over by other data lines. The fourth type column data line is configured to provide fourth data voltages to a remaining of the second micro light-emitting diodes.

Abstract: A method of forming a conductive area at a top surface of a light-emitting diode includes: preparing a substrate having a top surface with a conductive pad thereon; bonding a light-emitting diode having first and second type semiconductor layers and an active layer to the conductive pad; forming a polymer layer on the substrate such that a difference between a distance from a first surface of the polymer layer to the top surface of the substrate and a distance from a second surface of the polymer layer to a top surface of the light-emitting diode is greater than a distance from an interface between a second type semiconductor layer and an active layer to the top surface of the substrate; and etching the polymer layer till the second type semiconductor layer to expose the top surface of the light-emitting diode from the polymer layer.

Abstract: A micro light-emitting diode display including a column of first/second micro light-emitting diodes and a first/second/third/fourth type column data line is provided. The first type column data line is configured to provide first data voltages to some of the first micro light-emitting diodes. The second type column data line is configured to provide second data voltages to a remaining of the first micro light-emitting diodes. The second type column data line is not crossed over by other data lines. The third type column data line is configured to provide third data voltages to some of the second micro light-emitting diodes. The third type column data line is not crossed over by other data lines. The fourth type column data line is configured to provide fourth data voltages to a remaining of the second micro light-emitting diodes.

Abstract: A method for rapidly gathering a sub-threshold swing from a thin film transistor is provided. The method includes: electrically connecting an operational amplifier and an anti-exponential component to a source terminal of the thin film transistor; performing a measuring process to the thin film transistor in which the measuring process is inputting multiple values of a gate voltage to a gate terminal, such that multiple values of an output voltage are correspondingly generated from the output terminal of the operational amplifier; and performing a fitting process to the output voltage corresponding to the thin film transistor in which the fitting process is fitting at least two of said multiple values of the output voltage to get the sub-threshold swing.

Abstract: An electrical binding structure is provided, which includes a substrate, a contact pad set, and a combination of a micro device and an electrode. The contact pad set is on the substrate in which the contact pad set includes at least one contact pad, and the at least one contact pad is conductive. The combination is on the contact pad set. Opposite sides of the electrode are respectively in contact with the micro device and the contact pad set in which at least the contact pad set and the electrode define at least one volume space. A vertical projection of the at least one volume space on the substrate is overlapped with a vertical projection of one of the contact pad set and the electrode on the substrate, and is enclosed by a vertical projection of an outer periphery of the micro device on the substrate.

Abstract: An electrical binding structure is provided, which includes a substrate, a contact pad set, and a combination of a micro device and an electrode set. The contact pad set is on the substrate in which the contact pad set includes at least one contact pad, and the at least one contact pad is conductive. The combination is on the contact pad set. Opposite sides of the electrode set is respectively in contact with the micro device and the contact pad set. A vertical projection of a contact periphery between the contact pad set and the electrode set on the substrate is longer than a vertical projection of an outer periphery of the micro device on the substrate in which said vertical projection of the contact periphery on the substrate is enclosed by said vertical projection of the outer periphery on the substrate.

Abstract: A micro light-emitting diode display including a substrate and at least one pixel and a reflective layer is provided. The substrate has at least a portion that is transparent to visible light. The pixel includes an opaque electrode, a micro light-emitting diode, and a filling material. The opaque electrode is present on the substrate. The micro light-emitting diode is present on and in contact with the opaque electrode. A vertical projection of the micro light-emitting diode projected on the substrate at least partially overlaps with a vertical projection of the opaque electrode projected on the substrate. The filling material is present on the micro light-emitting diode and the substrate. The reflective layer is present on the filling material. A vertical projection of the reflective layer projected on the substrate at least partially overlaps with said portion of the substrate.

Abstract: A method for transferring a micro device is provided. The method includes: forming a liquid layer on the micro device attached on a transfer plate; placing the micro device over a receiving substrate such that the liquid layer is between the micro device and a contact pad of the receiving substrate and contacts the contact pad; and evaporating the liquid layer such that the micro device is bound to and in contact with the contact pad.

Abstract: A method of liquid assisted binding is provided. The method includes: forming a conductive pad on the substrate; placing a micro device on the conductive pad, such that the micro device is in contact with the conductive pad in which the micro device comprises an electrode facing the conductive pad; forming a liquid layer on the micro device and the substrate after said placing, such that a part of the liquid layer penetrates between the micro device and the conductive pad, and the micro device is gripped by a capillary force produced by said part of the liquid layer; and evaporating the liquid layer such that the electrode is bound to the conductive pad and is in electrical connection with the conductive pad.

Abstract: A method of restricting a micro device on a conductive pad is provided. The method includes: forming the conductive pad having a first lateral length on a substrate; forming a liquid layer on the conductive pad; and placing the micro device having a second lateral length over the conductive pad such that the micro device is in contact with the liquid layer and is gripped by a capillary force produced by the liquid layer between the micro device and the conductive pad, the micro device comprising an electrode facing the conductive pad, wherein the first lateral length is less than or equal to twice of the second lateral length.

Abstract: A light-emitting device display comprising a first light-emitting device and a second light emitting device is provided. The first light-emitting device and the second light-emitting device have a first forward voltage and a second forward voltage respectively, and the second forward voltage is higher than the first forward voltage. A first scan voltage and a second scan voltage is respectively provided to the first light-emitting device and the second light-emitting device. The first scan voltage is switched between a first scan-on voltage and a first scan-off voltage. The second scan voltage is switched between a second scan-on voltage and a second scan-off voltage. An absolute value of a difference between the second scan-on voltage and the second scan-off voltage is greater than an absolute value of a difference between the first scan-on voltage and the first scan-off voltage.

Abstract: A method of transferring different types of micro devices is provided. The method includes: assembling a first detachable transfer plate with first type micro devices thereon to an alignment assistive mechanism which is substantially above a receiving substrate, wherein the first type micro devices face the receiving substrate; aligning the first type micro devices on the first detachable transfer plate with positions of first sub-pixels respectively of pixels on the receiving substrate by the alignment assistive mechanism; transferring the first type micro devices to the first sub-pixels on the receiving substrate; replacing the first detachable transfer plate with a second detachable transfer plate with second type micro devices thereon, wherein the second type micro devices face the receiving substrate; and transferring the second type micro devices to second sub-pixels respectively of the pixels on the receiving substrate.