Abstract: The embodiments of the present disclosure provide a light-emitting substrate and a manufacturing method thereof, a backlight module, and a display device, and the light-emitting substrate includes a base substrate, a light-emitting device and a reflective layer on the base substrate. The reflective layer has an opening, and the light-emitting device is in the opening and spaced apart from the reflective layer; the reflective layer includes an edge part close to the light-emitting device and defining the opening, and a body part on a side of the edge part away from the light-emitting device, wherein the edge part has a plurality of reflective edges facing the light-emitting device and defining the opening, and a plurality of reflective included angles formed by the reflective edges interesting with each other, and the reflective included angles include included angles that are not completely identical in shape or angle.

Abstract: Provided are a method and device for controlling a vehicle and a vehicle, and relates to the technical field of automatic driving.

Abstract: A wiring substrate, an electronic element and an electronic apparatus is provided according to the disclosure, the wiring substrate includes: a base substrate; connection lines located on the substrate, wherein at least two connection lines are configured to transmit different signals; a plurality of pads, wherein any two pads are distributed at intervals, and the pads include first pads; a first pad group composed of at least three first pads; wherein the connection lines include a first type of connection line, which includes a plurality of branch portions, different branch portions are connected with different first pads, and any two branch portions are arranged at intervals.

Abstract: A light emitting element includes a base substrate, light emitting structures on the base substrate, a filling layer among the light emitting structures, a connecting electrode layer, an insulating layer, and pads. The connecting electrode layer is located at a side, away from the base substrate, of the filling layer. The insulating layer is located at a side, away from the filling layer, of the connecting electrode layer. The pads are located at a side, away from the connecting electrode layer, of the insulating layer. Each light emitting structure includes a first pole and a second pole. The connecting electrode layer includes connecting electrodes each connected to the first pole or the second pole of at least one light emitting structure. The light emitting element further includes holes in the insulating layer. The pads are connected to the connecting electrodes through the holes.

Abstract: A heat dissipation film for a display module, and a preparation method of a display device. The heat dissipation film comprises a composite structure layer and a removable protective film disposed on the composite structure layer. The composite structure layer has a first side surface and a second side surface disposed opposite to each other, and is provided with a preconfigured hole passing through the first side surface and the second side surface. The first side surface of the composite structure layer adheres to a side of the display module facing away from a display side. The protective film is attached to the second side surface of the composite structure layer. The protective film is provided with a shielding region covering the preconfigured hole. The shielding region and the rest of the protective film can all be independently torn off from the composite structure layer.

Abstract: Provided is a display panel. The display panel is divided into a display region and a non-display region disposed on a periphery of the display region. The display panel includes: a plurality of touch units and a plurality of light-emitting devices that are within the display region; and a plurality of touch signal leads and a plurality of data signal leads that are within the non-display region, wherein the touch signal lead is electrically connected to the touch unit, and the data signal lead is electrically connected to the light-emitting device; wherein in the non-display region, a region where at least a portion of the touch signal leads are disposed and a region where the plurality of data signal leads are disposed are respectively on different sides of the display region.

Abstract: Provided are an array substrate and an electronic apparatus. The array substrate includes: a base substrate; a first conductive layer on the base substrate, where the first conductive layer includes a plurality of pads, each pad includes a first metal layer, a material of the first metal layer includes Cu, a content of the Cu is greater than or equal to 99%, and a thickness of the first metal layer is greater than 2 ?m; and an electronic element disposed on a side of the first conductive layer facing away from the base substrate, where the electronic element includes an electronic element body and a plurality of pins disposed on a side of the electronic element body facing the base substrate, and the pins are connected with the pads.

Abstract: A light-emitting substrate includes: a substrate, a reflective layer, a reflective sheet, and a plurality of light-emitting devices. The reflective layer is located on a side of the substrate, and the reflective layer has a plurality of annular patterns arranged at intervals. The reflective sheet is located on a side of the reflective layer away from the substrate, and the reflective sheet has a plurality of first openings. An annular pattern is exposed by a corresponding first opening; and in a direction perpendicular to a plane where the substrate is located, an outer sidewall of the annular pattern surrounds the corresponding first opening, and an inner sidewall of the annular pattern is located in the corresponding first opening. A light-emitting device is located in an inner sidewall of one of the annular patterns.

Abstract: A display module includes a display panel and a peripheral region. The peripheral region includes a bendable fan-out region including a panel bonding portion and a driving chip; a flexible circuit board, including a first and a second conductive layers, and a substrate. The first conductive layer includes a first and a second bonding portions, and a connection portion; the second conductive layer is located on a side of the first conductive layer and at least partially overlaps with the first bonding portion; the first and the second conductive layers are connected through a via hole penetrating through the substrate; an end of the flexible circuit board is bonded to the panel bonding portion through the first bonding portion, and the second bonding portion is bonded to a control circuit board; and a conductive protection layer, covering the driving chip and connected to the second conductive layer.

Abstract: A backplane includes a substrate, a circuit structure layer, a reflective layer, a plurality of electronic devices and a plurality of encapsulation portions. Each encapsulation portion covers an electronic device in the plurality of electronic devices. At least one first conductive line includes at least one of a first linear extending portion, a second linear extending portion and a third linear extending portion. Orthographic projections of the first linear extending portion, the second linear extending portion, the third linear extending portion and an encapsulation portion in the plurality of encapsulation portions on the substrate are respectively a first orthographic projection, a second orthographic projection, a third orthographic projection and a fourth orthographic projection.

Abstract: A backlight module includes a substrate provided with a light-emitting region and a bonding region, a plurality of light-emitting units disposed on a side of the substrate, a back plate disposed on the other side of the substrate, and at least three drive circuit boards bonded and connected to the bonding region by first connectors. Moreover, an extension direction of a long edge of each of the light-emitting units is not parallel to a bonding edge of the bonding region. In this way, when the back plate is a curved back plate, the risk of peeling of the light-emitting units from the substrate when the back plate is in a curved state can be reduced by flexibly setting the degree of the included angle between the extension direction of each long edge of each light-emitting unit and the bonding edge of the bonding region.

Abstract: The present application provides a light emitting panel, a preparation method thereof, and a light emitting apparatus, which relate to the field of display technology. The light emitting panel includes a base; a reflective layer located on a side of the base, the reflective layer includes a plurality of grooves arranged in an array; a plurality of devices located in the grooves and electrically connected to the base; a first optical film located on a side of the reflective layer facing away from the base, the orthographic projection of the first optical film on the base covers the orthographic projection of the reflective layer on the base, and at least partial areas of the reflective layer are in direct contact with the first optical film.

Abstract: A light-emitting substrate includes a back plate, light-emitting regions arranged in an array and a bonding electrode group. The light-emitting regions are disposed on the back plate, and each light-emitting region is provided with at least one light-emitting group therein. The bonding electrode group is disposed on the back plate and includes a first bonding electrode and remaining bonding electrodes. A second power supply voltage terminal of a light-emitting group is electrically connected to a feedback signal line included in the light-emitting substrate, and the first bonding electrode is electrically connected to the feedback signal line. An impedance between the first bonding electrode and an adjacent one of the remaining bonding electrodes is larger then an impedance between two adjacent and consecutive ones of the remaining bonding electrodes.

Abstract: This disclosure relates to an automatic driving method, apparatus and system, and a non-transitory computer-readable storage medium, and relates to the field of agricultural machine automatic driving. The automatic driving method includes acquiring a trajectory of travel of an agricultural machine on a current row and an image of an operated area of a farm implement connected with the agricultural machine on the current row; determining a boundary of the operated area of the farm implement on the current row according to the image of the operated area of the farm implement on the current row; determining an operating width of the farm implement; and determining a space between a trajectory of travel of the agricultural machine on a next row and the trajectory of travel of the agricultural machine on the current row.

Abstract: A backlight module includes a substrate provided with a light-emitting region and a bonding region, a plurality of light-emitting units disposed on a side of the substrate, a back plate disposed on the other side of the substrate, and at least three drive circuit boards bonded and connected to the bonding region by first connectors. Moreover, an extension direction of a long edge of each of the light-emitting units is not parallel to a bonding edge of the bonding region. In this way, when the back plate is a curved back plate, the risk of peeling of the light-emitting units from the substrate when the back plate is in a curved state can be reduced by flexibly setting the degree of the included angle between the extension direction of each long edge of each light-emitting unit and the bonding edge of the bonding region.

Abstract: Provided is a support member of a flexible display module. The support member includes: a body portion and a plurality of outward protrusion portions. The plurality of outward protrusion portions are at least distributed at two opposite sides of the body portion and protrude outwards relative to the sides of the body portion. A positioning hole is formed in each of the outward protrusion portions.

Abstract: A light-emitting substrate includes a substrate, and a plurality of light-emitting devices and a reflective layer that are disposed on a side of the substrate. The reflective layer has a plurality of openings, and the plurality of openings include a plurality of first openings; a light-emitting device is located in a first opening. A surface of the reflective layer away from the substrate has a plurality of protruding structures.

Abstract: A backplane includes a substrate, a circuit structure layer, a reflective layer, a plurality of electronic devices and a plurality of encapsulation portions. Each encapsulation portion covers an electronic device in the plurality of electronic devices. At least one first conductive line includes a first linear extending portion, a second linear extending portion and a third linear extending portion that are sequentially connected. Orthographic projections of the first linear extending portion, the second linear extending portion, the third linear extending portion and an encapsulation portion in the plurality of encapsulation portions on the substrate are respectively a first orthographic projection, a second orthographic projection, a third orthographic projection and a fourth orthographic projection.

Abstract: Provided are a phenanthroimidazole derivative, and a preparation method therefor, and an application thereof. The phenanthroimidazole derivative has a structural formula as shown in Formula (I), R being an electron donor group, wherein by taking a phenanthroimidazole group containing a trifluoromethyl phenyl group as an electron acceptor, and in virtue of the properties of the specific electron donor group R, the phenanthroimidazole derivative containing a light-absorbing photosensitive group of a series D-?-A structure is synthesized, and can be used as a photoinitiator, which is used in the technical field of UV light-curing systems or 3D printing.

Abstract: The present disclosure relates to a composition, a substrate and a preparation method of a light reflection layer. The composition comprises: a matrix material and an additive, the matrix material including a solvent, reactant molecules and a material with reflection function dispersed in the solvent, wherein the reactant molecules is capable of undergoing cross-linking reaction under a first preset condition, and include monomer molecules and/or prepolymer molecules; the additive including a filler material that is in the form of powder or microspheres, capable of being dispersed in the matrix material, and filled between the crosslinking points of any adjacent reactant molecules to block the crosslinking reaction of some adjacent reactant molecules under the first preset condition.