Patents by Inventor Liang Lu

Liang Lu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11791835
    Abstract: The present invention provides a computer-implemented method, computer system and computer program product for data compression. According to the computer-implemented method, one or more data blocks on a data source to be replicated to a data target may be detected. Then, compression performance of a first compression dictionary may be evaluated. The first compression dictionary may be previously used to compress existing data on the data target. If the compression performance is lower than a preset performance threshold, a second compression dictionary may be generated based on the existing data on the data target. The data target may be updated based on the existing data and the one or more data blocks using the second compression dictionary.
    Type: Grant
    Filed: June 13, 2022
    Date of Patent: October 17, 2023
    Assignee: International Business Machines Corporation
    Inventors: Xiao Wei Zhang, Hao Zhang, Meng Guo, Liang Lu, Jing F Fan, Jing Huang, Deng Ke Zhao
  • Publication number: 20230326815
    Abstract: A semiconductor device includes a first wafer and a second wafer. The semiconductor device includes a seal ring structure comprising a first metal structure in a body of the first wafer, a second metal structure in the body of the first wafer, a third metal structure in a body of the second wafer, and a metal bonding structure including a first set of metal elements coupling the first metal structure and the third metal structure through an interface between the first wafer and the second wafer, and a second set of metal elements coupling the second metal structure and the third metal structure through the interface between the first wafer and the second wafer.
    Type: Application
    Filed: June 15, 2023
    Publication date: October 12, 2023
    Inventors: Chun-Liang LU, Chun-Wei CHIA, Chun-Hao CHOU, Kuo-Cheng LEE
  • Publication number: 20230325581
    Abstract: A font switching method and an electronic device are provided. A target font consistent with a font currently used by an operating system is found through pixel matching of a dot matrix, and the target font is applied to a third-party application, so that the third-party application can accurately vary with a font change of the operating system. This avoids a problem that the font used by the third-party application software is inconsistent with the font used by the operating system.
    Type: Application
    Filed: March 31, 2021
    Publication date: October 12, 2023
    Inventors: Liang Lu, Yaoming Liu, Lin Peng
  • Patent number: 11780031
    Abstract: A method for laser processing a packaging box is provided, which includes feeding a paper material printed with a pattern on the front side thereof to a cutting machine by back feeding using an automatic paper feeder; performing edge finding on the rear side of the paper material, and forming indentations on the rear side of the paper material corresponding to where the pattern is on the front side; conveying the paper material to a laser cutting machine to perform registration marking on the rear side of the paper material before laser cutting; and finally performing laser cutting based on the registration markings to obtain a packaging box with the pattern printed on the front side and the indentations formed on the rear side.
    Type: Grant
    Filed: December 1, 2020
    Date of Patent: October 10, 2023
    Assignee: GREAT COMPUTER CORP.
    Inventors: Liang Shih, Heng-Kuan Lin, Chia-Liang Lu
  • Patent number: 11776998
    Abstract: A device comprises a plurality of nanosheets, source/drain stressors, and a gate structure wrapping around the nanosheets. The nanosheets extend in a first direction above a semiconductor substrate and are arranged in a second direction substantially perpendicular to the first direction. The source/drain stressors are on either side of the nanosheets. Each of the source/drain stressors comprises a first epitaxial layer and a second epitaxial layer over the first epitaxial layer. The first and second epitaxial layers are made of a Group IV element and a Group V element. An atomic ratio of the Group V element to the Group IV element in the second epitaxial layer is greater than an atomic ratio of the Group V element to the Group IV element in the first epitaxial layer.
    Type: Grant
    Filed: January 24, 2022
    Date of Patent: October 3, 2023
    Assignees: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD., NATIONAL TAIWAN UNIVERSITY
    Inventors: Chung-En Tsai, Chia-Che Chung, Chee-Wee Liu, Fang-Liang Lu, Yu-Shiang Huang, Hung-Yu Yeh, Chien-Te Tu, Yi-Chun Liu
  • Publication number: 20230299203
    Abstract: A semiconductor structure includes an isolation feature formed in the semiconductor substrate and a first fin-type active region. The first fin-type active region extends in a first direction. A dummy gate stack is disposed on an end region of the first fin-type active region. The dummy, gate stack may overlie an isolation structure. In an embodiment, any recess such as formed for a source/drain region in the first fin-type active region will be displaced from the isolation region by the distance the dummy gate stack overlaps the first fin-type active region.
    Type: Application
    Filed: May 24, 2023
    Publication date: September 21, 2023
    Inventors: Shao-Ming YU, Chang-Yun Chang, Chih-Hao Chang, Hsin-Chih Chen, Kai-Tai Chang, Ming-Feng Shieh, Kuei-Liang Lu, Yi-Tang Lin
  • Patent number: 11756842
    Abstract: A semiconductor device includes a first wafer and a second wafer. The semiconductor device includes a seal ring structure comprising a first metal structure in a body of the first wafer, a second metal structure in the body of the first wafer, a third metal structure in a body of the second wafer, and a metal bonding structure including a first set of metal elements coupling the first metal structure and the third metal structure through an interface between the first wafer and the second wafer, and a second set of metal elements coupling the second metal structure and the third metal structure through the interface between the first wafer and the second wafer.
    Type: Grant
    Filed: September 17, 2021
    Date of Patent: September 12, 2023
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Chun-Liang Lu, Chun-Wei Chia, Chun-Hao Chou, Kuo-Cheng Lee
  • Patent number: 11742321
    Abstract: The present disclosure, in some embodiments, relates to a workpiece bonding apparatus. The workpieces bonding apparatus includes a first substrate holder having a first surface configured to receive a first workpiece, and a second substrate holder having a second surface configured to receive a second workpiece. A vacuum apparatus is positioned between the first substrate holder and the second substrate holder and is configured to selectively induce a vacuum between the first surface and the second surface. The vacuum is configured to attract the first surface and the second surface toward one another.
    Type: Grant
    Filed: May 13, 2021
    Date of Patent: August 29, 2023
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Xin-Hua Huang, Kuan-Liang Liu, Kuo Liang Lu, Ping-Yin Liu
  • Publication number: 20230265083
    Abstract: The disclosure is directed to, in part, to heterocycle CDK inhibitors, pharmaceutical compositions comprising the same, as well as methods of their use and preparation.
    Type: Application
    Filed: August 10, 2021
    Publication date: August 24, 2023
    Inventors: Liang Lu, Andrew P. Combs, Chaofeng Dai, Raul A. Leal
  • Patent number: 11721761
    Abstract: A semiconductor structure includes an isolation feature formed in the semiconductor substrate and a first fin-type active region. The first fin-type active region extends in a first direction. A dummy gate stack is disposed on an end region of the first fin-type active region. The dummy gate stack may overlie an isolation structure. In an embodiment, any recess such as formed for a source/drain region in the first fin-type active region will be displaced from the isolation region by the distance the dummy gate stack overlaps the first fin-type active region.
    Type: Grant
    Filed: January 27, 2022
    Date of Patent: August 8, 2023
    Assignee: Mosaid Technologies Incorporated
    Inventors: Shao-Ming Yu, Chang-Yun Chang, Chih-Hao Chang, Hsin-Chih Chen, Kai-Tai Chang, Ming-Feng Shieh, Kuei-Liang Lu, Yi-Tang Lin
  • Publication number: 20230242543
    Abstract: The disclosure is directed to, in part, to CDK inhibitors, pharmaceutical compositions comprising the same, as well as methods of their use and preparation.
    Type: Application
    Filed: April 4, 2023
    Publication date: August 3, 2023
    Inventors: Liang Lu, Rupa Shetty, Andrew Paul Combs, Chaofeng Dai, Raul Andrew Leal, Klare Lazor Bersch
  • Publication number: 20230226062
    Abstract: Disclosed are compounds of Formula (I?), methods of using the compounds as immunomodulators, and pharmaceutical compositions comprising such compounds. The compounds inhibit PD-1/PD-L1 interaction and are useful in treating, preventing or ameliorating diseases or disorders such as cancer or infections.
    Type: Application
    Filed: September 26, 2022
    Publication date: July 20, 2023
    Inventors: Liangxing Wu, Ding-Quan Qian, Liang Lu, Neil Lajkiewicz, Leah C. Konkol, Zhenwu Li, Fenglei Zhang, Jingwei Li, Haisheng Wang, Meizhong Xu, Kaijiong Xiao, Wenqing Yao
  • Patent number: 11702423
    Abstract: The present disclosure provides bifunctional compounds comprising a target protein binding moiety and a E3 ubiquitin ligase binding moiety, and associated methods of use.
    Type: Grant
    Filed: June 9, 2021
    Date of Patent: July 18, 2023
    Assignee: Prelude Therapeutics Incorporated
    Inventors: Hong Lin, Philip Pitis, Liang Lu, Andrew Paul Combs
  • Publication number: 20230220863
    Abstract: A self-drilling expanding anchor bolt, including a drill bit for drilling, an anchor rod connected to the drill bit, and an expanding sleeve surrounding the anchor rod, the anchor rod having an expansion cone at a first end adjoining the drill bit, having a neck region behind and contiguous with the expansion cone, and having a threaded segment at a second end of the neck region remote from the drill bit, wherein the expansion cone expands the expanding sleeve in a radial direction when the expansion cone is pulled into the expanding sleeve; a transition part is provided between the drill bit and the expansion cone of the anchor rod, the maximum diameter of the transition part being smaller than the hole diameter of a drilled hole formed by the drill bit.
    Type: Application
    Filed: June 16, 2021
    Publication date: July 13, 2023
    Inventors: Gaisheng KOH, Liang LU, Linda XU
  • Publication number: 20230211486
    Abstract: A setting device for a self-drilling anchor bolt of the present invention includes: a drive shaft, one end thereof having a shank for connecting to an impact tool, and another end being a setting part for pushing the self-drilling anchor bolt axially; a coupling, partially surrounding the drive shaft along an axis, and being supported on the drive shaft in such a way as to be incapable of relative rotation while being axially moveable at least locally; and a releasable locking component, disposed between the drive shaft and the coupling; in a locked position, the locking component is coupled to an extremity of an anchor rod such that the anchor rod is fed axially with rotational striking into a receiving material, and in a released position, the drive shaft strikes a sleeve to advance axially along the anchor rod and expand at an expansion part.
    Type: Application
    Filed: June 16, 2021
    Publication date: July 6, 2023
    Inventors: Gaisheng KOH, Linda XU, Liang LU
  • Publication number: 20230201165
    Abstract: The present disclosure relates to a class of JAK inhibitor compounds for treating severe pneumonia. Specifically, the present disclosure discloses a method for treating severe pneumonia, the method comprising administering to a patient in need thereof a therapeutically effective amount of a compound represented by formula (G), isotopically labeled compound thereof, or optical isomer thereof, geometric isomer thereof, a tautomer thereof or a mixture of various isomers, or a pharmaceutically acceptable salt thereof, or a prodrug thereof, or a metabolite thereof.
    Type: Application
    Filed: February 14, 2023
    Publication date: June 29, 2023
    Inventors: Liang Lu, Hia Huang, Longzheng Zhang, Saisai Zhao, Jixuan Zhang
  • Publication number: 20230192711
    Abstract: The present disclosure relates to a class of JAK inhibitor compounds and uses thereof. Specifically, the present disclosure discloses a compound represented by formula (G), isotopically labeled compound thereof, or optical isomer thereof, geometric isomer thereof, a tautomer thereof or a mixture of various isomers, or a pharmaceutically acceptable salt thereof, or a prodrug thereof, or a metabolite thereof. The present disclosure also relates to the application of the compounds in medicine.
    Type: Application
    Filed: February 15, 2023
    Publication date: June 22, 2023
    Inventors: Liang Lu, Hai Huang, Longzheng Zhang, Saisai Zhao, Jixuan Zhang
  • Publication number: 20230192656
    Abstract: The present disclosure relates to FGFR inhibitor compounds and its use. Specifically, the present disclosure discloses a compound represented by formula (I), isotopically labeled compound thereof, or optical isomer thereof, geometric isomer thereof, a tautomer thereof or a mixture of various isomers, or a pharmaceutically acceptable salt thereof, or a prodrug thereof, or a metabolite thereof. The present disclosure also relates to use of the above compound in medicine.
    Type: Application
    Filed: February 10, 2023
    Publication date: June 22, 2023
    Inventors: Liang Lu, Saisai Zhao, Jixuan Zhang, Hai Huang, Longzheng Zhang
  • Publication number: 20230192710
    Abstract: The present disclosure relates to a JAK inhibitor compound and uses thereof. Specifically, the present disclosure discloses a compound of formula (G) in a solid form, isotopically labeled compound thereof, or optical isomer thereof, geometric isomer thereof, a tautomer thereof or a mixture of various isomers, or a pharmaceutically acceptable salt thereof, or a prodrug thereof, or a metabolite thereof. The present disclosure also relates to the application of the compound in a solid form in medicine.
    Type: Application
    Filed: February 14, 2023
    Publication date: June 22, 2023
    Inventors: Liang Lu, Saisai Zhao
  • Patent number: 11673883
    Abstract: Disclosed are compounds of Formula (I), methods of using the compounds as immunomodulators, and pharmaceutical compositions comprising such compounds. The compounds are useful in treating, preventing or ameliorating diseases or disorders such as cancer or infections.
    Type: Grant
    Filed: October 5, 2020
    Date of Patent: June 13, 2023
    Assignee: Incyte Corporation
    Inventors: Liang Lu, Ding-Quan Qian, Liangxing Wu, Wenqing Yao