Abstract: A muscle training equipment configured to train at least one target muscle of human body and including frame, at least one vibration detector, and at least one resistance adjustment assembly. The at least one vibration detector is configured to be disposed on the at least one target muscle so as to produce at least one muscle vibration signal based on the activity of the at least one target muscle. The at least one resistance adjustment assembly includes motor, handle and linkage assembly. The motor is disposed on the frame and has resistance-adjustable shaft. An end of the linkage assembly is fixed to the resistance-adjustable shaft, and another end of the linkage assembly is pivotally connected to the handle. The at least one resistance adjustment assembly is configured to adjust a resistance force applied on the resistance-adjustable shaft according to the at least one muscle vibration signal.

Abstract: A method includes forming a metal gate structure, wherein the metal gate structure includes a gate dielectric layer and a gate electrode; performing a surface treatment to a top surface of the metal gate structure, wherein the surface treatment converts a top portion of the gate electrode to an oxidation layer; forming a conductive layer above the gate electrode, wherein the forming of the conductive layer includes substituting oxygen in the oxidation layer with a metallic element; and forming a contact feature above the metal gate structure, wherein the contact feature is in direct contact with the conductive layer.

Abstract: A method includes forming a first high-k dielectric layer over a first semiconductor region, forming a second high-k dielectric layer over a second semiconductor region, forming a first metal layer comprising a first portion over the first high-k dielectric layer and a second portion over the second high-k dielectric layer, forming an etching mask over the second portion of the first metal layer, and etching the first portion of the first metal layer. The etching mask protects the second portion of the first metal layer. The etching mask is ashed using meta stable plasma. A second metal layer is then formed over the first high-k dielectric layer.

Abstract: A butted contact structure is provided. In one embodiment, a structure includes a first transistor on a substrate, the first transistor comprising a first source or drain region, a first gate, and a first gate spacer being disposed between the first gate and the first source or drain region. The structure includes a second transistor on the substrate, the second transistor comprising a second source or drain region, a second gate, and a second gate spacer being disposed between the second gate and the second source or drain region. The structure includes a butted contact disposed above and extending from the first source or drain region to at least one of the first or second gate, a portion of the first gate spacer extending a distance into the butted contact to separate a first bottom surface of the butted contact from a second bottom surface of the butted contact.

Abstract: An ashing process and device forms radicals of an ashing gas through a secondary reaction. A plasma is generated from a first gas, which is diffused through a first gas distribution plate (GDP). The plasma is diffused through a second GDP and a second gas is supplied below the second GDP. The first gas reacts with the second gas to energize the second gas. The energized second gas is used in ashing a resist layer from a substrate.

Abstract: An ashing process and device forms radicals of an ashing gas through a secondary reaction. A plasma is generated from a first gas, which is diffused through a first gas distribution plate (GDP). The plasma is diffused through a second GDP and a second gas is supplied below the second GDP. The first gas reacts with the second gas to energize the second gas. The energized second gas is used in ashing a resist layer from a substrate.

Abstract: Permeable membrane microchannel heat sinks and methods of producing such a heat sink, wherein such a heat sink includes a base and at least first and second microchannels defined by at least one porous and permeable membrane that is on the base and defines primary heat exchange surfaces of the heat sink. The membrane has opposing faces exposed to the first and second microchannels, and a fluid flowing through the heat sink flows from the first microchannel to the second microchannel through pores in the membrane.

Abstract: Embodiments described herein relate to plasma processes. A tool includes a pedestal. The pedestal is configured to support a semiconductor substrate. The tool includes a bias source. The bias source is electrically coupled to the pedestal. The bias source is operable to bias the pedestal with a direct current (DC) voltage. The tool includes a plasma generator. The plasma generator is operable to generate a plasma remote from the pedestal. A method for semiconductor processing includes performing a plasma process on a substrate in a tool. The plasma process includes flowing a gas into the tool. The plasma process includes biasing a pedestal that supports the substrate in the tool. The plasma process includes igniting a plasma in the tool using the gas.

Abstract: Embodiments of the disclosure provide a method for processing data in a database, an apparatus, and a non-transitory computer readable medium. The method can include: receiving, from a user, a first operating instruction for selecting at least one data label of a plurality of generated data labels; determining a query statement and a data range based on the at least one data label; and generating a data query instruction according to the query statement and the data range.

Abstract: A semiconductor package including a chip stack, at least one conductive wire, a first insulating encapsulant, a second insulating encapsulant, and a redistribution layer is provided, and a manufacturing method thereof is also provided. The chip stack includes semiconductor chips stacked on top of each other. Each semiconductor chip has an active surface that has at least one bonding region, and each bonding region is exposed by the chip stack. The conductive wire is correspondingly disposed on the bonding region. The first insulating encapsulant encapsulates the bonding region and the conductive wire. At least a portion of each conductive wire is exposed from the first insulating encapsulant. The second insulating encapsulant encapsulates the chip stack and the first insulating encapsulant. The first insulating encapsulant is exposed from the second insulating encapsulant. The redistribution layer is disposed on the first and second insulating encapsulant and electrically coupled to the conductive wire.

Abstract: A system for generating an electron beam array, comprising a light source, a first substrate having a plurality of plasmonic lenses mounted thereon, the plasmonic lenses configured to received light from the light source and produce an electron emission, and a plurality of electrostatic microlenses configured to focus the electron emissions into a beam for focusing on a wafer substrate. A light source modulator and digital micro mirror may be included which captures light from the light source and projects light beamlets on the plasmonic lenses.

Abstract: A chip structure including a chip and a redistribution layer is provided. The chip includes a plurality of pads. The redistribution layer includes a dielectric layer and a plurality of conductive traces. The dielectric layer is disposed on the chip and has a plurality of contact windows located above the pads. The conductive traces are located on the dielectric layer and are electrically coupled to the pads through the contact windows. At least one of the conductive traces includes a body and at least one protrusion coupled to the body, and the at least one protrusion is coupled to an area of the body other than where the contact windows are coupled to on the body.

Abstract: A chip structure including a chip and a redistribution layer is provided. The chip includes a plurality of pads. The redistribution layer includes a dielectric layer and a plurality of conductive traces. The dielectric layer is disposed on the chip and has a plurality of contact windows located above the pads. The conductive traces are located on the dielectric layer and are electrically coupled to the pads through the contact windows. At least one of the conductive traces includes a body and at least one protrusion coupled to the body, and the at least one protrusion is coupled to an area of the body other than where the contact windows are coupled to on the body.

Abstract: A system for generating an electron beam array, comprising a light source, a first substrate having a plurality of plasmonic lenses mounted thereon, the plasmonic lenses configured to received light from the light source and produce an electron emission, and a plurality of electrostatic microlenses configured to focus the electron emissions into a beam for focusing on a wafer substrate. A light source modulator and digital micro mirror may be included which captures light from the light source and projects light beamlets on the plasmonic lenses.

Abstract: The present invention relates to a highly-simulated horseback riding machine, comprising supporting horse feet, a horse head, a horse hide, and a saddle. A movement mechanism is disposed within the horse hide, which comprises a base, a motor, a crank, a connecting rod, and a swing arm. Two ends of the connecting rod are hinged to the crank and the swing arm, respectively. The sum of length of the crank and the length the swing arm is less than the length of the connecting rod, and the length of the crank is less than that of the swing arm; the lower end of the swing arm is fixed to the base, and the fixed position of the lower end of the swing arm is higher than the position of the highest point of the crank in the process of rotation; the saddle is fixed to the connecting rod by means of a vertical rod; and the base is supported by the horse feet. The horse feet are in a double-splayed form so as to ensure that the horseback riding machine may not bounce unexpectedly in motion.

Abstract: The present invention relates to a highly-simulated horseback riding machine, comprising supporting horse feet, a horse head, a horse hide, and a saddle. A movement mechanism is disposed within the horse hide, which comprises a base, a motor, a crank, a connecting rod, and a swing arm. Two ends of the connecting rod are hinged to the crank and the swing arm, respectively. The sum of length of the crank and the length the swing arm is less than the length of the connecting rod, and the length of the crank is less than that of the swing arm; the lower end of the swing arm is fixed to the base, and the fixed position of the lower end of the swing arm is higher than the position of the highest point of the crank in the process of rotation; the saddle is fixed to the connecting rod by means of a vertical rod; and the base is supported by the horse feet. The horse feet are in a double-splayed form so as to ensure that the horseback riding machine may not bounce unexpectedly in motion.

Abstract: A rapidly printing 3D nanostructures arrangement, comprising a first photonic source configured to provide photoinitiation energy to a polymer medium via a dynamic light spatial modulator to an excited state to initiate polymerization, a second photonic source configured to selectively provide inhibition energy to the polymerized medium to a depleted state to inhibit polymerization thereby generating a dead zone below a growth zone, the dead zone allows continuous 3D polymerization.

Abstract: A supporting base includes a bottom plate and a plurality of stepwise supporting structures connected with and raised up from a plurality of side edges of the bottom plate. Each stepwise supporting structure includes a plurality of raising segments and at least one supporting segment. The plurality of raising segments and the at least one supporting segment are alternately arranged. The at least one supporting segment is substantially parallel to the bottom plate. The lowest raising segment has a bottom end connected with one of the side edges of the bottom plate. A thickness of at least one of the at least one supporting segment is greater than that of at least one of the plurality of raising segments. A display device using the support base is also provided to improve assembling efficiency and reduce cost.

Abstract: The present disclosure provides a suspension of a solid catalyst component used in propylene polymerization and a method for preparing the same. The suspension includes the solid catalyst component and a liquid medium containing propylene and an alkane, and is preferably prepared by mixing the solid catalyst component and the alkane to obtain a mixed slurry, which is further mixed with liquid propylene. Using of a proper liquid dispersing agent at a proper proportion and amount enables the solid catalyst component to be more homogeneously dispersed, thus preventing the phenomenon of agglomeration in the polymerization process without using a large amount of the dispersing agent or any additional mixer. The present disclosure further provides a method of propylene polymerization, including feeding the suspension into a reaction system of propylene polymerization, wherein propylene polymerization is initiated under polymerization conditions.