Patents by Inventor Liang Pan

Liang Pan has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20190371619
    Abstract: An ashing process and device forms radicals of an ashing gas through a secondary reaction. A plasma is generated from a first gas, which is diffused through a first gas distribution plate (GDP). The plasma is diffused through a second GDP and a second gas is supplied below the second GDP. The first gas reacts with the second gas to energize the second gas. The energized second gas is used in ashing a resist layer from a substrate.
    Type: Application
    Filed: May 30, 2018
    Publication date: December 5, 2019
    Inventors: Jack Kuo-Ping Kuo, Sheng-Liang Pan, Chia-Yang Hung, Jyu-Horng Shieh, Shu-Huei Suen, Syun-Ming Jang
  • Publication number: 20190360759
    Abstract: Permeable membrane microchannel heat sinks and methods of producing such a heat sink, wherein such a heat sink includes a base and at least first and second microchannels defined by at least one porous and permeable membrane that is on the base and defines primary heat exchange surfaces of the heat sink. The membrane has opposing faces exposed to the first and second microchannels, and a fluid flowing through the heat sink flows from the first microchannel to the second microchannel through pores in the membrane.
    Type: Application
    Filed: May 24, 2019
    Publication date: November 28, 2019
    Inventors: Ivel Lee Collins, Justin A. Weibel, Liang Pan, Suresh V. Garimella
  • Publication number: 20190267211
    Abstract: Embodiments described herein relate to plasma processes. A tool includes a pedestal. The pedestal is configured to support a semiconductor substrate. The tool includes a bias source. The bias source is electrically coupled to the pedestal. The bias source is operable to bias the pedestal with a direct current (DC) voltage. The tool includes a plasma generator. The plasma generator is operable to generate a plasma remote from the pedestal. A method for semiconductor processing includes performing a plasma process on a substrate in a tool. The plasma process includes flowing a gas into the tool. The plasma process includes biasing a pedestal that supports the substrate in the tool. The plasma process includes igniting a plasma in the tool using the gas.
    Type: Application
    Filed: November 1, 2018
    Publication date: August 29, 2019
    Inventors: Sheng-Liang Pan, Bing-Hung Chen, Chia-Yang Hung, Jyu-Horng Shieh, Shu-Huei Suen, Syun-Ming Jang, Jack Kuo-Ping Kuo
  • Publication number: 20190205303
    Abstract: Embodiments of the disclosure provide a method for processing data in a database, an apparatus, and a non-transitory computer readable medium. The method can include: receiving, from a user, a first operating instruction for selecting at least one data label of a plurality of generated data labels; determining a query statement and a data range based on the at least one data label; and generating a data query instruction according to the query statement and the data range.
    Type: Application
    Filed: December 27, 2018
    Publication date: July 4, 2019
    Inventors: Qicheng WANG, Liang PAN, Jingfang ZHENG
  • Patent number: 10276545
    Abstract: A semiconductor package including a chip stack, at least one conductive wire, a first insulating encapsulant, a second insulating encapsulant, and a redistribution layer is provided, and a manufacturing method thereof is also provided. The chip stack includes semiconductor chips stacked on top of each other. Each semiconductor chip has an active surface that has at least one bonding region, and each bonding region is exposed by the chip stack. The conductive wire is correspondingly disposed on the bonding region. The first insulating encapsulant encapsulates the bonding region and the conductive wire. At least a portion of each conductive wire is exposed from the first insulating encapsulant. The second insulating encapsulant encapsulates the chip stack and the first insulating encapsulant. The first insulating encapsulant is exposed from the second insulating encapsulant. The redistribution layer is disposed on the first and second insulating encapsulant and electrically coupled to the conductive wire.
    Type: Grant
    Filed: March 27, 2018
    Date of Patent: April 30, 2019
    Assignee: Powertech Technology Inc.
    Inventors: Kun-Yung Huang, Chi-Liang Pan, Jing-Hua Cheng, Bin-Hui Tseng
  • Publication number: 20190019648
    Abstract: A system for generating an electron beam array, comprising a light source, a first substrate having a plurality of plasmonic lenses mounted thereon, the plasmonic lenses configured to received light from the light source and produce an electron emission, and a plurality of electrostatic microlenses configured to focus the electron emissions into a beam for focusing on a wafer substrate. A light source modulator and digital micro mirror may be included which captures light from the light source and projects light beamlets on the plasmonic lenses.
    Type: Application
    Filed: September 11, 2018
    Publication date: January 17, 2019
    Applicant: Purdue Research Foundation
    Inventors: Liang Pan, Xianfan Xu
  • Patent number: 10177077
    Abstract: A chip structure including a chip and a redistribution layer is provided. The chip includes a plurality of pads. The redistribution layer includes a dielectric layer and a plurality of conductive traces. The dielectric layer is disposed on the chip and has a plurality of contact windows located above the pads. The conductive traces are located on the dielectric layer and are electrically coupled to the pads through the contact windows. At least one of the conductive traces includes a body and at least one protrusion coupled to the body, and the at least one protrusion is coupled to an area of the body other than where the contact windows are coupled to on the body.
    Type: Grant
    Filed: August 8, 2017
    Date of Patent: January 8, 2019
    Assignee: Powertech Technology Inc.
    Inventors: Chi-Liang Pan, Ting-Feng Su
  • Publication number: 20180301396
    Abstract: A chip structure including a chip and a redistribution layer is provided. The chip includes a plurality of pads. The redistribution layer includes a dielectric layer and a plurality of conductive traces. The dielectric layer is disposed on the chip and has a plurality of contact windows located above the pads. The conductive traces are located on the dielectric layer and are electrically coupled to the pads through the contact windows. At least one of the conductive traces includes a body and at least one protrusion coupled to the body, and the at least one protrusion is coupled to an area of the body other than where the contact windows are coupled to on the body.
    Type: Application
    Filed: August 8, 2017
    Publication date: October 18, 2018
    Applicant: Powertech Technology Inc.
    Inventors: Chi-Liang Pan, Ting-Feng Su
  • Patent number: 10074509
    Abstract: A system for generating an electron beam array, comprising a light source, a first substrate having a plurality of plasmonic lenses mounted thereon, the plasmonic lenses configured to received light from the light source and produce an electron emission, and a plurality of electrostatic microlenses configured to focus the electron emissions into a beam for focusing on a wafer substrate. A light source modulator and digital micro mirror may be included which captures light from the light source and projects light beamlets on the plasmonic lenses.
    Type: Grant
    Filed: June 7, 2016
    Date of Patent: September 11, 2018
    Assignee: PURDUE RESEARCH FOUNDATION
    Inventors: Liang Pan, Xianfan Xu
  • Patent number: 10046221
    Abstract: The present invention relates to a highly-simulated horseback riding machine, comprising supporting horse feet, a horse head, a horse hide, and a saddle. A movement mechanism is disposed within the horse hide, which comprises a base, a motor, a crank, a connecting rod, and a swing arm. Two ends of the connecting rod are hinged to the crank and the swing arm, respectively. The sum of length of the crank and the length the swing arm is less than the length of the connecting rod, and the length of the crank is less than that of the swing arm; the lower end of the swing arm is fixed to the base, and the fixed position of the lower end of the swing arm is higher than the position of the highest point of the crank in the process of rotation; the saddle is fixed to the connecting rod by means of a vertical rod; and the base is supported by the horse feet. The horse feet are in a double-splayed form so as to ensure that the horseback riding machine may not bounce unexpectedly in motion.
    Type: Grant
    Filed: August 3, 2017
    Date of Patent: August 14, 2018
    Assignee: Wuhan Bailih Sports Equipment Co., Ltd.
    Inventors: Changqing Ye, Liang Pan, Jiasheng Le
  • Publication number: 20180050252
    Abstract: The present invention relates to a highly-simulated horseback riding machine, comprising supporting horse feet, a horse head, a horse hide, and a saddle. A movement mechanism is disposed within the horse hide, which comprises a base, a motor, a crank, a connecting rod, and a swing arm. Two ends of the connecting rod are hinged to the crank and the swing arm, respectively. The sum of length of the crank and the length the swing arm is less than the length of the connecting rod, and the length of the crank is less than that of the swing arm; the lower end of the swing arm is fixed to the base, and the fixed position of the lower end of the swing arm is higher than the position of the highest point of the crank in the process of rotation; the saddle is fixed to the connecting rod by means of a vertical rod; and the base is supported by the horse feet. The horse feet are in a double-splayed form so as to ensure that the horseback riding machine may not bounce unexpectedly in motion.
    Type: Application
    Filed: August 3, 2017
    Publication date: February 22, 2018
    Inventors: Changqing YE, Liang PAN, Jiasheng LE
  • Publication number: 20180015661
    Abstract: A rapidly printing 3D nanostructures arrangement, comprising a first photonic source configured to provide photoinitiation energy to a polymer medium via a dynamic light spatial modulator to an excited state to initiate polymerization, a second photonic source configured to selectively provide inhibition energy to the polymerized medium to a depleted state to inhibit polymerization thereby generating a dead zone below a growth zone, the dead zone allows continuous 3D polymerization.
    Type: Application
    Filed: July 17, 2017
    Publication date: January 18, 2018
    Inventors: Xianfan Xu, Bryan William Boudouris, Liang Pan
  • Patent number: 9753316
    Abstract: A supporting base includes a bottom plate and a plurality of stepwise supporting structures connected with and raised up from a plurality of side edges of the bottom plate. Each stepwise supporting structure includes a plurality of raising segments and at least one supporting segment. The plurality of raising segments and the at least one supporting segment are alternately arranged. The at least one supporting segment is substantially parallel to the bottom plate. The lowest raising segment has a bottom end connected with one of the side edges of the bottom plate. A thickness of at least one of the at least one supporting segment is greater than that of at least one of the plurality of raising segments. A display device using the support base is also provided to improve assembling efficiency and reduce cost.
    Type: Grant
    Filed: October 27, 2015
    Date of Patent: September 5, 2017
    Assignee: AU OPTRONICS CORP.
    Inventors: Nan-Jui Chen, Yun-Wei Tsai, Wen-Hung Huang, Chih-Liang Pan, Ming-Sheng Lai
  • Patent number: 9593185
    Abstract: The present disclosure provides a suspension of a solid catalyst component used in propylene polymerization and a method for preparing the same. The suspension includes the solid catalyst component and a liquid medium containing propylene and an alkane, and is preferably prepared by mixing the solid catalyst component and the alkane to obtain a mixed slurry, which is further mixed with liquid propylene. Using of a proper liquid dispersing agent at a proper proportion and amount enables the solid catalyst component to be more homogeneously dispersed, thus preventing the phenomenon of agglomeration in the polymerization process without using a large amount of the dispersing agent or any additional mixer. The present disclosure further provides a method of propylene polymerization, including feeding the suspension into a reaction system of propylene polymerization, wherein propylene polymerization is initiated under polymerization conditions.
    Type: Grant
    Filed: December 5, 2014
    Date of Patent: March 14, 2017
    Assignees: China Petroleum & Chemical Corporation, Sinopec Catalyst Co., Ltd., Beijing Research Institute Of Chemical Industry, China Petroleum & Chemical Corporation
    Inventors: Jinlai Qin, Haixiang Cui, Xiaodong Wang, Mingzhi Gao, Cuiling Xiao, Yanju Sun, Liang Pan, Xin Chen, Ziqiang Wang
  • Publication number: 20160358743
    Abstract: A system for generating an electron beam array, comprising a light source, a first substrate having a plurality of plasmonic lenses mounted thereon, the plasmonic lenses configured to received light from the light source and produce an electron emission, and a plurality of electrostatic microlenses configured to focus the electron emissions into a beam for focusing on a wafer substrate. A light source modulator and digital micro mirror may be included which captures light from the light source and projects light beamlets on the plasmonic lenses.
    Type: Application
    Filed: June 7, 2016
    Publication date: December 8, 2016
    Applicant: Purdue Research Foundation
    Inventors: Liang Pan, Xianfan Xu
  • Patent number: 9341762
    Abstract: A reflective back cover made of plastic material having micro cellular structures is processed by compression molding and cutting so as to have a monolithical structure. The white material of the reflective back cover reflects lights such that the back cover can be an integral component featuring multiple functions of various components. With the thickness control of the reflective back cover, a concave can be formed at the side of the back cover where a light source is contained and the concave further retains the light source and its flexible printed circuit board. With the incorporation of the reflective back cover, the thickness of the backlight module can be reduced and a reliable and repetitive manufacturing of the backlight module can be introduced.
    Type: Grant
    Filed: July 18, 2014
    Date of Patent: May 17, 2016
    Assignee: AU Optronics Corp.
    Inventors: Yu-Yu Chen, Chih-Liang Pan, Yen-Po Yeh
  • Publication number: 20160109989
    Abstract: A display device includes a display panel, an electromagnetic touch panel, and a backlight module overlapping one another. The backlight module has a light guide plate and a light source module consisting of a flexible circuit board strip. The flexible circuit board strip includes a light source section and a signal transmission section extending along a light entrance edge and a side edge adjacent to the light entrance edge of the light guide plate, respectively. Two ends of a connection section are connected to the light source section and the signal transmission section, respectively. The connection section includes at least one first fold making the light source disposing plane of the light source section and the wiring disposing plane of the signal transmission section be non-coplanar and also makes the wiring disposing plane be parallel to the plane of the side edge of the light guide plate.
    Type: Application
    Filed: December 28, 2015
    Publication date: April 21, 2016
    Inventors: Yen-Po Yeh, Jeng-Bin Hsu, Chih-Liang Pan, Yu-Hsiu Chang
  • Publication number: 20160048051
    Abstract: A supporting base includes a bottom plate and a plurality of stepwise supporting structures connected with and raised up from a plurality of side edges of the bottom plate. Each stepwise supporting structure includes a plurality of raising segments and at least one supporting segment. The plurality of raising segments and the at least one supporting segment are alternately arranged. The at least one supporting segment is substantially parallel to the bottom plate. The lowest raising segment has a bottom end connected with one of the side edges of the bottom plate. A thickness of at least one of the at least one supporting segment is greater than that of at least one of the plurality of raising segments. A display device using the support base is also provided to improve assembling efficiency and reduce cost.
    Type: Application
    Filed: October 27, 2015
    Publication date: February 18, 2016
    Inventors: Nan-Jui CHEN, Yun-Wei TSAI, Wen-Hung HUANG, Chih-Liang PAN, Ming-Sheng LAI
  • Patent number: 9256338
    Abstract: A display device includes a display panel, an electromagnetic touch panel, and a backlight module overlapping one another. The backlight module has a light guide plate and a light source module consisting of a flexible circuit board strip. The flexible circuit board strip includes a light source section and a signal transmission section extending along a light entrance edge and a side edge adjacent to the light entrance edge of the light guide plate, respectively. Two ends of a connection section are connected to the light source section and the signal transmission section, respectively. The connection section includes at least one first fold making the light source disposing plane of the light source section and the wiring disposing plane of the signal transmission section be non-coplanar and also makes the wiring disposing plane be parallel to the plane of the side edge of the light guide plate.
    Type: Grant
    Filed: August 10, 2010
    Date of Patent: February 9, 2016
    Assignee: AU OPTRONICS CORPORATION
    Inventors: Yen-Po Yeh, Jeng-Bin Hsu, Chih-Liang Pan, Yu-Hsiu Chang
  • Patent number: D828819
    Type: Grant
    Filed: August 17, 2016
    Date of Patent: September 18, 2018
    Assignee: Huawei Technologies Co., Ltd.
    Inventors: Shuang Li, Liang Pan, Yang Zhang