Patents by Inventor Liang Wei
Liang Wei has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
-
Publication number: 20250108541Abstract: A method of manufacturing an article include: providing a molding device, wherein the molding device includes a first mold, a second mold, the first mold includes a supporting member protruded from a inner wall; cooling a core to reduce a temperature of the core from a first temperature to a second temperature; disposing the core on the supporting member; engaging the second mold with the first mold to form a mold cavity defined by the first mold and the second mold, wherein the core having the second temperature is disposed within the mold cavity; injecting a first material into the mold cavity; and foaming the first material to form a first foamed member. At least a portion of the first foamed member is in contact with the core, and the first temperature is substantially higher than the second temperature. The core includes a hollow space enclosed by a layer.Type: ApplicationFiled: December 13, 2024Publication date: April 3, 2025Inventors: CHING-HAO CHEN, LIANG-HUI YEH, TING-WEI CHEN
-
Publication number: 20250108134Abstract: Provided are methods of treating a disease or condition by administering a circular RNA (circRNA) encoding a therapeutic polypeptide (e.g., an antigenic polypeptide, a functional protein, a receptor protein, or a targeting protein (e.g., antibody)), wherein the circRNA is naked; and pharmaceutical composition(s) comprising the circRNA(s) as disclosed herein.Type: ApplicationFiled: January 28, 2023Publication date: April 3, 2025Inventors: Wensheng WEI, Yong SHEN, Liang QU, Feng CHEN, Zongyi YI
-
Patent number: 12267970Abstract: A thermal dissipation holder for a handheld electronic device is provided. The thermal dissipation holder includes a main structure, a movable element, an elastic element, and a locker. The main structure has a front surface and a rear surface. The movable element is movably connected to the main structure along a first direction and has a clamp portion at a side away from the carrier. One end of the elastic element is connected to the main structure. The other end of the elastic element is connected to the movable element. The elastic element drives the movable element to move along the first direction. The locker is disposed in the main structure and has a locking portion, where a position of the locking portion corresponds to that of the clamp portion, and the locker is selectively engaged with the clamp portion through the locking portion to lock the movable element.Type: GrantFiled: January 13, 2023Date of Patent: April 1, 2025Assignee: ASUSTEK COMPUTER INC.Inventors: Jhih-Wei Rao, Zih-Siang Huang, Hung-Chieh Wu, Liang-Jen Lin
-
Publication number: 20250099074Abstract: A medical apparatus comprises: an operating console, a limiting mechanism, and a manual release mechanism. The limiting mechanism releases the limitation on movement of the operating console in a case where a pressing force is applied to the manual release mechanism. The manual release mechanism comprises: a handle, a conversion portion, and a base portion. The handle is provided with a first guide portion. The base portion is provided with a second guide portion that cooperates with the first guide portion. The handle moves linearly in a direction substantially perpendicular to the base portion under guidance of the first guide portion and the second guide portion in a case where the pressing force is applied to the handle. Thus, a smooth linear motion of the handle can be ensured to provide a good feeling of operation, helping to improve the user experience.Type: ApplicationFiled: September 16, 2024Publication date: March 27, 2025Inventors: Yalan Yang, Mingze Yang, Fenggui Huang, Jie Wang, Fangyu Huang, Liang Wei
-
Publication number: 20250094133Abstract: Various embodiments of the teachings herein include a device control method. An example includes: receiving a first workflow generated by an OT domain low code development tool; generating a micro-service corresponding to the first workflow used for defining an operation to be performed by one working unit in the OT domain; receiving a parameter value of the micro-service configured by an IT domain code development platform; and generating a second workflow based at least in part on the parameter value of the micro-service configured by the IT domain code development platform, so each OT device connected to the working unit performs an operation according to the second workflow.Type: ApplicationFiled: January 29, 2022Publication date: March 20, 2025Applicant: Siemens AktiengesellschaftInventors: Zhen Hua Zhou, Chang Wei Weng, Xiaoxun Zhu, Liang Liao
-
Patent number: 12252555Abstract: A selenium-chelating pea oligopeptide, a preparation method thereof and use thereof. After the selenium-chelating pea oligopeptide is subjected to digestion treatment in at least one of following three ways, a change rate of selenium content not more than 3% with respect to the selenium content before the digestion treatment: hydrolyzing for 4 hours by a pepsin at a pH value of 2 and a temperature of 37° C.; hydrolyzing for 6 hours by a trypsin at a pH value of 7.5 and a temperature of 37° C.; maintaining the temperature constant at 37° C., firstly hydrolyzing for 4 hours by the pepsin at a pH value of 2, and then continuing to hydrolyze for 6 hours by a trypsin at a pH value of 6.8. The preparation method thereof includes mixing and reacting an aqueous solution of pea oligopeptide and sodium selenite, and then being subjected to alcohol precipitation and drying.Type: GrantFiled: April 9, 2021Date of Patent: March 18, 2025Assignee: CHINA NATIONAL RESEARCH INSTITUTE OF FOOD & FERMENTATION INDUSTRIES CO., LTD.Inventors: Muyi Cai, Ruizeng Gu, Jun Lu, Wenying Liu, Xiuyuan Qin, Xingchang Pan, Zhe Dong, Yong Ma, Yaguang Xu, Yongqing Ma, Liang Chen, Lu Lu, Haixin Zhang, Ying Wei, Yan Liu, Kelu Cao, Jing Wang, Guoming Li, Ming Zhou, Yuchen Wang, Yuqing Wang, Kong Ling, Yuan Bi, Xinyue Cui
-
Publication number: 20250082746Abstract: Provided are circular RNAs (circRNAs) encoding an antigenic polypeptide of a SARS-CoV-2 variant. Provided are circRNA vaccines against a SARS-CoV-2 variant, such as a Delta or Omicron variant. The circRNA vaccine comprises a circRNA comprising a nucleic acid sequence encoding an antigenic polypeptide comprising a Spike(S) protein or a fragment thereof of a SRAS-CoV-2 variant. Also provided are methods of treating or preventing a SARS-CoV-2 infection using the circRNAs or compositions thereof.Type: ApplicationFiled: January 9, 2023Publication date: March 13, 2025Applicant: Peking UniversityInventors: Wensheng WEI, Liang QU, Zongyi YI, Yong SHEN, Liangru LIN, Feng CHEN
-
Publication number: 20250087639Abstract: A method includes forming first integrated circuits on a front side of a semiconductor substrate of a first device die, forming a trench capacitor extending from a backside of the semiconductor substrate into the semiconductor substrate, and forming a first through-via and a second through-via penetrating through the semiconductor substrate. The trench capacitor is electrically coupled between the first through-via and the second through-via. A second device die is bonded to the first die. The second device die includes second integrated circuits, and power nodes of the second integrated circuits are electrically coupled to the first through-via and the second through-via.Type: ApplicationFiled: January 2, 2024Publication date: March 13, 2025Inventors: Ke-Gang Wen, Yu-Bey Wu, Tsung-Chieh Hsiao, Liang-Wei Wang, Dian-Hau Chen
-
Publication number: 20250079339Abstract: Semiconductor devices having dummy regions with dummy fill structures that vary in lateral dimensions and methods for forming the semiconductor devices are provided herein. The semiconductor devices may include a through silicon via extending through a substrate of the semiconductor device, an active device in or on the substrate, and a dummy region of the substrate separating the through silicon via and the active device, the dummy region including dummy fill structures, wherein the dummy fill structures have lateral dimensions measured in a first direction from the through silicon via to the active device, wherein the lateral dimensions of the dummy fill structures varying in the first direction.Type: ApplicationFiled: August 28, 2023Publication date: March 6, 2025Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.Inventors: Mao-Nan Wang, Chih Hsin Yang, Liang-Wei Wang, Dian-Hau Chen
-
Publication number: 20250070064Abstract: An embodiment is a device including a first die and a substrate including a first surface and a second surface opposite the first surface. The device also includes an active device on the first surface of the substrate. The device also includes a first interconnect structure on the first surface of the substrate. The device also includes a through substrate via extending through the first interconnect structure and the substrate to the second surface of the substrate, the through substrate via being electrically coupled to metallization patterns in the first interconnect structure. The device also includes one or more material-filled trench structures extending from the second surface of the substrate into the substrate, the one or more material-filled trench structures being electrically isolated from the through substrate via.Type: ApplicationFiled: January 3, 2024Publication date: February 27, 2025Inventors: Ke-Gang Wen, Yu-Bey Wu, Liang-Wei Wang, Hsin-Feng Chen, Tsung-Chieh Hsiao, Chih Chuan Su, Dian-Hau Chen
-
Publication number: 20250070052Abstract: A method includes forming first nanostructures over a first region of a substrate; forming second nanostructures over a second region of the substrate; forming first gate structures around the first nanostructures; replacing the second nanostructures with isolation regions; and forming a seal ring over the substrate, wherein the seal ring is between the first region and the second region.Type: ApplicationFiled: October 24, 2023Publication date: February 27, 2025Inventors: Ke-Gang Wen, Chih Hsin Yang, Kuan-Hsun Wang, Tsung-Chieh Hsiao, Liang-Wei Wang, Dian-Hau Chen
-
Publication number: 20250051816Abstract: The present application provides methods for producing circular RNAs (circRNAs) from a DNA construct encoding a linear RNA precursor, wherein the linear RNA precursor comprises from the 5?-end to the 3? end: a 3? catalytic Group I intron fragment, a 3? exon sequence, an effector RNA sequence, a 5? exon sequence, and a 5? catalytic Group I intron fragment, wherein the method comprises an in vitro single-pot reaction. In some embodiments, the single-pot reaction does not comprise supplementing the reagent composition with GTP, a divalent metal ion such as Mg2+, or DNase I prior to circularization of a linear RNA precursor.Type: ApplicationFiled: March 22, 2022Publication date: February 13, 2025Inventors: Wensheng WEI, Liang QU, Zongyi YI, Yong SHEN
-
Publication number: 20250049316Abstract: An optical biometer includes a light-source module, a light-splitting module, a reference-arm, a sensing-arm and a sensing module. The light-source module emits incident-light. The light-splitting module, disposed corresponding to light-source module, divides the incident-light into reference light and sensing light. The reference-arm, disposed corresponding to light-splitting module, generates a first reflected-light according to the reference light. The sensing-arm, disposed corresponding to the light-splitting module, emits the sensing light to the eye and receives a second reflected-light from the eye. The sensing module generates a sensing result according to the first reflected-light and second reflected-light. In a first mode, the sensing light is emitted to a first position of the eye. In a second mode, the sensing light is emitted to a second position of the eye.Type: ApplicationFiled: August 2, 2024Publication date: February 13, 2025Inventors: Yen-Jen CHANG, Tung-Yu LEE, Chun-Nan LIN, Che-Liang TSAI, Sung-Yang WEI, Hsuan-Hao CHAO, William WANG, Ching Hung LIN
-
Publication number: 20250052126Abstract: An integrated plugging and perforating operation system is provided, including an operation truck, a wellhead equipment pry, and a centralized control room. A mechanical mechanism and a power mechanism are arranged on a chassis of the operation truck. The mechanical mechanism includes a turntable assembly, where a telescopic arm assembly is installed on the turntable assembly, a mechanical arm assembly for logging operation is installed at an operating end of the telescopic arm assembly, and a logging winch assembly and a follow-up winch assembly are arranged at a counterweight end of the telescopic arm assembly to form a counter weight of the telescopic arm assembly. The power mechanism is configured for providing power output to the mechanical mechanism.Type: ApplicationFiled: April 19, 2024Publication date: February 13, 2025Inventors: Jianbo LI, Ziqiang KANG, Jianfeng YAO, Xijun JIANG, Dawei ZHANG, Liang BAI, Teng LI, Haiquan LI, Enfeng YANG, Yaliang HU, Lin QI, Yonggang LV, Zhen YUAN, Qiujuan ZHANG, Rui MAO, Bingwen WEI
-
Publication number: 20250049319Abstract: An optical detection system integrating tonometer and autorefractor includes first and second optical modules. The first optical module includes a light source, first and second lens sets, a reflector, a first light-splitter and a sensor. The first lens set and reflector are disposed corresponding to light source. The first light-splitter is disposed corresponding to the reflector, second lens set and sensor. The second optical module includes a second light-splitter and first to third optical elements. The incident light emitted by the light source passes through the first lens, reflected by the reflector, passes through the first light-splitter, reflected by the second light-splitter, passes through the first to third optical elements and emitted to an eye. A sensing light from the eye passes through the third to first optical elements, reflected by the second light-splitter and first light-splitter, passes through the second lens set and emitted to the sensor.Type: ApplicationFiled: August 5, 2024Publication date: February 13, 2025Inventors: Che-Liang TSAI, Yen-Jen CHANG, Chung-Ping CHUANG, Tung-Yu LEE, Sung-Yang WEI, William WANG
-
Publication number: 20250056781Abstract: A layout pattern of static random-access memory (SRAM) includes a substrate, a plurality of diffusion regions and a plurality of gate structures are located on the substrate, each diffusion region includes a first diffusion region, a second diffusion region, a third diffusion region, a fourth diffusion region, a fifth diffusion region, a sixth diffusion region, a seventh diffusion region and an eighth diffusion region, and each gate structure spans the plurality of diffusion regions. The plurality of gate structures include a first gate structure, the first gate structure includes a first L-shaped portion, which spans the first diffusion region and the fifth diffusion region and forms a first pull-down transistor (PD1), the first diffusion region is adjacent to and in direct contact with the fifth diffusion region.Type: ApplicationFiled: September 13, 2023Publication date: February 13, 2025Applicant: UNITED MICROELECTRONICS CORP.Inventors: Po-Lin Chen, Tsung-Hsun Wu, Liang-Wei Chiu, Yao-Chin Cheng
-
Publication number: 20250052135Abstract: A wellhead automatic positioning method and a system of a plugging and perforating operation machine are provided. The method includes: determining a wellhead position, and acquiring standard positioning parameters of a boom according to the wellhead position and a tool string length, where the positioning parameters include a standard extension length L of the boom, a standard lifting length J, and an included angle ? between a projection of the boom and a wellhead; acquiring actual positioning parameters of the boom, where the actual positioning parameters include an actual length L? of the boom, an actual lifting length J?, and an initial angle ?? between the projection of the boom and the wellhead; and according to the standard positioning parameters and the actual positioning parameters of the boom, making the boom to extend and retract, lift and lower, and rotate to complete automatic positioning of the wellhead.Type: ApplicationFiled: April 19, 2024Publication date: February 13, 2025Inventors: Jianbo LI, Liang BAI, Dawei ZHANG, Jianfeng YAO, Ziqiang KANG, Xijun JIANG, Enfeng YANG, Rui MAO, Bingwen WEI
-
Patent number: 12222576Abstract: An optical element driving mechanism includes a movable assembly, a fixed assembly, and a driving assembly. The movable assembly is configured to be connected to an optical element. The movable assembly is movable relative to the fixed assembly. The driving assembly is configured to drive the movable assembly to move relative to the fixed assembly in a range of motion. The optical element driving mechanism further includes a positioning assembly configured to position the movable assembly at a predetermined position relative to the fixed assembly when the driving assembly is not operating.Type: GrantFiled: November 9, 2023Date of Patent: February 11, 2025Assignee: TDK TAIWAN CORP.Inventors: Chao-Chang Hu, Kuen-Wang Tsai, Liang-Ting Ho, Chao-Hsi Wang, Chih-Wei Weng, He-Ling Chang, Che-Wei Chang, Sheng-Zong Chen, Ko-Lun Chao, Min-Hsiu Tsai, Shu-Shan Chen, Jungsuck Ryoo, Mao-Kuo Hsu, Guan-Yu Su
-
Patent number: 12224179Abstract: The current disclosure describes techniques of protecting a metal interconnect structure from being damaged by subsequent chemical mechanical polishing processes used for forming other metal structures over the metal interconnect structure. The metal interconnect structure is receded to form a recess between the metal interconnect structure and the surrounding dielectric layer. A metal cap structure is formed within the recess. An upper portion of the dielectric layer is strained to include a tensile stress which expands the dielectric layer against the metal cap structure to reduce or eliminate a gap in the interface between the metal cap structure and the dielectric layer.Type: GrantFiled: March 15, 2023Date of Patent: February 11, 2025Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.Inventors: Yi-Sheng Lin, Chi-Jen Liu, Chi-Hsiang Shen, Te-Ming Kung, Chun-Wei Hsu, Chia-Wei Ho, Yang-Chun Cheng, William Weilun Hong, Liang-Guang Chen, Kei-Wei Chen
-
Patent number: D1065121Type: GrantFiled: June 28, 2021Date of Patent: March 4, 2025Assignee: HONOR DEVICE CO., LTD.Inventors: Bin Xie, Hungyi Huang, Liang Ma, Qian Wang, Junxuan Chen, Qichong Wei, Jian Xu, Guoping Wu