Abstract: A power system including a first battery pack, a second battery pack, and a power management circuit is disclosed. The first battery pack has a first end and a second end, and has a first battery capacity. The second battery pack has a third end and a fourth end. The third end is coupled to the second end of the first battery pack and provides a low battery voltage. The fourth end is grounded, the second battery pack has a second battery capacity, and the second battery capacity is greater than the first battery capacity. The power management circuit is coupled to the second battery pack to receive the low battery voltage, and provides a component operating voltage to an electronic components based on the low battery voltage.

Abstract: An AI-assisted automatic labeling system and a method thereof are disclosed. The method comprises steps: selecting images from microscopic images as candidate images, using a pre-labeling module to automatically label cells in the candidate images, and dividing the labeled images into training data and verification data; using a training module and the training data to train a basic model; using a verification module to verify and modify the basic model, wherein the verification module respectively verifies at least one cell area and at least one background area of the verification data to converge the basic model and form an automatic labeling model; using the automatic labeling model to automatically label cells in redundant images of the microscopic images. The basic model trained by the present invention can use few labeled images to perform regressive training and verification and then automatically labels the redundant images accurately and efficiently.

Abstract: A via structure, a semiconductor structure, and methods for forming the via structure and the semiconductor structure are presented. A via structure includes a first conductive portion through an interconnect structure, a second conductive portion through a substrate and in contact with the first conductive portion, and a liner layer. The liner layer is between the first conductive portion and the interconnect structure, and between the second conductive portion and the substrate. The liner layer includes a portion extending parallel to a surface of the substrate.

Abstract: Some implementations described herein include systems and techniques for fabricating a multi-dimension through silicon via structure in a three-dimensional integrated circuit device. The multi-dimension through silicon via structure includes a first columnar structure having a first width and a second columnar structure including a second width that is greater relative to the first width. The first columnar structure may include a low electrical capacitance and be configured for electrical signaling within the three-dimensional integrated circuit device. The second columnar structure may be configured to provide power to integrated circuitry of the three-dimensional integrated circuit device and also be configured to conduct heat through the three-dimensional integrated circuit device for thermal management of the three-dimensional integrated circuit device. Additionally, a pattern including the second columnar structure may be used for alignment purposes.

Abstract: A riding mowing device includes a seat used for a user to sit on and including a seat cushion and a backrest; a frame for supporting the seat; a cutting assembly including a cutting deck and a mowing element for mowing grass, where the mowing element is at least partially accommodated in the cutting deck, and the cutting assembly is mounted to the frame; a traveling assembly for driving the riding mowing device to travel; a control circuit board for controlling at least the cutting assembly and the traveling assembly; and a power supply assembly for supplying power to at least the cutting assembly and the traveling assembly. At least part of the control circuit board is disposed between the seat and the power supply assembly.

Abstract: A vibration module is provided, having a main axis passing through the center of the vibration module. The vibration module includes a fixed part and a first vibration part. The first vibration part is disposed within the fixed part. The first vibration part includes a first moving member and a first driving assembly. The first driving assembly drives the first moving member to move along the main axis relative to the fixed part.

Abstract: An integrated circuit (IC) device includes a substrate. The IC device includes a multi-layer interconnect structure disposed over a first side of the substrate. The multi-layer interconnect structure includes a plurality of metal layers. The IC device includes a first portion of a through-substrate via (TSV) disposed over the first side of the substrate. The first portion of the TSV includes a plurality of conductive components belonging to the plurality of metal layers of the multi-layer interconnect structure. The IC device includes a second portion of the TSV that extends vertically through the substrate from the first side to a second side opposite the first side. The second portion of the TSV is electrically coupled to the first portion of the TSV.

Abstract: A button module is provided. The button module comprises a base, a pressing part, and an elastic part. The pressing part includes a fixed end and a free end. The fixed end is pivotally connected to the base in a first axial direction. The elastic part is disposed on a side of the pressing part facing the base. The elastic part includes a first damping portion and a second damping portion selectively pressing against the base, where a hardness of the first damping portion is different from a hardness of the second damping portion.

Abstract: A system for remotely controlling microscopic machinery and a method thereof are provided. The system includes at least one local device and a remote host for sending a control command thereto. A microslide is placed on a microscopic camera device in the local device, and the microscopic camera device captures an image of the microslide according to a capture command in the control command. The local device transmits the image to the remote host in a video format. A motorized stage moves to a next preset position according to a movement command in the control command to capture another image of the microslide. The steps of capturing and transmitting the image and the step of moving are repeated until the microslide is captured completely. The invention can solve the problem of time delay when the image captured by the remote control microscopic camera device is displayed.

Abstract: A graphene heating chip includes a substrate, an insulating layer, a graphene film, and a plurality of electrodes. The substrate has two opposite a first surface and a second surface, and the substrate defines a through hole. The insulating layer is suspended on the substrate. The insulating layer covering the through hole and not in direct contact with the first surface is defined as a window, and a plurality of grooves are formed on the window. The graphene film covers the window, and the graphene film includes a first graphene film portion and a second graphene film portion, and the first graphene film portion and the second graphene film portion are spaced apart from each other. The plurality of electrodes are located on the surface of the insulating layer away from the substrate. The present application also provides a method for making the graphene heating chip.

Abstract: A graphene heating chip includes a substrate, an insulating layer, a graphene film, and a plurality of electrodes. The substrate has two opposite a first surface and a second surface, and the substrate defines a through hole. The insulating layer is suspended on the substrate. The insulating layer covering the through hole and not in direct contact with the first surface is defined as a window, and a plurality of grooves are formed on the window. The graphene film covers the window, and the graphene film includes a first graphene film portion and a second graphene film portion, and the first graphene film portion and the second graphene film portion are spaced apart from each other. The plurality of electrodes are located on the surface of the insulating layer away from the substrate. The present application also provides a method for calibrating a temperature of the graphene heating chip.

Abstract: A semiconductor package includes a first semiconductor device and a second semiconductor device. The first semiconductor device includes a first semiconductor substrate, a first bonding structure and a memory cell. The second semiconductor device is stacked over the first semiconductor device. The second semiconductor device includes a second semiconductor substrate, a second bonding structure in a second dielectric layer and a peripheral circuit between the second semiconductor substrate and the second bonding structure. The first bonding structure and the second bonding structure are bonded and disposed between the memory cell and the peripheral circuit, and the memory cell and the peripheral circuit are electrically connected through the first bonding structure and the second bonding structure.

Abstract: The disclosure provides a mower. The mower includes a vehicle frame, a walking assembly, a working assembly, a seat and a battery pack. The walking assembly includes a first walking wheel assembly and a second walking wheel assembly connected with the vehicle frame. The first walking wheel assembly and/or the second walking wheel assembly includes a main walking wheel and a hub motor, the main walking wheel is connected with the hub motor, and the hub motor is arranged outside a side of the vehicle frame. The working assembly is connected with the vehicle frame. The seat is arranged on the vehicle frame. The battery pack is lowered and mounted on the vehicle frame and extends below the seat.

Abstract: Provided herein are opioid receptor modulators and pharmaceutical compositions comprising said compounds.

Abstract: A duty cycle calibration circuit includes delay, temperature compensation, differential, and phase adjustment units. The delay adjustment unit receives a single-ended input clock signal to be calibrated and an adjustment voltage and outputs a single-ended clock signal adjusted by the adjustment voltage. The temperature compensation adjustment unit determines the adjustment voltage output by the temperature compensation adjustment unit, and provides the adjustment voltage to the delay adjustment unit to eliminate the influence of the temperature on the duty cycle. The differential adjustment unit converts the single-ended clock signal into a differential clock signal, and adjusts delay of the differential clock signal.

Abstract: Semiconductor device and methods of forming the same are provided. A semiconductor device according to one embodiment includes a dielectric layer including a top surface, a plurality of magneto-resistive memory cells disposed in the dielectric layer and including top electrodes, a first etch stop layer disposed over the dielectric layer, a common electrode extending through the first etch stop layer to be in direct contact with the top electrodes, and a second etch stop layer disposed on the first etch stop layer and the common electrode. Top surfaces of the top electrodes are coplanar with the top surface of the dielectric layer.

Abstract: An image sensor device includes a semiconductor substrate, a radiation sensing member, a shallow trench isolation, and a color filter layer. The radiation sensing member is in the semiconductor substrate. An interface between the radiation sensing member and the semiconductor substrate includes a direct band gap material. The shallow trench isolation is in the semiconductor substrate and surrounds the radiation sensing member. The color filter layer covers the radiation sensing member.

Abstract: A method for estimating a trailer wheel position includes identifying a first set of wheel locations in at least a first image. Each of the wheel locations in the first set of wheel locations is associated with a corresponding trailer angle. A subset of wheel locations is identified in the first set of wheel locations as being false positives and the false positives are removed from the first set of wheel locations. A quadratic regression is applied to the first set of wheel locations and a parabola curve is determined relating a y position in the at least the first image to an x position in the at least the first image. A trailer angle is determined. A current wheel location is estimated by applying the determined trailer angle to the parabola curve.

Abstract: A method for detecting a trailer presence includes identifying a region of interest within a video feed from one or more cameras secured to a vehicle. The video feed depicts a scene having a first pixel area, and the region of interest corresponds to a portion of the scene having a second pixel area that is less than the first pixel area. The method also includes determining an optical flow within the region of interest, and determining that a trailer is connected to the vehicle in response to the optical flow within the region of interest matching a predetermined pattern corresponding to a connected trailer. A camera monitoring system for a vehicle is also disclosed.

Abstract: An audio visual haptic signal reconstruction method includes first utilizing a large-scale audio-visual database stored in a central cloud to learn knowledge, and transferring same to an edge node; then combining, by means of the edge node, a received audio-visual signal with knowledge in the central cloud, and fully mining semantic correlation and consistency between modals; and finally fusing the semantic features of the obtained audio and video signals and inputting the semantic features to a haptic generation network, thereby realizing the reconstruction of the haptic signal. The method effectively solves the problems that the number of audio and video signals of a multi-modal dataset is insufficient, and semantic tags cannot be added to all the audio-visual signals in a training dataset by means of manual annotation. Also, the semantic association between heterogeneous data of different modals are better mined, and the heterogeneity gap between modals are eliminated.