Patents by Inventor Liang Wei
Liang Wei has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
-
Publication number: 20250147480Abstract: Various embodiments of the teachings herein include an information processing method. An example method includes: generating a workflow in an OT domain described by using a common information model based on an instruction input by a user, wherein the workflow defines an operation to be performed by a workcell in the OT domain; converting the workflow into a function block program described in a domain specific language; and deploying the function block program described in the domain specific language to runtime of a main controller of the workcell for execution, to control an OT device in the workcell to perform, based on the workflow, the operation.Type: ApplicationFiled: January 29, 2022Publication date: May 8, 2025Applicant: Siemens AktiengesellschaftInventors: Zhen Hua Zhou, Chang Wei Weng, Xiaoxun Zhu, Liang Liao
-
Publication number: 20250143007Abstract: The present disclosure provides a method for preparing a solar cell, a solar cell, and a solar cell module. An example solar cell includes a solar cell body, a first conductive pattern and a second conductive pattern sequentially laminated on the solar cell body, and electrically connected through one of welding, eutectic bonding, a conductive adhesive pattern between the first and the second conductive patterns, or a third conductive pattern between the first and the second conductive patterns. The conductive adhesive pattern comprises a conductive material and an adhesive. The third conductive pattern includes a first part close to the first conductive pattern, a second part close to the second conductive pattern, and a middle part between the first and the second parts. A grain size of the third conductive pattern increases from the first part to the middle part and increases from the second part to the middle part.Type: ApplicationFiled: January 6, 2025Publication date: May 1, 2025Inventors: Chaowei XUE, Chaofeng WEI, Jie LI, Shiyang SUN, Liang FANG, Junzhe WEI, Minghao QU, Xixiang XU
-
Publication number: 20250142799Abstract: The invention provides a layout pattern of static random-access memory (SRAM), which comprises a substrate, wherein a plurality of diffusion regions and a plurality of gate structures are located on the substrate to form a plurality of transistors, wherein the plurality of gate structures comprise a first gate structure, which has a stepped shape when viewed from a top view, and the first gate structure spans a first diffusion region and a second diffusion region to form a first access transistor (PG1), wherein the first diffusion region is adjacent to and in direct contact with the second diffusion region.Type: ApplicationFiled: December 28, 2023Publication date: May 1, 2025Applicant: UNITED MICROELECTRONICS CORP.Inventors: Chun-Yen Tseng, Yu-Tse Kuo, Shu-Ru Wang, Tsung-Hsun Wu, Liang-Wei Chiu, Chun-Hsien Huang
-
Publication number: 20250142067Abstract: Embodiments of the present disclosure relate to the field of video coding and decoding, and provide a picture decoding method, a picture coding method, and corresponding apparatuses. According to an example of the picture decoding method, a quantization parameter (QP) value of at least one pixel point is determined for any at least one pixel point indicating one pixel point or a plurality of parallel dequantized pixel points in the current coding block, the QP values of at least two pixel points among pixel points in the current coding block being different. The at least one pixel point is then dequantized according to the QP value of the at least one pixel point. The QP value of each pixel point is determined for the coding block; therefore, each pixel point can be dequantized according to the QP value of each pixel point.Type: ApplicationFiled: January 17, 2023Publication date: May 1, 2025Inventors: Liang WEI, Fangdong CHEN, Li WANG
-
Publication number: 20250132246Abstract: A semiconductor structure and a method of forming the same are provided. In an embodiment, a method includes receiving a workpiece comprising a first transistor and a second transistor formed over a first side of a substrate, forming a first multi-layer interconnect (MLI) structure over the first side of the substrate, wherein the first MLI structure comprising a first plurality of metal lines and a first plurality of vias, after the forming of the first MLI structure, forming a source/drain contact directly under a source/drain feature of the first transistor, and forming a second MLI structure under the source/drain contact and under a second side of the substrate, the second side being opposite the first side, wherein the MLI structure comprises a second plurality of metal lines and a second via, a thickness of the second via is greater than a thickness of one of the first plurality of vias.Type: ApplicationFiled: October 20, 2023Publication date: April 24, 2025Inventors: Yi Ling Liu, Tsung-Chieh Hsiao, Liang-Wei Wang, Dian-Hau Chen
-
Patent number: 12282328Abstract: Systems and methods for generating attention masks are provided. In particular, a computing system can access sensor data and map data for an area around an autonomous vehicle. The computing system can generate a voxel grid representation of the sensor data and map data. The computing system can generate an attention mask based on the voxel grid representation. The computing system can generate, by using the voxel grid representation and the attention mask as input to a machine-learned model, an attention weighted feature map. The computing system can determine using the attention weighted feature map, a planning cost volume for an area around the autonomous vehicle. The computing system can select a trajectory for the autonomous vehicle based, at least in part, on the planning cost volume.Type: GrantFiled: January 15, 2021Date of Patent: April 22, 2025Assignee: AURORA OPERATIONS, INC.Inventors: Raquel Urtasun, Bob Qingyuan Wei, Mengye Ren, Wenyuan Zeng, Ming Liang, Bin Yang
-
Publication number: 20250118230Abstract: An electronic device is provided and includes a substrate, a first bump, a second bump, and an electronic element. The substrate includes a first through hole and a second through hole disposed adjacent to the first through hole along a direction. The first bump and the second bump are overlapped with the substrate, wherein the first bump is adjacent to the second bump along the direction. The electronic element is overlapped with the substrate and electrically connected to the first bump, wherein the substrate is disposed between the first bump and the electronic element. A distance between the first through hole and the second through hole of the substrate along the direction is different from a distance between the first bump and the second bump along the direction.Type: ApplicationFiled: December 17, 2024Publication date: April 10, 2025Applicant: InnoLux CorporationInventors: Chin-Lung Ting, Chung-Kuang Wei, Li-Wei Mao, Chi-Liang Chang, Chia-Hui Lin
-
Publication number: 20250115617Abstract: The disclosure provides a method of preparing chiral metacyclophanes. The method involves palladium-catalyzed cross-coupling of a meta-substituted aryl group with base and a chiral ligand. The disclosure also provides metacyclophane compounds, which include diaryl and monoaryl macrocycles.Type: ApplicationFiled: September 20, 2024Publication date: April 10, 2025Inventors: Junqi Li, Shengkai Wei, Liang-Yu Chen
-
Publication number: 20250115677Abstract: The present disclosure provides antibody drug conjugates comprising antibodies and antigen-binding fragments thereof that bind to human CEA and a linker-payload, a pharmaceutical composition comprising the anti-CEA antibody drug conjugate, and use of the anti-CEA antibody drug conjugate for treating a CEA-related diseases or disorders.Type: ApplicationFiled: November 7, 2024Publication date: April 10, 2025Applicant: BeiGene Switzerland GmbHInventors: Charng-Sheng TSAI, Mei-Hsuan TSAI, Liang QU, Xiaodong WEI, Zewei WANG, Wei LUO, Maomao HE, Zhuo LI
-
Publication number: 20250116814Abstract: A laser redundancy device includes a plurality of lasers and a PLC that includes a plurality of input waveguides, a plurality of first couplers, a plurality of intermediate waveguides, a plurality of second couplers, and a plurality of output waveguides. Each first coupler includes a plurality of first input arms and a plurality of first output arms. Each second coupler includes a plurality of second input arms and a plurality of second output arms. Each first coupler is connected to: two or more input waveguides via the plurality of first input arms, and the plurality of second couplers via the plurality of first output arms, two or more intermediate waveguides, and respective second input arms of the plurality of second couplers. Each second coupler is connected to two or more output waveguides via the plurality of second output arms.Type: ApplicationFiled: November 30, 2023Publication date: April 10, 2025Inventors: Cailin WEI, Jihua DU, Prasad YALAMANCHILI, Liang ZHAO, Hao XU
-
Publication number: 20250120139Abstract: A semiconductor device structure includes nanostructures formed over a substrate. The structure also includes a fin isolation structure formed beside the nanostructures. The structure also includes a work function layer surrounding the nanostructures and covering a sidewall of the fin isolation structure. The structure also includes a gate electrode layer covering the work function layer. The gate electrode layer has an extending portion surrounded by the work function layer.Type: ApplicationFiled: December 17, 2024Publication date: April 10, 2025Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.Inventors: Chun-Fai CHENG, Liang-Yi CHEN, Chi-An WANG, Kuan-Chung CHEN, Chih-Wei LEE
-
Patent number: 12272554Abstract: A method of manufacturing semiconductor device includes forming a multilayer photoresist structure including a metal-containing photoresist over a substrate. The multilayer photoresist structure includes two or more metal-containing photoresist layers having different physical parameters. The metal-containing photoresist is a reaction product of a first precursor and a second precursor, and each layer of the multilayer photoresist structure is formed using different photoresist layer formation parameters. The different photoresist layer formation parameters are one or more selected from the group consisting of the first precursor, an amount of the first precursor, the second precursor, an amount of the second precursor, a length of time each photoresist layer formation operation, and heating conditions of the photoresist layers.Type: GrantFiled: July 27, 2023Date of Patent: April 8, 2025Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.Inventors: Jia-Lin Wei, Ming-Hui Weng, Chih-Cheng Liu, Yi-Chen Kuo, Yen-Yu Chen, Yahru Cheng, Jr-Hung Li, Ching-Yu Chang, Tze-Liang Lee, Chi-Ming Yang
-
Patent number: 12274147Abstract: The present disclosure provides an organic light emitting display panel, a method for manufacturing the same, and an organic light emitting display apparatus. The organic light emitting display panel includes an array substrate, a color filter substrate and an encapsulation structure; the encapsulation structure includes a sealing frame and/or a sealing layer disposed between the array substrate and the color filter substrate, and the array substrate and the color filter substrate are adhesively fixed through the sealing frame and/or the sealing layer; wherein the sealing frame is formed by curing a frame sealant and is located in a frame area of the array substrate and the color filter substrate, and the sealing layer is formed by curing a filling adhesive and is located in a display area of the array substrate and the color filter substrate.Type: GrantFiled: December 15, 2021Date of Patent: April 8, 2025Assignee: Everdisplay Optronics (Shanghai) Co., LtdInventors: Biming Wei, Yanhu Li, Liang Xu, Hsin Chih Lin, Haiyan Hao
-
Patent number: 12271113Abstract: Method of manufacturing semiconductor device includes forming photoresist layer over substrate. Forming photoresist layer includes combining first precursor and second precursor in vapor state to form photoresist material, wherein first precursor is organometallic having formula: MaRbXc, where M at least one of Sn, Bi, Sb, In, Te, Ti, Zr, Hf, V, Co, Mo, W, Al, Ga, Si, Ge, P, As, Y, La, Ce, Lu; R is substituted or unsubstituted alkyl, alkenyl, carboxylate group; X is halide or sulfonate group; and 1?a?2, b?1, c?1, and b+c?5. Second precursor is at least one of an amine, a borane, a phosphine. Forming photoresist layer includes depositing photoresist material over the substrate. The photoresist layer is selectively exposed to actinic radiation to form latent pattern, and the latent pattern is developed by applying developer to selectively exposed photoresist layer to form pattern.Type: GrantFiled: January 15, 2021Date of Patent: April 8, 2025Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.Inventors: Chih-Cheng Liu, Yi-Chen Kuo, Jia-Lin Wei, Ming-Hui Weng, Yen-Yu Chen, Jr-Hung Li, Yahru Cheng, Chi-Ming Yang, Tze-Liang Lee, Ching-Yu Chang
-
Publication number: 20250108134Abstract: Provided are methods of treating a disease or condition by administering a circular RNA (circRNA) encoding a therapeutic polypeptide (e.g., an antigenic polypeptide, a functional protein, a receptor protein, or a targeting protein (e.g., antibody)), wherein the circRNA is naked; and pharmaceutical composition(s) comprising the circRNA(s) as disclosed herein.Type: ApplicationFiled: January 28, 2023Publication date: April 3, 2025Inventors: Wensheng WEI, Yong SHEN, Liang QU, Feng CHEN, Zongyi YI
-
Publication number: 20250108541Abstract: A method of manufacturing an article include: providing a molding device, wherein the molding device includes a first mold, a second mold, the first mold includes a supporting member protruded from a inner wall; cooling a core to reduce a temperature of the core from a first temperature to a second temperature; disposing the core on the supporting member; engaging the second mold with the first mold to form a mold cavity defined by the first mold and the second mold, wherein the core having the second temperature is disposed within the mold cavity; injecting a first material into the mold cavity; and foaming the first material to form a first foamed member. At least a portion of the first foamed member is in contact with the core, and the first temperature is substantially higher than the second temperature. The core includes a hollow space enclosed by a layer.Type: ApplicationFiled: December 13, 2024Publication date: April 3, 2025Inventors: CHING-HAO CHEN, LIANG-HUI YEH, TING-WEI CHEN
-
Patent number: 12267970Abstract: A thermal dissipation holder for a handheld electronic device is provided. The thermal dissipation holder includes a main structure, a movable element, an elastic element, and a locker. The main structure has a front surface and a rear surface. The movable element is movably connected to the main structure along a first direction and has a clamp portion at a side away from the carrier. One end of the elastic element is connected to the main structure. The other end of the elastic element is connected to the movable element. The elastic element drives the movable element to move along the first direction. The locker is disposed in the main structure and has a locking portion, where a position of the locking portion corresponds to that of the clamp portion, and the locker is selectively engaged with the clamp portion through the locking portion to lock the movable element.Type: GrantFiled: January 13, 2023Date of Patent: April 1, 2025Assignee: ASUSTEK COMPUTER INC.Inventors: Jhih-Wei Rao, Zih-Siang Huang, Hung-Chieh Wu, Liang-Jen Lin
-
Publication number: 20250099074Abstract: A medical apparatus comprises: an operating console, a limiting mechanism, and a manual release mechanism. The limiting mechanism releases the limitation on movement of the operating console in a case where a pressing force is applied to the manual release mechanism. The manual release mechanism comprises: a handle, a conversion portion, and a base portion. The handle is provided with a first guide portion. The base portion is provided with a second guide portion that cooperates with the first guide portion. The handle moves linearly in a direction substantially perpendicular to the base portion under guidance of the first guide portion and the second guide portion in a case where the pressing force is applied to the handle. Thus, a smooth linear motion of the handle can be ensured to provide a good feeling of operation, helping to improve the user experience.Type: ApplicationFiled: September 16, 2024Publication date: March 27, 2025Inventors: Yalan Yang, Mingze Yang, Fenggui Huang, Jie Wang, Fangyu Huang, Liang Wei
-
Publication number: 20250094133Abstract: Various embodiments of the teachings herein include a device control method. An example includes: receiving a first workflow generated by an OT domain low code development tool; generating a micro-service corresponding to the first workflow used for defining an operation to be performed by one working unit in the OT domain; receiving a parameter value of the micro-service configured by an IT domain code development platform; and generating a second workflow based at least in part on the parameter value of the micro-service configured by the IT domain code development platform, so each OT device connected to the working unit performs an operation according to the second workflow.Type: ApplicationFiled: January 29, 2022Publication date: March 20, 2025Applicant: Siemens AktiengesellschaftInventors: Zhen Hua Zhou, Chang Wei Weng, Xiaoxun Zhu, Liang Liao
-
Patent number: 12252555Abstract: A selenium-chelating pea oligopeptide, a preparation method thereof and use thereof. After the selenium-chelating pea oligopeptide is subjected to digestion treatment in at least one of following three ways, a change rate of selenium content not more than 3% with respect to the selenium content before the digestion treatment: hydrolyzing for 4 hours by a pepsin at a pH value of 2 and a temperature of 37° C.; hydrolyzing for 6 hours by a trypsin at a pH value of 7.5 and a temperature of 37° C.; maintaining the temperature constant at 37° C., firstly hydrolyzing for 4 hours by the pepsin at a pH value of 2, and then continuing to hydrolyze for 6 hours by a trypsin at a pH value of 6.8. The preparation method thereof includes mixing and reacting an aqueous solution of pea oligopeptide and sodium selenite, and then being subjected to alcohol precipitation and drying.Type: GrantFiled: April 9, 2021Date of Patent: March 18, 2025Assignee: CHINA NATIONAL RESEARCH INSTITUTE OF FOOD & FERMENTATION INDUSTRIES CO., LTD.Inventors: Muyi Cai, Ruizeng Gu, Jun Lu, Wenying Liu, Xiuyuan Qin, Xingchang Pan, Zhe Dong, Yong Ma, Yaguang Xu, Yongqing Ma, Liang Chen, Lu Lu, Haixin Zhang, Ying Wei, Yan Liu, Kelu Cao, Jing Wang, Guoming Li, Ming Zhou, Yuchen Wang, Yuqing Wang, Kong Ling, Yuan Bi, Xinyue Cui