Abstract: A semiconductor device structure includes nanostructures formed over a substrate. The structure also includes a fin isolation structure formed beside the nanostructures. The structure also includes a work function layer surrounding the nanostructures and covering a sidewall of the fin isolation structure. The structure also includes a gate electrode layer covering the work function layer. The gate electrode layer has an extending portion surrounded by the work function layer.

Abstract: An electronic device is provided and includes a substrate, a first bump, a second bump, and an electronic element. The substrate includes a first through hole and a second through hole disposed adjacent to the first through hole along a direction. The first bump and the second bump are overlapped with the substrate, wherein the first bump is adjacent to the second bump along the direction. The electronic element is overlapped with the substrate and electrically connected to the first bump, wherein the substrate is disposed between the first bump and the electronic element. A distance between the first through hole and the second through hole of the substrate along the direction is different from a distance between the first bump and the second bump along the direction.

Abstract: A laser redundancy device includes a plurality of lasers and a PLC that includes a plurality of input waveguides, a plurality of first couplers, a plurality of intermediate waveguides, a plurality of second couplers, and a plurality of output waveguides. Each first coupler includes a plurality of first input arms and a plurality of first output arms. Each second coupler includes a plurality of second input arms and a plurality of second output arms. Each first coupler is connected to: two or more input waveguides via the plurality of first input arms, and the plurality of second couplers via the plurality of first output arms, two or more intermediate waveguides, and respective second input arms of the plurality of second couplers. Each second coupler is connected to two or more output waveguides via the plurality of second output arms.

Abstract: The present disclosure provides antibody drug conjugates comprising antibodies and antigen-binding fragments thereof that bind to human CEA and a linker-payload, a pharmaceutical composition comprising the anti-CEA antibody drug conjugate, and use of the anti-CEA antibody drug conjugate for treating a CEA-related diseases or disorders.

Abstract: The disclosure provides a method of preparing chiral metacyclophanes. The method involves palladium-catalyzed cross-coupling of a meta-substituted aryl group with base and a chiral ligand. The disclosure also provides metacyclophane compounds, which include diaryl and monoaryl macrocycles.

Abstract: The present disclosure provides an organic light emitting display panel, a method for manufacturing the same, and an organic light emitting display apparatus. The organic light emitting display panel includes an array substrate, a color filter substrate and an encapsulation structure; the encapsulation structure includes a sealing frame and/or a sealing layer disposed between the array substrate and the color filter substrate, and the array substrate and the color filter substrate are adhesively fixed through the sealing frame and/or the sealing layer; wherein the sealing frame is formed by curing a frame sealant and is located in a frame area of the array substrate and the color filter substrate, and the sealing layer is formed by curing a filling adhesive and is located in a display area of the array substrate and the color filter substrate.

Abstract: A method of manufacturing semiconductor device includes forming a multilayer photoresist structure including a metal-containing photoresist over a substrate. The multilayer photoresist structure includes two or more metal-containing photoresist layers having different physical parameters. The metal-containing photoresist is a reaction product of a first precursor and a second precursor, and each layer of the multilayer photoresist structure is formed using different photoresist layer formation parameters. The different photoresist layer formation parameters are one or more selected from the group consisting of the first precursor, an amount of the first precursor, the second precursor, an amount of the second precursor, a length of time each photoresist layer formation operation, and heating conditions of the photoresist layers.

Abstract: Method of manufacturing semiconductor device includes forming photoresist layer over substrate. Forming photoresist layer includes combining first precursor and second precursor in vapor state to form photoresist material, wherein first precursor is organometallic having formula: MaRbXc, where M at least one of Sn, Bi, Sb, In, Te, Ti, Zr, Hf, V, Co, Mo, W, Al, Ga, Si, Ge, P, As, Y, La, Ce, Lu; R is substituted or unsubstituted alkyl, alkenyl, carboxylate group; X is halide or sulfonate group; and 1?a?2, b?1, c?1, and b+c?5. Second precursor is at least one of an amine, a borane, a phosphine. Forming photoresist layer includes depositing photoresist material over the substrate. The photoresist layer is selectively exposed to actinic radiation to form latent pattern, and the latent pattern is developed by applying developer to selectively exposed photoresist layer to form pattern.

Abstract: Provided are methods of treating a disease or condition by administering a circular RNA (circRNA) encoding a therapeutic polypeptide (e.g., an antigenic polypeptide, a functional protein, a receptor protein, or a targeting protein (e.g., antibody)), wherein the circRNA is naked; and pharmaceutical composition(s) comprising the circRNA(s) as disclosed herein.

Abstract: A method of manufacturing an article include: providing a molding device, wherein the molding device includes a first mold, a second mold, the first mold includes a supporting member protruded from a inner wall; cooling a core to reduce a temperature of the core from a first temperature to a second temperature; disposing the core on the supporting member; engaging the second mold with the first mold to form a mold cavity defined by the first mold and the second mold, wherein the core having the second temperature is disposed within the mold cavity; injecting a first material into the mold cavity; and foaming the first material to form a first foamed member. At least a portion of the first foamed member is in contact with the core, and the first temperature is substantially higher than the second temperature. The core includes a hollow space enclosed by a layer.

Abstract: A thermal dissipation holder for a handheld electronic device is provided. The thermal dissipation holder includes a main structure, a movable element, an elastic element, and a locker. The main structure has a front surface and a rear surface. The movable element is movably connected to the main structure along a first direction and has a clamp portion at a side away from the carrier. One end of the elastic element is connected to the main structure. The other end of the elastic element is connected to the movable element. The elastic element drives the movable element to move along the first direction. The locker is disposed in the main structure and has a locking portion, where a position of the locking portion corresponds to that of the clamp portion, and the locker is selectively engaged with the clamp portion through the locking portion to lock the movable element.

Abstract: A medical apparatus comprises: an operating console, a limiting mechanism, and a manual release mechanism. The limiting mechanism releases the limitation on movement of the operating console in a case where a pressing force is applied to the manual release mechanism. The manual release mechanism comprises: a handle, a conversion portion, and a base portion. The handle is provided with a first guide portion. The base portion is provided with a second guide portion that cooperates with the first guide portion. The handle moves linearly in a direction substantially perpendicular to the base portion under guidance of the first guide portion and the second guide portion in a case where the pressing force is applied to the handle. Thus, a smooth linear motion of the handle can be ensured to provide a good feeling of operation, helping to improve the user experience.

Abstract: Various embodiments of the teachings herein include a device control method. An example includes: receiving a first workflow generated by an OT domain low code development tool; generating a micro-service corresponding to the first workflow used for defining an operation to be performed by one working unit in the OT domain; receiving a parameter value of the micro-service configured by an IT domain code development platform; and generating a second workflow based at least in part on the parameter value of the micro-service configured by the IT domain code development platform, so each OT device connected to the working unit performs an operation according to the second workflow.

Abstract: A selenium-chelating pea oligopeptide, a preparation method thereof and use thereof. After the selenium-chelating pea oligopeptide is subjected to digestion treatment in at least one of following three ways, a change rate of selenium content not more than 3% with respect to the selenium content before the digestion treatment: hydrolyzing for 4 hours by a pepsin at a pH value of 2 and a temperature of 37° C.; hydrolyzing for 6 hours by a trypsin at a pH value of 7.5 and a temperature of 37° C.; maintaining the temperature constant at 37° C., firstly hydrolyzing for 4 hours by the pepsin at a pH value of 2, and then continuing to hydrolyze for 6 hours by a trypsin at a pH value of 6.8. The preparation method thereof includes mixing and reacting an aqueous solution of pea oligopeptide and sodium selenite, and then being subjected to alcohol precipitation and drying.

Abstract: Provided are circular RNAs (circRNAs) encoding an antigenic polypeptide of a SARS-CoV-2 variant. Provided are circRNA vaccines against a SARS-CoV-2 variant, such as a Delta or Omicron variant. The circRNA vaccine comprises a circRNA comprising a nucleic acid sequence encoding an antigenic polypeptide comprising a Spike(S) protein or a fragment thereof of a SRAS-CoV-2 variant. Also provided are methods of treating or preventing a SARS-CoV-2 infection using the circRNAs or compositions thereof.

Abstract: A method includes forming first integrated circuits on a front side of a semiconductor substrate of a first device die, forming a trench capacitor extending from a backside of the semiconductor substrate into the semiconductor substrate, and forming a first through-via and a second through-via penetrating through the semiconductor substrate. The trench capacitor is electrically coupled between the first through-via and the second through-via. A second device die is bonded to the first die. The second device die includes second integrated circuits, and power nodes of the second integrated circuits are electrically coupled to the first through-via and the second through-via.

Abstract: Semiconductor devices having dummy regions with dummy fill structures that vary in lateral dimensions and methods for forming the semiconductor devices are provided herein. The semiconductor devices may include a through silicon via extending through a substrate of the semiconductor device, an active device in or on the substrate, and a dummy region of the substrate separating the through silicon via and the active device, the dummy region including dummy fill structures, wherein the dummy fill structures have lateral dimensions measured in a first direction from the through silicon via to the active device, wherein the lateral dimensions of the dummy fill structures varying in the first direction.

Abstract: An embodiment is a device including a first die and a substrate including a first surface and a second surface opposite the first surface. The device also includes an active device on the first surface of the substrate. The device also includes a first interconnect structure on the first surface of the substrate. The device also includes a through substrate via extending through the first interconnect structure and the substrate to the second surface of the substrate, the through substrate via being electrically coupled to metallization patterns in the first interconnect structure. The device also includes one or more material-filled trench structures extending from the second surface of the substrate into the substrate, the one or more material-filled trench structures being electrically isolated from the through substrate via.

Abstract: A method includes forming first nanostructures over a first region of a substrate; forming second nanostructures over a second region of the substrate; forming first gate structures around the first nanostructures; replacing the second nanostructures with isolation regions; and forming a seal ring over the substrate, wherein the seal ring is between the first region and the second region.