Abstract: A system for programming integrated circuit (IC) dies formed on a wafer includes a magnetic field transmitter that outputs a digital test program as a magnetic signal. At least one digital magnetic sensor (e.g., Hall effect sensor) is formed with the IC dies on the wafer. The digital magnetic sensor detects and receives the magnetic signal. A processor formed on the wafer converts the magnetic signal to the digital test program and the digital test program is stored in memory on the wafer in association with one of the IC dies. The magnetic field transmitter does not physically contact the dies, but can flood an entire surface of the wafer with the magnetic signal so that all of the IC dies are concurrently programmed with the digital test program.

Abstract: A system for programming integrated circuit (IC) dies formed on a wafer includes an optical transmitter that outputs a digital test program as an optical signal. At least one optical sensor (e.g., photodiode) is formed with the IC dies on the wafer. The optical sensor detects and receives the optical signal. A processor formed on the wafer converts the optical signal to the digital test program and the digital test program is stored in memory on the wafer in association with one of the IC dies. The optical transmitter does not physically contact the dies, but can flood an entire surface of the wafer with the optical signal so that all of the IC dies are concurrently programmed with the digital test program.

Abstract: A system for programming magnetic field sensors formed on a wafer includes a magnetic field transmitter that outputs a digital test program as a magnetic signal. At least one digital magnetic sensor (e.g., magnetoresistive sensor) is formed with the magnetic field sensors on the wafer and is distinct from the magnetic field sensors. The digital magnetic sensor detects and receives the magnetic signal. A processor formed on the wafer converts the magnetic signal to the digital test program and the digital test program is stored in memory on the wafer in association with one of the magnetic field sensors. The magnetic field transmitter does not physically contact the wafer, but can flood an entire surface of the wafer with the magnetic signal so that all of the magnetic field sensors are concurrently programmed with the digital test program.

Abstract: An electrode cap grinding and changing machine is provided. The machine includes a frame, a drive motor having an output end and a balanced floating unit, wherein the balanced floating unit is arranged on the frame, and the drive motor is arranged on the balanced floating unit, the output end of the drive motor penetrates through the balanced floating unit and then is connected with a working table having two sides, the two sides of the working table having a cap dismounting unit and a cap grinding unit drivably interconnected with the output end of the drive motor, and electrode cap storage units arranged at an outermost end of the two sides of the working table or on the frame.

Abstract: An integrated inertial sensor and pressure sensor may include a first substrate including a first surface and a second surface; at least one or more conductive layers, formed on the first surface of the first substrate; a movable sensitive element, formed by using a first region of the first substrate; a second substrate and a third substrate, the second substrate being coupled to a surface of the conductive layer, the third substrate being coupled to the second surface of the first substrate in which the movable sensitive element of the inertial sensor is formed, and the third substrate and the second substrate are respectively arranged on opposite sides of the movable sensitive element; and a sensitive film of the pressure sensor, including at least a second region of the first substrate, or including at least one of the conductive layers on the second region of the first substrate.

Abstract: Disclosed are an optical disc drive installation mechanism, and an outer frame for installing an optical disc drive. The optical disc drive installation mechanism includes: an optical disc drive module and an outer frame which is configured to insert or pull out the optical disc drive module, and a buckle is connected to a side surface of the optical disc drive module; a buckle limiting hole is disposed on a first side surface of the outer frame; and a groove is further disposed on an outer wall on the first side surface of the outer frame, a fixedly connected spacing elastomer is disposed on an inner wall on a second side surface of the outer frame, the spacing elastomer and the first elastic part are configured to lock or unlock the optical disc drive module, and a first side surface is perpendicular to the second side surface.

Abstract: A device 20 includes a substrate 22 coupled with a substrate 24 such that a volume 32 is formed between the substrates 22, 24. Contact posts 48, 50 on the substrate 22 and a cantilever beam structure 36 on the substrate 24 are located within the volume 32. The cantilever beam structure has a conductive trace 38 that is selectively contactable with the contact posts 48, 50 to yield a microelectromechanical (MEMS) switch within the volume 32. Fabrication methodology for making the contact posts 48, 50 entails forming post protrusions 68, 70 on the substrate 22 and shaping post protrusions 68, 70 so that they acquire a rounded shape. Input and output signal lines 42, 44 are constructed such that respective portions of input and output signal lines 42, 44 overly corresponding post protrusions 68, 70 and take on the shape of post protrusions 68, 70.

Abstract: Disclosed are a hybrid power system of a vehicle and a control method therefor. The hybrid power system of a vehicle comprises: an engine; a dual-clutch automatic transmission comprising an ISG motor; a first power unit and a second power unit; a power battery, the power battery being connected to the ISG motor by the first power unit; a power battery manager, the power battery manager being connected to the power battery and used to test an SOC of the power battery; a rear wheel drive motor, the rear wheel drive motor being connected to the power battery by the second power unit, and the rear wheel drive motor being connected to a rear speed reducer of the vehicle; and a vehicle controller, the vehicle controller being connected to the power battery manager, and the vehicle controller controlling the vehicle to enter a corresponding operating mode according to the SOC and drive required torque WTD at a wheel of the vehicle.

Abstract: A cabinet liquid cooling system is configured to dissipate heat of a cabinet. A flow allocation unit is installed on a single side of the cabinet, is located in space between a side wall of the cabinet and a mounting bar of the cabinet, and is provided with a liquid inlet and a liquid outlet. A liquid cooling system (LCS) control unit is installed at the bottom of the cabinet and cyclically supplies liquid to the flow allocation unit using the liquid inlet and the liquid outlet. A liquid supply branch includes a liquid delivery pipe and a liquid return pipe. A node pipe includes a liquid inlet pipe and a liquid outlet pipe. Both the liquid inlet pipe and the liquid outlet pipe are connected to the corresponding liquid delivery pipe and liquid return pipe using the quick male connector and the quick female connector.

Abstract: A front-end-of-line through-substrate via is provided for application in certain semiconductor device fabrication, including microelectromechanical (MEMS) devices. The through-substrate via (TSV) has a conductive element formed from the cylindrical core of a ring-shaped isolating etch trench. The conductivity of the core is provided by in-diffusion of dopants from a highly-doped layer deposited along sidewalls of the core within the etched trench. The highly-doped layer used as the diffusion source can be either conductive or insulating, depending upon the application. The highly-doped diffusion source layer can be retained after diffusion to further contribute to the conductivity of the TSV, to help fill or seal the via, or can be partially or completely removed. Embodiments provide for the drive in-diffusion process to use a same heating step as that used for thermal oxidation to fill or seal the via trench. Other embodiments can provide for diffusion elements from a gaseous source.

Abstract: A magnitude and direction of at least one of a reset current and a second stabilization current (that produces a reset field and a second stabilization field, respectively) is determined that, when applied to an array of magnetic sense elements, minimizes the total required stabilization field and reset field during the operation of the magnetic sensor and the measurement of the external field. Therefore, the low field sensor operates optimally (with the highest sensitivity and the lowest power consumption) around the fixed external field operating point. The fixed external field is created by other components in the sensor device housing (such as speaker magnets) which have a high but static field with respect to the low (earth's) magnetic field that describes orientation information.

Abstract: A predictive model for building energy consumption may be constructed and run to predict energy consumption in a building or to detect anomaly in energy consumption in a building or combinations thereof. Historic energy consumption data associated with energy consumed in a building may be received. Enthalpy of air outside the building may be determined. An energy consumption model may be calibrated based on the historic energy consumption data and the enthalpy of air outside the building. The energy consumption model incorporates enthalpy difference between a balance enthalpy and the enthalpy of air outside the building.

Abstract: A structure and method are provided for self-test of a Z axis sensor. Two self-test current lines are symmetrically positioned adjacent, but equidistant from, each sense element. The vertical component of the magnetic field created from a current in the self-test lines is additive in a flux guide positioned adjacent, and orthogonal to, the sense element; however, the components of the magnetic fields in the plane of the sense element created by each of the two self-test current line pairs cancel one another at the sense element center, resulting in only the Z axis magnetic field being sensed during the self-test.

Abstract: Compositions, methods of making, and methods of using nanoclusters in which the nanoclusters comprise a plurality of nanoparticles having a core of nanoparticles arranged such that the surfaces of the nanoparticles contact adjacent nanoparticles, the nanoparticles comprise an active ingredient, and the nanocluster has a mass median aerodynamic diameter of from about 0.25 ?m to about 20 ?m.

Abstract: A method of preparing a silicon-containing polymeric structure coated/encapsulated active ingredient is disclosed. The method has the steps of providing an insoluble active ingredient; dispersing the active ingredient in a liquid medium to form a suspension of the active ingredient; adding a silicon-containing polymeric structure precursor to the suspension; and reacting the precursor to form the silicon-containing polymeric structure. The silicon-containing polymeric structure is formed around the active ingredient, thereby forming a silicon-containing polymeric structure coated/encapsulated active ingredient.

Abstract: A magnitude and direction of at least one of a reset current and a second stabilization current (that produces a reset field and a second stabilization field, respectively) is determined that, when applied to an array of magnetic sense elements, minimizes the total required stabilization field and reset field during the operation of the magnetic sensor and the measurement of the external field. Therefore, the low field sensor operates optimally (with the highest sensitivity and the lowest power consumption) around the fixed external field operating point. The fixed external field is created by other components in the sensor device housing (such as speaker magnets) which have a high but static field with respect to the low (earth's) magnetic field that describes orientation information.

Abstract: A magnetic field sensor includes in-plane sense elements located in a plane of the magnetic field sensor and configured to detect a magnetic field oriented perpendicular to the plane. A current carrying structure is positioned proximate the magnetic field sensor and includes at least one coil surrounding the in-plane sense elements. An electric current is applied to the coil to create a self-test magnetic field to be sensed by the sense elements. The coil may be vertically displaced from the plane in which the sense elements are located and laterally displaced from an area occupied by the sense elements to produce both Z-axis magnetic field components and lateral magnetic field components of the self-test magnetic field. The sense elements are arranged within the coil and interconnected to cancel the lateral magnetic field components, while retaining the Z-axis magnetic field components to be used for self-test of the magnetic field sensor.

Abstract: A MEMS device includes a first substrate structure and a second substrate structure. The first substrate structure has a conductive microstructure and an oxide material surrounding lateral side of the conductive microstructure. A thickness of the conductive microstructure and a thickness of the oxide material are approximately equivalent. The second substrate structure has an active region of the MEMS device, and the second substrate structure is coupled in spaced apart relationship with the first substrate structure to produce a cavity between the structures. The active region of the MEMS device is suspended above the cavity and the conductive microstructure underlies the cavity. The conductive microstructure is formed from a polysilicon structure layer and a local oxidation of silicon process is implemented to thermally grow the oxide material using the polysilicon of the structural layer. The second substrate structure may be coupled to the first substrate structure by fusion bonding.

Abstract: An inertial sensor (20) includes a movable element (24) coupled to a substrate (28) and adapted for motion about a rotational axis (34). The sensor (20) further includes a trim elements (36, 38). The trim elements (36, 38) are spaced away from a surface (26) of the substrate (28) and are symmetrically positioned on opposing sides of the rotational axis (34). The trim elements (36, 38) are largely insensitive to acceleration about the rotational axis (34), but are sensitive to asymmetrical bending of the substrate (28). Trim signals (72, 74) are received via the trim elements (36, 38) and sense signals (68, 70) are received via sense elements (50, 52). The trim signals (72, 74) are applied to the sense signals (68, 70) to trim an offset error in an output signal of the inertial sensor (20) to produce a compensated sense signal (144).

Abstract: An electrode cap grinding and changing machine is provided. The machine includes a frame, a drive motor having an output end and a balanced floating unit, wherein the balanced floating unit is arranged on the frame, and the drive motor is arranged on the balanced floating unit, the output end of the drive motor penetrates through the balanced floating unit and then is connected with a working table having two sides, the two sides of the working table having a cap dismounting unit and a cap grinding unit drivably interconnected with the output end of the drive motor, and electrode cap storage units arranged at an outermost end of the two sides of the working table or on the frame.