Abstract: Generating a heat transfer model for building energy may comprise developing a PDE model that describes heat transfer through building envelope of a building, and developing an ODE model that describes the heat transfer and thermal balance in a space inside the building. Stepwise parameter estimation integrates the PDE model and the ODE model in generating the heat transfer model.

Abstract: A predictive model for building energy consumption may be constructed and run to predict energy consumption in a building or to detect anomaly in energy consumption in a building or combinations thereof. Historic energy consumption data associated with energy consumed in a building may be received. Enthalpy of air outside the building may be determined. An energy consumption model may be calibrated based on the historic energy consumption data and the enthalpy of air outside the building. The energy consumption model incorporates enthalpy difference between a balance enthalpy and the enthalpy of air outside the building.

Abstract: Methods for fabricating crack resistant Microelectromechanical (MEMS) devices are provided, as are MEMS devices produced pursuant to such methods. In one embodiment, the method includes forming a sacrificial body over a substrate, producing a multi-layer membrane structure on the substrate, and removing at least a portion of the sacrificial body to form an inner cavity within the multi-layer membrane structure. The multi-layer membrane structure is produced by first forming a base membrane layer over and around the sacrificial body such that the base membrane layer has a non-planar upper surface. A predetermined thickness of the base membrane layer is then removed to impart the base membrane layer with a planar upper surface. A cap membrane layer is formed over the planar upper surface of the base membrane layer. The cap membrane layer is composed of a material having a substantially parallel grain orientation.

Abstract: A magnitude and direction of at least one of a reset current and a second stabilization current (that produces a reset field and a second stabilization field, respectively) is determined that, when applied to an array of magnetic sense elements, minimizes the total required stabilization field and reset field during the operation of the magnetic sensor and the measurement of the external field. Therefore, the low field sensor operates optimally (with the highest sensitivity and the lowest power consumption) around the fixed external field operating point. The fixed external field is created by other components in the sensor device housing (such as speaker magnets) which have a high but static field with respect to the low (earth's) magnetic field that describes orientation information.

Abstract: A method (60) entails providing a substrate (34) with a structural layer (30) having a thickness (40). A partial etch process is performed at locations (82) on the structural layer (30) so that a portion (92) of the structural layer (30) remains at the locations (82). An oxidation process is performed at the locations which consumes the remaining portion of the structural layer and forms an oxide (36) having a thickness (42) that is similar to the thickness (40) of the structural layer (30). The oxide (36) electrically isolates microstructures (28) in the structural layer (30), thus producing a structure (22). A device substrate (120) is coupled to the structure (22) such that a cavity (48) is formed between them. An active region (44) is formed in the device substrate (120). A short etch process can be performed to expose the microstructures from an overlying oxide layer (110).

Abstract: Compositions, methods of making, and methods of using nanoclusters in which the nanoclusters comprise a plurality of nanoparticles having a core of nanoparticles arranged such that the surfaces of the nanoparticles contact adjacent nanoparticles, the nanoparticles comprise an active ingredient, and the nanocluster has a mass median aerodynamic diameter of from about 0.25 ?m to about 20 ?m.

Abstract: Methods for the fabrication of a Microelectromechanical Systems (“MEMS”) device are provided. In one embodiment, the MEMS device fabrication method includes forming a via opening extending through a sacrificial layer and into a substrate over which the sacrificial layer has been formed. A body of electrically-conductive material is deposited over the sacrificial layer and into the via opening to produce an unpatterned transducer layer and a filled via in ohmic contact with the unpatterned transducer layer. The unpatterned transducer layer is then patterned to define, at least in part, a primary transducer structure. At least a portion of the sacrificial layer is removed to release at least one movable component of the primary transducer structure. A backside conductor, such as a bond pad, is then produced over a bottom surface of the substrate and electrically coupled to the filled via.

Abstract: Methods for the fabrication of a Microelectromechanical Systems (“MEMS”) devices are provided, as are MEMS devices. In one embodiment, the MEMS device fabrication method includes forming at least one via opening extending into a substrate wafer, depositing a body of electrically-conductive material over the substrate wafer and into the via opening to produce a via, bonding the substrate wafer to a transducer wafer having an electrically-conductive transducer layer, and forming an electrical connection between the via and the electrically-conductive transducer layer. The substrate wafer is thinned to reveal the via through a bottom surface of the substrate wafer, and a backside conductor is produced over a bottom surface of the substrate wafer electrically coupled to the via.

Abstract: Methods for the fabrication of a Microelectromechanical Systems (“MEMS”) devices are provided. In one embodiment, the MEMS device fabrication method forming a via opening extending through a sacrificial layer and into a substrate over which the sacrificial layer has been formed. A body of electrically-conductive material is deposited over the sacrificial layer and into the via opening to produce an unpatterned transducer layer and a filled via in ohmic contact with the unpatterned transducer layer. The unpatterned transducer layer is then patterned to define, at least in part, a primary transducer structure. At least a portion of the sacrificial layer is removed to release at least one movable component of the primary transducer structure. A backside conductor, such as a bond pad, is then produced over a bottom surface of the substrate and electrically coupled to the filled via.

Abstract: Methods for fabricating crack resistant Microelectromechanical (MEMS) devices are provided, as are MEMS devices produced pursuant to such methods. In one embodiment, the method includes forming a sacrificial body over a substrate, producing a multi-layer membrane structure on the substrate, and removing at least a portion of the sacrificial body to form an inner cavity within the multi-layer membrane structure. The multi-layer membrane structure is produced by first forming a base membrane layer over and around the sacrificial body such that the base membrane layer has a non-planar upper surface. A predetermined thickness of the base membrane layer is then removed to impart the base membrane layer with a planar upper surface. A cap membrane layer is formed over the planar upper surface of the base membrane layer. The cap membrane layer is composed of a material having a substantially parallel grain orientation.

Abstract: A micro or nano electromechanical transducer device formed on a semiconductor substrate comprises a movable structure which is arranged to be movable in response to actuation of an actuating structure. The movable structure comprises a mechanical structure having at least one mechanical layer having a first thermal response characteristic, at least one layer of the actuating structure having a second thermal response characteristic different to the first thermal response characteristic, and a thermal compensation structure having at least one thermal compensation layer. The thermal compensation layer is different to the at least one layer and is arranged to compensate a thermal effect produced by the mechanical layer and the at least one layer of the actuating structure such that the movement of the movable structure is substantially independent of variations in temperature.

Abstract: An example method may include calculating a parameter for traffic propagating in a network between a sender and a receiver, where the traffic comprises encoding information and decoding information; determining whether the parameter meets a predetermined value; classifying the traffic as uni-directional if the parameter meets the predetermined value; and classifying the traffic as bi-directional if the parameter does not meet the predetermined value.

Abstract: The present invention relates to a processing cartridge, comprising a developing unit and a photosensitive unit, of which the latter consists of a photosensitive member and a developer chamber and has a developer outlet connecting the chamber and a sealing cap matching the developer outlet and used to seal the said outlet. Based on the said technical proposal, the photosensitive unit is designed with a developer outlet connecting the chamber and with a sealing cap matching the developer outlet and used to seal the said outlet, so, when the photosensitive unit becomes full with developer, the sealing cap can be opened to remove the developer in the photosensitive unit, which facilitates the cleaning without affecting the normal operation of the processing cartridge.

Abstract: Provided is a substrate structure, including: a first substrate and a second substrate arranged correspondingly. A first surface of the first substrate faces a second surface of the second substrate, wherein the first surface is successively arranged with a conductor interconnection layer and a bonding layer, with the bonding layer connecting the first substrate and the conductor interconnection layer to the second substrate. The substrate structure and a method for manufacturing the same. The second substrate can serve as a support substrate and the first substrate as a substrate for directly manufacturing a device. However, the first substrate is formed by the growth of a crystal without the problem of thickness and stress thereof, thereby avoiding unnecessary stress and further improving the performance of the device formed in the first substrate.

Abstract: The invention discloses a processing cartridge, which includes a powder tube, a sliding member and a mechanism for holding the sliding member, wherein the powder tube is used for receiving toner and the sliding member is capable of freely sliding in the powder tube. The mechanism for holding the sliding member is driven to close a powder outlet under the non-use state and a powder outlet portion is arranged on the powder tube. The powder outlet is arranged on the powder outlet portion and the sliding member closes the powder outlet under the action of the mechanism for holding the sliding member under the non-use state, and moves under the action of an external force to open the powder outlet under the use state. An internal member provided with an internal powder feeding opening is also arranged inside the powder outlet portion.

Abstract: The present invention provides a method, system and computer program product for implementing an automated inventory replenishment process between a manufacturer and a business partner. In one embodiment of the invention, a method is provided comprising the business partner purchasing and maintaining an inventory of goods from the manufacturer, and the manufacturer providing price protection to the business partner for the purchasing of the goods. This embodiment further comprises managing said inventory by using an automated process that takes into account said price protection for the purchasing of the goods.

Abstract: A wafer structure (88) includes a device wafer (20) and a cap wafer (60). Semiconductor dies (22) on the device wafer (20) each include a microelectronic device (26) and terminal elements (28, 30). Barriers (36, 52) are positioned in inactive regions (32, 50) of the device wafer (20). The cap wafer (60) is coupled to the device wafer (20) and covers the semiconductor dies (22). Portions (72) of the cap wafer (60) are removed to expose the terminal elements (28, 30). The barriers (36, 52) may be taller than the elements (28, 30) and function to prevent the portions (72) from contacting the terminal elements (28, 30) when the portions (72) are removed. The wafer structure (88) is singulated to form multiple semiconductor devices (89), each device (89) including the microelectronic device (26) covered by a section of the cap wafer (60) and terminal elements (28, 30) exposed from the cap wafer (60).

Abstract: A method for controlling a distance between a photosensitive member and a developing member in an integral or separated toner cartridge. The toner cartridge is provided with an elastic member for providing an elastic force to the developing member or to the photosensitive member, so as to force the developing member to move towards the photosensitive member, or to force the photosensitive member to move towards the developing member. A production accuracy requirement of the toner cartridge is reduced by the elasticity of the elastic member. Also a device for controlling a distance between a photosensitive member and a developing member in a toner cartridge. By using the method and the device thereof, the requirement of the manufacturing accuracy of a toner cartridge can be reduced, and the negative impact of the accuracy bias caused by abrasion can be reduced, so, the product cost is saved, and the service life of the product is increased.

Abstract: A control methodology and component in Business Performance Management (BPM) Systems. This enables firms to exploit control theoretic techniques for Business Performance Management. Information from BPM systems is used to calibrate models of the business process. This model is then used to assess and optimize control actions to manage business performance, on the basis of which a control action is selected for business process execution.

Abstract: A Micro Electromechanical System (MEMS) pressure sensor may include a first substrate provided with a sensitive diaphragm of a capacitive pressure sensing unit, an electrical connecting layer and a first bonding layer on a surface of the first substrate; and a second substrate provided with an inter-conductor dielectric layer, a conductor connecting layer in the inter-conductor dielectric layer and/or a second bonding layer on a surface of the second substrate. The second substrate is arranged opposite to the first substrate, and the second substrate is fixedly coupled to the first substrate via the first bonding layer and the second bonding layer; a pattern of the first bonding layer is corresponding to a pattern of the second bonding layer, and both the first bonding layer and the second bonding layer are formed of a conductive material.