Patents by Inventor Lin Chen

Lin Chen has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20200373404
    Abstract: Methods of forming and processing semiconductor devices are described. Certain embodiments related to electronic devices which comprise a dipole region having an interlayer dielectric, a high-? dielectric material, and a dipole layer. The dipole layer comprises one or more of titanium lanthanum nitride (TiLaN), titanium yttrium nitride (TiYN), titanium strontium nitride (TiSrN), titanium magnesium nitriride (TiMgN, titanium aluminum nitride (TiAlN), titanium tantalum nitride (TiTaN), hafnium carbide (HfC), hafnium nitride (HfN), hafnium oxynitride (HfON), hafnium oxycarbide (HfOC), hafnium carbide aluminum (HfCAl), hafnium aluminum nitride (HfAlN), or hafnium carbonitride (HfCN).
    Type: Application
    Filed: May 18, 2020
    Publication date: November 26, 2020
    Applicant: Applied Materials, Inc.
    Inventors: Yongjing Lin, Karla M. Bernal Ramos, Luping Li, Shih Chung Chen, Jacqueline S. Wrench, Yixiong Yang, Steven C.H. Hung, Srinivas Gandikota, Naomi Yoshida, Lin Dong
  • Publication number: 20200375005
    Abstract: The disclosure relates to a light supplement device or module, and a light supplement control method, a terminal, and an apparatus for the light supplement module, and belongs to the technical field of electronic devices. The light supplement module includes a circuit substrate; n Light Emitting Diodes (LED) disposed in an array on the circuit substrate, n being an integer greater than 1, and there being at least two LEDs having different colors; and a light guiding layer disposed on an upper layer of the n LEDs, wherein the LEDs are color LEDs, or the n LEDs constitute a color LED group.
    Type: Application
    Filed: November 27, 2019
    Publication date: November 26, 2020
    Applicant: Beijing Xiaomi Mobile Software Co., Ltd.
    Inventors: Jianglin Gu, Jian Bai, Lin Chen, Shujun Wei, Chiafu Yen
  • Publication number: 20200373267
    Abstract: External electrical connectors and methods of forming such external electrical connectors are discussed. A method includes forming an external electrical connector structure on a substrate. The forming the external electrical connector structure includes plating a pillar on the substrate at a first agitation level affected at the substrate in a first solution. The method further includes plating solder on the external electrical connector structure at a second agitation level affected at the substrate in a second solution. The second agitation level affected at the substrate is greater than the first agitation level affected at the substrate. The plating the solder further forms a shell on a sidewall of the external electrical connector structure.
    Type: Application
    Filed: August 10, 2020
    Publication date: November 26, 2020
    Inventors: Meng-Fu Shih, Chun-Yen Lo, Cheng-Lin Huang, Wen-Ming Chen, Chien-Ming Huang, Yuan-Fu Liu, Yung-Chiuan Cheng, Wei-Chih Huang, Chen-Hsun Liu, Chien-Pin Chan, Yu-Nu Hsu, Chi-Hung Lin, Te-Hsun Pang, Chin-Yu Ku
  • Publication number: 20200370174
    Abstract: Embodiments of the present disclosure generally relate to an apparatus and a method for cleaning a processing chamber. In one embodiment, a substrate support cover includes a bulk member coated with a fluoride coating. The substrate support cover is placed on a substrate support disposed in the processing chamber during a cleaning process. The fluoride coating does not react with the cleaning species. The substrate support cover protects the substrate support from reacting with the cleaning species, leading to reduced condensation formed on chamber components, which in turn leads to reduced contamination of the substrate in subsequent processes.
    Type: Application
    Filed: March 2, 2020
    Publication date: November 26, 2020
    Inventors: Shuran SHENG, Lin ZHANG, Jiyong HUANG, Joseph C. WERNER, Stanley WU, Mahesh Adinath KANAWADE, Yikai CHEN, Yixing LIN, Ying MA
  • Publication number: 20200373318
    Abstract: Methods of forming memory structures are discussed. Specifically, methods of forming 3D NAND devices are discussed. Some embodiments form memory structures with a metal nitride barrier layer, an ?-tungsten layer, and a bulk metal material. The barrier layer comprises a TiXN or TaXN material, where X comprises a metal selected from one or more of aluminum (Al), silicon (Si), tungsten (W), lanthanum (La), yttrium (Yt), strontium (Sr), or magnesium (Mg).
    Type: Application
    Filed: May 18, 2020
    Publication date: November 26, 2020
    Applicant: Applied Materials, Inc.
    Inventors: Jacqueline S. Wrench, Yixiong Yang, Yong Wu, Wei V. Tang, Srinivas Gandikota, Yongjing Lin, Karla M. Barnal Ramos, Shih Chung Chen
  • Publication number: 20200371617
    Abstract: A touch panel includes a touch sensing layer, a flexible circuit board and an anisotropic conductive film. The touch sensing layer includes sensing pads and a reserved room, and the reserved room is arranged outside the sensing pads. The flexible circuit board includes conductive pads, the outermost conductive pad is provided with a virtual pattern, and the position of the virtual pattern corresponds to the position of the reserved room. The anisotropic conductive film is arranged between the touch sensing layer and the flexible circuit board, and the sensing pads are respectively electrically connected to the conductive pads through the anisotropic conductive film.
    Type: Application
    Filed: June 4, 2019
    Publication date: November 26, 2020
    Inventors: PO-LIN CHEN, HSUAN-MAN CHANG, MIN-HUI YIN, CHU-JUNG LIN, MEI-HUA CHOU
  • Publication number: 20200369883
    Abstract: Described herein is a thermoplastic polyamide composition comprising long chain polyamide of 25-65 wt %, modified poly (arylene ether) resin of 5-20 wt %, and D-glass fibers of 30-65 wt %. Also described herein is a manufacturing process of the thermoplastic polyamide composition and a method of using the thermoplastic polyamide composition in high frequency communication products. The thermoplastic polyamide composition expresses very good dielectric property and good mechanical properties useful in high frequency communication technology.
    Type: Application
    Filed: November 21, 2018
    Publication date: November 26, 2020
    Inventors: Lin Chen, Zhenguo Liu
  • Publication number: 20200372439
    Abstract: A system and method for determining a team are provided. The method may include obtaining information relating to each of a plurality of participants to be grouped, the plurality of participants including a plurality of team leaders and a plurality of team members. The method may also include determining one or more teams by automatically allocating the plurality of team members to the plurality of team leaders based on the information relating to the plurality of participants, wherein each of the one or more teams includes a team leader and at least one team member.
    Type: Application
    Filed: August 11, 2020
    Publication date: November 26, 2020
    Applicant: BEIJING DIDI INFINITY TECHNOLOGY AND DEVELOPMENT CO., LTD.
    Inventors: Lingyu ZHANG, Lin ZENG, Ning MA, Bo LIU, Xiaoxue WANG, Chen CHEN
  • Publication number: 20200370263
    Abstract: Disclosed is an energy-saving bidirectional ship lift by gravity balancing, including: a ship lift body. A first support is provided in a middle of the ship lift body. A second support is provided at a side of the first support. A third support is provided at the other side of the first support. A space between the second support and the first support forms a first shaft. A space between the first support and the third support forms a second shaft. A first ship-carrying chamber and a second ship-carrying chamber are respectively provided in the first shaft and the second shaft to allow two ships to be transported at the same time. An entry water tank and an exit water tank are provided at two sides of each ship-carrying chamber to adjust the weight of the two ship-carrying chambers.
    Type: Application
    Filed: May 11, 2020
    Publication date: November 26, 2020
    Inventors: Huaming WANG, Shi HE, Lin CHEN, Tao WANG, Junmei LIU, Zhenhuang DU, Qiaorui WU
  • Patent number: 10843626
    Abstract: A warning system for detecting approaching vehicle and method thereof are provided. The system includes a detection unit detecting a relative distance with respect to the approaching vehicle and a driving path of the approaching vehicle; a storage unit storing a warning information; and a processing unit receiving the detection signal to acquire the current time to collision and the current driving path. When the time to collision is equal to or shorter than the predetermined time to collision, and the driving path falls in the warning area, and the driving path fulfills the confirmation condition, the processing unit sends a warning signal. Therefore, a potentially dangerous approaching vehicle is accurately judged, and the warning is correctly sent.
    Type: Grant
    Filed: February 27, 2019
    Date of Patent: November 24, 2020
    Assignee: CUBTEK INC.
    Inventors: San-Chuan Yu, Cheng-Foo Chen, Chi-Yu Hung, Jyong Lin, Yu-Jen Lin
  • Patent number: 10844143
    Abstract: The present invention provides a modified rubber containing silicon and phosphorus, and a composition and manufacturing method thereof. The present invention provides the modified rubber structured as formula (1), wherein X is selected from a C1-C12 alkylene group, a C2-C12 alkenylene group, a C3-C12 alicyclic group, and a C6-C12 aromatic group; and A1, A2, A3, Y, and Z are each independently selected from an alkyl group, an alkoxy group, a halide group, and a conjugated diene rubber, wherein the conjugated diene rubber is a polymer composed of a conjugated diene monomer or the conjugated diene monomer with a vinyl aromatic monomer, A1, A2, A3, Y, and Z are the same or different from each other, and at least one of A1, A2, A3, Y, and Z is the conjugated diene rubber.
    Type: Grant
    Filed: October 8, 2018
    Date of Patent: November 24, 2020
    Assignee: TSRC Corporation
    Inventors: Chun-Lin Chen, Yun-Ta Lee, Adel Farhan Halasa
  • Patent number: 10849108
    Abstract: The disclosure provides a method and a device in a User Equipment (UE) and a base station for wireless communication. The UE, in turn, receives first control information, transmits a first and a second radio signal, wherein the first control information is used for indicating a first multiple access signature sequence, the first multiple access signature sequence includes a first and a second multiple access signature in turn, the first multiple access signature is used for generating the first radio signal based on a first bit block, and the second multiple access signature is used for generating the second radio signal based on a second bit block. According to the disclosure, different multiple access signatures are configured on different time-frequency resources for the UE, which reduces interferences or conflicts between uplink communications due to conflicts of multiple access signatures between multiple users or correlations between non-orthogonal multiple access signatures.
    Type: Grant
    Filed: June 10, 2019
    Date of Patent: November 24, 2020
    Assignee: SHANGHAI LANGBO COMMUNICATION TECHNOLOGY COMPANY LIMITED
    Inventors: JinHui Chen, XiaoBo Zhang, Lin Yang
  • Patent number: 10847623
    Abstract: Techniques in accordance with embodiments described herein are directed to semiconductor devices including a layer of aluminum nitride AlN or aluminum gallium nitride AlGaN as a ferroelectric layer and a method of making a thin film of AlN/AlGaN that possesses ferroelectric properties. In a ferroelectric transistor, a thin film of AlN/AlGaN that exhibits ferroelectric properties is formed between a gate electrode and a second semiconductor layer, e.g., of GaN.
    Type: Grant
    Filed: December 28, 2018
    Date of Patent: November 24, 2020
    Assignees: Taiwan Semiconductor Manufacturing Co., Ltd., National Taiwan University
    Inventors: Miin-Jang Chen, Tzong-Lin Jay Shieh, Bo-Ting Lin
  • Patent number: 10843197
    Abstract: The present invention provides a fluidic connector, to combine with a microfluidic chip cartridge, comprising: a base, having a plurality of through holes; and a plurality of soft tubes, penetrating the base via the through holes and fixed on the base, and having a Shore A hardness in a range of 50-99, wherein an end of the plurality of soft tubes is protruded from a first side of the base to form plurality of protrusion portions and each protrusion portion has a length in a range of 0.5-10 mm. The present invention also provides a microfluidic chip cartridge and a fluidic connector assembly.
    Type: Grant
    Filed: November 14, 2017
    Date of Patent: November 24, 2020
    Assignee: MiCareo Taiwan Co., Ltd.
    Inventors: Hui-Min Yu, Jui-Lin Chen
  • Patent number: 10845925
    Abstract: An electronic device such as a device with a display may have a force sensor. The force sensor may include capacitive electrodes separated by a deformable layer such as a layer of an elastomeric polymer. The display or other layers in the electronic device may deform inwardly under applied force from a finger of a user or other external object. As the deformed layers contact the deformable layer, the deformable layer is compressed and the spacing between the capacitive electrodes of the force sensor decreases. This causes a measurable rise in the capacitance signal and therefore the force signal output of the force sensor. To prevent the deformable layer from sticking to the inner surface of the display layers, air flow promotion structures may be interposed between the deformable layer and the inner surface of the display. The air flow promotion structures may include spacer pads with anti-stick surfaces.
    Type: Grant
    Filed: December 6, 2018
    Date of Patent: November 24, 2020
    Assignee: Apple Inc.
    Inventors: Wei Lin, Henry E. Herman, III, Po-Jui Chen, Robert W. Rumford, Steve L. Terry, Yindar Chuo
  • Patent number: 10846560
    Abstract: A system for performing single Gaussian skin detection is described herein. The system includes a memory and a processor. The memory is configured to receive image data. The processor is coupled to the memory. The processor is to generate a single Gaussian skin model based on a skin dominant region associated with the image data and a single Gaussian non-skin model based on a second region associated with the image data and to classify individual pixels associated with the image data via a discriminative skin likelihood function based on the single Gaussian skin model and the single Gaussian non-skin model to generate skin label data associated with the image data.
    Type: Grant
    Filed: March 25, 2016
    Date of Patent: November 24, 2020
    Assignee: Intel Corporation
    Inventors: Lin Xu, Liu Yang, Anbang Yao, Yurong Chen
  • Patent number: 10845927
    Abstract: A touch panel includes a touch sensing layer, a flexible circuit board and an anisotropic conductive film. The touch sensing layer includes sensing pads and a reserved room, and the reserved room is arranged outside the sensing pads. The flexible circuit board includes conductive pads, the outermost conductive pad is provided with a virtual pattern, and the position of the virtual pattern corresponds to the position of the reserved room. The anisotropic conductive film is arranged between the touch sensing layer and the flexible circuit board, and the sensing pads are respectively electrically connected to the conductive pads through the anisotropic conductive film.
    Type: Grant
    Filed: June 4, 2019
    Date of Patent: November 24, 2020
    Assignees: Interface Technology (Chengdu) Co., Ltd., Interface Optoelectronics (Shenzhen) Co., Ltd., General Interface Solution Limited
    Inventors: Po-Lin Chen, Hsuan-Man Chang, Min-Hui Yin, Chu-Jung Lin, Mei-Hua Chou
  • Publication number: 20200366703
    Abstract: A system for managing information security attack and defense planning includes a hacker end, an observer end, and a manager end. The hacker end conducts a real-word hacking exercise to hack a targeted website through a monitoring and control server. The observer end monitors the hacker end. The manager end provides an analysis platform communicatively connected to the monitoring and control server. The hacker end and the observer end generate a first independent report and a second independent report respectively according to logged information during the real-world hacking exercise and respectively transmit the first independent report and the second independent report to the analysis platform through the targeted institution for analysis, allowing the manager end to generate a summary report including flaws and vulnerabilities in information security and transmit the summary report to the targeted institution for the targeted institution to objectively and effectively assess the summary report.
    Type: Application
    Filed: May 13, 2019
    Publication date: November 19, 2020
    Inventors: Chien-Yang HSU, Ju-We CHEN, Yi LIN
  • Publication number: 20200364547
    Abstract: The present disclosure relates to a neural network artificial intelligence chip and a method for forming the same. The neural network artificial intelligence chip includes: a storage circuit, that includes a plurality of storage blocks; and a calculation circuit, that includes a plurality of logic units, the logic units being correspondingly coupled one-to-one to the storage blocks, and the logic unit being configured to acquire data in the corresponding storage block and store data to the corresponding storage block.
    Type: Application
    Filed: April 17, 2020
    Publication date: November 19, 2020
    Applicants: ICLEAGUE Technology Co., Ltd., AP Memory Technology Corp.
    Inventors: Wenliang CHEN, Eugene Jinglun TAM, Lin MA, Joseph Zhifeng XIE, Alessandro MINZONI
  • Publication number: 20200365593
    Abstract: A semiconductor structure is provided. The semiconductor structure includes a first hybrid bonding structure, a memory structure, and a control circuit structure. The first hybrid bonding layer includes a first surface and a second surface. The memory structure is in contact with the first surface. The control circuit structure is configured to control the memory structure. The control circuit structure is in contact with the second surface. A system in package (SiP) structure and a method for manufacturing a plurality of semiconductor structures are also provided.
    Type: Application
    Filed: July 3, 2020
    Publication date: November 19, 2020
    Inventors: WENLIANG CHEN, LIN MA