Abstract: A head-mounted display device includes a body, an eye tracking module and a face gasket. The body has a first lens and a second lens corresponding to both eyes, and also has a first positioning portion. The eye tracking module is assembled to and electrically connected to the body and includes an outer frame, a first camera, a second camera, a first lens frame and a second lens frame. The outer frame has a second positioning portion. The second positioning portion is used for connecting with the first positioning portion, so that the outer frame is positioned on the body. The first lens frame and the second lens frame are movably arranged on the outer frame. The first lens frame is used for connecting the first lens. The second lens frame is used for connecting the second lens. The first camera is arranged on the first lens frame. The second camera is arranged on the second lens frame. The first camera and the second camera are used to shoot both eyes.

Abstract: A congestion processing method is applied to a first node, and includes receiving congestion information, wherein the congestion information is used for congestion processing of the first node; and performing the congestion processing based on the congestion information.

Abstract: A backlight module and a display device are provided, and the backlight module includes a light guide plate, a plurality of light-emitting components, and a frame. The light guide plate includes a first side, a second side, and two third sides. The light-emitting components are disposed on the first side, and light generated from the light-emitting components enters the light guide plate from the first side. The frame covers the second side and the third sides and includes an opening and at least one buffer portion. The light-emitting components are disposed in the opening, and the buffer portion is disposed on a side of the opening and contacts the light guide plate.

Abstract: A semiconductor device and a method of forming the same are provided. The method includes forming a sacrificial gate structure over an active region. A first spacer layer is formed along sidewalls and a top surface of the sacrificial gate structure. A first protection layer is formed over the first spacer layer. A second spacer layer is formed over the first protection layer. A third spacer layer is formed over the second spacer layer. The sacrificial gate structure is replaced with a replacement gate structure. The second spacer layer is removed to form an air gap between the first protection layer and the third spacer layer.

Abstract: An electronic device is provided with an active area and a peripheral area, and includes a first substrate, a second substrate, a sealant frame, a conductive member and a wall structure. The second substrate is arranged opposite to the first substrate. The sealant frame is arranged on the first substrate and surrounds the active area. The conductive member is arranged on the peripheral area, wherein part of the conductive member is arranged between the first substrate and the second substrate. The wall structure is arranged between the first substrate and the second substrate, wherein the wall structure is arranged between the sealant frame and the conductive member when viewed in a top view direction.

Abstract: The present invention discloses a design for reducing a dark count rate of a superconducting nanowire single photon detector (SNSPD) based on a two-wire structure, which includes: intertwining two niobium nitride nanowires that are not crossed to form an SNSPD of a two-wire structure; regulating and controlling behaviors of one nanowire by adopting the other nanowire, and regulating bias current to be close to superconducting critical current; introducing an optical signal into a photosensitive area of the detector by adopting an optical fiber; outputting two channels of signals respectively through the two nanowires to make the dark count rates of the two nanowires mutually excited; and through a voltage comparator and an exclusive-OR gate, reducing a dark count rate signal, and retaining a photon response signal.

Abstract: A mass transferring system and the method thereof are provided. The system includes two platforms and a plurality of picking and placing units. When the mass transferring process is performed for one of the substrates, the replacing process and the aligning process are simultaneously executed for another one of the substrates, such that the mass transferring process and the replacing process can be performed at the same time. Compared with the conventional mass transferring processes, the efficiency of the mass transferring system and the method thereof according to the present invention can be increased by 90%.

Abstract: A stand adjustment device has a tripod-connecting member, a connecting seat, a proximal clamping plate, a boom-connecting tube, a locking shaft, and a manual operating member. The connecting seat is rotatably located around the tripod-connecting member. The proximal clamping plate is detachably attached to a side of the connecting seat. One end of the locking shaft is movably disposed in the boom-connecting tube. The boom is slidably mounted through the boom-connecting tube and the locking shaft. The locking shaft is slidably mounted through the boom-connecting tube, the proximal clamping plate, and the connecting seat such that the boom-connecting tube is rotatable relative to the connecting seat. The manual operating member and the locking shaft are configured to clamp the boom-connecting tube, the proximal clamping plate, and the connecting seat therebetween into a locked condition.

Abstract: A method for advertising a processing capability of a network device, a system, and a network device are disclosed, and relate to the field of communication technologies. The method is performed by a network device, and includes: generating a advertisement message including indication information, where the indication information is used to indicate a processing capability of the network device, the processing capability of the network device includes a processing capability of ignoring secondary path information included in a packet when the network device serves as a network device on a primary path for forwarding the packet and receives the packet including primary path information and the secondary path information, and the secondary path information is used to indicate one or more secondary paths for forwarding the packet when the primary path is unavailable.

Abstract: A semiconductor device includes a semiconductor substrate, an epitaxial structure, a silicide structure, a conductive structure, and a protection segment. The epitaxial structure is disposed in the semiconductor substrate. The silicide structure is disposed in the epitaxial structure. The conductive structure is disposed over the silicide structure and is electrically connected to the silicide structure. The protection segment is made of metal nitride, is disposed over the silicide structure, and is disposed between the silicide structure and the conductive structure.

Abstract: A stand adjustment device has a tripod-connecting member, a connecting seat, a distal clamping plate, a boom-connecting tube, a locking shaft, and a manual operating member. The connecting seat is rotatably located around the tripod-connecting member. The distal clamping plate is detachably attached to a side of the connecting seat. One end of the locking shaft is movably disposed in the boom-connecting tube. The boom is slidably mounted through the boom-connecting tube and the locking shaft. The locking shaft is slidably mounted through the boom-connecting tube, the distal clamping plate, and the connecting seat such that the boom-connecting tube is rotatable relative to the connecting seat. The manual operating member and the locking shaft are configured to clamp the boom-connecting tube, the distal clamping plate, and the connecting seat therebetween into a locked condition.

Abstract: Methods of forming metal-containing films for electronic devices (e.g., logic devices and/or memory devices) and methods for reducing equivalent oxide thickness (EOT) penalty in electronic devices are disclosed. The methods comprise exposing a substrate surface to a metal precursor, such as titanium chloride (TiCl4), a reducing agent, such as a cyclic 1,4-diene, and a reactant, ammonia (NH3), either simultaneously, partially simultaneously or separately and sequentially to form the metal-containing film.

Abstract: A window blind, wherein each ladder tape thereof includes two longitudinal cords, plural bearers and plural limiting members. The longitudinal cords each have an end connected to a deflecting mechanism disposed on the upper rail. The bearers are disposed between the two longitudinal cords for respectively supporting the slats. The limiting members include a first limiting member and a second limiting member neighboring thereto. The first limiting member has an end disposed on one of the longitudinal cords and includes a first slat-through portion located between two ends thereof passing through a first through hole of a first slat. A first linking loop is formed after the first slat-through portion passes through the first through hole. The second limiting member passes through the first linking loop for keeping the first through hole threaded through by one of the first limiting member and the second limiting member.

Abstract: Methods, systems, and devices for full multi-plane operation enablement are described. A flash controller can determine that a first plane of a set of planes of a memory die is an invalid plane. The flash controller can issue a single descriptor associated with a multi-plane operation for the set of planes of the memory die. The single descriptor can include a plurality of commands for the multi-plane operation in which the first command of the plurality of commands can be a duplicate of a second command of the plurality of commands based on the first plane being the invalid plane. In some cases, a negative-and (NAND) controller can receive the single descriptor associated with the multi-plane operation for the set of planes of a memory die. The NAND controller can issue a plurality of commands for the multi-plane operation based on receiving the single descriptor.

Abstract: A method includes: forming a masking layer on a backside of a substrate, the substrate including pixel regions having photodetectors, transistors being positioned on or in a frontside of the substrate; forming a mask opening in the masking layer by exposing the masking layer to patterned light, the opening including: mask pixel regions that mask the pixel regions; and mask protrusion regions that extend from the mask pixel regions toward a mask crossroad region; forming a substrate opening in the substrate by etching the substrate through the mask opening; and forming an isolation structure in the substrate opening.

Abstract: An integrated circuit includes a first semiconductor wafer, a second semiconductor wafer, a first interconnect structure, a first through substrate via, and an under bump metallurgy (UBM) layer. The first semiconductor wafer has a first side of the first semiconductor wafer. The second semiconductor wafer is coupled to the first semiconductor wafer, and is over the first semiconductor wafer. The second semiconductor wafer has a first device in a first side of the second semiconductor wafer. The first interconnect structure is on a second side of the first semiconductor wafer opposite from the first side of the first semiconductor wafer. The first interconnect structure includes an inductor below the first semiconductor wafer. The first through substrate via extends through the first semiconductor wafer. The first through substrate via electrically couples the inductor to at least the first device. The UBM layer is on a surface of the first interconnect structure.

Abstract: Semiconductor devices and their manufacturing methods are disclosed herein, and more particularly to semiconductor devices including a transistor having gate all around (GAA) transistor structures and manufacturing methods thereof. The methods described herein allow for complex shapes (e.g., “L-shaped”) to be etched into a multi-layered stack to form fins used in the formation of active regions of the GAA nanostructure transistor structures. In some embodiments, the active regions may be formed with a first channel width and a first source/drain region having a first width and a second channel width and a second source/drain region having a second width that is less than the first width.

Abstract: A test circuit includes a scan chain and a wrapper chain. The wrapper chain shifts in a test pattern according a first clock. The scan chain is coupled to the wrapper chain via a logic combination of a circuit under test. The wrapper chain is configured to transmit the test pattern to the scan chain via the logic combination according to a second clock in a capture phase. The wrapper chain includes a first, a second wrapper cell, and an asynchronous register. The first wrapper cell sequentially shifts in two bits of the test pattern in the shift-in phase. The second wrapper cell shifts in the first bit of the test pattern in the shift-in phase. The asynchronous register conducts the first wrapper cell to the second wrapper cell in the shift-in phase, and latches the second wrapper cell in the capture phase.

Abstract: A novel and environmentally preferable method is provided for preparing solid electrolyte particles capable of making dense, flexible, Li+ conducting electrolyte thin films. Methods are also provided for using the solid electrolyte particles and/or thin films in manufacturing safer and more efficient lithium-based batteries. In particular, the method uses inorganic precursors instead of using organic precursors in preparing an aerosol and then convert the aerosol to solid powders to provide the solid electrolyte particles. The solid electrolyte particles prepared have a cubic polymorph and have a desired particle size range, and are capable of making a solid electrolyte film with a thickness less than 50 ?m.

Abstract: A positioning method includes: transmitting, by a transmitting device, a pilot signal to an electromagnetic reflecting surface; transmitting, by the transmitting device, control information to an electromagnetic reflecting surface control unit, where the control information includes temporal information and control direction information, the control information is used for instructing the electromagnetic reflecting surface control unit to orient, in target time periods, reflected beams formed by target pilot signals on the electromagnetic reflecting surface towards preset directions, and the preset directions are directions indicated by multiple pieces of preset direction information corresponding to respective ones of the target time periods; and determining, by the transmitting device or the receiving device, signal measurement results corresponding to the preset directions, and positioning, by the transmitting device or the receiving device, the receiving device according to the preset directions and the s