Abstract: A device and method of forming a device are provided. The method includes forming a stack of nanostructure channels over a substrate by forming a source/drain opening. The method also includes forming a sacrificial source/drain in the source/drain opening. The method further includes increasing tensile strain of the stack of nanostructure channels by replacing the sacrificial source/drain with a replacement source/drain having germanium concentration that exceeds that of the sacrificial source/drain.

Abstract: A method for fabricating a semiconductor device is disclosed. The method involves forming a stack of alternating semiconductor channels and interposers on a substrate, with sacrificial structures between the interposers. Source/drain openings are formed, and strain in the channels is modified. Source/drain structures are formed in the openings, and dielectric layers are deposited. The resulting device features stacked nanostructures with inner spacers of varying heights, enabling improved performance in electronic devices.

Abstract: A reticle clamping module includes two clamping mechanisms and a plurality of anti-slip filler members. The two clamping mechanisms are disposed opposite to each other to form a reticle space. Each of the two clamping mechanisms includes a clamping member and a power member. A reticle contact surface of the clamping member is provided with a first groove, the power member is disposed at a back surface of the clamping member opposite to the reticle contact surface to push the clamping member to reciprocate, and the plurality of anti-slip filler members are respectively disposed in the first grooves of the two clamping mechanisms. The reticle clamping module of the present disclosure is capable of securely clamping and preventing damage of a reticle, as well as preventing the reticle from scratches or inappropriate forces applied thereupon.

Abstract: An electrical receptacle connector includes a metallic shell, an insulated housing in the metallic shell, a plurality of terminals at the insulated housing, and a metallic plate at the insulated housing. The terminals include two first terminal groups and two second terminal groups arranged in two rows, and the two rows are respectively arranged on the two faces of a tongue portion of the insulated housing. A length of each contact portion of each second terminal group is greater than a length of each contact portion of each first terminal group. The metallic plate is between the first terminal groups and the second terminal groups. The metallic plate has one or more extension portion between the contact portions of at least two adjacent terminals of one or more of the second terminal groups. The structural strength of the tongue portion can be improved by the extension portion.

Abstract: A gold finger connector and memory storage device having the same. The gold finger connector includes a connector body; a plurality of ground pins; and at least one signal shielding structures, disposed on a first ground pin of the plurality of ground pins, wherein the at least one first signal shielding structure is connected to the outside of a first side of an extension part of the first ground pin and electrically conducts at least two layers of the first ground pin.

Abstract: The present disclosure relates to managing communications between a first wireless communication device and a second communication device, including communicating, by a first wireless communication device with a second wireless communication device, Sidelink (SL) communications, and determining, by the first wireless communication device, an anomaly state on a first carrier.

Abstract: A method for preparing lyophilized platelets and use in preparation of a traumatic hemostatic product are provided. The preparation method adopts appropriate lyophilization conditions, has a faster lyophilization process than conventional lyophilization processes, and can increase an activation rate of LPs to about 70% while maintaining an activity of the LPs. The lyophilized platelets prepared by the preparation method shows stronger migration ability than conventional LPs, have higher maximum amplitude (MA) of blood clots in in vitro and in vivo experiments than the conventional LPs, and exhibit an excellent hemostatic effect. In addition, the platelet transfusion stock solution has enhanced coagulation activity after transfusion into trauma simulation animals compared with the conventional LPs, and is distributed to injury sites in a larger quantity, thereby better promoting coagulation and improving post-traumatic coagulation dysfunction.

Abstract: An alkene-containing amide compound of formula (I) and agriculturally acceptable salts thereof can be used as herbicides.

Abstract: An electrical receptacle connector includes a metallic shell, an insulated housing in the metallic shell, a plurality of terminals at the insulated housing, and a metallic plate. The terminals are arranged in two rows, and the metallic plate is at the insulated housing and between the terminals in the two rows. The metallic plate includes a first through hole portion, several second through hole portions, and several communication hole portions communication hole portions. By allowing that the communication hole portions communication hole portions to be in communication with the first through hole portion and the second through hole portions in the metallic plate, the molding efficiency for forming the tongue portion with the filling of the plastic materials can be increased.

Abstract: Presented are systems, methods, apparatuses, or computer-readable media for multi-path communications. A centralized unit (CU) may send, to a distributed unit (DU), the multi-path configuration information. The CU may receive, from the DU, multi-path configuration response information.

Abstract: Presented are systems, methods, apparatuses, or computer-readable media for facilitating handovers. A first wireless communication node may send, to a second wireless communication node, a handover request message identifying at least one wireless communication device in a user equipment (UE)-to-network relay configuration or an aggregation configuration. The first wireless communication node may receive, from the second wireless communication node, a handover request acknowledgement information identifying the at least one wireless communication device with which a handover is permitted.

Abstract: The present disclosure relates to communicating, by a first wireless communication device with a second wireless communication device, via a sidelink interface. The first wireless communication device may send at least one of beam measurement configuration or beam Reference Signal (RS) to the second wireless communication device via the sidelink interface. The first wireless communication device may receive beam measurement result from the second wireless communication device via the sidelink interface.

Abstract: A method of wireless communication is described. A method of wireless communication, comprising transmitting, from an integrated access and backhaul (IAB) node to an IAB donor, IAB node mobility status information.

Abstract: Methods of forming a semiconductor device are provided. A method according to the present disclosure includes forming, over a workpiece, a dummy gate stack comprising a first semiconductor material, depositing a first dielectric layer over the dummy gate stack using a first process, implanting the workpiece with a second semiconductor material different from the first semiconductor material, annealing the dummy gate stack after the implanting, and replacing the dummy gate stack with a metal gate stack.

Abstract: The present disclosure provides to a link state notification method, a link state notification device, a link processing method, a link processing device, a storage medium and an electronic device. The link state notification method includes: transmitting, by a first communication node, link state information to a second communication node which is a child node of the first communication node.

Abstract: A semiconductor device according to the present disclosure includes a logic cell and a memory array including a plurality of memory cells. The memory cells and the logic cell are arranged in a row, and a first plurality of the memory cells are positioned closer to the logic cell than a second plurality of the memory cells. A frontside interconnect structure is disposed over the memory cells and includes a frontside bit line. The frontside bit line is coupled to each of the memory cells arranged in the row. A backside interconnect structure is disposed under the memory cells and includes a backside bit line. The backside bit line is coupled to at least the first plurality of the memory cells. The frontside bit line is coupled to the backside bit line through a source/drain feature of a pass-gate transistor of one of the first plurality of the memory cells.

Abstract: An image sensor includes a plurality of pixels. Each of the plurality of pixels includes a photodiode. Each pixel further includes a color filter over the photodiode. Each pixel further includes a first transparent conductive layer over the color filter. Each pixel further includes an electro-optical (EO) film over the first transparent conductive layer. Each pixel further includes a second transparent conductive layer over the EO film. Each pixel further includes a pillar of transparent conductive material electrically connecting the first transparent conductive layer and the second transparent conductive layer.

Abstract: A 3D pop-up card assembly having a base card and a foldable figure that pops up when the base card is opened. The foldable figure is attached to the base card using a plurality of paper hinge constructs. Each of the paper hinge constructs has a first tab, a second tab and a transition section. The transition section contains fold lines along which each of the paper hinge constructs can fold. The first tab of each paper hinge construct is attached to the base card. The second tab of each paper hinge construct is attached to the foldable figure. When the base card is opened, each paper hinge construct can rotate in unaligned planes, therein applying tension to the foldable figure as the orientation between the base card and the foldable figure changes.

Abstract: A semiconductor image sensing structure includes a semiconductor substrate having a front side and a back side, a pixel sensor disposed in the semiconductor substrate, a transistor disposed over the front side of the semiconductor substrate, and a reflective structure disposed over the front side of the semiconductor substrate. A gate structure of the transistor and the reflective structure include a same material. A top surface of the gate structure of the transistor and a top surface of the reflective structure are aligned with each other.

Abstract: An integrated circuit includes a first nanosheet transistor and a second nanosheet transistor on a substrate. The first and second nanosheet each include gate electrodes. A gate isolation structure extends from a backside of the substrate between the gate electrodes. The gate isolation structure physically and electrically isolates the first and second gate electrodes from each other.