Lin Chen has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
Abstract: A method includes obtaining a first image of a scene using a first image sensor of an electronic device and a second image of the scene using a second image sensor of the electronic device. The method also includes generating a first feature map from the first image and a second feature map from the second image. The method further includes generating a third feature map based on the first feature map, the second feature map, and an asymmetric search window. The method additionally includes generating a depth map by restoring spatial resolution to the third feature map.
December 12, 2019
December 17, 2020
Chenchi Luo, Yingmao Li, Youngjun Yoo, George Q. Chen, Kaimo Lin, David D. Liu, Gyeongmin Choe
Abstract: An optical element driving mechanism is provided. The optical element driving mechanism includes a movable portion, a fixed portion, a driving assembly, and a stopping assembly. The movable portion is used for connecting to an optical element having a main axis. The movable portion is movable relative to the fixed portion. The driving assembly is disposed on the fixed portion or the movable portion to move the movable portion relative to the fixed portion. The stopping assembly connects to the movable portion and the fixed portion to limit the range of motion of the movable portion relative to the fixed portion.
Abstract: An optical element driving mechanism is provided, including a fixed portion, a movable portion, a driving assembly, and a stopping assembly. The movable portion is movably connected to the fixed portion, wherein the movable portion is used for connecting to an optical element having a main axis. The driving assembly is disposed on the fixed portion or the movable portion, and the driving assembly is used for driving the movable portion to move relative to the fixed portion. The stopping assembly is connected to the movable portion and the fixed portion.
Abstract: A device includes a die paddle and a plurality of leads. The leads surround the die paddle. Each of the leads includes an inner lead portion adjacent to and spaced apart from the die paddle, an outer lead portion opposite to the inner lead portion and a bridge portion between the inner lead portion and the outer lead portion. The inner lead portion has an upper bond section connected to the bridge portion and a lower support section below the upper bond section. A sum of a thickness of the upper bond section and a thickness of the lower support section is greater than a thickness of the bridge portion.
June 14, 2019
December 17, 2020
Advanced Semiconductor Engineering, Inc.
Abstract: A semiconductor device structure is provided. The semiconductor device structure includes a substrate. The semiconductor device structure includes a gate stack over the substrate, wherein the gate stack has a first portion and a second portion under the first portion, and the first portion is wider than the second portion. The semiconductor device structure includes a first spacer and a second spacer over opposite sides of the gate stack. The first spacer has a first upper portion and a first lower portion, the second spacer has a second upper portion and a second lower portion. The first spacer has a first recess, the first upper portion is between the first recess and the gate stack, the first lower portion is under the first recess, and the first recess has a first inner wall facing away from the gate stack.
Abstract: A pixel circuit includes a driving circuit, a lighting element, and multiple switching circuits. The driving circuit is configured to provide a driving current to a first node. A first terminal of the lighting element is coupled with a second node. A second terminal of the lighting element is configured to receive a system low voltage. The multiple switching circuits are coupled between the first node and the second node in a parallel connection, and configured to correspondingly receive multiple emission control signals and at least one grayscale control signal. During each frame, the multiple emission control signals provide multiple pulses, and the multiple pulses do not mutually overlapping in time sequence, so that the multiple switching circuits selectively couple the first node to the second node according to the multiple pulses and the at least one grayscale control signal.
Abstract: A multiplexer circuit includes first and second fins each extending in an X-axis direction. First, second, third and fourth gates extend in a Y-axis direction perpendicular to the X-axis direction and contact the first and second fins. The first, second, third and fourth gates are configured to receive first, second, third and fourth data signals, respectively. Fifth, sixth, seventh and eighth gates extend in the Y-axis direction and contact the first and second fins, the fifth, sixth, seventh and eighth gates, and are configured to receive the first, second, third and fourth select signals, respectively. An input logic circuit is configured to provide an output at an intermediate node. A ninth gate extends in the Y-axis direction and contacts the first and second fins. An output logic circuit is configured to provide a selected one of the first, second, third and fourth data signals at an output terminal.
Abstract: The low power wide area network communication mechanism mainly allocates the semi-persistent scheduling (SPS) frames to the terminal devices having network access requirements sequentially by the gateway. The SPS cycle is composed of a plurality of SPS frames and at least one buffering frame. In each SPS cycle, a data reception window is activated by the gateway according to each allocated SPS frames; the SPS frames that the networked terminal devices belong to are activated synchronously within each SPS cycle in order for the networked terminal devices to perform a data transmission with the gateway during each SPS cycle and ensure that the data transmission does not overlap with the data sent by other terminal devices. The scheduling may be re-scheduled at a preset time interval to allocate the SPS frames of terminal devices that are inoperable or out of service area to the terminal devices having network access requirements.
June 11, 2019
December 17, 2020
Yu-Lin Hwang, Tsun-Nan Chen, Tee Kian Hwee
Abstract: An adaptive micro-battery array including: a substrate having at least one charging and discharging port; a plurality of micro-battery units located on the substrate and each having at least one micro control unit and at least one energy storage unit; and a connecting network; where the connecting network and the micro control unit are formed on the substrate by a semiconductor fabrication process, and each of the micro-battery units is controlled by the at least one micro control unit therein to determine whether to make the at least one energy storage unit electrically connected to the connecting network, so that each of the at least one charging and discharging port is electrically connected with a corresponding micro-battery configuration.
Abstract: An ultrasonic sensing device includes a housing, a piezoelectric assembly, a board and a plurality of fixing members. The housing includes a bottom wall, a top wall and a surrounding side wall connected between the top wall and the bottom wall. The piezoelectric assembly includes an encapsulating body and a piezoelectric sheet, wherein at least a portion of the piezoelectric sheet is enclosed by the encapsulating body and has a sensing surface exposed to the encapsulating body and facing the bottom wall. The board is disposed on the top wall of the housing and has a pressing surface facing the encapsulating body and the top wall. The plurality of fixing members is configured to fix the board to the top wall of the housing to press the board to the encapsulating body of the piezoelectric assembly, thereby pressing the sensing surface of the piezoelectric sheet to the bottom wall.
Abstract: A photo-detecting apparatus is provided. The photo-detecting apparatus includes at least one pixel, and each pixel includes N subpixels, wherein each of the subpixels comprises a detection region, two first conductive contacts, wherein the detection region is between the two first conductive contacts, wherein N is a positive integer and is ?2.
Abstract: Spirometer, mouthpiece tube and inspection method thereof. The spirometer includes at least the mouthpiece tube and an ultrasound detector configured to detect the ultrasound generated by the gas flowing through the mouthpiece tube, wherein the mouthpiece tube has a shell having an opened end, a closed or opened end, and an ultrasonic generator configured to be inserted into different portions of the shell in different situations. Therefore, by inserting the ultrasonic generator into different portions of the shell during expiration and inspiration, the gas flow during expiration and inspiration may be converted into the ultrasonic signal and then maybe detected and analyzed.
August 15, 2017
Date of Patent:
December 15, 2020
Chia-Hung Chen, Hsiao-Pao Yen, Chia-Chi Su, Liang-Lin Yen
Abstract: A method of manufacturing a semiconductor device includes exposing a material to a semi-aqueous etching solution. The semi-aqueous etching solution comprises a solvent which chelates with the material and acts as a catalyst between the etching driving force and the material. As such, the etching driving force may be used to remove the material.
Abstract: A semiconductor device and a method of forming the same are provided. The method includes forming a sacrificial gate structure over an active region. A first spacer layer is formed along sidewalls and a top surface of the sacrificial gate structure. A first protection layer is formed over the first spacer layer. A second spacer layer is formed over the first protection layer. A third spacer layer is formed over the second spacer layer. The sacrificial gate structure is replaced with a replacement gate structure. The second spacer layer is removed to form an air gap between the first protection layer and the third spacer layer.
Abstract: An electronic device and a manufacturing method thereof are provided. The electronic device includes a chip package, an antenna pattern, and an insulating layer. The chip package includes a semiconductor die and an insulating encapsulation enclosing the semiconductor die. The antenna pattern is electrically coupled to the chip package, where a material of the antenna pattern comprises a conductive powder having fused metal particles. The insulating layer disposed between the chip package and the antenna pattern, where the antenna pattern includes a first surface in contact with the insulating layer, and a second surface opposite to the first surface, and a surface roughness of the second surface is greater than a surface roughness of the first surface.
Abstract: Present disclosure provides gate-all-around structure including a first transistor. The first transistor includes a semiconductor substrate having a top surface, a first nanowire over the top surface of the semiconductor substrate and between a first source and a first drain, a first gate structure around the first nanowire, an inner spacer between the first gate structure and the first source and first drain, and an isolation layer between the top surface of the semiconductor substrate and the first source and the first drain. Present disclosure also provides a method for manufacturing the gate-all-around structure described herein.
Abstract: A fault detection method in a semiconductor fabricating factory is provided. The method includes delivering a test vehicle along a rail to a test region. The method further includes projecting a test signal from a transducer that is positioned on the test vehicle over a check board when the test vehicle is located within the test region. The check board and the test vehicle are arranged along an axis that is parallel to the rail. The method also includes performing an analysis of the test signal projected over the check board. In addition, the method includes issuing a warning alarm when an abnormality is detected based on the analysis result.
Abstract: A window blind includes a first rail, a second rail, a plurality of slats, a modulation mechanism, and an adjustment unit. The modulation mechanism includes a modulation shaft which can drive two warps of the ladder tape to make a relative movement in a vertical direction, whereby to modulate the slats to turn. When the slats are turned from a first position to a second position, the adjustment unit moves a rear cord which is used to move the second rail, whereby to change a length of a segment of the rear cord between a bottom edge of the first rail and a top edge of the second rail. In this way, the second rail could be turned along with the slats which are driven by the modulation shaft, and the problem of light leakage could be improved.
Abstract: A semiconductor device includes a first metal wiring layer, an interlayer insulating layer formed over the first metal layer, a second metal wiring structure embedded in the interlayer dielectric layer and connected to the first metal wiring layer, and an etch-stop layer disposed between the first metal wiring and the first interlayer dielectric layer. The etch-stop layer includes one or more sub-layers. The etch-stop layer includes a first sub-layer made of an aluminum-based insulating material, hafnium oxide, zirconium oxide or titanium oxide.
Abstract: A control structure for a window covering includes a base, a revolving wheel having an axial post, a restriction means including a bushing fitting around the axial post, a transmission member provided on a side of the bushing, and at least one pawl connected to the axial post. The revolving wheel is connected to the base. The restriction means has at least one cutting groove. The transmission member has at least one abutting portion on an inner wall thereof. The pawl is pivotable within a width of the cutting groove. When the revolving wheel is rotated forward, an end of the pawl passes through the cutting groove to mesh with the abutting portion. When the revolving wheel is rotated backward, the pawl disengages from the abutting portion, and the transmission member is rotatable relative to the revolving wheel. Whereby, it could prevent generating noise while operating the window covering.