Abstract: A heat transferring module adapted to contact a heating element is provided. The heat transferring module includes a first plate, a second plate and a working fluid. The second plate is connected to the first plate to form a cavity therewith, and the cavity extends along an extension direction of a reference plane. The working fluid is located in the cavity, wherein the cavity is a first area, and a portion of the first plate or a portion of the second plate extending beyond the cavity is a second area. The first area transfers heat by heat convection, and the second area transfers heat by heat conduction.

Abstract: Examples herein relate to cooling systems. In one example, a cooling system comprises a plurality of adjacent fan modules configured to generate a plurality of cooling flows, a fan cage having a central axis adapted to contain the plurality of adjacent fan modules, the fan cage comprising a cavity on its central axis. Furthermore, the system comprises a first support bracket adapted to support the fan cage such that the fan cage rotates on its central axis and a bush established in the cavity of the fan cage. A first end of the bush is adapted to engage the first support bracket on a first surface of the fan cage.

Abstract: A roaster for roasting articles includes a containing device, an air supplying device, a first separating device, and a collector device. The containing device defines a roasting chamber. The air supplying device generates a heated air stream that flows into the roasting chamber. The first separating device has a shell unit disposed above the containing device, and a first separating member disposed in the shell unit and configured such that impurities which are carried along with the heated air stream are filtered out from the heated air stream. The collector device is connected to the shell unit for collecting the impurities filtered out from the heated air stream.

Abstract: A nitride semiconductor structure includes a substrate, a nitride semiconductor layer, and a buffer stack layer between the substrate and the nitride semiconductor layer. The buffer stack layer includes a plurality of metal nitride multilayers repeatedly stacked, wherein each of the metal nitride multilayers consists of a first, a second, and a third metal nitride thin films in sequence, or consists of the first, the third, the second, and the third metal nitride thin films in sequence. The aluminum concentration of the first metal nitride thin film is higher than that of the third metal nitride thin film, and the aluminum concentration of the third metal nitride thin film is higher than that of the second metal nitride thin film.

Abstract: A heat transferring module adapted to contact a heat element is provided. The heat transferring module includes a first plate, a second plate and a working fluid. The second plate is connected to the first plate to form a cavity therewith, and the cavity extends along an extension direction of a reference plane. The working fluid is located in the cavity, wherein the cavity is a first area, and a portion of the first plate or a portion of the second plate extending beyond the cavity is a second area. The first area transfers heat by heat convection, and the second area transfers heat by heat conduction.

Abstract: A substrate includes a substrate body and an interconnection layer disposed on a bearing surface of the substrate body and having an annular portion and a plurality of protrusions extending outward from an outer periphery of the annular portion. A package module is formed by the substrate, a chip mounted on the bearing surface of the substrate body, and a cap enclosing the chip and having a bottom thereof adhered to the interconnection layer of the substrate by an adhesive. By means of the protrusions of the interconnection layer, the bonding area of the adhesive is increased and the spread of the adhesive is effectively concentrated.

Abstract: A substrate includes a substrate body and an interconnection layer disposed on a bearing surface of the substrate body and having an annular portion and a plurality of protrusions extending outward from an outer periphery of the annular portion. A package module is formed by the substrate, a chip mounted on the bearing surface of the substrate body, and a cap enclosing the chip and having a bottom thereof adhered to the interconnection layer of the substrate by an adhesive. By means of the protrusions of the interconnection layer, the bonding area of the adhesive is increased and the spread of the adhesive is effectively concentrated.

Abstract: A nitride semiconductor structure includes a substrate, a nitride semiconductor layer, and a buffer stack layer between the substrate and the nitride semiconductor layer. The buffer stack layer includes a plurality of metal nitride multilayers repeatedly stacked, wherein each of the metal nitride multilayers consists of a first, a second, and a third metal nitride thin films in sequence, or consists of the first, the third, the second, and the third metal nitride thin films in sequence. The aluminum concentration of the first metal nitride thin film is higher than that of the third metal nitride thin film, and the aluminum concentration of the third metal nitride thin film is higher than that of the second metal nitride thin film.

Abstract: The present invention is related to a core-shell particle and preparation and use thereof. The core of the core-shell particle includes a vinyl polymer. The shell of the core-shell particle includes a hydrophobic silane bonded to a surface of the core via a silane coupling agent. The core-shell particles are applied in a matting material as a matting agent.

Abstract: The present invention is related to a core-shell particle and preparation and use thereof. The core of the core-shell particle includes a vinyl polymer. The shell of the core-shell particle includes a hydrophobic silane bonded to a surface of the core via a silane coupling agent. The core-shell particles are applied in a matting material as a matting agent.

Abstract: Examples herein relate to cooling systems. In one example, a cooling system comprises a plurality of adjacent fan modules configured to generate a plurality of cooling flows, a fan cage having a central axis adapted to contain the plurality of adjacent fan modules, the fan cage comprising a cavity on its central axis. Furthermore, the system comprises a first support bracket adapted to support the fan cage such that the fan cage rotates on its central axis and a bush established in the cavity of the fan cage. A first end of the bush is adapted to engage the first support bracket on a first surface of the fan cage.

Abstract: In one example in accordance with the present disclosure, a system comprises a first computing device comprising a first baseboard management controller (BMC), a second computing device comprising a second BMC, a first universal serial bus (USB) port coupled to the first BMC, a second USB port coupled to the second BMC, a multiplexor coupled to the first USB port and the second USB port, a shared USB port coupled to the multiplexor, and a chassis manager coupled to the first computing device and the second computing device. The chassis manager may connect, with the multiplexor, the shared port to the first USB port or the second USB port.

Abstract: In one example in accordance with the present disclosure, a system comprises a first computing device comprising a first baseboard management controller (BMC), a second computing device comprising a second BMC, a first universal serial bus (USB) port coupled to the first BMC, a second USB port coupled to the second BMC, a multiplexor coupled to the first USB port and the second USB port, a shared USB port coupled to the multiplexor, and a chassis manager coupled to the first computing device and the second computing device. The chassis manager may connect, with the multiplexor, the shared port to the first USB port or the second USB port.

Abstract: An electronic assembly including a circuit board, a heat-generating element, and a heat pipe is provided. The heat-generating element includes a bottom surface and a side surface connected to the bottom surface. The heat-generating element is mounted on the circuit board via the bottom surface. The heat pipe is thermally coupled to the side surface of the heat-generating element to absorb heat from the heat-generating element. Additionally, an electronic device includes a casing, a display, and the above-described electronic assembly. The display is mounted on the casing. The electronic assembly is disposed in the casing. The heat-generating element is mounted on the circuit board and its side surface is thermally coupled to the heat pipe. As a result, the limitation on the thickness of the heat pipe is relaxed, thereby allowing the efficiency of the heat pipe to be increased.

Abstract: An electronic device including a case having a space, a circuit board disposed in the space, a heat source disposed on the circuit board and a vapor chamber disposed at a side of the circuit board and adjacent to the heat source is provided. The vapor chamber includes an upper sheet, a bottom sheet assembled with the upper sheet to form a chamber, and a working fluid disposed in the chamber.

Abstract: An electronic device and a heat dissipation plate are provided. The electronic device includes a frame or a housing, a first heat generating component, a second heat generating component and a heat pipe, and the heat dissipation plate includes the frame and the heat pipe. The heat pipe is installed at the frame or housing and has branches. An orthogonal projection of the heat pipe on the frame or the housing overlaps at least part of orthogonal projections of the first heat generating component and the second heat generating component on the frame or the housing.

Abstract: A roaster for roasting articles includes a containing device, an air supplying device, a first separating device, and a collector device. The containing device defines a roasting chamber. The air supplying device generates a heated air stream that flows into the roasting chamber. The first separating device has a shell unit disposed above the containing device, and a first separating member disposed in the shell unit and configured such that impurities which are carried along with the heated air stream are filtered out from the heated air stream. The collector device is connected to the shell unit for collecting the impurities filtered out from the heated air stream.

Abstract: An electronic assembly including a circuit board, a heat-generating element, and a heat pipe is provided. The heat-generating element includes a bottom surface and a side surface connected to the bottom surface. The heat-generating element is mounted on the circuit board via the bottom surface. The heat pipe is thermally coupled to the side surface of the heat-generating element to absorb heat from the heat-generating element. Additionally, an electronic device includes a casing, a display, and the above-described electronic assembly. The display is mounted on the casing. The electronic assembly is disposed in the casing. The heat-generating element is mounted on the circuit board and its side surface is thermally coupled to the heat pipe. As a result, the limitation on the thickness of the heat pipe is relaxed, thereby allowing the efficiency of the heat pipe to be increased.

Abstract: The disclosure provides a light-emitting diode and a method for manufacturing the same. The light-emitting diode comprises a N-type metal electrode, a N-type semiconductor layer contacted with the N-type metal electrode, a P-type semiconductor layer, a light-emitting layer interposed between the N-type semiconductor layer and the P-type semiconductor layer, a low-contact-resistance material layer positioned on the P-type semiconductor layer, a transparent conductive layer covered the low-contact-resistance material layer and the P-type semiconductor layer, and a P-type metal electrode positioned on the transparent conductive layer.

Abstract: An electronic device and a heat dissipation plate are provided. The electronic device includes a frame or a housing, a first heat generating component, a second heat generating component and a heat pipe, and the heat dissipation plate includes the frame and the heat pipe. The heat pipe is installed at the frame or housing and has branches. An orthogonal projection of the heat pipe on the frame or the housing overlaps at least part of orthogonal projections of the first heat generating component and the second heat generating component on the frame or the housing.