Patents by Inventor Lin Hsu

Lin Hsu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 12142843
    Abstract: An electronic device, including a metal back cover, a ground radiator, a third radiator, and a metal frame including a first cutting opening, a second cutting opening, a first radiator located between the first cutting opening and the second cutting opening, and a second radiator located beside the second cutting opening and separated from the first radiator by the second cutting opening, is provided. An end of a first slot formed between the metal back cover and a first part of the first radiator is communicated with the first cutting opening, and a second slot formed between the metal back cover and a second part of the first radiator and between the metal back cover and the second radiator is communicated with the second cutting opening. The ground radiator connects the metal back cover and the first radiator and separates the first slot from the second slot.
    Type: Grant
    Filed: February 23, 2023
    Date of Patent: November 12, 2024
    Assignee: PEGATRON CORPORATION
    Inventors: Chien-Yi Wu, Chao-Hsu Wu, Hau Yuen Tan, Chih-Wei Liao, Shih-Keng Huang, Wen-Hgin Chuang, Chia-Hong Chen, Lin-Hsu Chiang, Han-Wei Wang, Chun-Jung Hu
  • Patent number: 12144112
    Abstract: A display panel and a manufacturing method thereof are provided. The display panel includes a substrate, an active element, a driving circuit element, a first connection circuit, a second connection circuit and a conductive connector. The substrate has a first surface and a second surface opposite to the first surface. The active element is disposed on the first surface. The driving circuit element is disposed on the second surface and is overlapped with the active element. The first connection circuit is disposed on the first surface and is connected to the active element. The second connection circuit is disposed on the second surface and is connected to the driving circuit element. The conductive connector penetrates through the substrate and two ends of the conductive connector are electrically connected to the first connection circuit and the second connection circuit, respectively.
    Type: Grant
    Filed: November 2, 2022
    Date of Patent: November 12, 2024
    Assignee: E Ink Holdings Inc.
    Inventors: Yi Jiun Wu, Wen-Chung Tang, Yung-Sheng Chang, Cheng-Hao Lee, Yu-Lin Hsu, Kuo-Hsing Cheng
  • Publication number: 20240371854
    Abstract: An integrated circuit (IC) device includes a substrate, first and second semiconductor devices correspondingly in different first and second doped regions in the substrate. A gate of the first semiconductor device is electrically coupled to a source/drain of the second semiconductor device. The IC device further includes a first protection device configured as one of a first forward diode and a first reverse diode, and a second protection device configured as the other of the first forward diode and the first reverse diode. The first forward diode and the first reverse diode are electrically coupled in series between the substrate and a doped well. The doped well is in the first doped region and a source/drain of the first semiconductor device is in the doped well. Alternatively, the doped well is in the second doped region, and the source/drain of the second semiconductor device is in the doped well.
    Type: Application
    Filed: May 2, 2023
    Publication date: November 7, 2024
    Inventors: Chia-Lin HSU, Yu-Ti SU
  • Publication number: 20240356229
    Abstract: A microstrip antenna includes an insulating carrier, a circular body, two circular feeding points, a grounding element, and a power divider. The circular body has a first center and a radius. The two circular feeding points are surrounded by the circular body and are not connected. The two circular feeding points can produce a capacitive effect with the circular body. Each of the two circular feeding points has a second center, and a shortest distance between the second center and the first center is less than ½ of the radius. The grounding element is disposed on the insulating carrier. The power divider can generate a phase difference of 90 degrees between the two circular feeding points.
    Type: Application
    Filed: April 21, 2023
    Publication date: October 24, 2024
    Inventors: CHUN-HENG CHAO, MIAO-LIN HSU
  • Publication number: 20240347341
    Abstract: The present disclosure describes a system and a method for an ion implantation (IMP) process. The system includes an ion implanter configured to scan an ion beam over a target for a range of angles, a tilting mechanism configured to support and tilt the target, an ion-collecting device configured to collect a distribution and a number of ejected ions from the ion beam scan over the target, and a control unit configured to adjust a tilt angle based on a correction angle determined based on the distribution and number of ejected ions.
    Type: Application
    Filed: June 25, 2024
    Publication date: October 17, 2024
    Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Chun-Jung HUANG, Li-Hsin CHU, Po-Feng TSAI, Henry PENG, Kuang Huan HSU, Tsung Wei CHEN, Yung-Lin HSU
  • Patent number: 12087647
    Abstract: A compound closed-type metal lid for a semiconductor chip package is provided. The compound closed-type metal lid includes a cover plate, and a frame bottom board. The cover plate has a frame body, and a plurality of riveting holes. The riveting holes penetrate through the frame body and are distributed symmetrically on the frame body. The frame bottom board has a frame body, a plurality of riveting protrusions, and an opening. The riveting protrusions are distributed on an upper surface of the frame body. The cover plate is disposed on an upper surface of the frame bottom board. The riveting protrusions are correspondingly riveted in the riveting holes.
    Type: Grant
    Filed: February 18, 2022
    Date of Patent: September 10, 2024
    Assignee: HOJET TECHNOLOGY CO., LTD.
    Inventors: Ying-Lin Hsu, Juei-An Lo
  • Patent number: 12075585
    Abstract: An electronic device includes a casing and a waterproof lid structure. The casing has an opening. The waterproof lid structure corresponds in position to the opening and includes a supportive sheet metal, waterproof component, movable latch lid and bolts. The supportive sheet metal has an axle pivotally connected to one side of the opening. The waterproof component hermetically seals the opening and lies on one side of the supportive sheet metal. The movable latch lid covers the other side of the supportive sheet metal and is penetrated by passages. The bolts correspond in position to the passages, respectively, and each include a rod portion and a head portion disposed at one end of the rod portion. The rod portions pass through the passages and supportive sheet metal to get fastened to the waterproof component, allowing the head portions to stop at the outer side of the movable latch lid.
    Type: Grant
    Filed: August 8, 2022
    Date of Patent: August 27, 2024
    Assignee: GETAC Technology Corporation
    Inventors: Wan-Lin Hsu, Juei-Chi Chang, Hsin-Chih Chou
  • Publication number: 20240277790
    Abstract: Disclosed herein is a recombinant baculovirus for producing an alphavirus virus-like replicon particle (VRP) having an exogenous gene in a mosquito cell. Said recombinant baculovirus comprises: (1) a replicon comprising a first promoter, and a first polynucleotide encoding at least one alphavirus non-structural protein and is operably linked to the first promoter; and (2) a helper comprising a second promoter, and a second polynucleotide encoding at least one alphavirus structural protein and is operably linked to the second promoter; wherein, the helper is upstream or downstream to the replicon; and the first promoter is less effective than the second promoter in driving gene expression in the mosquito cell. Also encompassed in the present disclosure are methods for detecting an antibody against an alphavirus in a biological sample, and/or screening an antiviral agent suitable for treating an alphavirus infection, with the aid of the alphavirus VRP produced by the present recombinant baculovirus.
    Type: Application
    Filed: February 22, 2023
    Publication date: August 22, 2024
    Applicant: National Defense Medical Center
    Inventors: Hui-Chung LIN, Szu-Cheng KUO, Der-Jiang CHIAO, Chang-Chi LIN, Yu-Lin HSU, Hui-Tsu LIN, Shan-Ko TSAI
  • Publication number: 20240274597
    Abstract: A circuit includes a substrate, p-well regions over the substrate and including n- channel metal-oxide semiconductor field-effect transistors, n-well regions over the substrate and including p-channel metal-oxide semiconductor field-effect transistors, drain/source regions of protection metal-oxide semiconductor field-effect transistors, and at least one control circuit. First conductive connections connect selected drain/source regions to the p-well regions and the n-well regions, second conductive connections connect selected n-channel metal-oxide semiconductor field-effect transistors and p-channel metal-oxide semiconductor field-effect transistors to one another, and third conductive connections are configured to connect gates of the protection metal-oxide semiconductor field-effect transistors to the at least one control circuit.
    Type: Application
    Filed: May 19, 2023
    Publication date: August 15, 2024
    Inventors: Chia-Lin HSU, Yu-Ti Su
  • Patent number: 12051593
    Abstract: The present disclosure describes a system and a method for an ion implantation (IMP) process. The system includes an ion implanter configured to scan an ion beam over a target for a range of angles, a tilting mechanism configured to support and tilt the target, an ion-collecting device configured to collect a distribution and a number of ejected ions from the ion beam scan over the target, and a control unit configured to adjust a tilt angle based on a correction angle determined based on the distribution and number of ejected ions.
    Type: Grant
    Filed: March 27, 2023
    Date of Patent: July 30, 2024
    Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
    Inventors: Chun-Jung Huang, Li-Hsin Chu, Po-Feng Tsai, Henry Peng, Kuang Huan Hsu, Tsung Wei Chen, Yung-Lin Hsu
  • Patent number: 12048111
    Abstract: The present invention provides an electronic device including a replaceable module and a sliding fastener. The replaceable module is provided with a first sliding track. The sliding fastener includes a body having a latch extending therefrom the body and a groove so as to form a handle. The body is provided with a second sliding track corresponding to the first sliding track, and the handle is elastically bendable along the groove so as to flex relative to the body and disengage from the replaceable module.
    Type: Grant
    Filed: January 10, 2023
    Date of Patent: July 23, 2024
    Assignee: Getac Technology Corporation
    Inventor: Wan-Lin Hsu
  • Publication number: 20240233990
    Abstract: A non-oriented electrical steel sheet with characteristics of high permeability, high magnetic flux, and low iron loss and a manufacturing method thereof are provided. The non-oriented electrical steel sheet includes an electrical steel, wherein the electrical steel includes the following compositions of: an amount of 0.005 wt. % or less of carbon, an amount of 0.005 wt. % or less of nitrogen, an amount of 0.005 wt. % or less of sulfur, an amount of 0.05 wt. % or less of phosphorus, an amount of 1.0 to 2.5 wt. % of silicon, an amount of 0.1 to 0.8 wt. % of aluminum, an amount of 0.1 to 0.8 wt. % of manganese, an amount of 0.01 to 0.10 wt. % of antimony and the balance of iron and other unavoidable impurities, wherein the electrical steel meets the following relationship: 20?10*silicon content+11*aluminum content+6*manganese content?30.
    Type: Application
    Filed: November 30, 2023
    Publication date: July 11, 2024
    Inventors: Po-yu CHEN, I-ching HSIAO, Ming-chin TSAI, Hsin-yi LEE, Lin HSU
  • Patent number: 12034367
    Abstract: A switching power converter includes: a power stage circuit, including at least one transistor which is configured to operably switch an inductor to convert an input power to an output power; and an active EMI filter circuit, including at least one amplifier, wherein the at least one amplifier is configured to operably sense a noise input signal which is related to a switching noise caused by the switching of the power stage circuit, and amplify the noise input signal to generate a noise canceling signal, wherein the noise canceling signal is injected into an input node of the switching power converter, so as to suppress the switching noise and thus reducing EMI, wherein the input power is provided through the input node to the power stage circuit.
    Type: Grant
    Filed: June 27, 2022
    Date of Patent: July 9, 2024
    Assignee: RICHTEK TECHNOLOGY CORPORATION
    Inventors: Chen-Pin Huang, Chia-Chun Li, Chen-Lin Hsu, Hung-Yu Cheng, Wan-Hsuan Yang
  • Patent number: 12028099
    Abstract: A semiconductor chip includes a first wireless communication circuit, a second wireless communication circuit, and an auxiliary path. The first wireless communication circuit includes a signal path, wherein the signal path includes a signal node. The second wireless communication circuit includes a mixer and a local oscillator (LO) buffer. The LO buffer is arranged to receive and buffer an LO signal, and is further arranged to provide the LO signal to the mixer. The auxiliary path is arranged to electrically connect the LO buffer to the signal node of the signal path, wherein the LO buffer is reused for a loop-back test function of the first wireless communication circuit through the auxiliary path.
    Type: Grant
    Filed: February 1, 2023
    Date of Patent: July 2, 2024
    Assignee: MEDIATEK INC.
    Inventors: Jui-Lin Hsu, Hsiang-Yun Chu, Yen-Tso Chen, Jen-Hao Cheng, Wei-Hsiu Hsu, Tzu-Chin Lin, Chih-Ming Hung, Jing-Hong Conan Zhan
  • Patent number: 12012335
    Abstract: 3D bundle-shaped multi-walled carbon nanotubes and preparation method, includes the following steps: uniformly mixing bi-component alloy catalyst and transition metal in an inert gas environment in order to obtain a three-component nano-intermetallic alloy catalyst; disposing the intermetallic catalyst on the substrate; allowing hydrogen to flow through the substrate, and heating the substrate to a first temperature, and using the hydrogen to undergo a reduction of the intermetallic catalyst at the first temperature; applying a protective gas and a carbon source gas, heating the substrate to a second temperature, undergoing a reaction at the second temperature to generate the 3D bundle-shaped multi-walled carbon nanotubes, and collecting the 3D bundle-shaped multi-walled carbon nanotubes after annealing; wherein the second temperature is greater than or equal to the first temperature; a working electrode includes conductive drain material, a conductive bonding gent and a plurality of 3D bundle-shaped multi-wa
    Type: Grant
    Filed: October 18, 2021
    Date of Patent: June 18, 2024
    Assignee: KUN SHAN UNIVERSITY
    Inventors: Hao-Lin Hsu, Jean-Hong Chen
  • Publication number: 20240195083
    Abstract: An antenna module including a first radiator and a second radiator is provided. The first radiator includes a first segment to a fifth segment connected in sequence. A first slot is formed between the second segment and the fourth segment. The second radiator has an edge. A first retracting distance is between the second segment and an extension line. A second retracting distance is between the fourth segment and the extension line. The first segment resonates at a first high frequency band. The first radiator and the first slot resonate at a low frequency band and a second high frequency band. The first retracting distance, the second retracting distance, the second segment, the fourth segment, the fifth segment and the first slot resonate at a third high frequency band. The first segment and the second radiator resonate at a fourth high frequency band. In addition, an electronic device is provided.
    Type: Application
    Filed: October 17, 2023
    Publication date: June 13, 2024
    Applicant: PEGATRON CORPORATION
    Inventors: Chien-Yi Wu, Chao-Hsu Wu, Shih-Keng Huang, Hau Yuen Tan, Chih-Wei Liao, Chia-Hung Chen, Wen-Hgin Chuang, Chia-Hong Chen, Lin-Hsu Chiang, Hsi Yung Chen
  • Publication number: 20240174277
    Abstract: A drawer cart structure includes a first drawer trolley, a second drawer trolley, a plurality of drawers matching the first drawer trolley and the second drawer trolley, and a packaging box, wherein the drawers can be stacked separately into a first drawer set and a second drawer set according to the required number of drawers of the first drawer trolley and the second drawer trolley. The first drawer trolley and the second drawer trolley are in the form of open frame structures except for two sides and the top. The first drawer trolley and the second drawer trolley approach each other in opposite directions and from the bottoms of the two drawer trolleys, so that the first drawer trolley and the second drawer trolley are stacked crosswise and there is a distance between the tops of the first drawer trolley and the second drawer trolley.
    Type: Application
    Filed: October 3, 2023
    Publication date: May 30, 2024
    Applicant: YOUNG BRIOHAM ENTERPRISE CO., LTD.
    Inventor: Ching-Lin Hsu
  • Publication number: 20240136213
    Abstract: In an embodiment, a system, includes: a first pressurized load port interfaced with a workstation body; a second pressurized load port interfaced with the workstation body; the workstation body maintained at a set pressure level, wherein the workstation body comprises an internal material handling system configured to move a semiconductor workpiece within the workstation body between the first and second pressurized load ports at the set pressure level; a first modular tool interfaced with the first pressurized load port, wherein the first modular tool is configured to process the semiconductor workpiece; and a second modular tool interfaced with the second pressurized load port, wherein the second modular tool is configured to inspect the semiconductor workpiece processed by the first modular tool.
    Type: Application
    Filed: January 3, 2024
    Publication date: April 25, 2024
    Inventors: Chun-Jung HUANG, Yung-Lin HSU, Kuang Huan HSU, Jeff CHEN, Steven HUANG, Yueh-Lun YANG
  • Publication number: 20240124310
    Abstract: A method for preparing a three-dimensional carbon nanotube composite structure comprises: providing a substrate; subjecting the substrate to nickel ion modification treatment to form at least one nickel ion nuclear seed on the substrate; providing a hydrogen gas to pass through the substrate and heating the substrate to a reduction temperature for reducing the nickel ion nuclear seed by the hydrogen gas at the reduction temperature; and supplying a carbon source gas and a protective gas to pass through the substrate and heating the substrate to a growth temperature so that the carbon atoms generated by the carbon source gas through the catalytic cracking of the nickel ion nuclear seed are deposited on the bottom of the nickel ion nuclear seed to form a carbon nanotube gradually, wherein the growth temperature is greater than or equal to the reduction temperature. The three-dimensional carbon nanotube composite structure prepared by the method and its application are also disclosed.
    Type: Application
    Filed: October 13, 2022
    Publication date: April 18, 2024
    Inventors: Hao-Lin HSU, Shuhn-Shyurng HOU
  • Publication number: 20240120735
    Abstract: An electrostatic discharge (ESD) circuit includes a first ESD detection circuit, a first discharging circuit and a first ESD assist circuit. The first ESD detection circuit is coupled between a first node having a first voltage and a second node having a second voltage. The first discharging circuit includes a first transistor. The first transistor has a first gate, a first drain, a first source and a first body terminal. The first gate is coupled to the first ESD detection circuit by a third node. The first drain is coupled to the first node. The first source and the first body terminal are coupled together at the second node. The first ESD assist circuit is coupled between the second and third node, and configured to clamp a third voltage of the third node at the second voltage during an ESD event at the first or second node.
    Type: Application
    Filed: December 19, 2023
    Publication date: April 11, 2024
    Inventors: Chia-Lin HSU, Ming-Fu TSAI, Yu-Ti SU, Kuo-Ji CHEN