Abstract: A crystal oscillator and an oscillating device are provided. The crystal oscillator includes a resonator, a low-thermal conductivity glue, an integrated circuit chip, and a heating element. In the resonator, a crystal blank is hermetically encapsulated. The low-thermal conductivity glue wraps the resonator to suppress temperature variation in the resonator. The integrated circuit chip is disposed below the resonator, and the heating element is configured to supply heat to the resonator.

Abstract: A magnetoresistive random access memory (MRAM) structure, including a substrate and multiple MRAM cells on the substrate, wherein the MRAM cells are arranged in a memory region adjacent to a logic region. An ultra low-k (ULK) layer covers the MRAM cells, wherein the surface portion of ultra low-k layer is doped with fluorine, and dents are formed on the surface of ultra low-k layer at the boundaries between the memory region and the logic region.

Abstract: A system for assessing extubation includes a respiratory assistance device, an artificial intelligence platform, and a hospital information system. The respiratory assistance device is adapted to communicate with a trachea of a patient. The artificial intelligence platform includes a prediction module. A method for assessing extubation includes the following steps. Measured values of respiratory parameters of the patient are recorded by the respiratory assistance device. The recorded times and the measured values of the respiratory parameters corresponding to each of the recording times are transmitted to the artificial intelligence platform. The prediction module analyzes the measured values of respiratory parameters within a predetermined time period according to a prediction model to generate a prediction result. The prediction result is transmitted to the hospital information system and is recorded into a medical record of the patient.

Abstract: An electronic device including a metal back cover, a metal frame, a first radiator and a second radiator is provided. The metal frame includes a disconnected part and two connecting parts, the two connecting parts are located at two sides of the disconnected part, separated from the disconnected part and connected to the metal back cover. A U-shaped slot is formed between the disconnected part and the metal back cover, and between the disconnected part and the two connecting parts. The first radiator is located beside the disconnected part and includes a feeding end and a first connecting end away from the feeding end, and the first connecting end is connected to the disconnected part. The second radiator is located beside the disconnected part, and includes a ground end and a second connecting end opposite to each other. The ground end is connected to the metal back cover.

Abstract: In an embodiment, a system, includes: a first pressurized load port interfaced with a workstation body; a second pressurized load port interfaced with the workstation body; the workstation body maintained at a set pressure level, wherein the workstation body comprises an internal material handling system configured to move a semiconductor workpiece within the workstation body between the first and second pressurized load ports at the set pressure level; a first modular tool interfaced with the first pressurized load port, wherein the first modular tool is configured to process the semiconductor workpiece; and a second modular tool interfaced with the second pressurized load port, wherein the second modular tool is configured to inspect the semiconductor workpiece processed by the first modular tool.

Abstract: A portable computer includes a computer body and a handle. The handle, operable to be located at a closed position and an open position relative to the computer body, includes a body component for holding of a user, a movable member and an auxiliary member. One end of the movable member is pivotally connected to the body component and the other end is pivotally connected to the computer body. The auxiliary component is disposed on one end of the body component, and is abutted against one side of the movable member. During a movement process of the handle between the closed position and the open position, at least a portion of the movable member is kept in contact with the auxiliary member. When the handle is at the closed position and the open position, the auxiliary member and the body component jointly secure the movable member.

Abstract: An ESD power clamp device includes an ESD detection circuit; a controlling circuit coupled with the ESD detection circuit; a field effect transistor (FET) coupled with the controlling circuit, and an impedance element coupled with the FET. The FET includes a drain terminal coupled with a first supply node; a gate terminal coupled with the controlling circuit; a source terminal coupled with a second supply node via the impedance element; and a bulk terminal coupled with second supply node.

Abstract: An electrostatic discharge (ESD) circuit includes an ESD detection circuit, a clamp circuit and an ESD assist circuit. The ESD detection circuit is coupled between a first and a second node. The first node has a first voltage. The second node has a second voltage. The clamp circuit includes a first transistor having a first gate, a first drain, a first source and a first body terminal. The first gate is coupled to at least the ESD detection circuit by a third node. The first drain is coupled to the second node. The first source and the first body terminal are coupled together at the first node. The ESD assist circuit is coupled between the first node and the third node, and is configured to clamp a third voltage of the third node at the first voltage during an ESD event at the first node or the second node.

Abstract: A latching member includes a hard material member and a soft material member. The hard material member includes a hard material body, an elastic arm, and a buckle portion. The hard material body has a first side and a second side opposite to each other. One of two ends of the elastic arm is connected to the first side of the hard material body, and at least one hollow portion is between the elastic arm and the hard material body. The buckle portion is connected to the other end of the elastic arm. The soft material member includes a first soft material body, the first soft material body is on the first side of the hard material body and covers the hollow portion and the elastic arm.

Abstract: An electronic device, including a metal back cover, a ground radiator, a third radiator, and a metal frame including a first cutting opening, a second cutting opening, a first radiator located between the first cutting opening and the second cutting opening, and a second radiator located beside the second cutting opening and separated from the first radiator by the second cutting opening, is provided. An end of a first slot formed between the metal back cover and a first part of the first radiator is communicated with the first cutting opening, and a second slot formed between the metal back cover and a second part of the first radiator and between the metal back cover and the second radiator is communicated with the second cutting opening. The ground radiator connects the metal back cover and the first radiator and separates the first slot from the second slot.

Abstract: An electronic device including a metal housing, a first antenna module, and a second antenna module is disclosed. The metal housing includes a back cover and a frame, the frame is located on a side of the back cover, and a slot is arranged between the back cover and the frame. The frame includes two slits and a segment, and the two slits are connected with the slot to form a U shape. The segment is surrounded by the two slits and the slot. The first antenna module includes an antenna radiator formed by the segment. The antenna radiator is coupled to the back cover across the slot through multiple connecting portions. The second antenna module is disposed on the connecting portions to be coupled to the back cover and grounded, and an antenna coupling gap exists between the second antenna module and the frame.

Abstract: A semiconductor structure includes a substrate, a first support layer, and multiple support pillars. The substrate includes a monitoring region. The monitoring region includes a first region and a second region. The first support layer is located in the first region and the second region, and is located above the substrate. The support pillars are located in the second region. The support pillars penetrate the first support layer and are not connected to each other. Each of the support pillars extends toward the substrate.

Abstract: A spread spectrum switching power converter circuit includes: a power stage circuit which includes an inductor and a power switch and is configured to switch the power switch according to a switching signal having spread spectrum for power conversion; a variable frequency oscillator, which generates a spread spectrum clock signal according to a spread spectrum control signal; a spread spectrum control circuit, which generates the spread spectrum control signal according to a first clock signal and a second clock signal; and a pulse width modulation circuit, configured to generate the switching signal according to a feedback signal based on the spread spectrum clock signal. The spread spectrum control circuit generates the spread spectrum control signal by sampling and combining a periodic waveform and a random waveform. The random waveform is generated according to the first clock signal and the periodic waveform is generated according to the second clock signal.

Abstract: A bicycle holding device for holding a bicycle that has a perforation at the bottom end of each of the left and right fork blades of the front fork thereof is disclosed to include a bicycle holder frame settable on the ground or wall, and a front fork support rod located in the bicycle holder frame and passing through the perforations of the left and right fork blades of the front fork. Thereby, the bicycle holding device of the present invention can allow the user to easily complete bicycle parking, and can provide good stability after the completion of the parking.

Abstract: A transceiver includes: a radio-frequency (RF) front-end circuit; a dedicated RF front-end circuit; and a switchable matching circuit, integrated in a chip. The RF front-end circuit deals with communications of a first wireless standard, and the dedicated RF front-end circuit deals with communications of a second wireless standard. The switchable matching circuit provides impedance matching between the signal port and the RF front-end circuit when the RF front-end circuit is in operation, and provides impedance matching between the signal port and the dedicated RF front-end circuit when the dedicated RF front-end circuit is in operation, and includes: a first capacitive circuit coupled to the signal port; a first switch circuit coupled between the first capacitive circuit and the dedicated RF front-end circuit; a second capacitive circuit coupled to the dedicated RF front-end circuit; and a second switch circuit coupled to a second terminal of the second capacitive circuit.

Abstract: An electric vehicle cooling system includes a vehicle control unit (VCU), a coolant pump controller, a motor controller, a motor, a vehicle charger, an electronic coolant pump, and a cooling plate. The electronic coolant pump, the vehicle charger, the motor controller, the motor, and the cooling plate are connected in sequence to form a closed coolant loop for a coolant. Either the VCU or the coolant pump controller of the electronic coolant pump can control the electronic coolant pump to switch between an idle mode and a normal mode according to a coolant temperature detected from the closed coolant loop. Under the normal mode, the VCU controls the electronic coolant pump to have an ideal pumping speed according to the coolant temperature detected from the closed coolant loop and a rotational speed of the motor, ensuring good cooling efficiency.

Abstract: A three-dimensional semiconductor device includes multiple semiconductor device layers on a substrate, wherein each layer includes a first stacked structure, a first gate dielectric layer, a first semiconductor layer, a first channel layer, a first source region, a first drain region, and a first resistive random access memory cell. The first stacked structure on the substrate includes a first insulating layer and a first gate conductor layer. The first gate dielectric layer surrounds a sidewall of the first stacked structure. The first semiconductor layer surrounds a sidewall of the first gate dielectric layer. The first channel layer is in the first semiconductor layer. The first source region and the first drain region are on both sides of the first channel layer in the first semiconductor layer. The first resistive random access memory cell is on a first sidewall of the first semiconductor layer and connected to the first drain region.

Abstract: A heat dissipation module includes a diversion case and a fan. The diversion case includes an input section, an output section, and a connecting section that connects the input section and the output section, where an angle is defined between an extending direction of the input section and an extending direction of the output section, and an end of the input section away from the connecting section and an end of the output section away from the connecting section are respectively inclined relative to the connecting section. The fan is accommodated in the connecting section. An electronic device assembly includes an expansion component and the heat dissipation module.

Abstract: The present disclosure provides an image display method and an image display system for alleviating motion sickness. The image display method includes: obtaining a number of shock and speed information of a transportation; comparing at least one of the shock and speed information with one or more than one corresponding threshold to determine whether motion sickness occurs; and in response to the determination that motion sickness occurs, positioning a position of a first image displayed on a display unit according to the shock and speed information.

Abstract: An electronic device includes a housing and a first heat source, a second heat source, and a heat dissipation module that are disposed in the housing. The heat dissipation module includes a first fan, a second fan, a first heat conduction member, and a second heat conduction member. The first fan and the second fan are disposed on two opposite sides of the housing. One end of the first heat conduction member is disposed at the first fan, and the other end is located at a position on a side of an upper surface of the housing corresponding to the first heat source. One end of the second heat conduction member is disposed at the second fan, and the other end is located on a side of a lower surface of the housing and abuts against the second heat source.