Abstract: An electronic device includes a housing and a first heat source, a second heat source, and a heat dissipation module that are disposed in the housing. The heat dissipation module includes a first fan, a second fan, a first heat conduction member, and a second heat conduction member. The first fan and the second fan are disposed on two opposite sides of the housing. One end of the first heat conduction member is disposed at the first fan, and the other end is located at a position on a side of an upper surface of the housing corresponding to the first heat source. One end of the second heat conduction member is disposed at the second fan, and the other end is located on a side of a lower surface of the housing and abuts against the second heat source.

Abstract: An electronic device assembly includes an expansion component and a host. The expansion component includes a first case, a first circuit board, and a first connector. The host includes a second case, a main circuit board, and a main connector. The first circuit board is arranged in the first case. The first connector is electrically connected to the first circuit board and is exposed from a top plate of the first case. The main circuit board is arranged in the second case. The main connector is electrically connected to the main circuit board and exposed from a second surface of the second case. When the host is assembled to the expansion component, the second surface of the second case covers the top plate of the first case, and the first connector is electrically connected to the main connector.

Abstract: An electronic device including a first shell, a second shell, a circuit board, a heat conductive member and a heat source. The first shell is made of a metal material. The second shell is disposed on a side of the first shell. The circuit board is disposed between the first shell and the second shell, and includes a through hole that passes through both sides. The heat conductive member includes a first contact portion, an extending section and a second contact portion connected in a sequential manner. The first contact portion is located on one side of the circuit board, the second contact portion is located on the other side of the circuit board, the extending section extends through the through hole, and the first contact portion abuts against the first shell. The heat source is connected to the second contact portion.

Abstract: An electronic device includes: a body, including opposite outer and inner surfaces, and a through opening passing through the outer and inner surfaces; a fan, disposed on the outer surface and having an air outlet; a heat sink assembly, disposed at the air outlet and corresponding to the through opening; a first thermal tube, having one end assembled on the heat sink assembly and located on the side of the outer surface; a first heat source, disposed corresponding to the other end of the first thermal tube; a thermal plate, disposed in the body and corresponding to the through opening, having one side abutting against the heat sink assembly and the inner surface; a second thermal tube, having one end connected to the other side of the thermal plate; and a second heat source, disposed corresponding to the other end of the second thermal tube.

Abstract: An electronic device includes an input unit and a transmission dock. The transmission dock is pivotally connected to the input unit, and includes at least one pivotal concave portion, a first wall, a second wall and a third wall. The at least one pivotal concave portion has a first sidewall and a second sidewall opposite to each other. The first wall is connected to the first sidewall and the second sidewall. The second wall is connected to the first sidewall and the second sidewall. The third wall is connected to the first sidewall and the second sidewall. The first wall and the second wall are connected to two opposite sides of the third wall, respectively. An inner surface of the third wall forms a sloped surface toward each of the first sidewall and the second sidewall, and each of the sloped surfaces has an opening at an end thereof.

Abstract: A replacement device includes a replacement module and a slider. The replacement module includes a sliding portion. The sliding portion is provided with a limiting column, which is formed with a fixing hole. The slider includes a slider body. The slider body is provided with a first latch, a limiting hole and a fixing element, wherein the first latch is arranged on a first side edge of the slider body. The slider is correspondingly arranged on the sliding portion of the replacement module, and the limiting column of the sliding portion passes through the limiting hole. The fixing element has a top portion, and is fixed in the fixing hole. The size of the top portion is greater than the size of the limiting hole, so that the slider moves relative to the replacement module within a limit range of the limiting hole.

Abstract: A semiconductor fabrication facility (FAB) is provided. The FAB includes a group of processing tools. The FAB also includes a number of sampling tubes connecting the group of processing tools. In addition, the FAB includes a sampling station which includes a connection port, a valve manifold box and a controller. The valve manifold box is used for switching a gas sample from one of the processing tools to the connection port. The controller is sued for controlling the connection of the valve manifold box and the sampling tubes. The FAB further includes a metrology module. The metrology module is connected to the connection port of the sampling station and is used to perform a measurement of a parameter related to the gas sample.

Abstract: A stretchable circuit is provided in the invention. The stretchable circuit comprises a plurality of segments. Each segment includes a plurality of sub-segments. Each sub-segment includes at least one main line, at least one secondary line, and rib lines, and in each sub-segment, the main lines and the secondary lines are electrically connected to the rib lines.

Abstract: A connection module is disposed in a main circuit board and includes a card edge connector, a hard circuit board and two connectors. The card edge connector is fixedly disposed on the main circuit board. The hard circuit board has a board body and a connecting tongue for correspondingly plugging with the card edge connector. The board body is configured with a disconnecting notch, and the board body is separated by the disconnecting notch into two floating plates arranged side by side at an interval and floatable using the disconnecting notch. The connectors are respectively fixed to the floating plates. Thus, without needing an additional guide frame, the connectors are enabled to float in any desired direction, thereby achieving effects of reducing an overall height and satisfying current thinning requirements.

Abstract: The present invention provides an electronic device including a replaceable module and a sliding fastener. The replaceable module is provided with a first sliding track. The sliding fastener includes a body having a latch extending therefrom the body and a groove so as to form a handle. The body is provided with a second sliding track corresponding to the first sliding track, and the handle is elastically bendable along the groove so as to flex relative to the body and disengage from the replaceable module.

Abstract: A connection module and an electronic device are provided. The connection module includes: two floating plates formed by a board body of a main circuit board; and at least two connectors respectively fixed to the floating plates. The board body is provided with at least one disconnecting notch, the board body is separated by the disconnecting notch into the two floating plates arranged side by side at an interval and floatable using the disconnecting notch, and the main circuit board is a hard circuit board.

Abstract: The present disclosure describes a system and a method for an ion implantation (IMP) process. The system includes an ion implanter configured to scan an ion beam over a target for a range of angles, a tilting mechanism configured to support and tilt the target, an ion-collecting device configured to collect a distribution and a number of ejected ions from the ion beam scan over the target, and a control unit configured to adjust a tilt angle based on a correction angle determined based on the distribution and number of ejected ions.

Abstract: The present disclosure describes a method for forming a nitrogen-rich protective layer within a low-k layer of a metallization layer to prevent damage to the low-k layer from subsequent processing operations. The method includes forming, on a substrate, a metallization layer having conductive structures in a low-k dielectric. The method further includes forming a capping layer on the conductive structures, where forming the capping layer includes exposing the metallization layer to a first plasma process to form a nitrogen-rich protective layer below a top surface of the low-k dielectric, releasing a precursor on the metallization layer to cover top surfaces of the conductive structures with precursor molecules, and treating the precursor molecules with a second plasma process to dissociate the precursor molecules and form the capping layer. Additionally, the method includes forming an etch stop layer to cover the capping layer and top surfaces of the low-k dielectric.

Abstract: A semiconductor package is provided, including a package component and a number of conductive features. The package component has a non-planar surface. The conductive features are formed on the non-planar surface of the package component. The conductive features include a first conductive feature and a second conductive feature respectively arranged in a first position and a second position of the non-planar surface. The height of the first position is less than the height of the second position, and the size of the first conductive feature is smaller than the size of the second conductive feature.

Abstract: A system includes a local oscillator (LO) signal generation circuit, a receiver (RX) circuit, and a calibration circuit. The LO signal generation circuit generates an LO signal according to a reference clock, and includes an active oscillator that generates the reference clock. The active oscillator includes at least one active component. The RX circuit generates a processed RX signal by processing an RX input signal according to the LO signal. The calibration circuit checks a signal characteristic of the processed RX signal by detecting if a calibration tone exists within a receiver bandwidth, set a frequency calibration control output in response to the calibration tone being not found in the receiver bandwidth, and output the frequency calibration control output to the LO signal generation circuit. The LO signal generation circuit adjusts an LO frequency of the LO signal in response to the frequency calibration control output.

Abstract: A semiconductor chip includes a first wireless communication circuit, a local oscillator (LO) buffer, and an auxiliary path. The first wireless communication circuit has a signal path, wherein the signal path has a mixer input port and a signal node distinct from the mixer input port. The auxiliary path is used to electrically connect the LO buffer to the signal node of the signal path. The LO buffer is reused for a transmit (TX) function through the auxiliary path.

Abstract: A display panel and a manufacturing method thereof are provided. The display panel includes a substrate, an active element, a driving circuit element, a first connection circuit, a second connection circuit and a conductive connector. The substrate has a first surface and a second surface opposite to the first surface. The active element is disposed on the first surface. The driving circuit element is disposed on the second surface and is overlapped with the active element. The first connection circuit is disposed on the first surface and is connected to the active element. The second connection circuit is disposed on the second surface and is connected to the driving circuit element. The conductive connector penetrates through the substrate and two ends of the conductive connector are electrically connected to the first connection circuit and the second connection circuit, respectively.

Abstract: The invention refers to a light-transmissive plastic plate structure suitable for vehicle sunroof with curved surface and a method for fabricating the same. By using polymer material formulation, UV resistant coating formulation and precision coating technology, the wear resistance of polymer surface of plastic substrate can be improved to the same level as glass, and the original optical and physical properties after various environmental tests can also be maintained. The plastic substrate is first formed into a curved plastic plate through a hot pressing process, and then a connecting structure is formed and fixed on the plastic plate by an insert-molding injection process, in order to replace the traditional car sunroof mechanism which is assembled by glass plate bonded with metal connecting parts.

Abstract: The invention refers to a light-transmissive plastic plate structure suitable for vehicle sunroof with curved surface and a method for fabricating the same. By using polymer material formulation, UV resistant coating formulation and precision coating technology, the wear resistance of polymer surface of plastic substrate can be improved to the same level as glass, and the original optical and physical properties after various environmental tests can also be maintained. The plastic substrate is first formed into a curved plastic plate through a hot pressing process, and then a connecting structure is formed and fixed on the plastic plate by an insert-molding injection process, in order to replace the traditional car sunroof mechanism which is assembled by glass plate bonded with metal connecting parts.

Abstract: An electronic apparatus including a compression molding board and a connection pad is provided. The compression molding board has a device bonding area and a bending area formed by compression molding. The device bonding area is different from the bending area. The connection pad is disposed on the device bonding area of the compression molding board.