Abstract: A surgical instrument includes a rod and a push portion. The push portion includes a first end connected to an end of the rod and a second end having a blade portion. The push portion includes a plurality of grooves. The plurality of grooves is recessed in a surface of the push portion and is spaced from each other. Each two adjacent grooves has a rib formed therebetween. A top face of a cross section of each rib is the surface of the push portion. Each rib has a guiding face on the cross section of the push portion. The guiding face is connected to the surface of the push portion. The guiding face faces a rotating direction of the rod. An angle between the guiding face and the surface of the push portion in the cross section is greater than 90°.

Abstract: A photoresist composition includes a mixture. The mixture includes a first photosensitive material and a second photosensitive material. The first photosensitive material is a 6-Sn oxide cluster, a 12-Sn oxide cluster or a combination thereof. The second photosensitive material has a composition being different from a composition of the first photosensitive material.

Abstract: Various embodiments of the present disclosure are directed towards a microelectromechanical systems (MEMS) package comprising a wire-bond damper. A housing structure overlies a support substrate, and a MEMS structure is between the support substrate and the housing structure. The MEMS structure comprises an anchor, a spring, and a movable mass. The spring extends from the anchor to the movable mass to suspend and allow movement of the movable mass in a cavity between the support substrate and the housing structure. The wire-bond damper is on the movable mass or structure surrounding the movable mass. For example, the wire-bond damper may be on a top surface of the movable mass. As another example, the wire-bond damper may be on the support substrate, laterally between the anchor and the movable mass. Further, the wire-bond damper comprises a wire formed by wire bonding and configured to dampen shock to the movable mass.

Abstract: A thin film transistor includes a gate electrode embedded in an insulating layer that overlies a substrate, a gate dielectric overlying the gate electrode, an active layer comprising a compound semiconductor material and overlying the gate dielectric, and a source electrode and drain electrode contacting end portions of the active layer. The gate dielectric may have thicker portions over interfaces with the insulating layer to suppress hydrogen diffusion therethrough. Additionally or alternatively, a passivation capping dielectric including a dielectric metal oxide material may be interposed between the active layer and a dielectric layer overlying the active layer to suppress hydrogen diffusion therethrough.

Abstract: A golf teaching method and a golf teaching system are provided. The golf teaching method includes: configuring image capturing devices and golf simulator to capture swing images and corresponding simulator data records, when a user performs a golf swing; configuring an expert model that includes expert motion information and corresponding correction suggestion information; configuring a computing device to perform an analysis process on the swing images and the simulator data records to divide the golf swing into user motions according to stages and obtaining records of user motion information corresponding to the plurality of stages, and to compare the user motion information with the corresponding expert motion information in each stage through the expert model, and to provide the corresponding correction suggestion information according to a comparison result; and configuring a user interface to provide the correction suggestion information.

Abstract: Various embodiments of the present disclosure are directed towards an integrated chip including a dielectric structure sandwiched between a first electrode and a bottom electrode. A passivation layer overlies the second electrode and the dielectric structure. The passivation layer comprises a horizontal surface vertically below a top surface of the passivation layer. The horizontal surface is disposed above a top surface of the dielectric structure.

Abstract: Disclosed herein are device and method for performing a total internal reflection scattering (TIRS) measurement to a sample slide. The device comprises a first reflective plate having a first opening; a second reflective plate having second and third openings and disposed on top of the first reflective plate thereby forming a slot therebetween for accommodating the sample slide, wherein the first opening of the first reflective plate is disposed directly underneath the second opening of the second reflective plate; a white light source disposed in the space formed by the third opening of the second reflective plate and configured to emit a white light into the slot; and a first blackout layer disposed on top of the third opening thereby covering the white light source and keeping the emitted white light from leaking. When the sample slide is inserted into the slot, the white light source illuminates the sample slide so as to achieve the TIRS measurement to the sample slide.

Abstract: A compound including a first ligand LA of is disclosed. In the structure of Formula I, one of L1 and L2 is C, and the other is N; Y1 to Y14 are each C or N; at least two adjacent Y7, Y8, Y9, and Y10 are carbon atoms that are fused to a structure of Z1 and Z2 are each O, S, Se, NR, CRR?, or SiRR?; and each R, R?, RA, RB, RC, and RD is hydrogen or a substituent; and any two substituents may be joined or fused together to form a ring. In the compound, LA is complexed to a metal M by L1 and L2, and M has an atomic weight greater than 40. Organic light emitting devices and consumer products containing the compounds are also disclosed.

Abstract: An electrical connector includes: an insulating housing; plural rows of signal terminals; and a respective row of grounding terminals disposed in the insulating housing, each of the grounding terminals comprising a main part retained in the insulating housing and an upper elastic arm and a lower elastic arm extending obliquely from the main part, each of the upper and lower elastic arms having a respective contacting portion and a respective end extending downward from the contacting portion, wherein the main part defines a front face and a rear face confronting adjacent signal terminals, an upper face, and a lower face; and the respective ends deviate from the main part toward the rear face or the front face of the main part for contacting with the rear face or the front face of the main part.

Abstract: An electronic device includes a rollable panel and a metal layer. The rollable panel includes a first portion and a second portion. The rollable panel has a first side and a second side opposite to the first side. The rollable panel includes a substrate, a circuit layer disposed on the substrate and a cover layer disposed on the circuit layer. The metal layer is disposed on one of the first side and the second side of the rollable panel and outside the rollable panel. In a rolled mode, at least a part of the metal layer is positioned between the first portion and the second portion of the rollable panel.

Abstract: The disclosure provides a method of active immunotherapy for a cancer patient, comprising administering vaccines against Globo series antigens (i.e., Globo H, SSEA-3 and SSEA-4). Specifically, the method comprises administering Globo H-CRM197 (OBI-833/821) in patients with cancer. The disclosure also provides a method of selecting a cancer patient who is suitable as treatment candidate for immunotherapy. Exemplary immune response can be characterized by reduction of the severity of disease, including but not limited to, prevention of disease, delay in onset of disease, decreased severity of symptoms, decreased morbidity and delayed mortality.

Abstract: Various embodiments of the present disclosure are directed towards a method for forming a semiconductor structure, the method includes forming a buffer layer over a substrate. An active layer is formed on the buffer layer. A top electrode is formed on the active layer. An etch process is performed on the buffer layer and the substrate to define a plurality of pillar structures. The plurality of pillar structures include a first pillar structure laterally offset from a second pillar structure. At least portions of the first and second pillar structures are spaced laterally between sidewalls of the top electrode.

Abstract: A substrate structure is provided, in which an insulating protection layer is formed on a substrate body having a plurality of electrical contact pads, and the insulating protection layer has a plurality of openings corresponding to the plurality of exposed electrical contact pads, and the insulating protection layer is formed with a hollow portion surrounding a partial edge of at least one of the electrical contact pads at at least one of the openings, so as to reduce the barrier of the insulating protection layer.

Abstract: A method includes: receiving a design layout comprising a feature extending in a peripheral region and a central region of the design layout; determining compensation values associated with a pellicle assembly and the peripheral region according to an exposure distribution in an exposure field of a workpiece; and adjusting the design layout according to the compensation values. The modifying of the shape of the feature according to the compensation values includes: partitioning the peripheral region into compensation zones; and adjusting line widths in the compensation zones of the feature according to the compensation values associated with the respective compensation zones.

Abstract: Hybrid positioning methods and electronic apparatuses are provided. A representative method includes: obtaining initial location information; computing initial moving information based upon the sensor readings; computing estimated location information based on the initial moving information and the initial location information; acquiring geographical location readings if a location update condition is satisfied; generating reference location information based on the geographical location readings acquired; comparing the estimated location information with the reference location information to obtain a deviation information; computing a calibrated moving information based on the estimated location information and the deviation information; and computing a calibrated location information based on the deviation information, calibrated moving information and the estimated location information.

Abstract: Different isolation liners for different type FinFETs and associated isolation feature fabrication are disclosed herein. An exemplary method includes performing a fin etching process on a substrate to form first trenches defining first fins in a first region and second trenches defining second fins in a second region. An oxide liner is formed over the first fins in the first region and the second fins in the second region. A nitride liner is formed over the oxide liner in the first region and the second region. After removing the nitride liner from the first region, an isolation material is formed over the oxide liner and the nitride liner to fill the first trenches and the second trenches. The isolation material, the oxide liner, and the nitride liner are recessed to form first isolation features (isolation material and oxide liner) and second isolation features (isolation material, nitride liner, and oxide liner).

Abstract: An electronic device includes a substrate, a semiconductor unit and an insulating layer. The semiconductor unit is disposed on the substrate. The insulating layer is disposed on the semiconductor unit, and the insulating layer includes a first portion and a second portion connected to the first portion. In a top view, the first portion partially overlaps the semiconductor unit, the second portion does not overlap the semiconductor unit, and a part of an edge of the insulating layer is irregular.

Abstract: An antenna structure includes a substrate, a plurality of reflective plates, a grounding plate, a radiating member, a signal feeding via and a plurality of conductive vias. The substrate has opposite first and second surfaces and comprises liquid crystal polymer. The reflective plates are arrayed on the first surface of the substrate. The grounding plate is disposed on the second surface of the substrate and overlapped with the reflective plates in a normal direction of the substrate. The grounding plate further includes an opening. The radiating member is disposed on the first surface of the substrate and physically separated from the reflective plates. The signal feeding via is coupled with the radiating member and penetrates through the substrate to be exposed in the opening of the grounding plate. The conductive vias penetrate through the substrate and respectively connect the reflective plates and the grounding plate.

Abstract: A communication receiver includes a first signal processing circuit and a second signal processing circuit. The first signal processing circuit includes a first feedforward equalizer and a decision circuit. The first feedforward equalizer processes a received signal to generate a first equalized signal. The decision circuit performs hard decision upon the first equalized signal to generate a first symbol decision signal. The second signal processing circuit includes a second feedforward equalizer, a decision feedforward equalizer, and a first decision feedback equalizer. The second feedforward equalizer processes the first equalized signal to generate a second equalized signal. The decision feedforward equalizer processes the first symbol decision signal to generate a third equalized signal. The first decision feedback equalizer generates a second symbol decision signal according to the second equalized signal and the third equalized signal.

Abstract: A display device includes a display panel including a rollable portion and a non-rollable portion. The display panel includes a supporting structure including a groove disposed on a first side of the supporting structure, a substrate disposed on a second side of the supporting structure and the first side opposite to the second side, and a circuit board fixed onto a back of the display panel. The non-rollable portion has a first region. A first region of the circuit board is joined to the first region of the non-rollable portion. The non-rollable portion has a first end and a second end. The first end is connected to the rollable portion. The second end is connected to the circuit board.