Abstract: A semiconductor structure includes a first metal-dielectric-metal layer, a first dielectric layer, a first conductive layer, a second conductive layer, and a second dielectric layer. The first metal-dielectric-metal layer includes a plurality of first fingers, a plurality of second fingers, and a first dielectric material. The first fingers are electrically connected to a first voltage. The second fingers are electrically connected to a second voltage different from the first voltage, and the first fingers and the second fingers are arranged in parallel and staggeredly. The first dielectric material is between the first fingers and the second fingers. The first dielectric layer is over the first metal-dielectric-metal layer. The first conductive layer is over the first dielectric layer. The second conductive layer is over the first conductive layer. The second dielectric layer is between the first conductive layer and the second conductive layer.

Abstract: In some embodiments, the present disclosure relates to a semiconductor device. The semiconductor device includes a channel layer over a base substrate and an active layer over the channel layer. A source and a drain are over the active layer. A gate is over the active layer and laterally between the source and the drain. A dielectric is over the active layer and laterally surrounds the source, the drain, and the gate. A cap structure laterally contacts the source and is disposed laterally between the gate and the source. The source vertically extends to a top of the cap structure.

Abstract: A boundary defining method implemented by a boundary defining system comprises: (A) obtaining a piece of positioning data that includes a path record and a signal status record, the path record indicating a circling path defining a circled area, the signal status record indicating one or more risky path sections in the circling path that meet a poor signal condition; (B) based on each risky path section indicated by the signal status record, determining an alternative path section corresponding to the risky path section and located within the circled area; and (C) based on at least the alternative path section(s), generating and outputting a piece of operating range data indicating an operating boundary, the operating boundary defining an operating area suitable for automatic movement of an autonomous mobile operation equipment, and that does not include the risky path section(s).

Abstract: A signal sensing device includes a body and two signal sensing elements disposed in the body. An insulating layer is sandwiched between the two signal sensing elements. Each of the two signal sensing elements incudes a signal transmission section and a signal sensing section in electrical connection with the signal transmission section. The signal transmission sections are planar antennae parallel to each other and each having an antenna shape of meander-line type. The antenna shape of each transmission section has a vertical projection on a plane parallel to each signal transmission section. The vertical projections of the antenna shapes do not overlap completely. When a portion of the body forms a surrounding portion which surrounds a to-be-sensed target, a portion or an entirety of each signal sensing section is located on the surrounding portion.

Abstract: In some embodiments, the present disclosure relates to an integrated chip. The integrated chip includes a first source contact, a drain contact, and a first gate structure disposed over a substrate. The first gate structure is between the first source contact and the drain contact along a first direction. The first gate structure surrounds the first source contact. An isolation region is disposed within the substrate and surrounds an active area. A second gate structure surrounds a second source contact. The second gate structure is separated from the first gate structure by the drain contact. Both the first gate structure and the second gate structure are at least partially within the active area.

Abstract: Bonding a full-bridge device and an LLC device in a stack, or forming the full-bridge device and the LLC device on a same substrate, rather than connecting the devices, reduces a chip area associated with a power converter including the full-bridge device and the LLC device. Additionally, the full-bridge device and the LLC device consume less power because parasitic inductance and capacitance are reduced. Additionally, raw materials and production time are conserved that would otherwise have been used to connect the full-bridge device and the LLC device (e.g., via wires).

Abstract: A cushion airbag pad, which comprises: a cushion body, comprising a pad body; a plurality of airbags; and a plurality of airways; and a one-way air admittance member mounted in the cushion body and internally provided with a one-way air admittance channel; wherein the one-way air admittance channel is provided with an air inlet port and at least one air outlet port, and at least two ends of the one-way air admittance member are fixed to the cushion body, and one end of the at least two ends, away from the air inlet port, of the one-way air admittance member is fixed to the pad body, such that warping of the one-way air admittance member is inhibited, thereby keeping the one-way air admittance member in a non-bending state.

Abstract: An electronic package is provided and includes an electronic structure and a plurality of conductive pillars embedded in a cladding layer, a circuit structure formed on the cladding layer, and a reinforcing member bonded to a side surface of the cladding layer, where a plurality of electronic elements are disposed on and electrically connected to the circuit structure, such that the electronic structure electrically bridges any two of the electronic elements via the circuit structure, so as to enhance the structural strength of the electronic package and avoid warpage by means of the design of the reinforcing member.

Abstract: A negative pressure medical device includes a suction component and a care component. The suction component includes a cylinder body having a chamber. One end of the cylinder body has a suction port connected to the chamber. The other end of the cylinder body opposite the suction port has an insertion port. A plunger rod is disposed in the chamber, such that the plunger rod is movable in a direction along the suction port and the insertion port. The plunger rod abuts an inner peripheral wall of the cylinder body by an airtight component. The care component is configured to cover skin around a wound area of a user to maintain a negative pressure environment between the care component and the wound area. The care component is connected to the suction port of the suction component, such that gas of the negative pressure environment flows unidirectionally to the suction component.

Abstract: The present invention provides a chip including a plurality of application circuits and a UART interface. The plurality of application circuits, configured to generate a plurality of data, respectively, wherein the plurality of data respectively generated by the plurality of application circuits are transmitted to another chip via the same UART interface.

Abstract: The present disclosure relates to a transistor device. The transistor device includes a plurality of source contacts disposed over a substrate. A plurality of gate structures are disposed over the substrate. The plurality of gate structures wrap around one or more of the plurality of source contacts in one or more closed loops. A drain contact is disposed over the substrate. The drain contact continuously wraps around one or more of the plurality of gate structures as a continuous structure. The plurality of gate structures are separated from the drain contact by a first distance and are separated from a source contact of the plurality of source contacts by a second distance. The second distance is different than the first distance.

Abstract: A gas shield protection device for thermal spraying includes a spraying member and a gas shield generation device. The spraying member includes a nozzle and a shield body disposed on the nozzle. The nozzle is configured to align with one of a plurality of workpieces on a worktable. The gas shield generation device is configured to align with the worktable and includes a housing and a second gas ejection portion. The housing has a gas passageway therein. The second gas ejection portion has at least one gas ejection port intercommunicating with the gas passageway. The at least one gas ejection port is configured to face the plurality of workpieces, such that an area of a gas shield ejected from the at least one gas ejection port of the second gas ejection portion covers the plurality of workpieces. Thus, oxidation of the coating on the workpiece can be avoided.

Abstract: A signal sensing device includes a body and two signal sensing elements disposed in the body. An insulating layer is sandwiched between the two signal sensing elements. Each of the two signal sensing elements incudes a signal transmission section and a signal sensing section in electrical connection with the signal transmission section. The signal transmission sections are planar antennae parallel to each other and each having an antenna shape of meander-line type. The antenna shape of each transmission section has a vertical projection on a plane parallel to each signal transmission section. The vertical projections of the antenna shapes do not overlap completely. When a portion of the body forms a surrounding portion which surrounds a to-be-sensed target, a portion or an entirety of each signal sensing section is located on the surrounding portion.

Abstract: A signal sensing device includes a signal amplifying structure to amplify the strength of the measured signal. The signal sensing device includes a body, a signal sensing element, and a signal amplifying portion. The signal sensing element is disposed in the body and includes a signal transmission section and a signal sensing section in electrical connection with the signal transmission section. The signal amplifying portion includes a plurality of protruding structures protruding outward from the body. Each of the plurality of protruding structures is cylindrical and has a diameter of 250-400 ?m and a height of 40-75 ?m. When a portion of the body forms a surrounding portion surrounding a to-be-sensed target, a portion or an entirety of the signal sensing section is located on the surrounding portion, and the signal amplifying portion is partially or entirely in contact with the to-be-sensed target.

Abstract: A cell modification system includes a separation module, a modification module, a culture module and a filter module. The separation module is configured to receive a blood sample, separate cells and plasma from the blood sample, and then separate target cells. The modification module is configured to receive the target cells and introduce a modification composite material into the target cells to convert the target cells into modified cells. The culture module is configured to receive and store the modified cells, and monitor a cell proliferation environment to facilitate the activation and proliferation of the modified cells. The filter module is configured to receive the modified cells after proliferating, determine whether the modified cells have been modified successfully, and output the cells that have been modified successfully as a therapeutic product. A cell modification device is also disclosed.

Abstract: A surgical device has a handle, a shaft connecting to the handle, a clamping portion disposed on one end of the shaft different from the end connected to the handle, a hook fixedly connected to the shaft and a closing member pivotally connected to the hook, and a control mechanism mounted on the handle and extending through the shaft and connect to the clamping portion, wherein the control mechanism controls the pivoting of the closing member to switch the clamping portion between a closed position and an opened position.

Abstract: A bracket for a computing device includes a bracket backwall having a height H1, a first bracket sidewall coupled to a first corner of the bracket backwall, and a second bracket sidewall coupled to a second corner of the bracket backwall. The first bracket sidewall has a height H2,The second bracket sidewall is coupled to a second corner of the bracket backwall. The second corner is opposite the first corner along a diagonal of the bracket backwall. The second bracket sidewall has a height H2. The bracket further includes a first PCIe securing tab extending from the first bracket sidewall towards the second bracket sidewall, and a second PCIe securing tab extending from the second bracket sidewall towards the first bracket sidewall. The height H1 is approximately equal to a sum of the height H2 and the height H3.

Abstract: An electronic package is provided and includes a substrate structure, an electronic element disposed on the substrate structure and an encapsulation layer encapsulating the electronic element, where at least one functional circuit is formed on a surface of a substrate body of the substrate structure, and a wire having a smaller width is arranged on a boundary line at a junction between an encapsulation area and a peripheral area, so that when a mold for forming the encapsulation layer is formed to cover the substrate structure, the mold will create a gap around the wire to serve as an exhaust passage. Therefore, when the encapsulation layer is formed, the exhaust passage can be used to exhaust air, so as to avoid problems such as the occurrence of voids or overflows of the encapsulation layer.

Abstract: An information handling system includes a printed circuit board, a screw, and a processor. The printed circuit board includes a through hole via. The through hole via includes top and bottom sections plated with a conductive plating material, and a middle section without any conductive plating material. The screw is in physical communication with the top, middle, and bottom sections of the through hole via in the printed circuit board. The processor determines whether an electrical circuit is formed between the screw, the top section of the through hole via, and the bottom section of the through hole via. Based on the determination of the electrical circuit being formed, the processor provides an indication that no intrusion has been made into the information handling system.

Abstract: In some embodiments, the present disclosure relates to a method of forming a transistor device. The method includes forming a source contact over a substrate, forming a drain contact over the substrate, and forming a gate contact material over the substrate. The gate contact material is patterned to define a gate structure that wraps around the source contact along a continuous and unbroken path.