Abstract: A connector for coupling a coaxial cable (240) to a strip line comprises a first plate (210) to be arranged above a conductor (220) of the strip line to which a center conductor (244) of the coaxial cable (240) is soldered, the first plate (210) including: a first solder portion (212) to which a braid (242) of the coaxial cable (240) is soldered; and an aperture (214) formed adjacent to the first solder portion (212) and configured to prevent heat propagation of a solder point of the first solder portion (212) and the braid (242) of the coaxial cable (240) and to expose a solder point of the conductor (220) of the strip line and the center conductor (244) of the coaxial cable (240), wherein a biggest dimension of the aperture (214) is shaped to be less than 5% of highest frequency wavelength.

Abstract: There is provided a capacitive touch device including a touch panel, a detection circuit and a processing unit. The touch panel includes a plurality of drive electrodes and a plurality of receiving electrodes configured to form a coupling electric field with an external touch panel, and the receiving electrodes are respectively configured to output a detection signal. The detection circuit is coupled to one of the receiving electrodes and configured to modulate the detection signal with two signals to generate two detection components. The processing unit is configured to obtain a phase value according to the two detection components to accordingly decode transmission data.

Abstract: A clamping structure includes an object, a clamping component and an elastic component. The object has a hole and a containing space, wherein the containing space is connected to the hole. The clamping component includes a pillar, a bump and a head portion, wherein the bump and the head portion are connected to the pillar, and the pillar is adapted to be inserted into the hole and rotated such that the bump moves to the containing space. When the bump is located in the containing space, the elastic component is compressed between the object and the head portion, and the bump is positioned at the containing space by elastic force of the elastic component, such that the clamping component is fastened to the object.

Abstract: A liquid crystal display (LCD) system is provided. The LCD system includes a light source and a self-contained display unit including at least a LCD panel and a light guide plate coupled together, wherein the light guide plate is configured to guide light from the light source to the LCD panel as backlight and to structurally support the LCD panel. Further, a plurality of pre-made hollow spaces are contained in the display unit configured to host components of the LCD system. The LCD system also includes a controller contained in the plurality of pre-made hollow spaces and coupled to the LCD panel to control the LCD panel such that the light passing through the light guide plate is used as backlight for operation of the LCD panel.

Abstract: A consensus-based power control apparatus is provided, which includes a real power control module and a reactive power control module. A real power consensus signal between a first power generating apparatus and a second power generating apparatus is provided and a frequency restoration signal is generated according to the real power consensus signal, thereby allowing the real power control module to generate a real power output signal. A reactive power consensus signal between the first power generating apparatus and the second power generating apparatus is provided and a voltage differential restoration signal is generated according to the reactive power consensus signal, thereby allowing the reactive power control module to generate a reactive power output signal. Therefore, the invention can control real power and reactive power input signals (i.e., actual real power and reactive power outputs) of the first power generating apparatus in a grid system.

Abstract: A semiconductor component includes a semiconductor substrate having an opening A first dielectric liner having a first compressive stress is disposed in the opening. A second dielectric liner having a tensile stress is disposed on the first dielectric liner. A third dielectric liner having a second compressive stress disposed on the second dielectric liner.

Abstract: A method of making a solar cell includes: preparing an active layer solution including p-type and n-type organic semiconductor materials, a solvent, and an additive, the additive containing 1, 8-iodooctane (DIO) and 1-chloronaphthalene (CN) that has a total volume not greater than 3 vol % based on a total volume of the solvent and the additive; preparing an assembly having a substrate, a first electrode layer, and a first transporting layer; coating the active layer solution on the first transporting layer to form a wet active layer; drying the wet active layer at a temperature not greater than 60° C.; and forming a second transporting layer and a second electrode layer on the active layer.

Abstract: An embedded button without having gap is disclosed according to the present invention. The button area just bends to operate instead of moving back and forth to operate within a through hole so that no water, vapor, or dust shall enter into the device. One of the embodiment comprises an inner bump configured on an inner side of an outer frame; a pressure switch is configured under the inner bump and touches the bottom surface of the bump; and an activating electrical signal is triggered when the button area is pressed by user with a force exceeding a threshold force level from outside surface of the outer frame of the electronic device.

Abstract: An enclosure includes a chassis received a plurality of heating elements and a power supply unit. The chassis defines a plurality of air inlets. The power supply unit includes a fixing bracket and a power supply fan fixed in the fixing bracket. The fixing bracket defines a plurality of air vents and a plurality of air outlets. The airflow can enter into the enclosure through the air inlets and enter into the fixing bracket through the air vents after taking away the heat of the heating elements. The airflow will dissipate out of the enclosure from the air outlets under the drive of power supply fan.

Abstract: A method of making a semiconductor device is provided including forming a first opening and a second opening in a first surface of a substrate. A conductive material is formed in the first opening and in the second opening and over the first surface in the first region of the substrate between the openings. A thickness of the substrate may be reduced from a second surface of the substrate, opposite the first surface, to a third surface opposite the first surface which exposes the conductive material in the first opening and the conductive material in the second opening. A light emitting diode (LED) device is connected to the third surface of the substrate.

Abstract: A semiconductor device having light-emitting diodes (LEDs) formed on a concave textured substrate is provided. A substrate is patterned and etched to form recesses. A separation layer is formed along the bottom of the recesses. An LED structure is formed along the sidewalls and, optionally, along the surface of the substrate between adjacent recesses. In these embodiments, the surface area of the LED structure is increased as compared to a planar surface. In another embodiment, the LED structure is formed within the recesses such that the bottom contact layer is non-conformal to the topology of the recesses. In these embodiments, the recesses in a silicon substrate result in a cubic structure in the bottom contact layer, such as an n-GaN layer, which has a non-polar characteristic and exhibits higher external quantum efficiency.

Abstract: A processor is provided having an instruction set with a sliding window non-linear convolution function. A processor obtains a software instruction that performs a non-linear convolution function for a plurality of input delayed signal samples. In response to the software instruction for the non-linear convolution function, the processor generates a weighted sum of two or more of the input delayed signal samples, wherein the weighted sum comprises a plurality of variable coefficients defined as a sum of one or more non-linear functions of a magnitude of the input delayed signal samples; and repeats the generating step for at least one time-shifted version of the input delayed signal samples to compute a plurality of consecutive outputs. The software instruction for the non-linear convolution function is optionally part of an instruction set of the processor. The non-linear convolution function can model a non-linear system with memory, such as a power amplifier model and/or a digital pre-distortion function.

Abstract: In one embodiment, the present invention is a method for performing incremental preamble detection in a wireless communication network. The method processes non-overlapping chunks of incoming antenna data, where each chunk is smaller than the preamble length, to detect the signature of the transmitted preamble. For each chunk processed, chips of the chunk are correlated with possible signatures employed by the wireless network to update a set of correlation profiles, each profile comprising a plurality of profile values. Further, an intermediate detection is performed by comparing the updated profile values to an intermediate threshold that is also updated for each chunk. Upon receiving the final chunk, the correlation profiles are updated, and a final preamble detection is made by comparing the updated profile values to a final threshold. Detections are performed on an incremental basis to meet latency requirements of the wireless network.

Abstract: A data migration system and a data migration method thereof are provided. The data migration system comprises a transmission unit, a storage unit and a processing unit. The transmission unit is configured to connect with a client and a legacy storage system. The processing unit is configured to: receive a first data request from the client via the transmission unit, wherein the first data request indicates a required data; determine that the required data is missed in the storage unit; retrieve the required data from the legacy storage system via the transmission unit; copy the required data in the storage unit; and transmit the required data to the client via the transmission unit.

Abstract: A device and a method for virtual storage are provided. The device includes a physical processor, a hypervisor and a physical storage. The hypervisor is executed on the physical processor and configured to create at least one client virtual machine and a controller virtual machine. The physical storage is clustered with physical storage of at least another device via the controller virtual machine to form a storage cluster. The controller virtual machine is further configured to define a virtual storage pool in the storage cluster and create at least one virtual storage controller virtual machine to interface the at least one client virtual machine with the virtual storage pool so that the at least one client virtual machine accesses the virtual storage pool via the at least one virtual storage controller virtual machine and the controller virtual machine. The method is applied to the device to implement the operations.

Abstract: Through silicon via (TSV) isolation structures are provided and suppress electrical noise such as may be propagated through a semiconductor substrate when caused by a signal carrying active TSV such as used in 3D integrated circuit packaging. The isolation TSV structures are surrounded by an oxide liner and surrounding dopant impurity regions. The surrounding dopant impurity regions may be P-type dopant impurity regions that are coupled to ground or N-type dopant impurity regions that may advantageously be coupled to VDD. The TSV isolation structure is advantageously disposed between an active, signal carrying TSV and active semiconductor devices and the TSV isolation structures may be formed in an array that isolates an active, signal carrying TSV structure from active semiconductor devices.

Abstract: This invention provides novel azido linkers for deoxynucleotide analogues having a detectable marker attached thereto.

Abstract: A method of making a semiconductor device, the method includes forming a first opening and a second opening in a substrate. The method further includes forming a conductive material in the first opening and in the second opening, the conductive material comprising a joined portion where the conductive material in the first opening and the conductive material in the second opening are electrically and thermally connected together at a first surface of the substrate. The method further includes reducing a thickness of the substrate from a second surface of the substrate, opposite the first surface, to expose the conductive material in the first opening and the conductive material in the second opening. The method further includes connecting a device to the second surface of the substrate.

Abstract: A vector processor is provided having an instruction set with a vector convolution function. The disclosed vector processor performs a convolution function between an input signal and a filter impulse response by obtaining a vector comprised of at least N1+N2-1 input samples; obtaining N2 time shifted versions of the vector (including a zero shifted version), wherein each time shifted version comprises N1 samples; and performing a weighted sum of the time shifted versions of the vector by a vector of N1 coefficients; and producing an output vector comprising one output value for each of the weighted sums. The vector processor performs the method, for example, in response to one or more vector convolution software instructions having a vector input. The vector can comprise a plurality of real or complex input samples and the filter impulse response can be expressed using a plurality of coefficients that are real or complex.

Abstract: A light-emitting device comprises a substrate; a plurality of light-emitting diodes formed on the substrate, wherein each of the plurality of light-emitting diodes comprises a first conductivity type layer, an active layer on the first conductivity type layer, and a second conductivity type layer on the active layer; a reflective layer surrounding a sidewall of each of the plurality of light-emitting diodes; and a top electrode formed on the reflective layer and the plurality of light-emitting diodes.