Patents by Inventor Lin Yu

Lin Yu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 8575725
    Abstract: A semiconductor component includes a semiconductor substrate having a top surface. An opening extends from the top surface into the semiconductor substrate. The opening includes an interior surface. A first dielectric liner having a first compressive stress is disposed on the interior surface of the opening. A second dielectric liner having a tensile stress is disposed on the first dielectric liner. A third dielectric liner having a second compressive stress disposed on the second dielectric liner. A metal barrier layer is disposed on the third dielectric liner. A conductive material is disposed on the metal barrier layer and fills the opening.
    Type: Grant
    Filed: March 13, 2013
    Date of Patent: November 5, 2013
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Chen-Hua Yu, Cheng-Hung Chang, Ebin Liao, Chia-Lin Yu, Hsiang-Yi Wang, Chun Hua Chang, Li-Hsien Huang, Darryl Kuo, Tsang-Jiuh Wu, Wen-Chih Chiou
  • Patent number: 8575115
    Abstract: The present invention relates to a novel crystalline form of a Compound 3,4?,5-trihydroxy-stilbene-3-?-D-glucoside (polydatin) and a method of preparation and use thereof, and to a pharmaceutical composition containing crystalline form I of 3,4?,5-trihydroxy-stilbene-3-?-D-glucoside. Crystalline form I of 3,4?,5-trihydroxy-stilbene-3-?-D-glucoside of the present invention has a stable crystalline morphology, a definite melting point and a good chemical stability. Such a novel form of 3,4?,5-trihydroxy-stilbene-3-?-D-glucoside possesses the properties required for the preparation of solid formulations and is easily tabletable and readily formable when formulated, which allows for substantial decrease in raw materials costs, more facile operations in production and easier control over quality in industrial drug production, and moreover, better convenience in storage.
    Type: Grant
    Filed: August 28, 2006
    Date of Patent: November 5, 2013
    Assignee: Shenzhen Neptunus Pharmaceutical Holdings Co., Ltd.
    Inventors: Hui Kang, Jinhua Zhao, Guanghui Yao, Weizhen Zeng, Milai Yin, Yong Li, Cunfang Wang, Lijuan Zhang, Dan Zhu, Hong Chen, Chuangui Huang, Yu Man, Jing Li, Hanlin Feng, Lin Yu
  • Publication number: 20130279404
    Abstract: In one embodiment, the invention is a method for performing preamble detection in a wireless communication network. The method performs a first dwell, wherein non-overlapping chunks of received data are processed to generate partial correlation values for each possible combination of a signature code and delay. Candidate selection is performed by comparing each of the partial correlation values to a candidate-selection threshold. For each detected candidate, the chunks of received data are processed to generate full correlation values. Each full correlation value is then compared to a preamble-detection threshold to detect a transmitted signature. Generating full correlation values for only the selected candidates reduces the computation complexity over prior-art methods that generate full correlation values for all signatures at all delays.
    Type: Application
    Filed: November 27, 2012
    Publication date: October 24, 2013
    Applicant: LSI Corporation
    Inventors: Ivan L. Mazurenko, Alexander A. Petyushko, Meng-Lin Yu, Jian-Guo Chen
  • Patent number: 8546953
    Abstract: Through silicon via (TSV) isolation structures are provided and suppress electrical noise such as may be propagated through a semiconductor substrate when caused by a signal carrying active TSV such as used in 3D integrated circuit packaging. The isolation TSV structures are surrounded by an oxide liner and surrounding dopant impurity regions. The surrounding dopant impurity regions may be P-type dopant impurity regions that are coupled to ground or N-type dopant impurity regions that may advantageously be coupled to VDD. The TSV isolation structure is advantageously disposed between an active, signal carrying TSV and active semiconductor devices and the TSV isolation structures may be formed in an array that isolates an active, signal carrying TSV structure from active semiconductor devices.
    Type: Grant
    Filed: December 13, 2011
    Date of Patent: October 1, 2013
    Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
    Inventors: Jaw-Juinn Horng, Chia-Lin Yu, Chung-Hui Chen, Der-Chyang Yeh, Yung-Chow Peng
  • Patent number: 8549525
    Abstract: A method for executing a first and a second task in M time units is disclosed. The method includes comparing the priority of the first task and the task. If the first task has a higher priority than the second task, the first task is executed. The first task is then suspended after the first duration, and the second task is executed for a second duration.
    Type: Grant
    Filed: March 5, 2007
    Date of Patent: October 1, 2013
    Assignee: Mediatek Inc.
    Inventors: Kuo-Hsien Hung, Lin Yu Hsiang
  • Patent number: 8519414
    Abstract: A semiconductor structure includes a substrate and a conductive carrier-tunneling layer over and contacting the substrate. The conductive carrier-tunneling layer includes first group-III nitride (III-nitride) layers having a first bandgap, wherein the first III-nitride layers have a thickness less than about 5 nm; and second III-nitride layers having a second bandgap lower than the first bandgap, wherein the first III-nitride layers and the second III-nitride layers are stacked in an alternating pattern. The semiconductor structure is free from a III-nitride layer between the substrate and the conductive carrier-tunneling layer. The semiconductor structure further includes an active layer over the conductive carrier-tunneling layer.
    Type: Grant
    Filed: September 20, 2011
    Date of Patent: August 27, 2013
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Chia-Lin Yu, Ding-Yuan Chen, Chen-Hua Yu, Wen-Chih Chiou
  • Patent number: 8516028
    Abstract: A system and method for providing memory bandwidth efficient correlation acceleration. A correlation accelerator or correlator (e.g., an X*Y correlator) can be configured in association with a processor of a wireless communication system for correlating an input signal data sequence (X) and its shifted versions with a reference data sequence. Shifted versions (including the 0-shifted or the original) with respect to the input signal data sequence can be generated for each column (Y columns) of a sliding window in the correlator in order to reduce an input bandwidth requirement. Each input signal data and the shifted versions can be concurrently multiplied with the reference signal data and the results can be summed together in order to generate an output signal data profile. The output signal data profile can be stored into an accumulator register in order to reduce an output bandwidth requirement.
    Type: Grant
    Filed: August 3, 2010
    Date of Patent: August 20, 2013
    Assignee: LSI Corporation
    Inventor: Meng-Lin Yu
  • Patent number: 8507940
    Abstract: The package substrates with through silicon plugs (or vias) described above provide lateral and vertical heat dissipation pathways for semiconductor chips that require thermal management. Designs of through silicon plugs (TSPs) with high duty ratios can most effectively provide heat dissipation. TSP designs with patterns of double-sided combs can provide high duty ratios, such as equal to or greater than 50%. Package substrates with high duty ratios are useful for semiconductor chips that generate large amount of heat. An example of such semiconductor chip is a light-emitting diode (LED) chip.
    Type: Grant
    Filed: September 10, 2010
    Date of Patent: August 13, 2013
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Chen-Hua Yu, Hung-Pin Chang, Yung-Chi Lin, Chia-Lin Yu, Jui-Pin Hung, Chien Ling Hwang
  • Patent number: 8504603
    Abstract: A method and system for parallel computation of a linear sequential circuit (LSC) based on a state transition matrix is disclosed herein. A multistep state transition matrix and a multistep output generation matrix can be pre-computed and stored in association with the linear sequential circuit. The multiple state transitions and the multiple output bits can be computed by multiplying the current input-state vector with a multistep next state transition matrix and a multistep output generation matrix, respectively. Multiple state transitions and multiple output bits can be generated in parallel in a single clock cycle based on the pre-computed state transition matrix and the output generation matrix utilizing a dot product in order to improve computational speed. Such a simple augmentation provides a flexible and inexpensive solution for high speedup linear sequential circuit computation with respect to a processor.
    Type: Grant
    Filed: July 28, 2010
    Date of Patent: August 6, 2013
    Assignee: LSI Corporation
    Inventor: Meng-Lin Yu
  • Publication number: 20130195007
    Abstract: In one embodiment, the present invention is a method for performing incremental preamble detection in a wireless communication network. The method processes non-overlapping chunks of incoming antenna data, where each chunk is smaller than the preamble length, to detect the signature of the transmitted preamble. For each chunk processed, chips of the chunk are correlated with possible signatures employed by the wireless network to update a set of correlation profiles, each profile comprising a plurality of profile values. Further, an intermediate detection is performed by comparing the updated profile values to an intermediate threshold that is also updated for each chunk. Upon receiving the final chunk, the correlation profiles are updated, and a final preamble detection is made by comparing the updated profile values to a final threshold. Detections are performed on an incremental basis to meet latency requirements of the wireless network.
    Type: Application
    Filed: August 3, 2012
    Publication date: August 1, 2013
    Applicant: LSI Corporation
    Inventors: Ivan Leonidovich Mazurenko, Alexander Alexandrovich Petyushko, Meng-Lin Yu, Jian-Guo Chen
  • Patent number: 8487410
    Abstract: A semiconductor component includes a semiconductor substrate having a top surface. An opening extends from the top surface into the semiconductor substrate. The opening includes an interior surface. A first dielectric liner having a first compressive stress is disposed on the interior surface of the opening. A second dielectric liner having a tensile stress is disposed on the first dielectric liner. A third dielectric liner having a second compressive stress disposed on the second dielectric liner. A metal barrier layer is disposed on the third dielectric liner. A conductive material is disposed on the metal barrier layer and fills the opening.
    Type: Grant
    Filed: April 13, 2011
    Date of Patent: July 16, 2013
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Chen-Hua Yu, Cheng-Hung Chang, Ebin Liao, Chia-Lin Yu, Hsiang-Yi Wang, Chun Hua Chang, Li-Hsien Huang, Darryl Kuo, Tsang-Jiuh Wu, Wen-Chih Chiou
  • Patent number: 8486807
    Abstract: A method of forming a semiconductor structure includes providing a substrate; forming a buffer/nucleation layer over the substrate; forming a group-III nitride (III-nitride) layer over the buffer/nucleation layer; and subjecting the III-nitride layer to a nitridation. The step of forming the III-nitride layer comprises metal organic chemical vapor deposition.
    Type: Grant
    Filed: December 17, 2010
    Date of Patent: July 16, 2013
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Chen-Hua Yu, Chia-Lin Yu, Ding-Yuan Chen, Wen-Chih Chiou
  • Publication number: 20130176718
    Abstract: A luminous circuit and a luminous device having the same are provided. The luminous circuit may include a first conducting wire and a second conducting wire connected to a positive terminal and a negative terminal of a power supply, respectively. The luminous circuit may further include N light-emitting circuits electrically and sequentially coupled between the first conducting wire and the second conducting wire in a parallel connection fashion beginning from a location in proximity of the power supply. Each of the light-emitting circuits corresponds to a light-emitting element, and jth light-emitting element is better than ith light-emitting element in lighting efficiency, wherein 1?i<j?N, i, j, and N are integers, and N?2.
    Type: Application
    Filed: April 23, 2012
    Publication date: July 11, 2013
    Applicant: LEXTAR ELECTRONICS CORP.
    Inventor: TSUNG-LIN YU
  • Publication number: 20130176145
    Abstract: A system is provided for detecting a blind spot for a driver of a vehicle. The system includes a side mirror. The side mirror is arranged on a body of the vehicle and includes a side mirror body, a mirror, and a supporting structure. The system also includes a detection system. The detection system is physically coupled with the side mirror to detect an object in a detection zone of the detection system. The detection zone covers the blind spot, and the detection system includes a detection module, an alert indicator, and a control module. The detection module includes at least one of a transmitter and a receiver, and the alert indicator is configured to send an alert light to the driver at a predetermined angle such that the alert light does not interfere with drivers of other vehicles close to the vehicle.
    Type: Application
    Filed: January 10, 2012
    Publication date: July 11, 2013
    Inventor: Xiao Lin Yu
  • Publication number: 20130149197
    Abstract: A biotechnology detection device with optical fibers comprises a first optical fiber connected to a light source, and a prism having a first surface and a second surface. The first surface is connected to the first optical fiber and coated with an anti-reflective layer to be passed through by short-wavelength light; a second optical fiber connected to the second surface of the prism. The end of the second optical fiber is to be coated with test sample blended with a fluorescent agent, wherein the fluorescent agent emits long-wavelength light after being excited by short-wavelength light. The second prism surface is coated with a high reflective layer to reflect part of the long-wavelength light. A third optical fiber is connected to the second prism surface to convey part of the long-wavelength light. A detector is connected to the third optical fiber for detecting part of the long-wavelength light.
    Type: Application
    Filed: June 12, 2012
    Publication date: June 13, 2013
    Applicant: National Taiwan University of Science and Technology
    Inventors: Shien-Kuei Liaw, Chia-Ching Chang, Shin-Hua Tseng, Yi-Lin Yu, Shu-Chuan Lin, Hung-Wei Chen
  • Publication number: 20130147057
    Abstract: Through silicon via (TSV) isolation structures are provided and suppress electrical noise such as may be propagated through a semiconductor substrate when caused by a signal carrying active TSV such as used in 3D integrated circuit packaging. The isolation TSV structures are surrounded by an oxide liner and surrounding dopant impurity regions. The surrounding dopant impurity regions may be P-type dopant impurity regions that are coupled to ground or N-type dopant impurity regions that may advantageously be coupled to VDD. The TSV isolation structure is advantageously disposed between an active, signal carrying TSV and active semiconductor devices and the TSV isolation structures may be formed in an array that isolates an active, signal carrying TSV structure from active semiconductor devices.
    Type: Application
    Filed: December 13, 2011
    Publication date: June 13, 2013
    Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
    Inventors: Jaw-Juinn HORNG, Chia-Lin YU, Chung-Hui CHEN, Der-Chyang YEH, Yung-Chow PENG
  • Patent number: 8437137
    Abstract: A fixing mechanism for fixing a thermal module on a base includes a U-shaped buckling component disposed on a side of the base for buckling a thermal fin and a heat conducting block of the thermal module, and a fixing component disposed on the other side of the base and connected to the U-shaped buckling component for clipping the base with the U-shaped buckling component.
    Type: Grant
    Filed: October 24, 2010
    Date of Patent: May 7, 2013
    Assignee: MSI Computer (Shenzhen) Co., Ltd.
    Inventors: Lin-Yu Lee, Shang-Chih Yang
  • Publication number: 20130107878
    Abstract: A method for node communication for use in a rack system is provided. The method includes providing a detecting unit for connecting to the nodes via a circuit switching device; predefining a linked list in which a limit of times for the detecting unit to communicate with each of the nodes is set; sequentially selecting one node of the nodes so that the detecting unit is connected to the one node via the circuit switching device; adding an assigned communication parameter between the detecting unit and the one node selected to the linked list, wherein a number of times of communication corresponding to the assigned communication parameter is not greater than the limit of times; and performing communication between the detecting unit and the one node selected in accordance with the assigned communication parameter in the linked list.
    Type: Application
    Filed: March 5, 2012
    Publication date: May 2, 2013
    Applicant: INVENTEC CORPORATION
    Inventor: Lin YU
  • Publication number: 20130110926
    Abstract: A method for controlling a rack system including a plurality of detachable chassis, where at lease one node is disposed in the chassis and a rack management controller (RMC) is disposed in the rack system. First, at least one detecting unit connected to the RMC and the node of the chassis in the rack system is provided. Next, a status message of the chassis is detected for determining whether the status of the chassis is changed. When the status is changed, the detecting unit determines whether the node corresponding to the chassis exists in the rack system. When the node exists, the detecting unit acquires a message of a field replaceable unit (FRU) of the node. Thereafter, the detecting unit transmits the message of the FRU to the RMC. Then, the RMC determines a type of the node according to the message of the FRU.
    Type: Application
    Filed: March 6, 2012
    Publication date: May 2, 2013
    Applicant: INVENTEC CORPORATION
    Inventor: Lin YU
  • Patent number: D680965
    Type: Grant
    Filed: April 14, 2011
    Date of Patent: April 30, 2013
    Assignee: Micro-Star Int'l Co., Ltd.
    Inventors: Shang-Chih Yang, Lin-Yu Lee