Patents by Inventor Ling Wei
Ling Wei has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20210066125Abstract: A package structure and a formation method of a package structure are provided. The method includes forming a conductive structure over a carrier substrate and disposing a semiconductor die over the carrier substrate. The method also includes forming a protective layer to surround the conductive structure and the semiconductor die. The method further includes forming an insulating layer over the protective layer. The insulating layer has an opening exposing a portion of the conductive structure. In addition, the method includes forming a conductive layer over the insulating layer. The conductive layer fills the opening, and the conductive layer has a substantially planar top surface.Type: ApplicationFiled: June 5, 2020Publication date: March 4, 2021Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.Inventors: Ling-Wei LI, Jung-Hua CHANG, Cheng-Lin HUANG
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Publication number: 20210066179Abstract: A package structure and a formation method of a package structure are provided. The method includes forming a conductive structure over a carrier substrate. The conductive structure has a lower portion and an upper portion, and the upper portion is wider than the lower portion. The method also includes disposing a semiconductor die over the carrier substrate. The method further includes forming a protective layer to surround the conductive structure and the semiconductor die. In addition, the method includes forming a conductive bump over the conductive structure. The lower portion of the conductive structure is between the conductive bump and the upper portion of the conductive structure.Type: ApplicationFiled: June 4, 2020Publication date: March 4, 2021Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.Inventors: Ling-Wei Li, Jung-Hua Chang, Cheng-Lin Huang
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Patent number: 10932195Abstract: In one embodiment, a method comprises: generating and storing, by a parent device in a low power lossy network (LLN), first state variables associated with a first execution state of an attached child during an active state of the child; determining a request, received by the parent device, is destined for the child and specifying a second execution state to be executed by the child; selectively updating, by the parent device, the first state variables with second state variables associated with the second execution state identifying an updated execution state for the child; detecting, by the parent device, that the child has transitioned from a sleep state to a second active state, and in response generating an instruction based on the second state variables; and transmitting the instruction to the child during the second active state, causing the child to execute the second execution state.Type: GrantFiled: September 18, 2019Date of Patent: February 23, 2021Assignee: CISCO TECHNOLOGY, INC.Inventors: Lele Zhang, Ling Wei, Xi Wu, Tonglin Yuan
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Publication number: 20200411467Abstract: A method for forming a chip package structure is provided. The method includes forming a first conductive bump and a first ring-like structure over a chip. The first ring-like structure surrounds the first conductive bump, the first ring-like structure and the first conductive bump are made of a same first material, the chip includes an interconnect structure, and the first ring-like structure is electrically insulated from the interconnect structure and the first conductive bump. The method includes bonding the chip to a substrate through the first conductive bump.Type: ApplicationFiled: June 27, 2019Publication date: December 31, 2020Inventors: Sheng-Yao YANG, Ling-Wei LI, Yu-Jui WU, Cheng-Lin HUANG, Chien-Chen LI, Lieh-Chuan CHEN, Che-Jung CHU, Kuo-Chio LIU
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Publication number: 20200411468Abstract: A chip package structure is provided. The chip package structure includes a first substrate. The chip package structure includes a conductive via structure passing through the first substrate. The chip package structure includes a chip over a first surface of the first substrate. The chip package structure includes a barrier layer over a second surface of the first substrate. The chip package structure includes an insulating layer over the barrier layer. The chip package structure includes a conductive pad over the insulating layer and passing through the insulating layer and the barrier layer to connect with the conductive via structure. The chip package structure includes a conductive bump over the conductive pad.Type: ApplicationFiled: August 17, 2020Publication date: December 31, 2020Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.Inventors: Ling-Wei LI, Jung-Hua CHANG, Cheng-Lin HUANG
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Patent number: 10809996Abstract: A method for creating image and a device thereof are provided. The method includes the following steps. A first software content list of a plurality of electronic devices is loaded. An operating system (OS), a plurality of first drivers and a plurality of first software are downloaded according to the first software content list. The OS, the plurality of first drivers and the plurality of first software are compressed into first image. The first image is decompressed, the first image is executed on each of the plurality of electronic devices, and the OS, at least one of the plurality of first drivers, and at least one of the plurality of first software are installed.Type: GrantFiled: November 30, 2018Date of Patent: October 20, 2020Assignee: Acer IncorporatedInventors: Chiu-Ling Wei, Hung-Ming Chang, Ming-Hao Kuo
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Patent number: 10765681Abstract: The present disclosure provides compounds of Formulas (I?) and (I), and pharmaceutically acceptable salts thereof. The compounds described herein may be useful in treating and/or preventing proliferative diseases (e.g., cancer). Also provided in the present disclosure are pharmaceutical compositions, kits, and uses thereof for treating proliferative diseases.Type: GrantFiled: February 3, 2017Date of Patent: September 8, 2020Assignees: Academia Sinica, National Taiwan UniversityInventors: Chi-Huey Wong, Pan-Chyr Yang, Jim-Min Fang, Szu-Hua Pan, Ting-Jen R. Cheng, Ling-Wei Li
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Patent number: 10770427Abstract: A method for forming a chip package structure is provided. The method includes forming a conductive via structure in a first substrate. The method includes bonding a chip to a first surface of the first substrate. The method includes forming a barrier layer over a second surface of the first substrate. The method includes forming a first insulating layer over the barrier layer. The method includes forming a conductive pad over the first insulating layer and in the first opening, the second opening, and the third opening. The conductive pad continuously extends from the conductive via structure into the third opening. The method includes forming a conductive bump over the conductive pad in the third opening.Type: GrantFiled: June 27, 2019Date of Patent: September 8, 2020Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.Inventors: Ling-Wei Li, Jung-Hua Chang, Cheng-Lin Huang
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Publication number: 20200105654Abstract: A method includes receiving a first design for conductive bumps on a first surface of an interposer, the conductive bumps in the first design having a same cross-section area; grouping the conductive bumps in the first design into a first group of conductive bumps in a first region of the first surface and a second group of conductive bumps in a second region of the first surface, where a bump pattern density of the second region is lower than that of the first region; forming a second design by modifying the first design, where modifying the first design includes modifying a cross-section area of the second group of conductive bumps in the second region; and forming the conductive bumps on the first surface of the interposer in accordance with the second design, where after being formed, the first group of conductive bumps and the second group of conductive bumps have different cross-section areas.Type: ApplicationFiled: June 21, 2019Publication date: April 2, 2020Inventors: Ling-Wei Li, Cheng-Lin Huang, Min-Tar Liu, Fu-Kang Chiao, Matt Chou, Chun-Yen Lo, Che-Jung Chu, Wen-Ming Chen, Kuo-Chio Liu
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Patent number: 10368776Abstract: An apparatus for determining cardiac performance in the patient includes a plurality of electrodes adapted to be placed in the patient and in communication with a heart chamber of the patient for measuring conductance and blood volume in the heart chamber of the patient; and a processor for determining instantaneous volume of the ventricle based on measurement of complex admittance at a plurality of frequencies to identify mechanical strength of the chamber, the processor in communication with the electrodes. A method for determining cardiac performance in a patient.Type: GrantFiled: November 17, 2017Date of Patent: August 6, 2019Assignee: Board of Regents, The University of Texas SystemInventors: Marc D. Feldman, Jonathan W. Valvano, John A. Pearce, Chia-Ling Wei
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Patent number: 10359516Abstract: Camera set with connecting structure includes a main camera and a detachable camera. The main camera includes a main housing with a main camera module mounted therein. A docking structure and a main connector are mounted on a side of the main housing. The main camera module includes a main lens mounted on a front side of the main housing. The detachable camera includes an expanded housing with a detachable camera module mounted therein. A join structure and a first expanded connector are mounted on a side of the expanded housing. The detachable camera module includes an expanded lens mounted on a front side of the expanded housing. A second expanded connector is mounted on the other side of the expanded housing. The main camera can be used individually or can expand functions by being assembled to another camera by the docking structure and join the structures.Type: GrantFiled: November 6, 2017Date of Patent: July 23, 2019Assignee: LIPS CORPORATIONInventors: Ling-Wei Liu, Yu-Chuan Shen, Cheng-Li Hsieh
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Publication number: 20190171431Abstract: A method for creating image and a device thereof are provided. The method includes, loading a first software content list of a plurality of electronic devices; downloading an operating system (OS), a plurality of first drivers and a plurality of first software according to the first software content list; compressing the OS, the plurality of first drivers and the plurality of first software into first image. The method also includes, decompressing the first image, so as to execute the first image on each of the plurality of electronic devices, and install the OS, at least one of the plurality of first drivers, and at least one of the plurality of first software.Type: ApplicationFiled: November 30, 2018Publication date: June 6, 2019Applicant: Acer IncorporatedInventors: Chiu-Ling Wei, Hung-Ming Chang, Ming-Hao Kuo
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Publication number: 20180369249Abstract: The present disclosure provides compounds of Formulas (I?) and (I), and pharmaceutically acceptable salts thereof. The compounds described herein may be useful in treating and/or preventing proliferative diseases (e.g., cancer). Also provided in the present disclosure are pharmaceutical compositions, kits, and uses thereof for treating proliferative diseases.Type: ApplicationFiled: February 3, 2017Publication date: December 27, 2018Applicants: Academia Sinica, National Taiwan UniversityInventors: Chi-Huey Wong, Pan-Chyr Yang, Jim-Min Fang, Szu-Hua Pan, Ting-Jen R. Cheng, Ling-Wei Li
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Publication number: 20180329059Abstract: Camera set with connecting structure comprises a main camera and a detachable camera. The main camera comprises a main housing with a main camera module being mounted therein. A docking structure and a main connector are mounted on a side of the main housing. The main camera module comprises a main lens being mounted on a front side of the main housing. The detachable camera comprises an expanded housing with a detachable camera being mounted therein. A join structure and a first expanded connector are mounted on a side of the expanded housing. The detachable camera module comprises an expanded lens being mounted on a front side of the expanded housing. A second expanded connector is mounted on the other side of the expanded housing. The main camera can be used individually or can expand functions by assembled to other camera by the docking structure and join structures.Type: ApplicationFiled: November 6, 2017Publication date: November 15, 2018Inventors: Ling-Wei Liu, Yu-Chuan Shen, Cheng-Li Hsieh
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Patent number: 10070782Abstract: The present disclosure provides an adaptive optical retina imaging apparatus and method. The adaptive optical retina imaging apparatus comprises an optical processing unit, an adaptive optical unit, a two-dimensional scanning unit and a primary aberration correcting unit, in which an imaging unit included in the optical processing unit is imaging based on the signal after high order aberration compensation and low order aberration compensation.Type: GrantFiled: April 26, 2016Date of Patent: September 11, 2018Assignee: The Institute of Optics and Electronics, The Chinese Academy of SciencesInventors: Yi He, Guohua Shi, Jinsheng Yang, Ling Wei, Xiqi Li, Zhibin Wang, Yudong Zhang
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Publication number: 20180240049Abstract: The invention provides a verifying method and a verifying device. The verifying method includes receiving a marketing requirement document (MRD) and a softload content list (SCL). The MRD includes a touch point information of a plurality of applications of a plurality of product lines. The SCL includes a name information and a version information of applications of one of the product lines. The verifying method further includes obtaining a first touch point information to be verified according to the MRD and the SCL. The first touch point information corresponds to a first application of the applications. The verifying method further includes searching a first application module corresponding to the first application from an application database according to the name information or the version information of the first application. The verifying method further includes verifying whether a touch point path of the first application module is valid.Type: ApplicationFiled: May 12, 2017Publication date: August 23, 2018Applicant: Acer IncorporatedInventors: Chiu-Ling Wei, Zhe-Xuan Zhou, Liang-Chi Chen
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Patent number: 10040994Abstract: The present invention provides a phosphor represented by the following formula: K2[Ge1-xF6]:Mnx4+, wherein 0<x<0.2. The phosphor has a hexagonal phase of a P63mc space group. The present invention also provides a method for fabricating the above phosphor. The present invention further provides a light-emitting device and a backlight module employing the same.Type: GrantFiled: May 13, 2016Date of Patent: August 7, 2018Assignee: Lextar Electronics CorporationInventors: Chun Che Lin, Ling-Ling Wei, Huan Jiao, Ru-Shi Liu, Ching-Yi Chen, Yu-Chun Lee, Tzong-Liang Tsai
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Patent number: 10026104Abstract: A computer-implemented method for automatically pausing advertisements based on user attention includes rendering a digital video to a user, in response to the user initiating the digital video through a web multimedia player. The computer-implemented method also includes streaming an advertisement to the user once the user begins to watch the digital video and monitoring the user attention as the user watches the advertisement. The user attention is monitored based on keystrokes and mouse movements. Further, the computer-implemented method includes detecting one or more changes in the user attention. Furthermore, the computer-implemented method includes pausing the advertisement automatically at instance of detecting the one or more changes. Moreover, the computer-implemented method includes detecting the one or more changes that directs the user attention to the paused advertisement and resuming streaming of the advertisement.Type: GrantFiled: November 16, 2015Date of Patent: July 17, 2018Assignee: EXCALIBUR IP, LLCInventors: Ling-Wei Huang, Wei-Han Li, Huai-Hsing Huang, Chia-Yen Liu, Chi-Wa Ng, Shih-ting Huang, Shih-Ping Lu, Dai-Yan Chen, Pin-Kuan Lee
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Patent number: 10021279Abstract: An image capturing device includes a first housing and a second housing. The first housing includes a first axis and a first slantwise surface. The second housing includes a second axis and a second slantwise surface. When the first housing is at a first state, the first axis and the second axis are substantially parallel to each other. When the first housing is not at the first state, the first axis and the second axis are nonparallel.Type: GrantFiled: April 15, 2016Date of Patent: July 10, 2018Assignee: ABILITY ENTERPRISE CO., LTD.Inventors: Yen-Min Chang, Ling-Wei Yeh, Yi-Ping Huang
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Patent number: 10002833Abstract: An integrated circuit chip includes a semiconductor substrate having thereon a plurality of inter-metal dielectric (IMD) layers and a plurality of first conductive layers embedded in respective said plurality of IMD layers, wherein said first conductive layers comprise copper; a first insulating layer overlying said plurality of IMD layers and said plurality of first conductive layers; at least a first wiring line in a second conductive layer overlying said first insulating layer, for distributing power signal or ground signal, wherein said second conductive layer comprise aluminum; and at least a second wiring line in a third conductive layer overlying said second conductive layer, for distributing power signal or ground signal.Type: GrantFiled: May 25, 2017Date of Patent: June 19, 2018Assignee: MediaTek Inc.Inventors: Ching-Chung Ko, Tao Cheng, Tien-Yueh Liu, Ta-Hsi Chou, Peng-Cheng Kao, Ling-Wei Ke