Abstract: A child stroller with simple structure and large accommodating space is provided and includes a stroller frame, a seat frame, a soft component and an accommodating component. The seat frame is disposed on the stroller frame. The soft component at least partially covers the stroller frame and the seat frame. The accommodating component is connected to a side of the soft component. An accommodating pocket is formed between the accommodating component and the soft component and for accommodating an object. An opening is formed on a side of the accommodating pocket and for allowing the object to enter into or exit from the accommodating pocket.

Abstract: The present disclosure relates to the field of semiconductor technology, and discloses a semiconductor structure and a manufacturing method thereof. The semiconductor structure includes a semiconductor substrate, a metal pad, a bump, a first solder layer, a barrier layer, and a second solder layer. The metal pad is disposed on the semiconductor substrate; the bump is arranged on the metal pad; the barrier layer is configured on the side of the bump away from the metal pad. The barrier layer includes a first surface and a second surface. The first solder layer is arranged between the bump and the first surface of the barrier layer. The second solder layer is configured on the second surface of the barrier layer. Since the first solder layer and the second solder layer are formed by reflowed and melt solder at a high temperature and can be stretched, the height of the second solder can be adjusted automatically, which reduces the non-wetting problem caused by the package substrate deformation after reflow.

Abstract: A semiconductor structure, a memory device, a semiconductor device and a semiconductor device manufacturing method are provided. The semiconductor structure includes a die, a power bus and a first pad assembly. The power bus is disposed on the die and extends in a predetermined direction. The first pad assembly is arranged on one side of the power bus. The first pad assembly includes at least four pads separated from one another along the predetermined direction by the first, the second and the third gaps. The first gap and the second gap both have a width larger than a width of the third gap and the first pad assembly includes a power pad coupled to the power bus and located between the first gap and the second gap. The power pad and the first and second gaps are all located between opposing ends of the power bus.

Abstract: A chip molding structure, a wafer level chip scale packaging structure and manufacturing methods thereof are disclosed, relating to the technical field of semiconductor production. The method of making a wafer level chip scale packaging structure includes: providing a wafer, comprising a plurality of bottom chips; bonding the wafer with a carrier; dicing the wafer to separate the plurality of bottom chips from a plurality of peripheral portions; removing the plurality of peripheral portions; and molding the plurality of bottom chips with a mold to form the molding structure. By dicing the wafer into independent bottom chips and peripheral portions, with the peripheral portions being removed before molding, the bottom chips may be prevented from being damaged during the molding. Compared with existing technologies, the packaging quality and production yield are improved.

Abstract: A copper pillar bump structure on a copper pillar on a metal pad of a semiconductor device and a method of fabricating thereof are disclosed. The copper pillar bump structure includes: a metal barrier layer formed on the copper pillar. The metal barrier layer has a U-shaped cross section, a central portion of the metal barrier layer covers the top surface of the copper pillar, an opening of the U-shaped cross section faces away from the copper pillar. The copper pillar bump structure further includes a solder layer on the copper pillar and filling the U-shaped cross section. The copper pillar bump structure provides a metal barrier layer having a U-shaped cross section and fills a solder layer in the U-shaped cross section, the metal barrier layer wraps sides of the solder layer, which can improve the non-wetting problem caused by insufficient tin, or the solder bridging problem caused by excessive solder, during a flip die soldering process.

Abstract: A wafer stacking method and structure are provided. The wafer stacking method includes: providing a first wafer, wherein an upper surface of the first wafer includes a first bonding pad configured to connect to a first signal; fabricating a first redistribution layer (RDL) on the first wafer, comprising a first wiring electrically connected to the first bonding pad, and the first wiring includes a first landing pad; bonding a second wafer on the first RDL, wherein the second wafer includes a second bonding pad configured to connect the first signal and located corresponding to the first bonding pad; fabricating a first through silicon via (TSV) with a bottom connected to the first landing pad at a position corresponding to the first landing pad; and fabricating a second RDL on the second wafer to connect the second bonding pad and the first TSV. This wafer stacking method improves the manufacturing yield.

Abstract: A display system includes an operation device and a display device. The operation device receives status information and a display image, and analyze the display image according to the status information to generate a foveal image, a background image, and positioning information corresponding to the foveal image. The display device is coupled to the operation device, and is configured to detect eyeball status of a user to generate the status information; receive the foveal image, the background image, and the positioning information; and enlarge the background image to generate an enlarged background image and combine the foveal image with the enlarged background image according to the positioning information to generate an output image.

Abstract: A semiconductor structure, a memory device, a semiconductor device and a semiconductor device manufacturing method are provided. The semiconductor structure includes a die, a power bus and a first pad assembly. The power bus is disposed on the die and extends in a predetermined direction. The first pad assembly is arranged on one side of the power bus. The first pad assembly includes at least four pads separated from one another along the predetermined direction by the first, the second and the third gaps. The first gap and the second gap both have a width larger than a width of the third gap and the first pad assembly includes a power pad coupled to the power bus and located between the first gap and the second gap. The power pad and the first and second gaps are all located between opposing ends of the power bus.

Abstract: A wafer stacking method and structure are provided. The wafer stacking method includes: providing a first wafer having an upper surface comprising a first bonding pad configured to connect to a first signal; fabricating a first lower redistribution layer (RDL) and a first upper RDL on the first wafer, with the first lower RDL including a first wiring connected to the first bonding pad, the first upper RDL including a second wiring connected to the first wiring, and the second wiring having a first landing pad; bonding a second wafer on the first upper RDL, wherein an upper surface of the second wafer includes a second bonding pad configured to connect to a second signal and located corresponding to the first bonding pad; and fabricating a first through silicon via (TSV) connected to the first landing pad. The wafer stacking method improves the manufacturing yield of a die.

Abstract: Systems and methods are disclosed for a mechanical clip lock that may include a rigid substrate; a clip lock pin extending vertically from a surface of the rigid substrate; a semi-rigid arm having a first end coupled to the rigid substrate, the semi-rigid arm extending orthogonally from the rigid substrate; a clip lock socket disposed at a second end of the semi-rigid arm opposite the first end, the clip lock socket configured to releasably engage the clip lock pin; and a plurality of clipping pegs extending vertically from the surface of the rigid substrate, each of the plurality of clipping pegs disposed on an exterior portion of the clip lock pin, the plurality of clipping pegs configured to apply a compression force on a device when the clip lock socket and clip lock pin are releasably engaged, the compression force removably coupling the device to a printed circuit board.

Abstract: A head-mounted display and an imaging apparatus for displaying image thereof are provided. The imaging apparatus includes a first display, a second display, and a first focus adjusting apparatus. The first display generates a first sub-image; wherein the first sub-image is located on a first imaging plane, and is then projected to the target system. The second display generates a second sub-image; wherein the second sub-image is located on a second imaging plane, and is then projected to the target system. The first focus adjusting apparatus is in front of the second display, and is used to adjust the position of the second imaging plane. The first imaging surface and a second imaging surface are overlapped or non-overlapped.

Abstract: A head mounted display and a multiple depth imaging apparatus thereof are provided. The imaging apparatus includes a beam splitting device, a first display, a second display, a third display and a lens set. The beam splitting device has a first reflective surface, a second reflective surface and a transmissive surface. The first display projects a first image to the first reflective surface. The second display projects a second image to the transmissive surface. The third display projects a third image to the second reflective surface. The lens set is disposed between the beam splitting device and a target area. The first image, second image and third image are respectively imaging on a first imaging surface, a second imaging surface and a third imaging surface, and distances between the target area and the first, second and third imaging surfaces are different.

Abstract: A head mounted display apparatus is provided, including a display, at least one image capturing device and an imaging device. The display provides a display image and projects the display image to a target region. The image capturing device is disposed adjacent to the display, and a camera lens of the image capturing device is oriented toward the target region. The imaging device is disposed between the target region and the display.

Abstract: A head mounted display apparatus is provided, including a display, at least one image capturing device and an imaging device. The display provides a display image and projects the display image to a target region. The image capturing device is disposed adjacent to the display, and a camera lens of the image capturing device is oriented toward the target region. The imaging device is disposed between the target region and the display.

Abstract: A head mounted display device and a backlight apparatus are provided. The backlight apparatus is adapted for the head mounted display device. The backlight apparatus includes a light guiding component, a light source, and a prism structure. The light source is disposed on a side of the light guiding component. The prism structure has a first surface adjacent to a first surface of the light guiding component. There are a plurality of convex pyramids on the first surface of the prism structure. The pyramids are arranged in an array.

Abstract: A head mounted display and a multiple depth imaging apparatus thereof are provided. The imaging apparatus includes a beam splitting device, a first display, a second display, a third display and a lens set. The beam splitting device has a first reflective surface, a second reflective surface and a transmissive surface. The first display projects a first image to the first reflective surface. The second display projects a second image to the transmissive surface. The third display projects a third image to the second reflective surface. The lens set is disposed between the beam splitting device and a target area. The first image, second image and third image are respectively imaging on a first imaging surface, a second imaging surface and a third imaging surface, and distances between the target area and the first, second and third imaging surfaces are different.

Abstract: A head-mounted display and an imaging apparatus for displaying image thereof are provided. The imaging apparatus includes a first display, a second display, and a first focus adjusting apparatus. The first display generates a first sub-image; wherein the first sub-image is located on a first imaging plane, and is then projected to the target system. The second display generates a second sub-image; wherein the second sub-image is located on a second imaging plane, and is then projected to the target system. The first focus adjusting apparatus is in front of the second display, and is used to adjust the position of the second imaging plane. The first imaging surface and a second imaging surface are overlapped or non-overlapped.

Abstract: A storage virtualization computer system. The storage virtualization computer system comprises a host entity for issuing an IO request, a storage virtualization controller coupled to the host entity for executing IO operations in response to the IO request, and a at least one physical storage device, each coupled to the storage virtualization controller through a point-to-point serial-signal interconnect, for providing storage to the storage virtualization computer system through the storage virtualization controller. As an example, the point-to-point serial-signal interconnect can be a Serial ATA IO device interconnect.

Abstract: The present disclosure provides apparatuses, methods and systems operable to provide transformable living spaces. The system includes a chassis and a configurable unit movably coupled to the chassis for at least one of translation and rotation with respect to the chassis. The system also includes at least one drivetrain assembly movably coupling the configurable unit to the chassis. The system includes at least one actuator coupled to the configurable unit by the at least one drivetrain assembly. The system also includes at least one robotic controller communicatively coupled to the at least one actuator.

Abstract: A light-emitting helmet is provided. The helmet includes a main body, a number of fixing members, and a number of light-emitting lamp strips. The main body includes a shell and inner layer. The shell includes an outer surface and a number of grooves defining in the outer surface. The fixing members are secured in the inner layer. The lamp strips are detachably mounted in the grooves by the fixing frames respectively. In addition, a light-emitting helmet manufacturing method is also provided.